TWI610073B - 工件之外觀檢查裝置及工件之外觀檢查方法 - Google Patents

工件之外觀檢查裝置及工件之外觀檢查方法 Download PDF

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Publication number
TWI610073B
TWI610073B TW105118583A TW105118583A TWI610073B TW I610073 B TWI610073 B TW I610073B TW 105118583 A TW105118583 A TW 105118583A TW 105118583 A TW105118583 A TW 105118583A TW I610073 B TWI610073 B TW I610073B
Authority
TW
Taiwan
Prior art keywords
workpiece
transfer
conveying
point
linear feeder
Prior art date
Application number
TW105118583A
Other languages
English (en)
Chinese (zh)
Other versions
TW201713935A (zh
Inventor
Katsuyoshi Kodera
Yasuo Okamoto
Hirofumi Mizukami
Original Assignee
Tokyo Weld Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Weld Co Ltd filed Critical Tokyo Weld Co Ltd
Publication of TW201713935A publication Critical patent/TW201713935A/zh
Application granted granted Critical
Publication of TWI610073B publication Critical patent/TWI610073B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/02—Devices for feeding articles or materials to conveyors
    • B65G47/04—Devices for feeding articles or materials to conveyors for feeding articles
    • B65G47/12—Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles
    • B65G47/14—Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles arranging or orientating the articles by mechanical or pneumatic means during feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/80—Turntables carrying articles or materials to be transferred, e.g. combined with ploughs or scrapers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N2021/845—Objects on a conveyor
    • G01N2021/8455—Objects on a conveyor and using position detectors

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Textile Engineering (AREA)
  • Feeding Of Articles To Conveyors (AREA)
  • Specific Conveyance Elements (AREA)
  • Attitude Control For Articles On Conveyors (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW105118583A 2015-08-26 2016-06-14 工件之外觀檢查裝置及工件之外觀檢查方法 TWI610073B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015167188A JP6529170B2 (ja) 2015-08-26 2015-08-26 ワークの外観検査装置およびワークの外観検査方法

Publications (2)

Publication Number Publication Date
TW201713935A TW201713935A (zh) 2017-04-16
TWI610073B true TWI610073B (zh) 2018-01-01

Family

ID=58209698

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105118583A TWI610073B (zh) 2015-08-26 2016-06-14 工件之外觀檢查裝置及工件之外觀檢查方法

Country Status (5)

Country Link
JP (1) JP6529170B2 (ja)
KR (1) KR101851975B1 (ja)
CN (1) CN106483141B (ja)
MY (1) MY177803A (ja)
TW (1) TWI610073B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6879822B2 (ja) * 2017-05-18 2021-06-02 株式会社 東京ウエルズ ワーク外観検査装置およびワーク外観検査方法
JP6795479B2 (ja) 2017-09-25 2020-12-02 株式会社Ｓｃｒｅｅｎホールディングス 検査装置および検査方法
JP7205846B2 (ja) * 2017-11-07 2023-01-17 株式会社 東京ウエルズ 搬送装置、搬送方法、及び外観検査装置
JP6970432B2 (ja) * 2017-11-30 2021-11-24 三星ダイヤモンド工業株式会社 基板整列装置
JP6987400B2 (ja) * 2019-09-26 2022-01-05 株式会社 東京ウエルズ ワーク搬送装置およびワーク搬送方法
KR102421136B1 (ko) * 2021-04-02 2022-07-14 주식회사 다인이엔지 자석을 이용한 ｍｌｃｃ 정렬기
CN113720856B (zh) * 2021-08-25 2022-07-01 东莞市华石晶电技术有限公司 一种检测设备及其检测方法
WO2023127310A1 (ja) * 2021-12-27 2023-07-06 株式会社村田製作所 部品処理装置
TWI814542B (zh) * 2022-08-17 2023-09-01 產台股份有限公司 工件外觀檢查機之整列裝置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449897B (zh) * 2009-11-27 2014-08-21 Tokyo Weld Co Ltd Workpiece appearance inspection device and workpiece appearance inspection method
TWI480540B (zh) * 2012-01-17 2015-04-11 Tokyo Weld Co Ltd The appearance inspection of the workpiece and the appearance inspection method of the workpiece

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002179232A (ja) * 2000-12-20 2002-06-26 Matsushita Electric Ind Co Ltd 搬送および供給装置
JP3855733B2 (ja) * 2001-10-30 2006-12-13 株式会社村田製作所 電子部品の外観検査装置および外観検査方法
US7190446B2 (en) * 2003-12-19 2007-03-13 Asm Assembly Automation Ltd. System for processing electronic devices
JP2008260594A (ja) * 2007-04-10 2008-10-30 Okano Denki Kk 部品搬送装置
CN102079448B (zh) * 2009-11-27 2013-09-04 东京威尔斯股份有限公司 工件的外观检查装置以及工件的外观检查方法
CN103801518B (zh) * 2014-01-29 2016-05-04 洛阳久德轴承模具技术有限公司 一种用于轴承滚动体的检测系统
CN203714822U (zh) * 2014-01-29 2014-07-16 洛阳久德轴承模具技术有限公司 用于轴承滚动体的输送及端面检测机构
CN105372245A (zh) * 2015-10-14 2016-03-02 上海为寻视自动化科技有限公司 键盘薄膜检测设备

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449897B (zh) * 2009-11-27 2014-08-21 Tokyo Weld Co Ltd Workpiece appearance inspection device and workpiece appearance inspection method
TWI480540B (zh) * 2012-01-17 2015-04-11 Tokyo Weld Co Ltd The appearance inspection of the workpiece and the appearance inspection method of the workpiece

Also Published As

Publication number Publication date
CN106483141B (zh) 2020-09-22
CN106483141A (zh) 2017-03-08
KR101851975B1 (ko) 2018-04-25
MY177803A (en) 2020-09-23
JP6529170B2 (ja) 2019-06-12
KR20170026099A (ko) 2017-03-08
JP2017044579A (ja) 2017-03-02
TW201713935A (zh) 2017-04-16

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