TWI608232B - 用於次表面缺陷再檢測之樣本之準備的系統與方法 - Google Patents

用於次表面缺陷再檢測之樣本之準備的系統與方法 Download PDF

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Publication number
TWI608232B
TWI608232B TW101144873A TW101144873A TWI608232B TW I608232 B TWI608232 B TW I608232B TW 101144873 A TW101144873 A TW 101144873A TW 101144873 A TW101144873 A TW 101144873A TW I608232 B TWI608232 B TW I608232B
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TW
Taiwan
Prior art keywords
defect
location
cutting
result file
electron microscope
Prior art date
Application number
TW101144873A
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English (en)
Chinese (zh)
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TW201333457A (zh
Inventor
西西里亞 坎柏契洛
蕭宏
萊爾特 麥可 梵
班傑明 詹姆士 湯瑪士 克拉克
赫許 辛哈
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克萊譚克公司
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Publication of TW201333457A publication Critical patent/TW201333457A/zh
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Publication of TWI608232B publication Critical patent/TWI608232B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/31—Electron-beam or ion-beam tubes for localised treatment of objects for cutting or drilling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2813—Scanning microscopes characterised by the application
    • H01J2237/2817—Pattern inspection

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW101144873A 2011-11-29 2012-11-29 用於次表面缺陷再檢測之樣本之準備的系統與方法 TWI608232B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161564733P 2011-11-29 2011-11-29
US13/687,244 US9318395B2 (en) 2011-11-29 2012-11-28 Systems and methods for preparation of samples for sub-surface defect review

Publications (2)

Publication Number Publication Date
TW201333457A TW201333457A (zh) 2013-08-16
TWI608232B true TWI608232B (zh) 2017-12-11

Family

ID=48467234

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101144873A TWI608232B (zh) 2011-11-29 2012-11-29 用於次表面缺陷再檢測之樣本之準備的系統與方法

Country Status (8)

Country Link
US (1) US9318395B2 (https=)
EP (1) EP2789008A4 (https=)
JP (1) JP6244307B2 (https=)
KR (1) KR101887730B1 (https=)
IL (1) IL232703B (https=)
SG (1) SG11201402475YA (https=)
TW (1) TWI608232B (https=)
WO (1) WO2013082181A1 (https=)

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Also Published As

Publication number Publication date
SG11201402475YA (en) 2014-06-27
JP2014534452A (ja) 2014-12-18
EP2789008A4 (en) 2015-07-22
WO2013082181A1 (en) 2013-06-06
US20130137193A1 (en) 2013-05-30
TW201333457A (zh) 2013-08-16
EP2789008A1 (en) 2014-10-15
JP6244307B2 (ja) 2017-12-06
US9318395B2 (en) 2016-04-19
KR101887730B1 (ko) 2018-08-10
IL232703B (en) 2018-03-29
IL232703A0 (en) 2014-07-31
KR20140108662A (ko) 2014-09-12

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