TWI602253B - 圓盤狀物件之液體處理用設備及用於該設備中之加熱系統 - Google Patents

圓盤狀物件之液體處理用設備及用於該設備中之加熱系統 Download PDF

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Publication number
TWI602253B
TWI602253B TW102136810A TW102136810A TWI602253B TW I602253 B TWI602253 B TW I602253B TW 102136810 A TW102136810 A TW 102136810A TW 102136810 A TW102136810 A TW 102136810A TW I602253 B TWI602253 B TW I602253B
Authority
TW
Taiwan
Prior art keywords
emitting portion
heating elements
lamp
arcuate
heating
Prior art date
Application number
TW102136810A
Other languages
English (en)
Chinese (zh)
Other versions
TW201434101A (zh
Inventor
凱文 馬修 克拉伯
菲力浦 英傑瑟
維傑 庫瑪 貝丹
Original Assignee
蘭姆研究股份公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/650,916 external-priority patent/US9093482B2/en
Priority claimed from US13/932,926 external-priority patent/US9748120B2/en
Application filed by 蘭姆研究股份公司 filed Critical 蘭姆研究股份公司
Publication of TW201434101A publication Critical patent/TW201434101A/zh
Application granted granted Critical
Publication of TWI602253B publication Critical patent/TWI602253B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Resistance Heating (AREA)
TW102136810A 2012-10-12 2013-10-11 圓盤狀物件之液體處理用設備及用於該設備中之加熱系統 TWI602253B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/650,916 US9093482B2 (en) 2012-10-12 2012-10-12 Method and apparatus for liquid treatment of wafer shaped articles
US13/932,926 US9748120B2 (en) 2013-07-01 2013-07-01 Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus

Publications (2)

Publication Number Publication Date
TW201434101A TW201434101A (zh) 2014-09-01
TWI602253B true TWI602253B (zh) 2017-10-11

Family

ID=50654094

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102136810A TWI602253B (zh) 2012-10-12 2013-10-11 圓盤狀物件之液體處理用設備及用於該設備中之加熱系統

Country Status (3)

Country Link
JP (1) JP6351948B2 (https=)
KR (2) KR20140047564A (https=)
TW (1) TWI602253B (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101681183B1 (ko) * 2014-07-11 2016-12-02 세메스 주식회사 기판 처리 장치
KR102069078B1 (ko) * 2014-08-27 2020-01-23 주식회사 제우스 기판 처리장치
JP6343100B2 (ja) * 2014-10-10 2018-06-13 ゼウス カンパニー リミテッド 基板処理用ヒーター装置及びこれを備えた基板液処理装置
KR102082151B1 (ko) * 2014-10-10 2020-02-27 주식회사 제우스 기판 처리용 히터장치 및 이를 구비한 기판 액처리 장치
KR102123563B1 (ko) * 2014-10-20 2020-06-16 주식회사 제우스 기판지지장치 및 이를 구비한 기판 액처리 장치
JP6658195B2 (ja) * 2016-03-28 2020-03-04 大日本印刷株式会社 エッチング方法およびエッチング装置
JP6837481B2 (ja) * 2016-05-26 2021-03-03 三益半導体工業株式会社 回転テーブル用ウェーハ加熱保持機構及び方法並びにウェーハ回転保持装置
US10720343B2 (en) * 2016-05-31 2020-07-21 Lam Research Ag Method and apparatus for processing wafer-shaped articles
US11500298B2 (en) * 2018-12-21 2022-11-15 Asml Holding N.V. Reticle sub-field thermal control
KR102263006B1 (ko) 2019-07-18 2021-06-10 세메스 주식회사 기판 처리 장치
KR102407266B1 (ko) 2019-10-02 2022-06-13 세메스 주식회사 지지 유닛, 이를 포함하는 기판 처리 장치 및 기판 처리 방법
FR3103629B1 (fr) * 2019-11-25 2021-10-22 Soitec Silicon On Insulator Procédé de collage de deux substrats
CN111403316A (zh) * 2020-03-18 2020-07-10 沈阳拓荆科技有限公司 一种提高硅片温度均匀性的加热系统
KR102564838B1 (ko) 2020-07-24 2023-08-10 세메스 주식회사 지지 유닛, 이를 포함하는 기판 처리 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW563196B (en) * 2000-10-30 2003-11-21 Dainippon Screen Mfg Substrate processing apparatus
WO2008059686A1 (en) * 2006-11-14 2008-05-22 Tokyo Electron Limited Substrate processing method and substrate processing system
TW200830060A (en) * 2006-11-14 2008-07-16 Tokyo Electron Ltd Substrate processing method and substrate processing system

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000164555A (ja) * 1998-11-30 2000-06-16 Ebara Corp 基板乾燥装置及び方法
JP3659863B2 (ja) * 2000-04-06 2005-06-15 大日本スクリーン製造株式会社 熱処理装置
JP2005032933A (ja) * 2003-07-10 2005-02-03 Hitachi Kokusai Electric Inc 基板処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW563196B (en) * 2000-10-30 2003-11-21 Dainippon Screen Mfg Substrate processing apparatus
WO2008059686A1 (en) * 2006-11-14 2008-05-22 Tokyo Electron Limited Substrate processing method and substrate processing system
TW200830060A (en) * 2006-11-14 2008-07-16 Tokyo Electron Ltd Substrate processing method and substrate processing system

Also Published As

Publication number Publication date
JP2014090168A (ja) 2014-05-15
KR20210049738A (ko) 2021-05-06
JP6351948B2 (ja) 2018-07-04
TW201434101A (zh) 2014-09-01
KR20140047564A (ko) 2014-04-22

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