JP6837481B2 - 回転テーブル用ウェーハ加熱保持機構及び方法並びにウェーハ回転保持装置 - Google Patents
回転テーブル用ウェーハ加熱保持機構及び方法並びにウェーハ回転保持装置 Download PDFInfo
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- JP6837481B2 JP6837481B2 JP2018519230A JP2018519230A JP6837481B2 JP 6837481 B2 JP6837481 B2 JP 6837481B2 JP 2018519230 A JP2018519230 A JP 2018519230A JP 2018519230 A JP2018519230 A JP 2018519230A JP 6837481 B2 JP6837481 B2 JP 6837481B2
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- 238000010438 heat treatment Methods 0.000 title claims description 73
- 230000007246 mechanism Effects 0.000 title claims description 46
- 238000000034 method Methods 0.000 title claims description 29
- 238000012545 processing Methods 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 230000005674 electromagnetic induction Effects 0.000 claims description 5
- 238000005530 etching Methods 0.000 description 17
- 238000009826 distribution Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 spin etching Chemical compound 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/06—Control, e.g. of temperature, of power
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
- H05B6/105—Induction heating apparatus, other than furnaces, for specific applications using a susceptor
- H05B6/107—Induction heating apparatus, other than furnaces, for specific applications using a susceptor for continuous movement of material
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
Claims (5)
- ウェーハ回転保持装置の回転テーブル用ウェーハ加熱保持機構であって、
回転軸と、
前記回転軸の先端に載置され且つ上面に支持ピンを介してウェーハを保持する回転テーブルと、
前記回転軸に動力を供給する駆動モータと、
前記回転テーブル上又は内部であり且つ前記ウェーハの下部に前記ウェーハに空間を有する非接触状態で設けられた前記ウェーハを加熱するための加熱手段と、
を有し、
前記回転軸の周囲に巻回された固定側1次コイルと、
前記固定側1次コイルに接続された電力供給源と、
前記固定側1次コイルに対応して所定距離離間して設けられ、且つ前記回転テーブルに取り付けられた回転テーブル側2次コイルと、
前記回転テーブル側2次コイルに接続された前記加熱手段と、
を含む回転テーブル用非接触電力供給機構を用い、電磁誘導により前記2次コイルを介して前記加熱手段に電力が供給されてなり、
前記加熱手段上に樹脂シートが設けられてなる、
回転テーブル用ウェーハ加熱保持機構。 - 前記回転テーブルと前記加熱手段の間に反射板を設けてなる、請求項1記載の回転テーブル用ウェーハ加熱保持機構。
- 請求項1又は2記載の回転テーブル用ウェーハ加熱保持機構を用いて、前記ウェーハを加熱してなる、回転テーブル用ウェーハ加熱方法。
- 請求項1又は2記載の回転テーブル用ウェーハ加熱保持機構を備えてなる、ウェーハ回転保持装置。
- 前記ウェーハ回転保持装置が、スピン処理機構を備える、請求項4記載のウェーハ回転保持装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016105591 | 2016-05-26 | ||
JP2016105591 | 2016-05-26 | ||
PCT/JP2017/018696 WO2017204083A1 (ja) | 2016-05-26 | 2017-05-18 | 回転テーブル用ウェーハ加熱保持機構及び方法並びにウェーハ回転保持装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017204083A1 JPWO2017204083A1 (ja) | 2019-03-14 |
JP6837481B2 true JP6837481B2 (ja) | 2021-03-03 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018519230A Active JP6837481B2 (ja) | 2016-05-26 | 2017-05-18 | 回転テーブル用ウェーハ加熱保持機構及び方法並びにウェーハ回転保持装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11056362B2 (ja) |
EP (1) | EP3442016B1 (ja) |
JP (1) | JP6837481B2 (ja) |
CN (1) | CN109155273B (ja) |
WO (1) | WO2017204083A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6689719B2 (ja) * | 2016-09-23 | 2020-04-28 | 株式会社Screenホールディングス | 基板処理装置 |
KR102111099B1 (ko) * | 2018-11-09 | 2020-05-15 | (주)에이앤아이 | 집전 픽업을 포함하는 무선 로터리 검사장치 |
JP7241646B2 (ja) * | 2019-08-30 | 2023-03-17 | 京セラ株式会社 | ヒータ及びヒータシステム |
JP7350613B2 (ja) * | 2019-10-17 | 2023-09-26 | 東京エレクトロン株式会社 | 基板処理装置 |
KR20210116770A (ko) * | 2020-03-13 | 2021-09-28 | 삼성전자주식회사 | 펠리클 전사 장치 및 펠리클 전사 방법 |
CN112133649A (zh) * | 2020-09-21 | 2020-12-25 | 南通大学 | 一种大尺寸晶片均匀高温腐蚀装置及其腐蚀方法 |
KR102548766B1 (ko) * | 2020-11-02 | 2023-06-30 | 세메스 주식회사 | 기판 처리 장치 및 발열 부재 제어 방법 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH06232047A (ja) * | 1993-01-29 | 1994-08-19 | Mitsubishi Heavy Ind Ltd | ウェハ回転装置 |
JPH09181155A (ja) * | 1995-09-29 | 1997-07-11 | Applied Materials Inc | 堆積装置のサセプタ |
JP4257816B2 (ja) | 2000-03-16 | 2009-04-22 | 三益半導体工業株式会社 | 廃液回収機構付ウェーハ表面処理装置 |
JP4111479B2 (ja) * | 1999-09-09 | 2008-07-02 | 三益半導体工業株式会社 | ウェーハ回転保持装置 |
JP3592233B2 (ja) * | 2000-12-14 | 2004-11-24 | 大日本スクリーン製造株式会社 | 基板表面処理装置および基板表面処理方法 |
JP4067858B2 (ja) * | 2002-04-16 | 2008-03-26 | 東京エレクトロン株式会社 | Ald成膜装置およびald成膜方法 |
JP2004072000A (ja) * | 2002-08-09 | 2004-03-04 | Matsushita Electric Ind Co Ltd | 加熱装置 |
KR101010532B1 (ko) | 2004-03-22 | 2011-01-24 | 미마스 한도타이 고교 가부시키가이샤 | 스핀 에칭에서의 공정 관리방법 및 스핀 에칭 장치 |
JP4625495B2 (ja) | 2005-03-30 | 2011-02-02 | 三益半導体工業株式会社 | スピンエッチング方法及び装置 |
JP2007335709A (ja) * | 2006-06-16 | 2007-12-27 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP4753832B2 (ja) * | 2006-10-19 | 2011-08-24 | 大日本スクリーン製造株式会社 | 基板回転保持装置および基板処理装置 |
JP4933409B2 (ja) * | 2007-11-29 | 2012-05-16 | 株式会社ニューフレアテクノロジー | 半導体製造装置および半導体製造方法 |
JP2010087197A (ja) * | 2008-09-30 | 2010-04-15 | M Setek Co Ltd | レジスト塗布装置 |
JP6351948B2 (ja) * | 2012-10-12 | 2018-07-04 | ラム・リサーチ・アーゲーLam Research Ag | 円板状物品の液体処理装置およびかかる装置で用いる加熱システム |
JP6036189B2 (ja) * | 2012-11-07 | 2016-11-30 | ソニー株式会社 | アンテナモジュール、情報通信装置及び情報通信システム |
CN110610894B (zh) * | 2012-11-27 | 2023-08-04 | 盛美半导体设备(上海)股份有限公司 | 使用基板支撑装置清洗基板背面的方法 |
DE102016103270B3 (de) * | 2016-02-24 | 2017-05-11 | Ev Group E. Thallner Gmbh | Vorrichtung und Verfahren zur Halterung, Rotation sowie Heizung und/oder Kühlung eines Substrats |
-
2017
- 2017-05-18 WO PCT/JP2017/018696 patent/WO2017204083A1/ja active Application Filing
- 2017-05-18 JP JP2018519230A patent/JP6837481B2/ja active Active
- 2017-05-18 US US16/304,385 patent/US11056362B2/en active Active
- 2017-05-18 CN CN201780031237.8A patent/CN109155273B/zh active Active
- 2017-05-18 EP EP17802675.3A patent/EP3442016B1/en active Active
Also Published As
Publication number | Publication date |
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US11056362B2 (en) | 2021-07-06 |
WO2017204083A1 (ja) | 2017-11-30 |
CN109155273A (zh) | 2019-01-04 |
EP3442016A4 (en) | 2019-11-13 |
CN109155273B (zh) | 2024-01-02 |
EP3442016A1 (en) | 2019-02-13 |
EP3442016B1 (en) | 2023-06-07 |
US20190295866A1 (en) | 2019-09-26 |
JPWO2017204083A1 (ja) | 2019-03-14 |
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