TWI600879B - Shape measuring device, processing device and shape measuring method - Google Patents

Shape measuring device, processing device and shape measuring method Download PDF

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TWI600879B
TWI600879B TW105104767A TW105104767A TWI600879B TW I600879 B TWI600879 B TW I600879B TW 105104767 A TW105104767 A TW 105104767A TW 105104767 A TW105104767 A TW 105104767A TW I600879 B TWI600879 B TW I600879B
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interpolation
data
measured
shape
gap
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TW105104767A
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TW201631295A (en
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高娜
市原浩一
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住友重機械工業股份有限公司
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/20Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring contours or curvatures, e.g. determining profile

Description

形狀計測裝置、加工裝置及形狀計測方法 Shape measuring device, processing device and shape measuring method

本發明關於一種形狀測量裝置、加工裝置及形狀測量方法。 The present invention relates to a shape measuring device, a processing device, and a shape measuring method.

已知有一種直線度測定法,其利用3個位移計且藉由逐次三點法求出測量對象物之表面形狀,並對直線度進行測定(例如,參照專利文獻1)。 There is known a straightness measurement method in which the surface shape of the object to be measured is obtained by a three-point method using three displacement meters, and the straightness is measured (for example, refer to Patent Document 1).

(先前技術文獻) (previous technical literature) (專利文獻) (Patent Literature)

專利文獻1:日本特開2003-254747號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2003-254747

上述直線度測定法中,例如,若在測量對象物之表面存在垃圾或油等異物、傷痕等,則有時由位移計測定的測定值會大幅變動,並難以以高精度求出測量對象物之表面形狀。 In the straightness measurement method, for example, when foreign matter such as garbage or oil or scratches are present on the surface of the object to be measured, the measured value measured by the displacement meter may fluctuate greatly, and it is difficult to obtain the measurement object with high precision. The surface shape.

本發明係鑑於上述內容而完成的,其目的在於提供一 種形狀測量裝置,該形狀測量裝置藉由減少存在於表面的異物等的影響能夠以高精度對測量對象物之表面形狀進行測量。 The present invention has been made in view of the above, and an object thereof is to provide a The shape measuring device can measure the surface shape of the object to be measured with high precision by reducing the influence of foreign matter or the like existing on the surface.

藉由本發明之一方案,一種形狀測量裝置,藉由3個位移計配設成一列的檢測儀對測量對象物進行掃描,並對前述測量對象物之表面形狀進行測量,該形狀測量裝置具備:間隙計算機構,藉由由前述3個位移計中位於中間之位移計測定的測定值和由其他位移計測定的測定值之差求出間隙資料;插值機構,求出前述間隙資料的平均值及標準偏差,並反覆執行插值處理,直至前述標準偏差的變化率成為預先設定的值以下,前述插值處理中以前述平均值對前述間隙資料中依據前述標準偏差而設定的範圍外之值進行插值;及形狀計算機構,依據已執行前述插值處理的前述間隙資料對前述測量對象物之表面形狀進行計算。 According to one aspect of the present invention, a shape measuring apparatus scans an object to be measured by a detector in which three displacement meters are arranged in a row, and measures a surface shape of the object to be measured, and the shape measuring device includes: The gap calculating means obtains the gap data by the difference between the measured value measured by the displacement meter located in the middle of the three displacement meters and the measured value measured by the other displacement meter; and the interpolation means obtains the average value of the gap data and Standard deviation, and the interpolation process is repeatedly performed until the rate of change of the standard deviation is equal to or less than a predetermined value, and the interpolation process performs interpolation on a value outside the range set by the standard deviation in the gap data by the average value; And the shape calculation means calculates the surface shape of the object to be measured based on the gap data on which the interpolation process has been performed.

藉由本發明之實施形態,能夠提供一種形狀測量裝置,該形狀測量裝置藉由減少存在於表面的異物等的影響能夠以高精度對測量對象物之表面形狀進行測量。 According to the embodiment of the present invention, it is possible to provide a shape measuring device capable of measuring the surface shape of the object to be measured with high precision by reducing the influence of foreign matter or the like existing on the surface.

12‧‧‧物體(測量對象物) 12‧‧‧ objects (measurement objects)

20‧‧‧控制裝置 20‧‧‧Control device

23‧‧‧間隙資料計算部(間隙計算機構) 23‧‧‧Gap data calculation department (gap calculation mechanism)

25‧‧‧插值處理部(插值機構) 25‧‧‧Interpolation Processing Department (Interpolation Mechanism)

27‧‧‧形狀計算部(形狀計算機構) 27‧‧‧Shape calculation unit (shape calculation mechanism)

30‧‧‧感測頭(檢測儀) 30‧‧‧Sensing head (detector)

31a‧‧‧第1位移感測器(位移計) 31a‧‧‧1st displacement sensor (displacement meter)

31b‧‧‧第2位移感測器(位移計) 31b‧‧‧2nd displacement sensor (displacement meter)

31c‧‧‧第3位移感測器(位移計) 31c‧‧‧3rd displacement sensor (displacement meter)

40‧‧‧顯示裝置(顯示機構) 40‧‧‧Display device (display mechanism)

100‧‧‧形狀測量裝置 100‧‧‧Shape measuring device

200‧‧‧加工裝置 200‧‧‧Processing device

第1圖係對實施形態中的加工裝置進行例示之圖。 Fig. 1 is a view showing an example of a processing apparatus in an embodiment.

第2圖係對實施形態中的形狀測量裝置的結構進行例示之圖。 Fig. 2 is a view showing an example of the configuration of the shape measuring device in the embodiment.

第3圖係對實施形態中的感測頭的結構進行例示之圖。 Fig. 3 is a view showing an example of the structure of the sensor head in the embodiment.

第4圖係用於對實施形態中的形狀測量進行說明的圖。 Fig. 4 is a view for explaining shape measurement in the embodiment.

第5圖係對實施形態中的形狀測量處理的流程進行例示之圖。 Fig. 5 is a view showing an example of the flow of the shape measuring process in the embodiment.

第6圖係對實施形態中的感測器資料進行例示之圖。 Fig. 6 is a diagram illustrating an example of sensor data in the embodiment.

第7圖係對實施形態中的間隙資料進行例示之圖。 Fig. 7 is a diagram showing an example of the gap data in the embodiment.

第8圖係對實施形態中的插值處理的流程進行例示之圖。 Fig. 8 is a view showing an example of the flow of the interpolation processing in the embodiment.

第9圖係對實施形態中的插值處理前的間隙資料進行例示之圖。 Fig. 9 is a view showing an example of the gap data before the interpolation processing in the embodiment.

第10圖係用於對實施形態中的間隙資料的插值處理進行說明之圖。 Fig. 10 is a view for explaining interpolation processing of the gap data in the embodiment.

第11圖係對在實施形態中執行1次插值處理後的間隙資料進行例示之圖。 Fig. 11 is a view showing an example of the gap data after the interpolation processing is performed once in the embodiment.

第12圖係對在實施形態中反覆執行插值處理後的間隙資料進行例示之圖。 Fig. 12 is a view showing an example of the gap data after the interpolation processing is repeatedly performed in the embodiment.

第13圖係用於對實施形態中的間隙資料的插值處理進行說明的圖。 Fig. 13 is a view for explaining interpolation processing of the gap data in the embodiment.

第14圖係對在實施形態中執行插值處理後的間隙資料進行例示之圖。 Fig. 14 is a view showing an example of the gap data after the interpolation processing is performed in the embodiment.

第15圖係對實施形態中之表面形狀的測量結果進行例示之圖。 Fig. 15 is a view showing an example of measurement results of the surface shape in the embodiment.

第16圖係對在物體之表面不存在異物的狀態下之表面形狀的測量結果進行例示之圖。 Fig. 16 is a view showing an example of measurement results of the surface shape in a state where no foreign matter is present on the surface of the object.

第17圖係在未執行插值處理狀態下之表面形狀的測量結果進行例示之圖。 Fig. 17 is a diagram showing an example of measurement results of the surface shape in a state where the interpolation processing is not performed.

以下,參閱附圖對實施形態進行說明。在各附圖中,有時對結構相同的部分標註相同元件符號,並省略重複說明。 Hereinafter, embodiments will be described with reference to the drawings. In the respective drawings, the same components are denoted by the same reference numerals, and the description thereof will not be repeated.

(加工裝置的結構) (Structure of processing device)

第1圖係對加工裝置200的結構進行例示之圖,該加工裝置200搭載有本實施形態所涉及之形狀測量裝置。 Fig. 1 is a view showing an example of a configuration of a processing apparatus 200 on which a shape measuring apparatus according to the present embodiment is mounted.

如第1圖所示,加工裝置200具有可移動工作台10、工作台引導機構11、砂輪頭15、砂輪16、導軌18、控制裝置20、顯示裝置40。另外,在以下附圖中,X方向為可移動工作台10的移動方向、Y方向為與X方向正交的砂輪頭15的移動方向、Z方向為與X方向及Y方向正交的高度方向。 As shown in Fig. 1, the processing apparatus 200 includes a movable table 10, a table guiding mechanism 11, a grinding head 15, a grinding wheel 16, a guide rail 18, a control device 20, and a display device 40. In addition, in the following drawings, the X direction is the moving direction of the movable table 10, the Y direction is the moving direction of the grinding head 15 orthogonal to the X direction, and the Z direction is the height direction orthogonal to the X direction and the Y direction. .

可移動工作台10被設置成藉由工作台引導機構11可朝向X方向移動,且載置有成為加工對象及測量對象之物體12。工作台引導機構11使可移動工作台10朝向X方 向移動 The movable table 10 is provided so as to be movable in the X direction by the table guiding mechanism 11, and the object 12 to be processed and the object to be measured is placed. The table guiding mechanism 11 faces the movable table 10 toward the X side Moving to

砂輪頭15之下端部設有砂輪16,以可朝向X方向移動且可朝向Z方向升降的方式設置在導軌18。導軌18使砂輪頭15朝向X方向及Z方向移動。砂輪16係圓柱狀,以其中心軸與Y方向平行的方式旋轉自如地設置在砂輪頭15的下端部。砂輪16與砂輪頭15一同朝向X方向及Z方向移動,並旋轉而對物體12之表面進行磨削。 A grinding wheel 16 is provided at a lower end portion of the grinding wheel head 15 so as to be movable in the X direction and to be lifted in the Z direction. The guide rail 18 moves the grinding head 15 in the X direction and the Z direction. The grinding wheel 16 has a cylindrical shape and is rotatably provided at a lower end portion of the grinding wheel head 15 such that its central axis is parallel to the Y direction. The grinding wheel 16 moves in the X direction and the Z direction together with the grinding wheel head 15, and rotates to grind the surface of the object 12.

控制裝置20藉由控制可移動工作台10及砂輪頭15的位置,且使砂輪16旋轉,以磨削物體12之表面的方式對加工裝置200的各部進行控制。 The control device 20 controls the respective portions of the processing apparatus 200 by grinding the surface of the object 12 by controlling the positions of the movable table 10 and the grinding wheel head 15 and rotating the grinding wheel 16.

顯示裝置40係顯示機構的一例,例如係液晶顯示器等。顯示裝置40由控制裝置20控制,並顯示例如物體12的加工條件等。 The display device 40 is an example of a display mechanism, and is, for example, a liquid crystal display or the like. The display device 40 is controlled by the control device 20 and displays, for example, processing conditions of the object 12 and the like.

(形狀測量裝置的結構) (Structure of shape measuring device)

第2圖係對搭載於加工裝置200的形狀測量裝置100的結構進行例示之圖。如第2圖所示,形狀測量裝置100包括控制裝置20、感測頭30、顯示裝置40。 FIG. 2 is a view exemplifying a configuration of the shape measuring device 100 mounted on the processing device 200. As shown in FIG. 2, the shape measuring apparatus 100 includes a control device 20, a sensing head 30, and a display device 40.

如上述,控制裝置20以磨削物體12之表面的方式對加工裝置200的各部進行控制,並且藉由由感測頭30的各位移感測器31a、31b、31c輸出之測定值來求出物體12之表面形狀。 As described above, the control device 20 controls the respective portions of the processing device 200 so as to grind the surface of the object 12, and is obtained by the measured values output from the displacement sensors 31a, 31b, and 31c of the sensing head 30. The surface shape of the object 12.

控制裝置20具有感測器資料取得部21、間隙資料計算部23、插值處理部25,形狀計算部27。控制裝置20 包括例如CPU、ROM、RAM等,並藉由由CPU執行與RAM配合而儲存於ROM的控制程式來實現各部的功能。 The control device 20 includes a sensor data acquisition unit 21, a gap data calculation unit 23, an interpolation processing unit 25, and a shape calculation unit 27. Control device 20 Including, for example, a CPU, a ROM, a RAM, etc., and the functions of the respective sections are realized by a CPU executing a control program stored in the ROM in cooperation with the RAM.

感測器資料取得部21從設置在感測頭30的各位移感測器31a、31b、31c取得感測器資料。間隙資料計算部23係間隙計算機構的一例,藉由由感測器資料取得部21所取得之感測器資料計算間隙資料。插值處理部25係插值機構的一例,對由間隙資料計算部23計算出之間隙資料執行插值處理。形狀計算部27係形狀計算機構的一例,基於藉由插值處理部25執行插值處理的間隙資料計算物體12之表面形狀。 The sensor data acquisition unit 21 acquires sensor data from the displacement sensors 31a, 31b, and 31c provided in the sensor head 30. The gap data calculation unit 23 is an example of the gap calculation unit, and calculates the gap data by the sensor data acquired by the sensor data acquisition unit 21. The interpolation processing unit 25 is an example of an interpolation mechanism, and performs interpolation processing on the gap data calculated by the gap data calculation unit 23. The shape calculation unit 27 is an example of a shape calculation unit, and calculates the surface shape of the object 12 based on the gap data in which the interpolation processing unit 25 performs interpolation processing.

感測頭30係檢測儀的一例,具備第1位移感測器31a、第2位移感測器31b、第3位移感測器31c,並設置在加工裝置200的砂輪頭15的下端。第3圖係對實施形態所涉及之感測頭30之結構進行例示之圖 The sensor head 30 is an example of a detector, and includes a first displacement sensor 31a, a second displacement sensor 31b, and a third displacement sensor 31c, and is provided at a lower end of the grinding head 15 of the processing apparatus 200. Fig. 3 is a view showing an example of the structure of the sensing head 30 according to the embodiment.

如第3圖所示,感測頭30中,第1位移感測器31a、第2位移感測器31b、第3位移感測器31c朝向X方向配設成一列。 As shown in FIG. 3, in the sensor head 30, the first displacement sensor 31a, the second displacement sensor 31b, and the third displacement sensor 31c are arranged in a line in the X direction.

第1位移感測器31a、第2位移感測器31b、第3位移感測器31c為位移計的一例,例如為雷射位移計。第1位移感測器31a、第2位移感測器31b、第3位移感測器31c被配設成測定點在物體12之表面以與X方向平行的直線狀等間隔排列,分別對與物體12之表面上的測定點之間的距離進行測定。若物體12被搭載於可移動工作台10而向X方向移動,則感測頭30相對物體12進行相對 移動,各位移感測器31a、31b、31c對物體12之表面進行掃描而輸出測定值。 The first displacement sensor 31a, the second displacement sensor 31b, and the third displacement sensor 31c are examples of the displacement meter, and are, for example, laser displacement meters. The first displacement sensor 31a, the second displacement sensor 31b, and the third displacement sensor 31c are disposed such that the measurement points are arranged at equal intervals on the surface of the object 12 in a line parallel to the X direction, and the objects are respectively aligned with each other. The distance between the measurement points on the surface of 12 was measured. When the object 12 is mounted on the movable table 10 and moved in the X direction, the sensing head 30 is opposed to the object 12 Moving, each of the displacement sensors 31a, 31b, and 31c scans the surface of the object 12 to output a measured value.

顯示裝置40由控制裝置20控制,並顯示例如藉由形狀計算部27求出之表面形狀的測量結果等。 The display device 40 is controlled by the control device 20, and displays, for example, a measurement result of the surface shape obtained by the shape calculating unit 27, and the like.

另外,本實施形態中,形狀測量裝置100與加工裝置200被構成為共用控制裝置20與顯示裝置40,但亦可以將控制裝置與顯示裝置分別設置在形狀測量裝置100與加工裝置200。並且,可移動工作台10被構成為與物體12一同朝向X方向移動,但亦可以構成為感測頭30相對物體12朝向X方向移動。 Further, in the present embodiment, the shape measuring device 100 and the processing device 200 are configured to share the control device 20 and the display device 40. However, the control device and the display device may be provided in the shape measuring device 100 and the processing device 200, respectively. Further, the movable table 10 is configured to move in the X direction together with the object 12, but may be configured such that the sensor head 30 moves in the X direction with respect to the object 12.

(形狀測量的基本原理) (The basic principle of shape measurement)

接著,對利用形狀測量裝置100求出測量物體12之表面形狀的方法進行說明。第4圖係用於對表面形狀的測量方法進行說明之圖。 Next, a method of obtaining the surface shape of the measuring object 12 by the shape measuring device 100 will be described. Fig. 4 is a view for explaining a method of measuring a surface shape.

如第4圖所示,位移感測器31a、31b、31c在X方向上隔開間隔P配設成一列,且分別對與物體12表面的a點、b點、c點之間的距離進行測定。若將藉由位移感測器31a、31b、31c求出之各位移感測器31a、31b、31c與物體12表面之間的距離分別設為A、B、C,則從第4圖(A)中所示的Z方向上的b點至連結a點與c點的直線之間的距離g(間隙)依據以下式(1)求出。 As shown in FIG. 4, the displacement sensors 31a, 31b, and 31c are arranged in a row at intervals P in the X direction, and respectively perform distances from points a, b, and c on the surface of the object 12. Determination. If the distances between the displacement sensors 31a, 31b, and 31c obtained by the displacement sensors 31a, 31b, and 31c and the surface of the object 12 are respectively A, B, and C, then from Fig. 4 (A) The distance g (gap) between the point b in the Z direction and the line connecting the point a and the point c is shown by the following formula (1).

[數學式1]g=B-(A+C)/2…(1)[Math 1] g = B -( A + C )/2...(1)

接著,如第4圖(B)所示,物體12表面之b點上的位移z的二階微分(d2z/dx2)為b點之曲率(1/r),利用連結a點與b點的直線之傾斜度(dzab/dx)與連結b點與c點的直線之傾斜度(dzbc/dx),依據以下式(2)示出。 Next, as shown in FIG. 4(B), the second-order differential (d 2 z/dx 2 ) of the displacement z at the b-point of the surface of the object 12 is the curvature (b) of the b-point, and the a point and b are connected by using The inclination of the straight line of the point (dz ab /dx) and the inclination of the straight line connecting the point b and the point c (dz bc /dx) are shown by the following formula (2).

式(2)中代入以下式(3)、式(4),如式(5)所示,可知藉由進一步利用式(1),則依據間隙g及感測器之間的距離P可以求出位移z的二階微分亦即曲率。 In the formula (2), the following formulas (3) and (4) are substituted, and as shown in the formula (5), it is understood that the distance (g) and the distance P between the sensors can be used by further using the formula (1). The second-order differential of the displacement z is also the curvature.

感測器之間的距離P被預先設定,由此藉由依據式(1)並基於各位移感測器31a、31b、31c所輸出的感測器資料能夠求出間隙g,且將依據式(5)所求出的曲率以感測器間隔P進行二階積分,能夠求出b點上的位移z。 The distance P between the sensors is set in advance, whereby the gap g can be found based on the sensor data output from the displacement sensors 31a, 31b, 31c according to the formula (1), and the basis is (5) The obtained curvature is second-order integrated at the sensor interval P, and the displacement z at the point b can be obtained.

然而,若在物體12之表面存在垃圾、油等異物或傷痕等,並感測器資料受到異物等的影響而大幅變動,則有時難以正確求出物體12之表面形狀。因此,本實施形態所涉及之形狀測量裝置100,藉由以下將要說明的形狀測量處理對物體12之表面形狀進行測量。 However, if foreign matter such as garbage or oil or scratches are present on the surface of the object 12, and the sensor data is largely changed by the influence of foreign matter or the like, it may be difficult to accurately determine the surface shape of the object 12. Therefore, the shape measuring apparatus 100 according to the present embodiment measures the surface shape of the object 12 by the shape measuring process to be described below.

(形狀測量處理) (shape measurement processing)

第5圖係對實施形態中的形狀測量處理之流程進行例示之圖。 Fig. 5 is a view showing an example of the flow of the shape measuring process in the embodiment.

本實施形態之形狀測量處理中,首先藉由步驟S101,可移動工作台10與作為測量對象物之物體12一同朝向X方向移動,感測頭30的各位移感測器31a、31b、31c對物體12之表面進行掃描。 In the shape measurement processing of the present embodiment, first, in step S101, the movable table 10 moves in the X direction together with the object 12 as the measurement target, and the displacement sensors 31a, 31b, 31c of the sensor head 30 are paired. The surface of the object 12 is scanned.

接著,藉由步驟S102,感測器資料取得部21從各位移感測器31a、31b、31c取得感測器資料。第6圖係對實 施形態中的感測器資料進行例示之圖。各位移感測器31a、31b、31c輸出感測器資料來作為與物體12之表面的測定點之間的距離。第5圖中所示出之曲線圖中,以一點虛線表示第1位移感測器31a的資料,以實線表示第2位移感測器31b的資料,以虛線表示第3位移感測器31c的資料。 Next, in step S102, the sensor data acquisition unit 21 acquires sensor data from the displacement sensors 31a, 31b, and 31c. Figure 6 is true The sensor data in the configuration is illustrated. Each of the displacement sensors 31a, 31b, 31c outputs sensor data as a distance from a measurement point of the surface of the object 12. In the graph shown in Fig. 5, the data of the first displacement sensor 31a is indicated by a dashed line, the data of the second displacement sensor 31b is indicated by a solid line, and the third displacement sensor 31c is indicated by a broken line. data of.

其中,若在物體12之表面存在異物等,則如第6圖所例示,在存在異物等的部分感測器資料大幅變動。第6圖中所示出之例中,位移感測器31a中為150mm附近,位移感測器31b中為250mm附近,位移感測器31c中為350mm附近,由於異物等的影響感測器資料分別成為非常大的值。另外,由於各位移感測器31a、31b、31c在掃描方向即X方向上隔開間隔而設置,因此即使為同一表面上的測量結果,由異物等所導致的資料變動位置亦不同。 In the case where foreign matter or the like is present on the surface of the object 12, as shown in Fig. 6, the sensor data in the presence of foreign matter or the like largely changes. In the example shown in Fig. 6, the displacement sensor 31a is in the vicinity of 150 mm, the displacement sensor 31b is in the vicinity of 250 mm, and the displacement sensor 31c is in the vicinity of 350 mm, and the sensor data is affected by foreign matter or the like. They become very large values. Further, since the displacement sensors 31a, 31b, and 31c are provided at intervals in the scanning direction, that is, in the X direction, even if the measurement results on the same surface are different, the position of data fluctuation caused by foreign matter or the like is different.

回到第5圖的流程,接著藉由步驟S103,間隙資料計算部23依據式(1)從各位移感測器31a、31b、31c的感測器資料計算間隙資料。第7圖係由第6圖中所示出之感測器資料計算出之間隙資料計算例。 Returning to the flow of Fig. 5, the gap data calculating unit 23 calculates the gap data from the sensor data of the displacement sensors 31a, 31b, and 31c in accordance with the equation (1). Fig. 7 is an example of calculation of the gap data calculated from the sensor data shown in Fig. 6.

如上述,若在物體12之表面存在異物等,則因受到異物等的影響而產生間隙資料大幅變動的部分,並難以正確求出物體12之表面形狀。因此,本實施形態之形狀測量處理中,藉由步驟S104,插值處理部25對間隙資料執行插值處理。 As described above, when foreign matter or the like is present on the surface of the object 12, the gap data greatly changes due to the influence of foreign matter or the like, and it is difficult to accurately obtain the surface shape of the object 12. Therefore, in the shape measurement processing of the present embodiment, the interpolation processing unit 25 performs interpolation processing on the gap data in step S104.

(插值處理) (interpolation processing)

第8圖係對實施形態中的插值處理的流程進行例示之圖。 Fig. 8 is a view showing an example of the flow of the interpolation processing in the embodiment.

插值處理中,首先藉由步驟S201,插值處理部25對間隙資料的平均值及標準偏差σ進行計算。接著,藉由步驟S202,插值處理部25對間隙資料中有無存在(平均值±3σ)的範圍外之資料進行判定。 In the interpolation processing, first, in step S201, the interpolation processing unit 25 calculates the average value and the standard deviation σ of the gap data. Next, in step S202, the interpolation processing unit 25 determines the presence or absence of the data in the presence or absence of the gap data (average value ±3σ).

若不存在(平均值±3σ)的範圍外之資料(步驟S202:否),則進入步驟S203,插值處理部25判斷為在物體12之表面不存在異物等並將異物標誌設定為“False”,並結束插值處理。 If there is no data outside the range of (average value ±3σ) (step S202: NO), the process proceeds to step S203, and the interpolation processing unit 25 determines that there is no foreign matter on the surface of the object 12 and sets the foreign matter flag to "False". And end the interpolation process.

若存在(平均值±3σ)的範圍外之資料(步驟S202:是),則進入步驟S204,插值處理部25判斷為在物體12之表面存在異物等並將異物標誌設定為“True”。接著,藉由步驟S205,插值處理部25以平均值對間隙資料中(平均值±3σ)的範圍外之資料進行插值。 If there is any data outside the range of (average value ±3σ) (step S202: YES), the process proceeds to step S204, and the interpolation processing unit 25 determines that foreign matter is present on the surface of the object 12 and sets the foreign matter flag to "True". Next, in step S205, the interpolation processing unit 25 interpolates the data outside the range of the gap data (average value ±3σ) by the average value.

例如,在第9圖中所示出之間隙資料中存在(平均值±3σ)的範圍外之資料。在該種情況下,例如,如第10圖(A)所示,插值處理部25對大於(平均值+3σ)的資料進行刪除,並如第10圖(B)所示以平均值對刪除的部分進行插值。同樣,插值處理部25對小於(平均值-3σ)的資料進行刪除,並以平均值對刪除的部分進行插值。藉由該種處理,間隙資料中的存在於物體12之表面的異物的影響得以減少。 For example, there is data outside the range of (mean ± 3σ) in the gap data shown in Fig. 9. In this case, for example, as shown in FIG. 10(A), the interpolation processing unit 25 deletes the data larger than (average value +3σ) and deletes it by the average value as shown in FIG. 10(B). The part is interpolated. Similarly, the interpolation processing unit 25 deletes the data smaller than (average - 3σ), and interpolates the deleted portion with the average value. With this treatment, the influence of the foreign matter existing on the surface of the object 12 in the gap data is reduced.

接著,藉由步驟S206,插值處理部25再次對間隙資料的平均值及標準偏差進行計算。第11圖係從第9圖中所示出之間隙資料中以平均值對(平均值±3σ)的範圍外之資料進行插值後的間隙資料。如第11圖所示,若存在(平均值±3σ)的範圍外之資料,則藉由步驟S207,插值處理部25同樣以平均值對(平均值±3σ)的範圍外之資料進行插值。 Next, in step S206, the interpolation processing unit 25 calculates the average value and the standard deviation of the gap data again. Fig. 11 is a gap data obtained by interpolating data outside the range of the average value (mean ± 3σ) from the gap data shown in Fig. 9. As shown in Fig. 11, if there is data outside the range of (average ± 3σ), the interpolation processing unit 25 similarly interpolates the data outside the range of the average value (mean ± 3σ) by the step S207.

步驟S208中,插值處理部25對計算出的標準偏差σn與之前計算出的標準偏差σn-1的變化率|(σnn-1)/σn×100|(%)進行計算,並判定標準偏差σ的變化率是否小於0.1%。插值處理部25反覆執行步驟S206、S207的處理,直至標準偏差σ的變化率例如小於0.1%。藉由反覆執行步驟S206、S207的處理,間隙資料中存在於物體12之表面的異物的影響進一步減少。 In step S208, the interpolation processing unit 25 performs the rate of change |(σ nn-1 )/σ n ×100|(%) of the calculated standard deviation σ n and the previously calculated standard deviation σ n-1 . Calculate and determine whether the rate of change of the standard deviation σ is less than 0.1%. The interpolation processing unit 25 repeatedly performs the processing of steps S206 and S207 until the rate of change of the standard deviation σ is, for example, less than 0.1%. By repeatedly performing the processes of steps S206 and S207, the influence of the foreign matter existing on the surface of the object 12 in the gap data is further reduced.

第12圖係反覆執行步驟S206、S207的處理,直至標準偏差σ的變化率小於0.1%的間隙資料。與第9圖中所示出之插值處理前的間隙資料相比較,可知第12圖中所示出之間隙資料中因存在於物體12之表面的異物所導致的資料變動大幅減少。另外,標準偏差σ的變化率的目標值並不限定於0.1%,例如依據所需測定精度等可適當設定。 Fig. 12 is a step of repeatedly performing the processing of steps S206 and S207 until the rate of change of the standard deviation σ is less than 0.1%. As compared with the gap data before the interpolation processing shown in Fig. 9, it can be seen that the data variation due to the foreign matter existing on the surface of the object 12 in the gap data shown in Fig. 12 is greatly reduced. In addition, the target value of the rate of change of the standard deviation σ is not limited to 0.1%, and can be appropriately set depending on, for example, the required measurement accuracy.

接著,藉由步驟S209,插值處理部25利用插值資料前後的資料各自的平均值,對間隙資料中包括插值資料前後的資料之插值區域的資料進行線性插值。利用第13圖 對步驟S209的處理進行具體說明。 Next, in step S209, the interpolation processing unit 25 linearly interpolates the data of the interpolation region including the data before and after the interpolation data in the gap data by using the average value of the data before and after the interpolation data. Using Figure 13 The processing of step S209 will be specifically described.

如第13圖(A)所示,插值處理部25中,將包括間隙資料中的以平均值進行插值之插值資料與插值資料前後的資料(例如,前後各3mm)的範圍設為插值區域。另外,插值區域並不限定於包括插值資料的前後各3mm的範圍,例如,藉由測量條件等可適當設定。 As shown in FIG. 13(A), the interpolation processing unit 25 sets the range of the interpolation data including the average value in the gap data and the data before and after the interpolation data (for example, 3 mm in front and rear) as the interpolation region. Further, the interpolation region is not limited to a range of 3 mm each including the front and rear of the interpolation data, and can be appropriately set by, for example, measurement conditions.

接著,插值處理部25對插值區域中的插值資料前後的資料各自的平均值進行計算。第13圖(A)的例中,插值資料前的資料(第13圖中的插值資料的左側)之平均值為a,插值資料後的資料(第13圖中的插值資料的右側)之平均值為b。如第13圖(B)所示,插值處理部25刪除插值區域中的間隙資料,以連結平均值a與平均值b的直線對插值區域進行線性插值。 Next, the interpolation processing unit 25 calculates an average value of each of the data before and after the interpolation data in the interpolation region. In the example of Fig. 13(A), the average value of the data before the interpolation data (the left side of the interpolation data in Fig. 13) is a, and the average of the data after the interpolation data (the right side of the interpolation data in Fig. 13) is average. The value is b. As shown in FIG. 13(B), the interpolation processing unit 25 deletes the gap data in the interpolation region, and linearly interpolates the interpolation region by connecting the straight line of the average value a and the average value b.

第14圖係對第12圖中所示出之間隙資料至對插值區域進行線性插值之後的間隙資料進行例示之圖。第14圖中所示出之間隙資料中,可知在第12圖的間隙資料中分別殘留於X座標的150mm附近、250mm附近、350mm附近之存在於物體12之表面的異物的影響得以減少。 Fig. 14 is a diagram illustrating the gap data shown in Fig. 12 to the gap data after linear interpolation of the interpolation region. In the gap data shown in Fig. 14, it is understood that the influence of foreign matter existing on the surface of the object 12 in the vicinity of 150 mm, around 250 mm, and around 350 mm of the X coordinate in the gap data of Fig. 12 is reduced.

另外,藉由步驟S201至S208的處理,在間隙資料中能夠減少異物等的影響的情況下,可以不對步驟S209中之插值區域進行線性插值。 Further, in the case where the influence of foreign matter or the like can be reduced in the gap data by the processing of steps S201 to S208, the interpolation region in step S209 may not be linearly interpolated.

藉由插值處理部25執行以上所說明之插值處理,並去除間隙資料中存在於物體12之表面的異物之影響,則回到第5圖中所示出之形狀測量處理,並進入步驟 S105。 The interpolation processing unit 25 performs the interpolation processing described above, and removes the influence of the foreign matter existing on the surface of the object 12 in the gap data, and returns to the shape measurement processing shown in FIG. 5, and proceeds to the step. S105.

步驟S105中,形狀計算部27利用藉由插值處理部25執行插值處理的間隙資料,並基於式(5)對物體12之表面形狀進行計算。並且,由形狀計算部27計算出的物體12之表面形狀顯示於顯示裝置40。 In step S105, the shape calculation unit 27 calculates the surface shape of the object 12 based on the equation (5) by using the gap data of the interpolation processing by the interpolation processing unit 25. Further, the surface shape of the object 12 calculated by the shape calculating unit 27 is displayed on the display device 40.

接著,步驟S106中,插值處理部25判定異物標誌是否為“True”。異物標誌為“True”(步驟S106:是),則藉由步驟S107,作為警告例如將“在比最前列更靠近136mm附近檢測出垃圾等的異物”等的異物檢測結果顯示於顯示裝置40。異物標誌為“False”(步驟S106:否),則結束處理而不顯示異物檢測結果。 Next, in step S106, the interpolation processing unit 25 determines whether or not the foreign matter flag is "True". When the foreign matter flag is "True" (step S106: YES), the foreign matter detection result such as "detecting foreign matter such as garbage in the vicinity of the forefront of 136 mm" is displayed on the display device 40 as a warning, for example, in step S107. When the foreign matter flag is "False" (step S106: NO), the processing is ended without displaying the foreign matter detection result.

使用形狀測量裝置100的操作員從顯示於顯示裝置40的警告中意識到存在異物等,若欲以進一步高的高精度進行測量,則可在將異物等去除後再次執行測量。 The operator using the shape measuring device 100 recognizes that there is a foreign matter or the like from the warning displayed on the display device 40, and if the measurement is to be performed with higher accuracy, the measurement can be performed again after removing the foreign matter or the like.

第15圖係第14圖中所示出之藉由已執行插值處理的間隙資料計算出之表面存在異物等的物體12之表面形狀測量結果。並且,將表面不存在垃圾等的異物的物體12之表面形狀測量結果示出於第16圖。第15圖與第16圖係相同物體12的相同部分之表面形狀測量結果,而在有無存在異物方面則不同。並且,將未利用第7圖中所示出之受到異物等的影響之間隙資料執行插值處理而直接求出之表面形狀測量結果示出於第17圖。 Fig. 15 is a view showing the surface shape measurement result of the object 12 in which foreign matter or the like is present on the surface calculated by the gap data on which the interpolation processing has been performed, as shown in Fig. 14. Further, the surface shape measurement result of the object 12 in which foreign matter such as garbage is not present on the surface is shown in Fig. 16. Fig. 15 and Fig. 16 show the surface shape measurement results of the same portion of the same object 12, but differ in the presence or absence of foreign matter. In addition, the surface shape measurement result which is directly obtained by performing interpolation processing using the gap data which is affected by foreign matter or the like shown in FIG. 7 is shown in FIG.

如第17圖所示,在未對表面存在異物等的物體12之表面形狀執行插值處理而直接進行測量之結果,與第16 圖中所示出之不存在異物等的物體12之表面形狀測量結果相比大有不同。如上述,可知在間隙資料受到存在於物體12之表面的異物等的影響之情況下,結果與物體12的實際表面形狀大有不同。 As shown in Fig. 17, the results of the measurement are directly performed by performing interpolation processing on the surface shape of the object 12 in which foreign matter or the like is present on the surface, and the 16th The surface shape measurement result of the object 12 in which no foreign matter or the like is present as shown in the drawing is considerably different. As described above, it is understood that when the gap data is affected by foreign matter or the like existing on the surface of the object 12, the result is greatly different from the actual surface shape of the object 12.

相對於此,可知第15圖中所示出之本實施形態中之表面形狀測量結果中得到與第16圖中所示出之不存在異物時之物體12之表面形狀測量結果相同的結果。如上述,藉由本實施形態,藉由執行上述插值處理而減少間隙資料中的異物的影響,即使在物體12之表面存在異物等的情況下,亦能夠得到與不存在異物等時相同之表面形狀測量結果。 On the other hand, in the surface shape measurement result in the present embodiment shown in Fig. 15, it is found that the surface shape measurement result of the object 12 when there is no foreign matter shown in Fig. 16 is obtained. As described above, according to the present embodiment, by performing the interpolation processing described above, the influence of the foreign matter in the gap data is reduced, and even when foreign matter or the like is present on the surface of the object 12, the same surface shape as when no foreign matter or the like is present can be obtained. Measurement results.

如以上說明,藉由本實施形態所涉及之形狀測量裝置100,即使為在表面存在垃圾、油等異物、傷痕等物體12,亦能夠以高精度對表面形狀進行測量。 As described above, the shape measuring apparatus 100 according to the present embodiment can measure the surface shape with high precision even if the object 12 such as foreign matter or scratches such as garbage or oil is present on the surface.

並且,本實施形態所涉及之搭載有形狀測量裝置100的加工裝置200中,在對物體12之表面進行磨削之後,藉由在將物體12搭載於可移動工作台10的狀態下藉由形狀測量裝置100所執行之表面形狀測量結果,能夠進行校正加工等。從而,能夠以高效率、高精度對物體12進行加工。 Further, in the processing apparatus 200 equipped with the shape measuring apparatus 100 according to the present embodiment, after the surface of the object 12 is ground, the shape is mounted on the movable table 10 by the shape. The surface shape measurement result performed by the measuring apparatus 100 can perform correction processing or the like. Therefore, the object 12 can be processed with high efficiency and high precision.

以上,對實施形態所涉及之形狀測量裝置、加工裝置及形狀測量方法進行了說明,但本發明並不限定於上述實施形態,在本發明之範圍內可施以各種變更及改良。 In the above, the shape measuring device, the processing device, and the shape measuring method according to the embodiment have been described. However, the present invention is not limited to the above embodiment, and various modifications and improvements can be made within the scope of the invention.

例如,形狀測量裝置100可以搭載於加工裝置,該加 工裝置以與本實施形態不同的構成對物體12進行磨削等加工。 For example, the shape measuring device 100 can be mounted on a processing device, the plus The workpiece 12 is subjected to grinding or the like in a configuration different from that of the present embodiment.

Claims (5)

一種形狀測量裝置,藉由3個位移計配設成一列的檢測儀對測量對象物進行掃描,並對前述測量對象物之表面形狀進行測量,該形狀測量裝置的特徵在於,具備:間隙計算機構,藉由由前述3個位移計中位於中間之位移計測定的測定值和由其他位移計測定的測定值之差求出間隙資料;插值機構,求出前述間隙資料的平均值及標準偏差,並反覆執行插值處理,直至前述標準偏差的變化率成為預先設定的值以下,前述插值處理中以前述平均值對前述間隙資料中藉由前述標準偏差而設定的範圍外之值進行插值;及形狀計算機構,藉由已執行前述插值處理的前述間隙資料對前述測量對象物之表面形狀進行計算。 A shape measuring device that scans an object to be measured by a detector in which three displacement meters are arranged in a row, and measures a surface shape of the object to be measured, and the shape measuring device is characterized in that: a gap calculating mechanism is provided The gap data is obtained by the difference between the measured value measured by the displacement meter located in the middle of the three displacement meters and the measured value measured by another displacement meter; and the interpolation means determines the average value and the standard deviation of the gap data. And performing interpolation processing repeatedly until the rate of change of the standard deviation is equal to or less than a predetermined value, and the interpolation process performs interpolation on a value outside the range set by the standard deviation in the gap data by the average value; and a shape The calculation means calculates the surface shape of the object to be measured by the aforementioned gap data on which the interpolation process has been performed. 如申請專利範圍第1項所述之形狀測量裝置,其中,前述插值機構對已執行前述插值處理的前述間隙資料中包括以前述平均值進行插值的插值資料前後的資料的插值區域的值,利用前述插值區域的前述插值資料前後的資料各自的平均值進行線性插值。 The shape measuring device according to the first aspect of the invention, wherein the interpolation means includes, in the gap data in which the interpolation processing has been performed, a value of an interpolation region of data before and after interpolation data interpolated by the average value, The average value of each of the data before and after the interpolation data of the interpolation region is linearly interpolated. 如申請專利範圍第1或2項所述之形狀測量裝置,其中,該形狀測量裝置具備顯示機構,當前述間隙資料包括前述範圍外之值時,該顯示機構顯示在前述測量對象物之 表面存在異物。 The shape measuring device according to claim 1 or 2, wherein the shape measuring device includes a display mechanism, and when the gap information includes a value other than the range, the display mechanism is displayed on the object to be measured Foreign matter is present on the surface. 一種加工裝置,其特徵在於,該加工裝置具備申請專利範圍第1或2項所述之形狀測量裝置。 A processing apparatus comprising the shape measuring apparatus according to claim 1 or 2 of the patent application. 一種形狀測量方法,藉由3個位移計配設成一列的檢測儀對測量對象物進行掃描,並對前述測量對象物之表面形狀進行測量,該形狀測量方法的特徵在於,具備:間隙計算步驟,藉由由前述3的位移計中位於中間之位移計測定的測定值和由其他位移計測定的測定值之差求出間隙資料;插值步驟,求出前述間隙資料的平均值及標準偏差,並反覆執行插值處理,直至前述標準偏差的變化率成為預先設定的值以下,前述插值處理中以前述平均值對前述間隙資料中藉由前述標準偏差而設定的範圍外之值進行插值;及形狀計算步驟,藉由已執行前述插值處理的前述間隙資料對前述測量對象物之表面形狀進行計算。 A shape measuring method is characterized in that a measuring object is scanned by three detectors arranged in a row, and a surface shape of the measuring object is measured, and the shape measuring method is characterized by: a gap calculating step The gap data is obtained by the difference between the measured value measured by the displacement meter located in the middle of the displacement meter of the above 3 and the measured value measured by another displacement meter; and the interpolation step is performed to obtain the average value and the standard deviation of the gap data. And performing interpolation processing repeatedly until the rate of change of the standard deviation is equal to or less than a predetermined value, and the interpolation process performs interpolation on a value outside the range set by the standard deviation in the gap data by the average value; and a shape The calculating step calculates the surface shape of the object to be measured by the aforementioned gap data on which the interpolation process has been performed.
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