TWI534410B - Linear shape measurement method and linear shape measuring device - Google Patents

Linear shape measurement method and linear shape measuring device Download PDF

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TWI534410B
TWI534410B TW104106310A TW104106310A TWI534410B TW I534410 B TWI534410 B TW I534410B TW 104106310 A TW104106310 A TW 104106310A TW 104106310 A TW104106310 A TW 104106310A TW I534410 B TWI534410 B TW I534410B
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measured
linear shape
curvature
sampling
height data
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TW104106310A
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TW201534864A (en
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Koichi Ichihara
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Sumitomo Heavy Industries
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/30Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring roughness or irregularity of surfaces
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/30Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/303Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces using photoelectric detection means

Description

直線形狀測量方法及直線形狀測量裝置 Linear shape measuring method and linear shape measuring device

本發明係有關一種測量被測量物表面的直線形狀之方法及測量裝置。 The present invention relates to a method and a measuring device for measuring a linear shape of a surface of an object to be measured.

公知有藉由逐次三點法測量被測量物表面的直線度之技術(專利文獻1)。逐次三點法中,藉由等間距配置之3個感測器同時測量3點的高度,由測量結果求出平面的局部彎曲程度(曲率)。藉由以感測器之間的間距對所求出之曲率進行二階數值積分,求出平面的直線形狀。 A technique of measuring the straightness of the surface of an object to be measured by a three-point method is known (Patent Document 1). In the successive three-point method, the heights of three points are simultaneously measured by three sensors arranged at equal intervals, and the degree of local curvature (curvature) of the plane is obtained from the measurement results. The linear shape of the plane is obtained by second-order numerical integration of the obtained curvature by the distance between the sensors.

專利文獻2中公開有在逐次三點法中使用之3個感測器上追加第4個感測器來求出直線度之方法。3個感測器等間距配置,第4個感測器在比3個感測器中的最端部的感測器更靠內側,隔開更小的間距δ P而配置。專利文獻2公開之方法中,使包括4個感測器在內的感測器單元一邊以間距δ P移動,一邊測量被測量物表面的高度。 Patent Document 2 discloses a method of obtaining a straightness by adding a fourth sensor to three sensors used in the three-point method. The three sensors are equally spaced, and the fourth sensor is disposed on the inner side of the sensor at the end of the three sensors, spaced apart by a smaller pitch δ P . In the method disclosed in Patent Document 2, the height of the surface of the object to be measured is measured while moving the sensor unit including the four sensors at a pitch δ P .

(先前技術文獻) (previous technical literature) (專利文獻) (Patent Literature)

專利文獻1:日本特開2003-232625號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2003-232625

專利文獻2:日本特開2007-333556號公報 Patent Document 2: Japanese Laid-Open Patent Publication No. 2007-333556

明確了習知之逐次三點法等中非鏡面的具有表面粗糙度之加工面的測量結果的再現性較低。例如,若遍及1m的長度測量同一被測量物表面的直線形狀,則每次測量時都在數μm的範圍內產生偏差。因此,無法在以1μm程度以下的精確度求出直線形狀之加工表面的評價中應用習知之逐次三點法。 It is clarified that the reproducibility of the measurement results of the machined surface having the surface roughness of the non-mirror of the conventional three-point method is low. For example, if the linear shape of the surface of the same object is measured over a length of 1 m, a deviation occurs in the range of several μm per measurement. Therefore, the conventional three-point method cannot be applied to the evaluation of the processed surface of the linear shape with an accuracy of about 1 μm or less.

本發明的目的為提供一種能夠以良好的再現性測量被測量物表面的直線形狀之直線形狀測量方法及直線形狀測量裝置。 An object of the present invention is to provide a linear shape measuring method and a linear shape measuring device capable of measuring a linear shape of a surface of an object to be measured with good reproducibility.

依本發明的一觀點,提供一種直線形狀測量方法,其具有:使沿第1方向等間隔排列之3個感測器與被測量物的表面對向,對於前述被測量物一邊沿前述第1方向相對移動,一邊以1mm以下的採樣間距收集前述被測量物表面的高度資料之過程;依據前述高度資料,求出沿前述第1方向以前述採樣間距分佈於前述被測量物表面上之採樣點之曲率之過程;及 依據前述曲率,求出前述被測量物表面的直線形狀之過程。 According to one aspect of the invention, there is provided a method for measuring a linear shape, comprising: arranging three sensors arranged at equal intervals in a first direction against a surface of a workpiece, and the first object along the first object a process of collecting the height data of the surface of the object to be measured at a sampling interval of 1 mm or less with respect to the relative movement; and sampling points distributed on the surface of the object to be measured at the sampling interval along the first direction according to the height data The process of curvature; and The process of determining the linear shape of the surface of the object to be measured is based on the aforementioned curvature.

依本發明的另一觀點,提供一種直線形狀測量裝置,其具有:3個感測器,沿第1方向等間隔排列;移動機構,與被測量物的表面對向地支撐前述感測器,並且使其對於前述被測量物沿前述第1方向相對移動;及處理裝置,控制前述移動機構來使前述感測器沿前述第1方向移動,並且收集以前述感測器測量之高度資料,前述處理裝置中,使前述感測器一邊沿前述第1方向移動,一邊以1mm以下的採樣間距收集高度資料,依據前述高度資料,求出沿前述第1方向以前述採樣間距分佈於前述被測量物表面上之採樣點之曲率,依據前述曲率,求出前述被測量物表面的直線形狀。 According to another aspect of the present invention, a linear shape measuring apparatus includes: three sensors arranged at equal intervals along a first direction; and a moving mechanism that supports the sensor opposite to a surface of the object to be measured, And moving the object to be measured relative to the first direction in the first direction; and the processing device controls the moving mechanism to move the sensor in the first direction, and collects height data measured by the sensor, In the processing apparatus, the sensor is configured to collect the height data at a sampling pitch of 1 mm or less while moving in the first direction, and to obtain the sample to be measured at the sampling pitch along the first direction based on the height data. The curvature of the sampling point on the surface is obtained by determining the linear shape of the surface of the object to be measured based on the curvature.

藉由使用以1mm以下的間距採樣之採樣點的高度資料計算直線形狀,與習知之逐次三點法相比,能夠減少包含表面粗糙度之表面的直線形狀的測量結果的偏差。 By calculating the linear shape using the height data of the sampling points sampled at a pitch of 1 mm or less, it is possible to reduce the deviation of the measurement results of the linear shape of the surface including the surface roughness as compared with the conventional three-point method.

10‧‧‧可動工作台 10‧‧‧ movable workbench

11‧‧‧工作台導向機構 11‧‧‧Workbench guidance mechanism

12‧‧‧導向軌道 12‧‧‧guide track

13‧‧‧砂輪頭 13‧‧‧Wheel head

14‧‧‧砂輪 14‧‧‧ grinding wheel

15‧‧‧處理裝置 15‧‧‧Processing device

16‧‧‧輸入裝置 16‧‧‧ Input device

17‧‧‧輸出裝置 17‧‧‧Output device

20‧‧‧被測量物 20‧‧‧Measured objects

30‧‧‧感測器單元 30‧‧‧Sensor unit

31i、31j、31k‧‧‧感測器 31i, 31j, 31k‧‧‧ sensors

A、B、C‧‧‧被測量點 A, B, C‧‧‧ measured points

p‧‧‧感測器間距 P‧‧‧sensor spacing

△p‧‧‧採樣間距 △p‧‧‧Sampling spacing

第1圖A係基於實施例之直線形狀測量裝置的立體 圖,第1圖B係安裝於砂輪頭下端之感測器及被測量物的概要圖。 Fig. 1A is a perspective view of a linear shape measuring device based on an embodiment Fig. 1B is a schematic view of a sensor and an object to be measured attached to the lower end of the grinding wheel head.

第2圖係表示藉由習知之逐次三點法測量被測量物的直線形狀之結果之曲線圖。 Fig. 2 is a graph showing the result of measuring the linear shape of the object to be measured by a conventional three-point method.

第3圖A及第3圖B係被測量物的表面及感測器單元的模式圖。 3A and 3B are schematic views of the surface of the object to be measured and the sensor unit.

第4圖係基於實施例之直線形狀測量方法的流程圖。 Fig. 4 is a flow chart based on the linear shape measuring method of the embodiment.

第5圖A及第5圖B係表示藉由基於實施例之方法測量直線形狀時的被測量物與感測器單元的位置關係的時程之模式圖。 FIGS. 5A and 5B are schematic diagrams showing time courses of the positional relationship between the object to be measured and the sensor unit when the linear shape is measured by the method according to the embodiment.

第6圖係表示感測器的原點及被測量點的位置關係之線圖。 Fig. 6 is a line diagram showing the positional relationship between the origin of the sensor and the point to be measured.

第7圖係表示使用實際的測量資料計算出之曲率ρ的一例之曲線圖。 Fig. 7 is a graph showing an example of the curvature ρ calculated using actual measurement data.

第8圖係表示感測器的原點及被測量點的位置關係之線圖。 Fig. 8 is a line diagram showing the relationship between the origin of the sensor and the position of the measured point.

第9圖係表示藉由基於實施例之方法沿著被測量物表面上的同一直線進行5次直線形狀測量之結果之曲線圖。 Fig. 9 is a graph showing the results of five straight line shape measurements along the same straight line on the surface of the object to be measured by the method according to the embodiment.

第10圖係用於說明藉由基於其他實施例之方法計算直線形狀的方法的原理的線圖。 Fig. 10 is a line diagram for explaining the principle of a method of calculating a straight line shape by a method based on other embodiments.

第1圖A中示出基於實施例之直線形狀測量裝置的立體圖。該直線形狀測量裝置搭載於平面磨削裝置。可動工 作台10藉由工作台導向機構(移動機構)11支撐為能夠向單方向移動。定義將可動工作台10的移動方向作為x軸並將鉛直下方作為y軸之xyz直角座標系。 A perspective view of a linear shape measuring device according to an embodiment is shown in Fig. 1A. This linear shape measuring device is mounted on a surface grinding device. Start work The stage 10 is supported by the table guiding mechanism (moving mechanism) 11 so as to be movable in one direction. The xyz rectangular coordinate system that defines the moving direction of the movable table 10 as the x-axis and the vertical lower side as the y-axis is defined.

導向軌道12將砂輪頭13支撐於可動工作台10的上方。砂輪頭13能夠沿著導向軌道12沿z軸方向移動。並且,砂輪頭13能夠對於可動工作台10沿y方向升降。在砂輪頭13的下端安裝有砂輪14。砂輪14具有圓柱狀外形,其中心軸以與z軸平行之姿勢安裝於砂輪頭13。 The guide rail 12 supports the grinding wheel head 13 above the movable table 10. The grinding wheel head 13 is movable along the guide rail 12 in the z-axis direction. Further, the grinding wheel head 13 can be raised and lowered in the y direction with respect to the movable table 10. A grinding wheel 14 is attached to the lower end of the grinding wheel head 13. The grinding wheel 14 has a cylindrical outer shape, and its central axis is attached to the grinding wheel head 13 in a posture parallel to the z-axis.

在可動工作台10上保持有被測量物(被磨削物)20。在使砂輪14與被測量物20的表面接觸之狀態下,一邊使砂輪14旋轉,一邊使可動工作台10沿x方向移動,藉此能夠磨削被測量物20的表面。 The object to be measured (ground material) 20 is held on the movable table 10. When the grinding wheel 14 is brought into contact with the surface of the object to be measured 20, the movable table 10 is moved in the x direction while rotating the grinding wheel 14, whereby the surface of the object 20 can be ground.

從輸入裝置16向處理裝置15輸入測量直線形狀所需的各種指令值。該指令值中包括測量直線形狀時的可動工作台10的移動速度、表面粗糙度的空間頻率、測量開始訊號等。處理裝置15依據測量結果計算直線形狀,將其結果輸出至輸出裝置17。 Various command values required to measure a straight line shape are input from the input device 16 to the processing device 15. The command value includes a moving speed of the movable table 10 when measuring a straight line shape, a spatial frequency of the surface roughness, a measurement start signal, and the like. The processing device 15 calculates a straight line shape based on the measurement result, and outputs the result to the output device 17.

如第1圖B所示,在砂輪頭13的下端安裝有感測器單元30。感測器單元30中安裝有3個感測器31i、31j及31k。感測器31i、31j及31k與被測量物20的表面對向。 作為感測器31i、31j、31k,例如使用具有能夠檢測表面粗糙度的振幅程度,例如超微級以下的位移的高分辨率之雷射位移計。感測器31i、31j、31k能夠測量從各個感測器31i、31j、31k的原點至被測量物20的表面為止的距 離。進行校準,以使以zx平面為基準時的感測器31i、31j、31k的原點的高度均相等。 As shown in FIG. 1B, the sensor unit 30 is attached to the lower end of the grinding wheel head 13. Three sensors 31i, 31j, and 31k are mounted in the sensor unit 30. The sensors 31i, 31j, and 31k are opposed to the surface of the object 20 to be measured. As the sensors 31i, 31j, and 31k, for example, a high-resolution laser displacement meter having a degree of amplitude capable of detecting surface roughness, for example, a displacement of ultra-fine level or lower is used. The sensors 31i, 31j, 31k are capable of measuring the distance from the origin of each of the sensors 31i, 31j, 31k to the surface of the object 20 to be measured from. The calibration is performed such that the heights of the origins of the sensors 31i, 31j, 31k when the zx plane is the reference are equal.

3個感測器31i、31j、31k沿x方向等間隔排列。將相互相鄰之感測器31i與31j的原點的間距及感測器31j與31k的原點的間距稱為感測器間距。以p表示該感測器間距。3個感測器31i、31j、31k的被測量點在被測量物20的表面上亦沿x方向以感測器間距p排列。感測器間距p例如為100mm。使砂輪頭13對於被測量物20一邊沿x方向相對移動一邊進行測量,藉此能夠測量x方向上的被測量物20的表面的直線形狀。另外,實際上,藉由使可動工作台10沿x方向移動,使被測量物20對於砂輪頭13沿x方向相對移動。從感測器31i、31j、31k向處理裝置15(第1圖A)輸入測量資料。 The three sensors 31i, 31j, and 31k are arranged at equal intervals in the x direction. The pitch of the origins of the sensors 31i and 31j adjacent to each other and the pitch of the origins of the sensors 31j and 31k are referred to as sensor pitches. The sensor spacing is denoted by p. The measured points of the three sensors 31i, 31j, 31k are also arranged on the surface of the object 20 in the x direction at the sensor pitch p. The sensor pitch p is, for example, 100 mm. The grinding wheel head 13 is measured while moving relative to the object 20 in the x direction, whereby the linear shape of the surface of the object 20 in the x direction can be measured. Further, actually, by moving the movable table 10 in the x direction, the object to be measured 20 is relatively moved in the x direction with respect to the grinding wheel head 13. Measurement data is input from the sensors 31i, 31j, and 31k to the processing device 15 (Fig. 1A).

參閱第2圖,對藉由習知之逐次三點法測量被測量物的直線形狀時的課題進行說明。習知之逐次三點法中,使感測器單元30(第1圖B)一邊沿x方向以與感測器間距p相等的採樣間距移動,一邊藉由感測器31i、31j、31k測量被測量物表面的高度。由測量結果求出被測量點(採樣點)之曲率。藉由對所求出之曲率以採樣間距進行二階積分,求出被測量物表面的直線形狀。為了評價基於習知之逐次三點法之測量結果,沿被測量物表面上的同一直線進行了5次測量。 Referring to Fig. 2, a problem in the case of measuring the linear shape of the object to be measured by a conventional three-point method will be described. In the conventional three-point method, the sensor unit 30 (Fig. 1B) is moved in the x direction at a sampling pitch equal to the sensor pitch p, and is measured by the sensors 31i, 31j, 31k. Measure the height of the surface of the object. The curvature of the measured point (sampling point) is obtained from the measurement result. The linear shape of the surface of the object to be measured is obtained by performing second-order integration on the obtained curvature at the sampling pitch. In order to evaluate the measurement results based on the conventional three-point method, five measurements were made along the same line on the surface of the object to be measured.

第2圖中示出5次測量的結果。橫軸以單位“mm”表示距所測量之直線上的基準點的距離,縱軸以單位“μm” 表示距被測量物表面的基準高度的位移。第2圖的星形、四角形、三角形、六角形、圓形的記號分別表示第1~第5次的測量結果。如第2圖所示,可知5次的測量結果之間產生了較大的偏差。 The results of the five measurements are shown in Fig. 2. The horizontal axis represents the distance from the reference point on the measured line in units of "mm", and the vertical axis is in units of "μm". Indicates the displacement from the reference height of the surface of the object being measured. The symbols of the star, the quadrangle, the triangle, the hexagon, and the circle in Fig. 2 indicate the first to fifth measurement results, respectively. As shown in Fig. 2, it can be seen that there is a large variation between the five measurement results.

例如,第5次的測量結果(圓形記號)中,表面從測量距離400mm朝向600mm的位置下降約2μm,但第2次的測量結果(四角形記號)中,表面從測量距離400mm朝向600mm的位置上升約5μm。如此,由於測量結果不一致,無法以高精確度測量直線形狀。 For example, in the fifth measurement result (circular mark), the surface is lowered by about 2 μm from a measurement distance of 400 mm toward a position of 600 mm, but in the second measurement result (quadruple mark), the surface is measured from a distance of 400 mm to a position of 600 mm. It rises by about 5 μm. Thus, since the measurement results are inconsistent, the linear shape cannot be measured with high accuracy.

參閱第3圖A及第3圖B,對測量結果的偏差原因進行說明。第3圖A中示出被測量物20的表面及感測器單元30的模式圖。被測量物20的表面具有在較長週期的波動上重疊較短週期的表面粗糙度的形狀。第3圖A中,以虛線表示僅考慮波動之表面,以實線表示考慮到表面粗糙度之實際表面。例如,已進行精密磨削之表面的表面粗糙度的空間頻率為數十循環/mm左右,表面粗糙度的高低差在0.1μm~數μm的範圍內。 Refer to Fig. 3A and Fig. 3B for explaining the cause of the deviation of the measurement results. A schematic view of the surface of the object 20 and the sensor unit 30 is shown in FIG. The surface of the object 20 to be measured has a shape that overlaps the surface roughness of a shorter period on the fluctuation of a longer period. In Fig. 3A, the surface on which only the fluctuation is considered is indicated by a broken line, and the actual surface in consideration of the surface roughness is indicated by a solid line. For example, the surface roughness of the surface subjected to precision grinding is about several tens of cycles/mm, and the difference in surface roughness is in the range of 0.1 μm to several μm.

因此,即便感測器單元30沿x方向僅偏離數μm,藉由3個感測器31i、31j、31k測量之被測量點A、B、C的高度亦大幅變動。其結果,導致由測量出之高度資料計算出之曲率亦大幅變動,且每次測量時藉由對曲率進行二階積分來獲得之直線形狀亦不一致。並且,假設每次測量時被測量點A、B、C的位置一致,但所測量之高度資料並非反映波動形狀其本身的資料,而係反映在波動形狀上重 疊有表面粗糙度形狀的資料。表面粗糙度的振幅與波動的波高值相同程度或為波高值以上,因此無法由測量到的高度資料準確地求出僅依據直線形狀的曲率。 Therefore, even if the sensor unit 30 is shifted by only several μm in the x direction, the heights of the measured points A, B, and C measured by the three sensors 31i, 31j, and 31k largely fluctuate. As a result, the curvature calculated from the measured height data also largely changes, and the linear shape obtained by second-order integration of the curvature at each measurement is also inconsistent. Also, it is assumed that the positions of the measured points A, B, and C are the same at each measurement, but the measured height data does not reflect the data of the wave shape itself, but is reflected in the wave shape. A material with a surface roughness shape. The amplitude of the surface roughness is equal to or higher than the wave height value of the fluctuation, and therefore the curvature based on the linear shape cannot be accurately obtained from the measured height data.

例如,第3圖A中,基於感測器31i的被測量點A位於表面粗糙度的波峰與波谷的大致中間,而第3圖B中,被測量點A位於表面粗糙度的波峰的頂點。若藉由3個感測器31i、31j、31k測量之被測量點A、B、C的高度不一致,則導致根據該高度計算之曲率亦不一致。其結果,由曲率求出之直線形狀的測量結果亦產生偏差。以下說明的實施例中能夠降低該偏差。 For example, in FIG. 3A, the measured point A based on the sensor 31i is located substantially in the middle of the peak of the surface roughness and the trough, and in FIG. 3B, the measured point A is located at the vertex of the peak of the surface roughness. If the heights of the points to be measured A, B, and C measured by the three sensors 31i, 31j, and 31k do not match, the curvature calculated based on the height is also inconsistent. As a result, the measurement result of the linear shape obtained by the curvature also varies. This deviation can be reduced in the embodiment described below.

參閱第4圖~第7圖,對基於實施例之直線形狀測量裝置及直線形狀測量方法進行說明。第4圖中示出基於實施例之直線形狀測量方法的流程圖。 The linear shape measuring device and the linear shape measuring method according to the embodiment will be described with reference to FIGS. 4 to 7 . A flowchart of the linear shape measuring method based on the embodiment is shown in FIG.

步驟S1中,對直線形狀測量裝置輸入高度資料的收集條件。該輸入藉由輸入裝置16(第1圖)進行。高度資料的收集條件中包括掃描速度V、被測量物20的表面粗糙度的最大空間頻率Fmax及感測器間距p。另外,感測器間距p可預先存儲於處理裝置15。 In step S1, the collection condition of the height data is input to the linear shape measuring device. This input is performed by the input device 16 (Fig. 1). The collection conditions of the height data include the scanning speed V, the maximum spatial frequency Fmax of the surface roughness of the object 20 to be measured, and the sensor pitch p. In addition, the sensor pitch p may be stored in advance in the processing device 15.

步驟S2中,確定採樣頻率Fs。採樣頻率Fs的確定可由處理裝置15(第1圖)進行,亦可由操作者確定採樣頻率Fs。由操作者確定採樣頻率Fs時,從輸入裝置16(第1圖)輸入所確定之採樣頻率Fs。 In step S2, the sampling frequency Fs is determined. The determination of the sampling frequency Fs can be performed by the processing device 15 (Fig. 1), or the sampling frequency Fs can be determined by the operator. When the operator determines the sampling frequency Fs, the determined sampling frequency Fs is input from the input device 16 (Fig. 1).

採樣頻率Fs以滿足不等式Fs2×V×Fmax的方式確定。以下,對該不等式的物理意義進行說明。上述不等式 能夠改寫為V/Fs1/(2×Fmax)。左邊的V/Fs等於收集高度資料之x方向的採樣間距(以下,稱為採樣間距△p)。 右邊的1/(2×Fmax)等於表面粗糙度的最小週期Pmin的1/2。亦即,上述不等式表示採樣間距△p為表面粗糙度的最小週期Pmin的1/2以下。 Sampling frequency Fs to satisfy the inequality Fs The mode of 2 × V × Fmax is determined. Hereinafter, the physical meaning of the inequality will be described. The above inequality can be rewritten as V/Fs 1/(2×Fmax). The V/Fs on the left is equal to the sampling pitch in the x direction of the collected height data (hereinafter, referred to as the sampling pitch Δp). The 1/(2 × Fmax) on the right side is equal to 1/2 of the minimum period Pmin of the surface roughness. That is, the above inequality indicates that the sampling pitch Δp is 1/2 or less of the minimum period Pmin of the surface roughness.

步驟S3中,使感測器31i、31j、31k對於被測量物20一邊沿x方向以掃描速度V相對移動,一邊以採樣頻率Fs收集高度資料。另外,實際上如第1圖A及第1圖B所示,使感測器31i、31j、31k靜止,使被測量物20沿x方向移動。 In step S3, the sensors 31i, 31j, and 31k are relatively moved with respect to the object 20 in the x direction at the scanning speed V, and the height data is collected at the sampling frequency Fs. Further, actually, as shown in FIG. 1A and FIG. 1B, the sensors 31i, 31j, and 31k are stationary, and the object 20 is moved in the x direction.

第5圖A及第5圖B中示出在步驟S3中測量高度資料時的被測量物20與感測器單元30的位置關係的時程。 在第5圖A所示之狀態下,以感測器31i、31j、31k分別收集高度資料a、b、c。在此,高度資料a、b、c表示分別從感測器31i、31j、31k的原點至被測量物20的被測量點A、B、C為止的距離。 The time course of the positional relationship between the object 20 to be measured and the sensor unit 30 when the height data is measured in step S3 is shown in FIGS. 5A and 5B. In the state shown in Fig. 5A, the height data a, b, and c are collected by the sensors 31i, 31j, and 31k, respectively. Here, the height data a, b, and c indicate the distances from the origin of the sensors 31i, 31j, and 31k to the measured points A, B, and C of the object 20, respectively.

如第5圖B所示,在感測器單元30對於被測量物20沿x方向僅移動採樣間距△p的時點,收集高度資料a、b、c。與步驟S2(第4圖)中確定之採樣頻率Fs對應之採樣間距△p為表面粗糙度的最小週期Pmin的1/2以下。 藉由以採樣頻率Fs收集高度資料a、b、c,收集沿x方向以採樣間距△p排列之複數個被測量點A、B、C的高度資料。藉由將採樣間距△p設為表面粗糙度的最小週期Pmin的1/2以下,能夠避免伴隨採樣的混疊現象。 As shown in FIG. 5B, the height data a, b, and c are collected when the sensor unit 30 moves only the sampling pitch Δp in the x direction with respect to the object 20 to be measured. The sampling pitch Δp corresponding to the sampling frequency Fs determined in step S2 (Fig. 4) is 1/2 or less of the minimum period Pmin of the surface roughness. The height data of the plurality of measured points A, B, and C arranged at the sampling pitch Δp in the x direction are collected by collecting the height data a, b, and c at the sampling frequency Fs. By setting the sampling pitch Δp to 1/2 or less of the minimum period Pmin of the surface roughness, the aliasing phenomenon accompanying sampling can be avoided.

步驟S4(第4圖)中,執行對於所收集之高度資料a、b、c去除具有小於感測器間距P的2倍的波長之波形成份之低通濾波處理。該低通濾波處理由處理裝置15(第1圖A)執行。 In step S4 (Fig. 4), low-pass filtering processing for removing the waveform components having a wavelength smaller than twice the sensor pitch P for the collected height data a, b, c is performed. This low pass filtering process is executed by the processing device 15 (Fig. 1A).

步驟S5中,依據低通濾波處理後的高度資料a、b、c,計算在被測量物20的表面沿x方向以採樣間距△p分佈之採樣點之曲率ρ。 In step S5, the curvature ρ of the sampling point distributed at the sampling pitch Δp in the x direction on the surface of the object 20 is calculated based on the height data a, b, and c after the low pass filtering process.

參閱第6圖,對曲率ρ的求出方法進行說明。第6圖表示感測器31i、31j、31k的原點D、E、F及被測量點A、B、C的位置關係。線段DA的長度相當於高度資料a,線段EB的長度相當於高度資料b,線段FC的長度相當於高度資料c。線段DE的長度及線段EF的長度相當於感測器間距p。以r表示通過3個被測量點A、B、C之圓周的半徑,以O表示該圓周的中心。 Referring to Fig. 6, a method of obtaining the curvature ρ will be described. Fig. 6 shows the positional relationship of the origins D, E, and F of the sensors 31i, 31j, and 31k and the points to be measured A, B, and C. The length of the line segment DA corresponds to the height data a, the length of the line segment EB corresponds to the height data b, and the length of the line segment FC corresponds to the height data c. The length of the line segment DE and the length of the line segment EF correspond to the sensor pitch p. The radius of the circumference passing through the three measured points A, B, and C is represented by r, and the center of the circumference is represented by O.

以G表示線段EB與線段AC的交點,以H表示線段BO與線段AC的交點。如下表示線段BG的長度g。 The intersection of the line segment EB and the line segment AC is indicated by G, and the intersection of the line segment BO and the line segment AC is indicated by H. The length g of the line segment BG is expressed as follows.

g=b-(a+c)/2…(1) g=b-(a+c)/2...(1)

長度g表示從被測量物20的被測量點A至被測量點C為止的表面的彎曲程度。長度g亦可稱為表示被測量物20的表面高度之高度資料。 The length g indicates the degree of bending of the surface from the measured point A of the object 20 to be measured to the point C to be measured. The length g may also be referred to as height data indicating the height of the surface of the object 20 to be measured.

線段EB與線段BO所呈之角度非常小。因此,能夠使線段GB的長度與線段HB的長度相等,並使線段GC 的長度與線段HC的長度相等或近似。因此,能夠使線段HB的長度與g近似,線段HC的長度與p近似。線段OH的長度與r-g近似。若在直角三角形OHC中應用勾股定理,則成立如下公式。 The angle between the line segment EB and the line segment BO is very small. Therefore, the length of the line segment GB can be made equal to the length of the line segment HB, and the line segment GC can be made The length is equal to or approximate to the length of the line segment HC. Therefore, the length of the line segment HB can be approximated by g, and the length of the line segment HC is approximated to p. The length of the line segment OH is similar to r-g. If the Pythagorean theorem is applied in a right triangle OHC, the following formula is established.

r2=(r-g)2+p2…(2) r 2 =(rg) 2 +p 2 (2)

曲率ρ定義為ρ=1/r,因此從該定義式及公式(2)獲得如下公式。 The curvature ρ is defined as ρ = 1 / r, so the following formula is obtained from the definition formula and the formula (2).

ρ=1/r=2g/(g2+p2)…(3) ρ=1/r=2g/(g 2 +p 2 )...(3)

若在公式(3)的右邊的g代入公式(1),則能夠計算被測量點B之曲率ρ。p為100mm左右,因此g為微米級。由於能夠假定為p充份大於g(p>>g),因此能夠使公式(3)與如下公式近似。 If g on the right side of the formula (3) is substituted into the formula (1), the curvature ρ of the measured point B can be calculated. p is about 100 mm, so g is on the order of microns. Since it can be assumed that the p-fill is larger than g(p>>g), the formula (3) can be approximated by the following formula.

ρ=2g/p2…(4) ρ=2g/p 2 ...(4)

正曲率ρ表示朝下凸出的曲率,負曲率ρ表示朝上凸出之曲率。對於在測量線上以採樣間距△p排列之複數個採樣點的每一個求出曲率ρ。藉此,計算x方向上之曲率ρ的分佈ρ(x)。 The positive curvature ρ represents the curvature that protrudes downward, and the negative curvature ρ represents the curvature that protrudes upward. The curvature ρ is obtained for each of a plurality of sampling points arranged at a sampling pitch Δp on the measurement line. Thereby, the distribution ρ(x) of the curvature ρ in the x direction is calculated.

第7圖中示出使用實際的測量資料計算出之曲率ρ的 一例。橫軸以單位“mm”表示被測量物20的x方向的位置,縱軸以單位“mm-1”表示曲率。第7圖的較細實線表示依據進行步驟S4的低通濾波處理之前的高度資料a、b、c計算出之曲率ρ,較粗實線表示依據已進行低通濾波處理之高度資料a、b、c計算出之曲率ρ。 An example of the curvature ρ calculated using the actual measurement data is shown in Fig. 7. The horizontal axis represents the position of the object 20 in the x direction in units of "mm", and the vertical axis represents the curvature in units of "mm -1 ". The thinner solid line in Fig. 7 indicates the curvature ρ calculated from the height data a, b, and c before the low-pass filter processing of step S4, and the thicker solid line indicates the height data a according to the low-pass filter processing. b, c calculate the curvature ρ.

可知使用實施低通濾波處理之前的高度資料a、b、c計算出之曲率ρ受到表面粗糙度的影響,偏差較大。藉由實施低通濾波處理,能夠排除表面粗糙度的影響,求出基於表面波動之曲率。另外,可依據所測量之高度資料a、b、c計算高度資料g,並對計算出之高度資料g實施低通濾波處理,以此代替從對所測量之高度資料a、b、c實施低通濾波處理並從公式(1)計算高度資料g。 It can be seen that the curvature ρ calculated using the height data a, b, and c before the low-pass filter processing is affected by the surface roughness is large. By performing the low-pass filter processing, the influence of the surface roughness can be excluded, and the curvature based on the surface fluctuation can be obtained. In addition, the height data g can be calculated according to the measured height data a, b, c, and the calculated height data g is subjected to low-pass filtering processing instead of performing low on the measured height data a, b, c The filter is processed and the height data g is calculated from the formula (1).

步驟S6(第4圖)中,將採樣間距△p作為數值積分的積分間距,對於採樣區間對曲率的分佈ρ(x)進行二階積分,藉此求出直線形狀。以下,參閱第7圖,對基於二階積分之直線形狀的具體求出方法進行說明。 In step S6 (Fig. 4), the sampling pitch Δp is used as the integral pitch of the numerical integration, and the distribution of the curvature ρ(x) is second-order integrated for the sampling interval, thereby obtaining the linear shape. Hereinafter, a specific method of obtaining a linear shape based on second-order integral will be described with reference to FIG.

第8圖中示出感測器31i、31j、31k的原點D、E、F及被測量點A、B、C的位置關係。分別以下述公式表示線段AB的傾斜度dy1/dx1及線段BC的傾斜度dy2/dx2Fig. 8 shows the positional relationship of the origins D, E, F of the sensors 31i, 31j, 31k and the points to be measured A, B, C. The inclination dy 1 /dx 1 of the line segment AB and the inclination dy 2 /dx 2 of the line segment BC are respectively expressed by the following formula.

以以下公式表示被測量點B之二階導數d2y/dx2The second derivative d 2 y/dx 2 of the point B to be measured is expressed by the following formula.

該二階導數與從公式(4)求出之曲率ρ相等。因此,可知藉由對曲率的分佈ρ(x)進行二階積分,可求出直線形狀y(x)。 The second derivative is equal to the curvature ρ obtained from equation (4). Therefore, it can be seen that the linear shape y(x) can be obtained by performing second-order integration on the distribution ρ(x) of the curvature.

接著,說明對曲率ρ(x)進行二階數值積分之方法。在採樣點標註從1開始之序列號i時,可獲得以下遞推公式。 Next, a method of performing second-order numerical integration on the curvature ρ(x) will be described. When the serial number i starting from 1 is marked at the sampling point, the following recurrence formula can be obtained.

二階導數d2y/dx2(i-1)及d2y/dx2(i)與從公式(4)求出之曲率ρ(i-1)及ρ(i)相同。因此,能夠從上述遞推公式求出直線形狀y(i)。 The second derivative d 2 y/dx 2 (i-1) and d 2 y/dx 2 (i) are the same as the curvatures ρ(i-1) and ρ(i) obtained from the formula (4). Therefore, the straight line shape y(i) can be obtained from the above recursion formula.

步驟S7(第4圖)中,進行直線形狀的傾斜度校正。如從上述遞推公式可知,若作為i=1時的dy/dx,亦即傾斜度的初始值設定任意值,例如“0”,並根據遞推公 式進行計算,則有時會產生直線形狀y(i)的平均的傾斜度。步驟S7中,進行傾斜度校正,以使例如直線形狀y(i)的平均的傾斜度成為“0”。 In step S7 (Fig. 4), the inclination correction of the linear shape is performed. As can be seen from the above recursive formula, if dy/dx when i=1, that is, the initial value of the inclination is set to an arbitrary value, for example, “0”, and according to the recursion When the calculation is performed, the average inclination of the straight line shape y(i) is sometimes generated. In step S7, the inclination correction is performed so that, for example, the average inclination of the straight line shape y(i) becomes "0".

第9圖中示出藉由基於實施例之方法沿著被測量物的表面上的同一直線進行5次測量之結果。橫軸以單位“mm”表示距所測量之直線上的基準點的距離,縱軸以單位“μm”表示距被測量物表面的基準高度的位移。5次的測量結果大致重疊。若對第2圖與第9圖進行比較,則可知藉由應用基於實施例之直線形狀測量方法,測量結果的偏差顯著減少。如此,藉由應用基於實施例之直線度測量方法,能夠進行再現性較高且精確度較高的測量。 Fig. 9 shows the results of 5 measurements along the same line on the surface of the object to be measured by the method according to the embodiment. The horizontal axis represents the distance from the reference point on the measured straight line in units of "mm", and the vertical axis represents the displacement from the reference height of the surface of the object to be measured in units of "μm". The results of the five measurements overlap roughly. Comparing Fig. 2 with Fig. 9, it can be seen that the deviation of the measurement results is remarkably reduced by applying the linear shape measuring method based on the embodiment. As described above, by applying the straightness measurement method based on the embodiment, it is possible to perform measurement with high reproducibility and high accuracy.

上述實施例中,在步驟S4(第4圖)中執行了低通濾波處理,但是亦可省略低通濾波處理。積分運算具有使原來的波形的高頻成份衰減之性質。因此,即使在作為步驟S6(第4圖)的二階積分對象之曲率如第7圖的低通濾波處理前的波形那樣在較短週期內急劇變動時,藉由進行二階積分,高頻成份亦衰減。因此,即使省略低通濾波處理,實際上亦能夠求出與對基於低通濾波處理後的高度資料之曲率進行二階積分之結果相同的直線形狀。 In the above embodiment, the low-pass filter processing is executed in step S4 (fourth diagram), but the low-pass filter processing may be omitted. The integral operation has the property of attenuating the high frequency components of the original waveform. Therefore, even if the curvature of the second-order integral object as the step S6 (Fig. 4) is sharply changed in a short period as in the waveform before the low-pass filter processing of Fig. 7, by performing the second-order integration, the high-frequency component is also attenuation. Therefore, even if the low-pass filter processing is omitted, it is possible to actually obtain the same straight line shape as that of the second-order integration of the curvature of the height data after the low-pass filter processing.

並且,上述實施例中,在步驟S6(第4圖)中對曲率ρ(x)進行了二階積分,但亦可對曲率ρ(x)求出移動平均值,並對該移動平均值進行二階積分。例如,當採樣間距△p為1mm時,可按長度10mm求出曲率ρ(x)的移動平均值,並對該移動平均值進行二階積分。該二階 積分中,將積分間距設為△p的10倍,亦即10mm。 Further, in the above embodiment, the curvature ρ(x) is second-order integrated in step S6 (Fig. 4), but the moving average value may be obtained for the curvature ρ(x), and the moving average value may be second-ordered. integral. For example, when the sampling pitch Δp is 1 mm, the moving average value of the curvature ρ(x) can be obtained by the length 10 mm, and the moving average value can be second-order integrated. The second order In the integration, the integration pitch is set to 10 times Δp, that is, 10 mm.

上述實施例中,在步驟S2中,將採樣間距△p設為表面粗糙度的最小週期Pmin的1/2以下,但藉由將採樣間距△p設為1mm以下,與採樣間距△p與感測器間距p相等的習知之逐次三點法相比,能夠進行精確度較高的測量。 In the above embodiment, in step S2, the sampling pitch Δp is set to 1/2 or less of the minimum period Pmin of the surface roughness, but the sampling pitch Δp is set to 1 mm or less, and the sampling pitch Δp is sensed. Compared with the conventional three-point method in which the detector pitch p is equal, it is possible to perform a measurement with higher accuracy.

接著,對其他實施例進行說明。以下說明之實施例中,應用複向量法處理。 Next, other embodiments will be described. In the embodiment described below, the complex vector method is applied.

如第10圖所示,能夠以微小單位向量x(i)的連接表示被測量物20表面的直線形狀。其中,i為0以上的整數。以△θ(i-1)表示向量x(i-1)與x(i)所呈之角度。以r(i-1)表示向量x(i-1)的位置之曲率半徑。能夠藉由以下公式計算半徑為r(i-1)、中心角為△θ(i-1)的圓弧的長度△s(i-1)。 As shown in FIG. 10, the linear shape of the surface of the object 20 can be represented by the connection of the micro unit vector x(i). Where i is an integer of 0 or more. The angle represented by the vector x(i-1) and x(i) is represented by Δθ(i-1). The radius of curvature of the position of the vector x(i-1) is represented by r(i-1). The length Δs(i-1) of the arc having the radius r(i-1) and the central angle Δθ(i-1) can be calculated by the following formula.

△s(i-1)=r(i-1)×△θ(i-1)…(8) △s(i-1)=r(i-1)×△θ(i-1)...(8)

向量x(i-1)與向量x(i)所呈之角度△θ(i-1)較微小,因此以下的近似公式得以成立。 The angle Δθ(i-1) represented by the vector x(i-1) and the vector x(i) is small, so the following approximation formula holds.

△s(i-1)=|x(i)|…(9) △s(i-1)=|x(i)|...(9)

其中,|x(i)|表示向量x(i)的長度。微小單位向量x(i)(i=0、1、2、3……)的長度恆定。 Where |x(i)| represents the length of the vector x(i). The length of the micro unit vector x(i) (i = 0, 1, 2, 3, ...) is constant.

從公式(8)及公式(9)獲得如下公式。 The following formula is obtained from the formula (8) and the formula (9).

△θ(i-1)=|x(i)|/r(i-1)…(10) Δθ(i-1)=|x(i)|/r(i-1)...(10)

向量x(i)的長度可近似於與採樣間距△p相等。曲率半徑r(i-1)能夠從上述公式(3)計算。因此,能夠求出向量x(i-1)與x(i)所呈之角度△θ(i-1)。 The length of the vector x(i) can be approximated to be equal to the sampling pitch Δp. The radius of curvature r(i-1) can be calculated from the above formula (3). Therefore, the angle Δθ(i-1) represented by the vectors x(i-1) and x(i) can be obtained.

向量x(i)與使向量x(i-1)僅旋轉角度△θ(i-1)之向量相等。因此,能夠以如下公式表示向量x(i)。 The vector x(i) is equal to the vector that causes the vector x(i-1) to rotate only by the angle Δθ(i-1). Therefore, the vector x(i) can be expressed by the following formula.

藉由求出i=0至i=n為止的微小單位向量x(i)的向量和,可求出第n個微小單位向量x(n)的終點座標。藉由求出各微小向量x(i)的終點座標,能夠確定直線形狀。 The end point coordinates of the nth minute unit vector x(n) can be obtained by finding the vector sum of the small unit vectors x(i) from i=0 to i=n. The linear shape can be determined by finding the end point coordinates of each of the minute vectors x(i).

依據以上實施例對本發明進行了說明,但本發明並不受限於此。例如可進行各種變更、改良、組合等,這對於本領域技術人員來說係顯而易見的。 The present invention has been described based on the above embodiments, but the present invention is not limited thereto. For example, various changes, modifications, combinations, and the like can be made, as will be apparent to those skilled in the art.

20‧‧‧被測量物 20‧‧‧Measured objects

30‧‧‧感測器單元 30‧‧‧Sensor unit

31i、31j、31k‧‧‧感測器 31i, 31j, 31k‧‧‧ sensors

A、B、C‧‧‧被測量點 A, B, C‧‧‧ measured points

Pmin‧‧‧表面粗糙度的最小週期 Pmin‧‧‧ Minimum period of surface roughness

△p‧‧‧採樣間距 △p‧‧‧Sampling spacing

Claims (4)

一種直線形狀測量方法,其具有:使沿第1方向等間隔排列之3個感測器與被測量物的表面對向,對於前述被測量物一邊沿前述第1方向相對移動,一邊以1mm以下的採樣間距收集前述被測量物表面的高度資料之過程;依據前述高度資料,求出沿前述第1方向以前述採樣間距分佈於前述被測量物表面上之採樣點之曲率之過程;及依據前述曲率,求出前述被測量物表面的直線形狀之過程,藉由對前述曲率或前述曲率的移動平均值進行二階積分,求出前述被測量物表面的直線形狀。 A method for measuring a linear shape, wherein three sensors arranged at equal intervals in the first direction face the surface of the object to be measured, and the object to be measured is relatively moved in the first direction by 1 mm or less. The sampling interval is used to collect the height data of the surface of the object to be measured; and according to the height data, the process of determining the curvature of the sampling point distributed on the surface of the object to be measured along the first direction by the sampling interval; and according to the foregoing The curvature is obtained by determining the linear shape of the surface of the object to be measured, and the linear shape of the surface of the object to be measured is obtained by second-order integration of the curvature or the moving average of the curvature. 如申請專利範圍第1項所述之直線形狀測量方法,其中,前述採樣間距設為相當於前述被測量物表面的表面粗糙度的最大空間頻率之週期的1/2以下。 The linear shape measuring method according to claim 1, wherein the sampling pitch is equal to or less than 1/2 of a period of a maximum spatial frequency corresponding to a surface roughness of the surface of the object to be measured. 一種直線形狀測量裝置,其具有:3個感測器,沿第1方向等間隔排列;移動機構,與被測量物的表面對向地支撐前述感測器,並且使其對於前述被測量物沿前述第1方向相對移動;及處理裝置,控制前述移動機構來使前述感測器沿前述第1方向移動,並且收集以前述感測器測量之高度資料, 前述處理裝置中,使前述感測器一邊沿前述第1方向移動,一邊以1mm以下的採樣間距收集高度資料,依據前述高度資料,求出沿前述第1方向以前述採樣間距分佈於前述被測量物表面上之採樣點之曲率,依據前述曲率,求出前述被測量物表面的直線形狀,前述處理裝置藉由對前述曲率或前述曲率的移動平均值進行二階積分,求出前述被測量物表面的直線形狀。 A linear shape measuring device having: three sensors arranged at equal intervals along a first direction; a moving mechanism supporting the aforementioned sensor opposite to a surface of the object to be measured and causing the aforementioned object to be measured The first direction is relatively moved; and the processing device controls the moving mechanism to move the sensor in the first direction, and collects height data measured by the sensor, In the processing apparatus, the sensor is configured to collect the height data at a sampling pitch of 1 mm or less while moving in the first direction, and to obtain the measurement in the first direction along the first sampling direction based on the height data. The curvature of the sampling point on the surface of the object is determined according to the curvature, and the linear shape of the surface of the object to be measured is obtained. The processing device obtains the surface of the object to be measured by second-order integration of the curvature or the moving average of the curvature. Straight line shape. 如申請專利範圍第3項所述之直線形狀測量裝置,其中,前述採樣間距設為相當於前述被測量物表面的表面粗糙度的最大空間頻率之週期的1/2以下。 The linear shape measuring apparatus according to claim 3, wherein the sampling pitch is equal to or less than 1/2 of a period of a maximum spatial frequency corresponding to a surface roughness of the surface of the object to be measured.
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