TWI599277B - 可撓性覆銅積層板 - Google Patents

可撓性覆銅積層板 Download PDF

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Publication number
TWI599277B
TWI599277B TW102133602A TW102133602A TWI599277B TW I599277 B TWI599277 B TW I599277B TW 102133602 A TW102133602 A TW 102133602A TW 102133602 A TW102133602 A TW 102133602A TW I599277 B TWI599277 B TW I599277B
Authority
TW
Taiwan
Prior art keywords
copper
clad laminate
layer
thickness
copper foil
Prior art date
Application number
TW102133602A
Other languages
English (en)
Chinese (zh)
Other versions
TW201424475A (zh
Inventor
矢熊建太郎
金子和明
及川真二
藤元伸悅
Original Assignee
新日鐵住金化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新日鐵住金化學股份有限公司 filed Critical 新日鐵住金化學股份有限公司
Publication of TW201424475A publication Critical patent/TW201424475A/zh
Application granted granted Critical
Publication of TWI599277B publication Critical patent/TWI599277B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW102133602A 2012-09-28 2013-09-17 可撓性覆銅積層板 TWI599277B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012217485 2012-09-28

Publications (2)

Publication Number Publication Date
TW201424475A TW201424475A (zh) 2014-06-16
TWI599277B true TWI599277B (zh) 2017-09-11

Family

ID=50409411

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102133602A TWI599277B (zh) 2012-09-28 2013-09-17 可撓性覆銅積層板

Country Status (4)

Country Link
JP (3) JP6284325B2 (ja)
KR (1) KR102045089B1 (ja)
CN (1) CN103716983B (ja)
TW (1) TWI599277B (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6320031B2 (ja) * 2012-12-28 2018-05-09 新日鉄住金化学株式会社 フレキシブル銅張積層板
JP6360760B2 (ja) * 2014-09-19 2018-07-18 新日鉄住金化学株式会社 銅張積層板及び回路基板
KR102404294B1 (ko) * 2014-09-30 2022-05-31 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 플렉시블 회로 기판 및 전자 기기
JP6682633B2 (ja) * 2016-07-12 2020-04-15 株式会社フジクラ 伸縮性基板
JP6440656B2 (ja) 2016-07-12 2018-12-19 古河電気工業株式会社 電解銅箔
CN106856646A (zh) * 2016-11-13 2017-06-16 惠州市大亚湾科翔科技电路板有限公司 一种柔性覆金属叠板
JP7256618B2 (ja) * 2018-08-29 2023-04-12 タツタ電線株式会社 転写フィルム付電磁波シールドフィルム、転写フィルム付電磁波シールドフィルムの製造方法及びシールドプリント配線板の製造方法
JP6624756B2 (ja) * 2018-12-26 2019-12-25 日鉄ケミカル＆マテリアル株式会社 フレキシブル回路基板、その使用方法及び電子機器
JP2021009997A (ja) 2019-06-28 2021-01-28 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルム、金属張積層板及びフレキシブル回路基板
CN111526613B (zh) * 2020-05-18 2022-07-12 无锡格菲电子薄膜科技有限公司 一种铜电极石墨烯电热膜及其制备方法
CN113597144B (zh) * 2021-07-28 2024-09-06 恒赫鼎富(苏州)电子有限公司 一种多层fpc线路板制作工艺

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6193910B1 (en) * 1997-11-11 2001-02-27 Ngk Spark Plug Co., Ltd. Paste for through-hole filling and printed wiring board using the same
JP4486196B2 (ja) * 1999-12-08 2010-06-23 イビデン株式会社 多層プリント配線板用片面回路基板およびその製造方法
US7263769B2 (en) * 2004-10-20 2007-09-04 Matsushita Electric Industrial Co., Ltd. Multi-layered flexible print circuit board and manufacturing method thereof
JP2007208087A (ja) 2006-02-03 2007-08-16 Kaneka Corp 高屈曲性フレキシブルプリント配線板
JP2007273766A (ja) * 2006-03-31 2007-10-18 Nippon Steel Chem Co Ltd 配線基板用積層体
JP5638951B2 (ja) * 2008-07-22 2014-12-10 古河電気工業株式会社 フレキシブル銅張積層板
KR101502653B1 (ko) * 2008-09-26 2015-03-13 스미토모 베이클라이트 가부시키가이샤 적층판, 회로판 및 반도체 장치
JP2010280191A (ja) 2009-06-08 2010-12-16 Hitachi Cable Ltd 熱処理用銅箔、熱処理用銅箔の製造方法およびフレキシブルプリント配線板
JP5689284B2 (ja) * 2009-11-11 2015-03-25 新日鉄住金化学株式会社 フレキシブル両面銅張積層板の製造方法
KR101690491B1 (ko) * 2009-12-25 2016-12-28 신닛테츠 수미킨 가가쿠 가부시키가이샤 가요성 회로기판 및 가요성 회로기판의 굴곡부 구조
JP5858915B2 (ja) * 2010-08-09 2016-02-10 新日鉄住金化学株式会社 繰返し屈曲用途向けフレキシブル回路基板、これを用いた電子機器及び携帯電話

Also Published As

Publication number Publication date
CN103716983A (zh) 2014-04-09
CN103716983B (zh) 2017-12-12
TW201424475A (zh) 2014-06-16
JP6581224B2 (ja) 2019-09-25
JP6545302B2 (ja) 2019-07-17
JP2018065395A (ja) 2018-04-26
JP6284325B2 (ja) 2018-02-28
KR20140042684A (ko) 2014-04-07
KR102045089B1 (ko) 2019-11-14
JP2018067740A (ja) 2018-04-26
JP2014080021A (ja) 2014-05-08

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