TWI598556B - Heat equalizing plate and method for making the same - Google Patents

Description

Temperature equalizing plate and manufacturing method thereof

The invention relates to a temperature equalizing plate and a manufacturing method thereof.

With the rapid development of technology, the power and efficiency of electronic components are increasing, and more and more heat is generated during operation. If these heats are not dissipated in time and accumulate inside the electronic components, the electronic components will be caused. The temperature rises and affects its performance, and even severe cases will cause the electronic component to malfunction or be damaged.

In view of this, it is necessary to provide a temperature equalizing plate with better thermal conductivity to effectively solve the heat dissipation problem of electronic components.

In addition, it is also necessary to provide a method of fabricating the above-described uniform temperature plate.

A temperature equalizing plate comprising a bottom plate and a cover plate covering the bottom plate, wherein a closed chamber is formed between the bottom plate and the cover plate, the chamber is filled with a working fluid, and the cover plate is provided with a plurality of surfaces facing the bottom plate a first trench, the bottom plate is provided with a plurality of second trenches facing the surface of the cover plate, and the plurality of second trenches are alternately arranged in a grid shape, and the groove walls of the first trench and the second trench are both A capillary structure is formed.

A method for manufacturing a temperature equalizing plate comprises the steps of: providing a cover plate, processing the cover plate to form a plurality of first grooves on a surface of the cover plate, and roughening the surface of the cover plate having the first groove So that the groove wall of the first groove forms an uneven/rough structure; Providing a bottom plate, the bottom plate is processed to form a plurality of second grooves on one surface of the bottom plate, the plurality of second grooves are alternately arranged in a grid shape, and the surface of the bottom plate having the second groove is roughened Processing to form a groove wall of the second groove to form an uneven/rough structure; injecting a working fluid into the second groove of the bottom plate; covering the cover plate to form a chamber, wherein the first groove and the first groove The two grooves are oppositely disposed; the chamber formed by the cover plate and the bottom plate is closed.

The invention optimizes the structure of the bottom plate and the cover plate of the temperature equalizing plate to ensure smooth circulation of the working fluid, so that the temperature equalizing plate has a good uniform temperature heat dissipation effect.

10‧‧‧Wall plate

11‧‧‧floor

13‧‧‧ Cover

15‧‧‧ chamber

17‧‧‧Working fluid

113‧‧‧Second trench

131‧‧‧First trench

30‧‧‧Capillary structure

19‧‧‧Binder

20‧‧‧Bliner

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view showing a temperature equalizing plate in accordance with a preferred embodiment of the present invention.

2 is a plan view showing the bottom plate of the temperature equalizing plate of the preferred embodiment of the present invention.

3 is a schematic plan view of a cover plate of a temperature equalizing plate according to a preferred embodiment of the present invention.

4 is a schematic view showing the processing flow of the bottom plate of the temperature equalizing plate according to the preferred embodiment of the present invention.

Fig. 5 is a schematic view showing the processing flow of a cover plate of a temperature equalizing plate according to a preferred embodiment of the present invention.

6 is a schematic view showing the processing flow of a temperature equalizing plate according to a preferred embodiment of the present invention.

Referring to FIG. 1 , a temperature equalizing plate 10 according to a preferred embodiment of the present invention includes a bottom plate 11 and a cover plate 13 that is closed on the bottom plate 11 . A closed chamber 15 is formed between the bottom plate 11 and the cover plate 13 . The chamber 15 is filled with a working fluid 17. The working fluid 17 can be water or other fluids commonly used in the art that can act as a working fluid for the temperature equalization plate. The chamber 15 can be a vacuum chamber, a chamber having an internal gas pressure below one atmosphere or near vacuum. The lower the internal pressure of the chamber 15, the lower the boiling point of the working fluid 17, and the more favorable the liquid working fluid 17 is converted into a gaseous state to achieve a heat conducting effect.

In use, the side of the bottom plate 11 of the temperature equalization plate 10 away from the cover plate 13 (ie, the evaporation zone) is attached to a heat generating component (such as a central processing unit, a wafer, etc., not shown) to adsorb heat generated by the heat generating component. The liquid working fluid 17 is evaporated to a gaseous state, and the heat is conducted to one side of the cover plate 13 (ie, the condensation zone), and the gaseous working fluid 17 is cooled in the condensation zone to be condensed into droplets, and the droplets are grown. After that, it is refluxed to the evaporation zone to continue the gas-liquid circulation to effectively achieve the uniform temperature heat dissipation effect.

Referring to FIG. 2 , the bottom plate 11 defines a plurality of second grooves 113 facing the surface of the cover plate 13 . The plurality of second grooves 113 are alternately arranged in a grid shape. In this embodiment, each of the second grooves has a strip shape. The groove wall of the second groove 113 is formed with a capillary structure 30 which is an uneven/rough structure formed by a micro-etching process or other roughening process. In this embodiment, the capillary structure 30 is a rough surface.

The plurality of second grooves 113 are alternately arranged to enhance the reflow effect of the working fluid 17. The working fluid 17 is received in the plurality of second grooves 113.

In this embodiment, the second groove 113 of the bottom plate 11 is designed as a non-arc groove (the groove wall is non-curved).

Referring to FIG. 3 , the cover plate 13 defines a plurality of first grooves 131 on the surface of the bottom plate 11 . Each of the first trenches 131 is strip-shaped, and the plurality of first trenches 131 are disposed in parallel. In this embodiment, each strip-shaped first groove 131 extends along the length or width direction of the cover plate 13. The groove wall of the first groove 131 is formed with a capillary structure 30 which is an uneven/rough structure formed by a micro-etching process or other roughening process. In this embodiment, the capillary structure 30 is a rough surface.

In use, the first groove 131 can serve as a gas passage to transfer heat to the cover plate 13 to achieve a uniform temperature heat dissipation effect.

In this embodiment, the first groove 131 of the cover plate 13 is designed as a curved groove (the groove wall is a curved surface). The first trench 131 is strip-shaped and is a curved groove, and the gaseous working fluid 17 is heated from one end of the first trench 131 to the other end.

In this embodiment, the width of the first trench 131 is greater than the width of the second trench 113. Preferably, each of the second trenches 113 has a width of 0.05 to 0.5 mm, and each of the first trenches 131 has a width of 1 to 3 mm.

In this embodiment, the bottom plate 11 and the cover plate 13 are both metal foils. The metal foil is preferably a copper foil, but is not limited to a copper foil. The thickness of the metal foil is 35-140 μm so that the temperature equalizing plate 10 has a relatively thin thickness.

It can be understood that in order to form the chamber 15 for the sealing between the bottom plate 11 and the cover plate 13, an adhesive 19 (shown in FIG. 1) may be disposed at the junction of the bottom plate 11 and the cover plate 13.

The present invention optimizes the structure of the bottom plate 11 and the cover plate 13 of the temperature equalizing plate 10, The circulating backflow of the working fluid 17 is ensured to be smooth, so that the temperature equalizing plate 10 has a good uniform temperature heat dissipation effect.

A method of fabricating the above-described temperature equalizing plate 10 according to a preferred embodiment of the present invention includes the following steps:

(S1) providing a bottom plate 11 which is processed to form a plurality of second grooves 113 interlaced with each other on one surface of the bottom plate 11, and roughening the surface of the bottom plate 11 having the second grooves 113 so that The groove wall of the second groove 113 is formed into an uneven/rough structure.

The plurality of second grooves 113 are alternately arranged in a grid shape. It can be understood that the processing method of forming the second trench 113 may be an etching process or a machining process.

The specific process flow of the (S1) step can be referred to FIG. 4. The etching process is performed: the shielding layer 20 (such as a photoresist) is used to partially shield the bottom plate 11 so that the etching portion is exposed, so that the etching portion is not shielded; then the etching of the bottom plate 11 is performed to form interlaced portions. a plurality of second grooves 113; removing the shielding on the bottom plate 11; and further roughening the groove walls of the second grooves 113. When the bottom plate 11 is a copper foil, the roughening treatment can directly etch the bottom plate 11 with hydrogen peroxide to form pits.

(S2) providing a cover plate 13, the cover plate 13 is processed to form a plurality of first grooves 131 on one surface of the cover plate 13; and the surface of the cover plate 13 having the first groove 131 is roughened to The groove wall of the first groove 131 is formed into an uneven/rough structure.

Each of the first trenches 131 is strip-shaped, and the plurality of first trenches 131 are disposed in parallel. It can be understood that the processing method of forming the first trench 131 may be an etching process or a machining process.

The specific process flow of the (S2) step can be referred to FIG. 5. Etching treatment: partially masking the cover plate 13 with a masking agent 20 (such as a photoresist), so that the etching portion is exposed, so that the etching portion is not shielded; then the cover plate 13 is etched to form a plurality of parallel settings. a strip-shaped first groove 131; removing the shield on the cover plate 13; and further roughening the groove wall of the first groove 131. When the cover plate 13 is a copper foil, the roughening treatment can directly etch the cover plate 13 with hydrogen peroxide to form pits.

It can be understood that the order of steps (S1) and (S2) is not limited thereto, and can also be exchanged.

(S3) The working fluid 17 is injected into the second groove 113 of the bottom plate 11.

Please refer to Figure 6 for the (S3) step. As shown in FIG. 6, the (S3) step may further include the step of providing the adhesive 19 at the junction of the bottom plate 11 and the cover plate 13.

(S4) As shown in FIG. 6, the cover plate 13 is covered on the bottom plate 11 to form a chamber 15, wherein the first groove 131 is disposed opposite to the second groove 113.

(S5) The chamber 15 formed by the cover plate 13 and the bottom plate 11 is closed.

The method also includes the step of pumping the closed chamber 15 such that the chamber 15 is formed as a vacuum chamber, a chamber having an internal gas pressure below one atmosphere or near vacuum.

The invention optimizes the structure of the bottom plate 11 and the cover plate 13 of the temperature equalizing plate 10 to ensure smooth circulation of the working fluid 17, so that the temperature equalizing plate 10 has a good uniform temperature heat dissipation effect.

10‧‧‧Wall plate

11‧‧‧floor

13‧‧‧ Cover

15‧‧‧ chamber

17‧‧‧Working fluid

113‧‧‧Second trench

131‧‧‧First trench

30‧‧‧Capillary structure

19‧‧‧Binder

Claims (8)

A temperature equalizing plate comprising a bottom plate and a cover plate attached to the bottom plate, wherein a closed chamber is formed between the bottom plate and the cover plate, the chamber is filled with a working fluid, and the improvement is that the cover plate faces the surface of the bottom plate Opening a plurality of first grooves, each of the first grooves is strip-shaped, the plurality of first grooves are disposed in parallel with each other, the plurality of first grooves are arcuate grooves, and the bottom plate faces the cover plate a plurality of second trenches are formed in the surface, the plurality of second trenches are alternately arranged in a grid shape in two orthogonal directions, and the plurality of second trenches are non-arc grooves, the first trench A capillary structure is formed on both the groove walls of the second groove, and the capillary structure is an uneven/rough structure formed by a micro-etching process. The temperature equalizing plate according to claim 1, wherein each of the first grooves has a width of 1 to 3 mm, and each of the second grooves has a width of 0.05 to 0.5 mm. The temperature equalizing plate according to claim 1, wherein the chamber is a vacuum chamber, and the internal air pressure is lower than one atmosphere or close to a vacuum chamber. The temperature equalizing plate according to claim 1, wherein the bottom plate and the cover plate are both metal foils, and the metal foil has a thickness of 35 to 140 μm. The temperature equalizing plate according to claim 1, wherein the bonding portion between the bottom plate and the cover plate is provided with an adhesive. A method for manufacturing a temperature equalizing plate, comprising the steps of: providing a cover plate, processing the cover plate to form a plurality of first grooves on a surface of the cover plate, each first groove being strip-shaped, the plurality of a groove is disposed in parallel with each other, and the surface of the cover plate having the first groove is micro-etched so that the groove wall of the first groove forms an uneven/rough structure, and the plurality of first grooves are arcs a surface groove; a bottom plate is provided, and the bottom plate is processed to form a plurality of second grooves on a surface of the bottom plate, wherein the plurality of second grooves are alternately arranged in a grid shape in two orthogonal directions, and have a bottom plate The surface of the second trench is microetched to form a trench wall having a rugged/rough structure, the plurality of second trenches being non-arc grooves; and a second trench for injecting a working fluid into the bottom plate a chamber is formed on the bottom plate to form a chamber, wherein the first groove is disposed opposite to the second groove; and the chamber formed by the cover plate and the bottom plate is closed. The method for manufacturing a temperature equalizing plate according to claim 6, wherein the method further comprises the step of performing a pumping operation on the closed chamber, so that the chamber is formed into a vacuum chamber and the internal air pressure is low. At a pressure or near vacuum chamber. The method for manufacturing a temperature equalizing plate according to claim 6, wherein the method further comprises: before the cover is closed on the bottom plate to form a chamber, and the joint between the bottom plate and the cover plate is set. The step of the adhesive.