TWI594294B - 用於具有嵌入式掃描電子顯微鏡結構重疊目標的重疊之裝置相關量測 - Google Patents

用於具有嵌入式掃描電子顯微鏡結構重疊目標的重疊之裝置相關量測 Download PDF

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Publication number
TWI594294B
TWI594294B TW102132263A TW102132263A TWI594294B TW I594294 B TWI594294 B TW I594294B TW 102132263 A TW102132263 A TW 102132263A TW 102132263 A TW102132263 A TW 102132263A TW I594294 B TWI594294 B TW I594294B
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TW
Taiwan
Prior art keywords
periodic structure
layer
target
periodic
overlay
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Application number
TW102132263A
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English (en)
Chinese (zh)
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TW201419377A (zh
Inventor
紐瑞爾 艾米爾
崔東燮
托爾 伊茲卡維奇
丹尼爾 堪德爾
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克萊譚克公司
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Publication of TW201419377A publication Critical patent/TW201419377A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70681—Metrology strategies
    • G03F7/70683—Mark designs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
TW102132263A 2012-09-06 2013-09-06 用於具有嵌入式掃描電子顯微鏡結構重疊目標的重疊之裝置相關量測 TWI594294B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261697503P 2012-09-06 2012-09-06
US13/776,550 US9093458B2 (en) 2012-09-06 2013-02-25 Device correlated metrology (DCM) for OVL with embedded SEM structure overlay targets

Publications (2)

Publication Number Publication Date
TW201419377A TW201419377A (zh) 2014-05-16
TWI594294B true TWI594294B (zh) 2017-08-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW102132263A TWI594294B (zh) 2012-09-06 2013-09-06 用於具有嵌入式掃描電子顯微鏡結構重疊目標的重疊之裝置相關量測

Country Status (5)

Country Link
US (1) US9093458B2 (https=)
JP (1) JP6320387B2 (https=)
KR (1) KR102160840B1 (https=)
TW (1) TWI594294B (https=)
WO (1) WO2014039689A1 (https=)

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Also Published As

Publication number Publication date
TW201419377A (zh) 2014-05-16
KR20150053770A (ko) 2015-05-18
US20140065736A1 (en) 2014-03-06
JP6320387B2 (ja) 2018-05-09
JP2015532733A (ja) 2015-11-12
US9093458B2 (en) 2015-07-28
WO2014039689A1 (en) 2014-03-13
KR102160840B1 (ko) 2020-09-29

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