TWI589656B - 接著劑組成物及接著薄膜 - Google Patents

接著劑組成物及接著薄膜 Download PDF

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Publication number
TWI589656B
TWI589656B TW102131678A TW102131678A TWI589656B TW I589656 B TWI589656 B TW I589656B TW 102131678 A TW102131678 A TW 102131678A TW 102131678 A TW102131678 A TW 102131678A TW I589656 B TWI589656 B TW I589656B
Authority
TW
Taiwan
Prior art keywords
weight
adhesive composition
styrene
elastomer
adhesive
Prior art date
Application number
TW102131678A
Other languages
English (en)
Chinese (zh)
Other versions
TW201418391A (zh
Inventor
野口拓也
緒方寿幸
久保安通史
今井洋文
吉岡孝広
鈴木康夫
Original Assignee
東京應化工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京應化工業股份有限公司 filed Critical 東京應化工業股份有限公司
Publication of TW201418391A publication Critical patent/TW201418391A/zh
Application granted granted Critical
Publication of TWI589656B publication Critical patent/TWI589656B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
TW102131678A 2012-10-25 2013-09-03 接著劑組成物及接著薄膜 TWI589656B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012236019A JP6059507B2 (ja) 2012-10-25 2012-10-25 接着剤組成物及び接着フィルム

Publications (2)

Publication Number Publication Date
TW201418391A TW201418391A (zh) 2014-05-16
TWI589656B true TWI589656B (zh) 2017-07-01

Family

ID=50787816

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102131678A TWI589656B (zh) 2012-10-25 2013-09-03 接著劑組成物及接著薄膜

Country Status (3)

Country Link
JP (1) JP6059507B2 (ko)
KR (1) KR101780519B1 (ko)
TW (1) TWI589656B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6443735B2 (ja) * 2014-11-11 2018-12-26 ナミックス株式会社 樹脂組成物、それを用いた絶縁フィルムおよび半導体装置
EP4159916A4 (en) 2020-05-25 2023-09-06 FUJIFILM Corporation COMPOSITION, LEAF-SHAPED MOLDED BODY, ARTIFICIAL LEATHER, AND METHOD FOR PRODUCING LEAF-SHAPED MOLDED BODY

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5268249A (en) * 1975-12-02 1977-06-06 Denki Kagaku Kogyo Kk Process for preparing block-copolymer latexes
TW311927B (ko) * 1995-07-11 1997-08-01 Minnesota Mining & Mfg
JP2002105413A (ja) * 2000-09-28 2002-04-10 Nitto Shinko Kk 制振用テープ

Also Published As

Publication number Publication date
JP2014084434A (ja) 2014-05-12
TW201418391A (zh) 2014-05-16
KR20140052823A (ko) 2014-05-07
JP6059507B2 (ja) 2017-01-11
KR101780519B1 (ko) 2017-09-21

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