TWI588077B - Turntable positioning device, loading and conveying system and plasma processing equipment - Google Patents
Turntable positioning device, loading and conveying system and plasma processing equipment Download PDFInfo
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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Description
本發明屬於半導體設備製造領域，具體涉及一種轉盤定位裝置、裝載傳輸系統及電漿加工設備。 The invention belongs to the field of semiconductor device manufacturing, and in particular relates to a turntable positioning device, a loading transmission system and a plasma processing device.
隨著微電子技術的不斷發展，相關生產企業的競爭越來越激烈，降低成本、提高生產效率則是提高企業競爭力的常用手段。例如，為了提高生產效率、降低生產成本，在進行製程的程序中，利用裝載傳輸系統實現對多個晶片同時進行不同的工序，以應對日益增加的市場需求。 With the continuous development of microelectronics technology, the competition of related production enterprises is becoming more and more fierce. Reducing costs and improving production efficiency are common means to improve the competitiveness of enterprises. For example, in order to increase production efficiency and reduce production costs, in a process of performing a process, a load transfer system is used to simultaneously perform different processes on a plurality of wafers in response to an increasing market demand.
第1圖為現有的一種裝載傳輸系統的示意圖。第2A圖為第1圖中反應腔室的俯視圖。第2B圖為沿第2A圖的A-A線的剖視圖。如第1圖所示，裝載傳輸系統包括裝卸腔室1、傳輸腔室2和反應腔室3。其中，裝卸腔室1用於裝載或卸載晶片；傳輸腔室2設置在裝卸腔室1和反應腔室3之間，且設置有機械手21，用以在裝卸腔室1和反應腔室3之間傳輸晶片。 Figure 1 is a schematic diagram of a conventional loading and transport system. Figure 2A is a top plan view of the reaction chamber in Figure 1. Fig. 2B is a cross-sectional view taken along line A-A of Fig. 2A. As shown in FIG. 1, the loading transport system includes a loading and unloading chamber 1, a transfer chamber 2, and a reaction chamber 3. Wherein the loading and unloading chamber 1 is used for loading or unloading the wafer; the transfer chamber 2 is disposed between the loading and unloading chamber 1 and the reaction chamber 3, and is provided with a robot 21 for loading and unloading the chamber 1 and the reaction chamber 3 Transfer the wafer between.
第2A圖和第2B圖所示，反應腔室3包括轉盤31、轉盤旋轉機構35、靶材32、頂針33、頂針升降機構36、基座34和基座升降機構37。反應腔室3的主要工作程序為：轉盤旋轉機構35驅動轉盤31旋轉，以使八個工作區51中的一個工作區51旋轉至用於裝卸晶片40的裝卸位置(如第1圖中位於正上方的那個工作區51所在位置)；頂針升降機構36驅動設置在轉盤31 底部且對應於該裝卸位置的頂針33上升，以使頂針33的頂端貫穿轉盤31並高於其上表面；機械手21將晶片40置於頂針33的頂端；頂針升降機構36驅動承載有晶片40的頂針33下降，直至頂針33的頂端位於轉盤31的下方，此時晶片40落在處於裝卸位置的工作區51上，從而完成一個晶片40的裝載；待所有的工作區51均裝載有晶片40之後，轉盤旋轉機構35驅動轉盤31旋轉，以使八個工作區51中的四個工作區51對應地位於四個靶材32的下方；基座升降機構37驅動位於轉盤31底部且對應於各個靶材32的四個基座34上升，以使基座34的上表面貫穿轉盤31，並托起相應工作區51上的晶片40，直至到達設置在腔室頂壁上且與靶材32相對應的通孔38的底部，此時靶材32、通孔38與基座34的上表面形成子腔室，四個子腔室用於同時對晶片40進行不同的工序；待當次工序完成後，基座升降機構37驅動基座34下降，直至基座34的上表面位於轉盤31的下方，此時晶片40落在轉盤31的相應工作區51上；轉盤旋轉機構35驅動轉盤31旋轉，以使完成當次工序的各個工作區51旋轉至對應於下一工序的靶材32下方；重複上述“上升晶片”、“加工晶片”、“下降晶片”以及“旋轉晶片”的步驟，直至每個晶片40完成所有的工序。 2A and 2B, the reaction chamber 3 includes a turntable 31, a turntable rotating mechanism 35, a target 32, a thimble 33, a thimble lifting mechanism 36, a base 34, and a pedestal lifting mechanism 37. The main working procedure of the reaction chamber 3 is that the turntable rotating mechanism 35 drives the turntable 31 to rotate, so that one of the eight working areas 51 is rotated to the loading and unloading position for loading and unloading the wafer 40 (as shown in Fig. 1 The upper working area 51 is located); the ejector lifting mechanism 36 is driven to be disposed on the turntable 31 The ejector pin 33 at the bottom and corresponding to the loading and unloading position is raised so that the top end of the ejector pin 33 passes through the turntable 31 and is higher than the upper surface thereof; the robot 21 places the wafer 40 on the top end of the ejector pin 33; the ejector pin lifting mechanism 36 drives the wafer 40 to be carried. The ejector pin 33 is lowered until the top end of the ejector pin 33 is located below the turntable 31, at which time the wafer 40 falls on the work area 51 in the loading and unloading position, thereby completing the loading of one wafer 40; all of the work areas 51 are loaded with the wafer 40. Thereafter, the turntable rotation mechanism 35 drives the turntable 31 to rotate so that four of the eight work areas 51 are correspondingly positioned below the four targets 32; the base lift mechanism 37 is driven at the bottom of the turntable 31 and corresponds to each The four pedestals 34 of the target 32 are raised such that the upper surface of the pedestal 34 passes through the turntable 31 and lifts the wafer 40 on the corresponding working area 51 until it reaches the top wall of the chamber and is in phase with the target 32. Corresponding to the bottom of the through hole 38, at this time, the target 32, the through hole 38 and the upper surface of the base 34 form a sub-chamber, and the four sub-chambers are used for simultaneously performing different processes on the wafer 40; after the completion of the process , base lifting mechanism 37 drive The seat 34 is lowered until the upper surface of the base 34 is located below the turntable 31, at which time the wafer 40 falls on the corresponding working area 51 of the turntable 31; the turntable rotating mechanism 35 drives the turntable 31 to rotate, so as to complete the respective operations of the next process. The region 51 is rotated below the target 32 corresponding to the next process; the steps of "rise wafer", "process wafer", "drop wafer", and "rotate wafer" are repeated until each wafer 40 completes all processes.
在進行上述工作程序之前，還需要借助轉盤定位裝置對轉盤進行原點搜索，以使轉盤能夠自原點位置開始旋轉，從而完成各個工作區51的轉動定位。第3圖為現有的一種轉盤定位裝置的俯視圖。如第3圖所示，轉盤定位裝置包括設置在轉盤31的外周壁上的原點凸起41，以及設置在反應腔室3的透明觀察窗42外側的鐳射漫反射感測器43。在進行原點搜索時， 當鐳射漫反射感測器43檢測到原點凸起41時，可認為此時轉盤旋轉機構中的電機處於原點位置，然後控制該電機進行絕對運動，以驅動轉盤31旋轉指定角度。此外，轉盤旋轉機構中的電機通常具有運動控制器，其可以即時檢測電機的旋轉角度，從而根據由該運動控制器提供的回饋信號，可以獲知轉盤31的旋轉角度，進而可以判斷轉盤的工作區51是否到位。 Before performing the above working procedure, it is also necessary to perform an origin search on the turntable by means of the turntable positioning device, so that the turntable can be rotated from the original position, thereby completing the rotational positioning of each working area 51. Figure 3 is a plan view of a conventional turntable positioning device. As shown in Fig. 3, the turntable positioning device includes an origin projection 41 provided on the outer peripheral wall of the turntable 31, and a laser diffuse reflection sensor 43 disposed outside the transparent observation window 42 of the reaction chamber 3. When doing an origin search, When the laser diffuse reflection sensor 43 detects the origin bump 41, it can be considered that the motor in the turntable rotation mechanism is at the origin position, and then the motor is controlled to perform absolute motion to drive the turntable 31 to rotate by a specified angle. In addition, the motor in the rotary mechanism of the turntable usually has a motion controller, which can instantly detect the rotation angle of the motor, so that the rotation angle of the turntable 31 can be known according to the feedback signal provided by the motion controller, and the working area of the turntable can be determined. 51 is in place.
上述轉盤定位裝置在實際應用中不可避免地存在以下問題，即： 由於上述轉盤定位裝置僅能夠對轉盤進行原點定位，而無法在製程程序中監測轉盤的工作區是否到達預定位置，導致無法及時獲知轉盤的工作區出現的位置異常，從而不僅會造成工作程序無法繼續，而且還可能造成機械故障，進而降低了電漿加工設備的安全性和穩定性。 The above-mentioned turntable positioning device inevitably has the following problems in practical applications, namely: Since the above-mentioned turntable positioning device can only position the turntable for the origin, and cannot monitor whether the work area of the turntable reaches the predetermined position in the process program, the position abnormality of the work area of the turntable cannot be known in time, thereby not only causing the work program to be unable to be Continue, and may also cause mechanical failure, which in turn reduces the safety and stability of the plasma processing equipment.
雖然電機的運動控制器可以通過檢測電機的旋轉角度而間接獲知轉盤的旋轉角度，但是，由於轉盤旋轉機構自身及其與轉盤之間的傳動往往會因機械誤差而造成轉盤的旋轉角度產生偏差，從而導致在製程程序中出現電機旋轉到位而轉盤的工作區域卻未到位的情況，或者因轉盤邊緣會將轉盤的角度偏差放大而出現轉盤旋轉機構的角度偏差沒有超出允許範圍，而轉盤邊緣的角度偏差超出允許範圍的情況。在出現上述兩種情況時，電機的運動控制器仍會提供表示轉盤的工作區域到位的回饋信號，導致對轉盤的工作區域是否到位判斷錯誤，這同樣會造成機械故障，從而降低了電漿加工設備的安全性和穩定性。 Although the motion controller of the motor can indirectly know the rotation angle of the turntable by detecting the rotation angle of the motor, the rotation angle of the turntable is often deviated due to mechanical errors due to the rotation mechanism of the turntable itself and the drive between the turntable and the turntable. As a result, in the process program, the motor rotates in place and the working area of the turntable is not in place, or the angle deviation of the turntable rotation mechanism does not exceed the allowable range due to the rotation of the turntable edge, and the angle of the turntable edge The case where the deviation is outside the allowable range. In the above two cases, the motion controller of the motor still provides a feedback signal indicating that the working area of the turntable is in place, which leads to an error in determining whether the working area of the turntable is in place, which also causes mechanical failure, thereby reducing plasma processing. Equipment safety and stability.
因此，如何提高轉盤定位裝置定位的準確性，保證裝載傳輸 系統能夠安全高效、性能穩定地運行，是本領域技術人員極需解決的技術問題。 Therefore, how to improve the accuracy of the positioning of the turntable positioning device and ensure the loading and transmission The system can operate safely, efficiently, and stably, which is a technical problem that a person skilled in the art needs to solve.
本發明旨在解決現有技術中存在的技術問題，提供了一種轉盤定位裝置、裝載傳輸系統及電漿加工設備，其可以監測轉盤的工作區是否到達預定位置，從而可以及時獲知轉盤的工作區出現的位置異常。 The invention aims to solve the technical problems existing in the prior art, and provides a turntable positioning device, a loading transmission system and a plasma processing device, which can monitor whether the working area of the turntable reaches a predetermined position, so that the working area of the turntable can be known in time. The location is abnormal.
為實現本發明的目的而提供一種轉盤定位裝置，包括轉盤，該轉盤上設置有用以承載工件的工作區，並且該轉盤定位裝置包括到位檢測單元和原點檢測單元，其中：該到位檢測單元包括第一標識模組和第一檢測模組，該第一標識模組用於標識該工作區域在該轉盤上的位置；該第一檢測模組用於通過檢測該第一標識模組來判斷該工作區是否到達預定位置；該原點檢測單元包括第二標識模組和第二檢測模組，該第二標識模組用於標識原點位置，該第二檢測模組用於通過檢測該第二標識模組來判斷該工作區是否到達原點位置。 To achieve the object of the present invention, a turntable positioning device is provided, comprising a turntable on which a work area for carrying a workpiece is disposed, and the turntable positioning device includes an in-position detecting unit and an origin detecting unit, wherein: the in-position detecting unit includes a first identification module and a first detection module, wherein the first identification module is configured to identify a position of the working area on the rotating table; the first detecting module is configured to determine the first identification module Whether the work area reaches the predetermined position; the origin detection unit includes a second identification module and a second detection module, the second identification module is used to identify the origin position, and the second detection module is configured to detect the first The two identification modules determine whether the work area has reached the origin position.
其中，該第一標識模組包括第一凸部，該第一凸部設置在該轉盤的外周壁上的與該工作區相對應的位置處。該第一檢測模組包括第一感測器和第一控制器，其中：該第一感測器為距離感測器，其設置在該轉盤外周壁的週邊，用以在該轉盤自其原點位置旋轉時，朝向該第一凸部經過的路徑發射檢測信號，並接收來自該路徑上的各個位置的回饋信號，且將該回饋信號發送至該第一控制器；該第一控制器用於在該轉盤旋轉至預定角度時，判斷該回饋信號是否來自該第一凸部，若是，則確定該工作區 到達預定位置；若否，則確定該工作區出現位置異常；該預定角度為預設的該工作區域到達預定位置時需要該轉盤自其原點位置旋轉的角度。 The first identification module includes a first convex portion disposed at a position corresponding to the working area on an outer peripheral wall of the turntable. The first detecting module includes a first sensor and a first controller, wherein: the first sensor is a distance sensor disposed at a periphery of the outer peripheral wall of the turntable for using the turntable from the original When the point position is rotated, the detection signal is transmitted toward the path through which the first convex portion passes, and the feedback signal from each position on the path is received, and the feedback signal is sent to the first controller; the first controller is used for Determining whether the feedback signal is from the first convex portion when the turntable is rotated to a predetermined angle, and if yes, determining the working area Arriving at the predetermined position; if not, determining that the working area is abnormal; the predetermined angle is an angle at which the predetermined rotating position of the working area needs to be rotated from the original position when the working area reaches the predetermined position.
其中，該第一標識模組被設置成沿該轉盤的厚度方向貫穿該轉盤的第一通孔，並且該第一通孔位於與該工作區相對應的位置處。該第一檢測模組包括第一感測器和第一控制器，其中：該第一感測器為對射感測器，其包括分別設置在該轉盤的上下兩側的發射端和接收端，該發射端用於在該轉盤自其原點位置旋轉時，朝向該承載面上的該第一通孔經過的路徑發射檢測信號；該接收端用於接收來自該發射端的且穿過該第一通孔的檢測信號，並將該檢測信號發送至該第一控制器；該第一控制器用於在該轉盤旋轉至預定角度時，判斷該接收端是否接收到該檢測信號，若是，則確定該工作區到達預定位置；若否，則確定該工作區出現位置異常；該預定角度為預設的該工作區域到達預定位置時需要該轉盤自其原點位置旋轉的角度。 The first identification module is disposed to penetrate the first through hole of the turntable in a thickness direction of the turntable, and the first through hole is located at a position corresponding to the working area. The first detecting module includes a first sensor and a first controller, wherein: the first sensor is a pair of sensors, and includes a transmitting end and a receiving end respectively disposed on upper and lower sides of the turntable The transmitting end is configured to emit a detection signal toward a path that the first through hole on the bearing surface passes when the rotating wheel rotates from the original position thereof; the receiving end is configured to receive from the transmitting end and pass through the first a detection signal of a through hole, and sending the detection signal to the first controller; the first controller is configured to determine whether the receiving end receives the detection signal when the turntable is rotated to a predetermined angle, and if yes, determine The working area reaches a predetermined position; if not, it is determined that the working area has an abnormal position; the predetermined angle is an angle at which the working area needs to be rotated from the original position when the working area reaches the predetermined position.
其中，該工作區的數量為多個，且沿該轉盤的周向間隔設置；該第一標識模組的數量和位置與該工作區的數量和位置一一對應；該第一感測器的數量少於或等於該工作區的數量，且在該轉盤處於原點位置時，每個該第一感測器單獨且唯一地對應於一個該第一標識模組。 The number of the working areas is multiple, and is arranged along the circumferential interval of the turntable; the number and position of the first identification module are in one-to-one correspondence with the number and position of the working area; the first sensor The number is less than or equal to the number of the work areas, and each of the first sensors individually and uniquely corresponds to one of the first identification modules when the turntable is at the origin position.
其中，該工作區的數量為多個，且沿該轉盤的周向間隔設置；該第一標識模組的數量少於或等於該工作區的數量；該第一感測器的數量與該工作區的數量一致，並且在該轉盤處於原點位置時，該第一感測器的位置與該工作區的位置一一對應，每個該第一標識模組單獨且唯一地 對應於一個該第一感測器。 Wherein, the number of the work areas is multiple, and is arranged along the circumferential interval of the turntable; the number of the first identification modules is less than or equal to the number of the work areas; the number of the first sensors and the work The number of zones is the same, and when the carousel is at the origin position, the position of the first sensor is in one-to-one correspondence with the location of the work zone, and each of the first identity modules is individually and uniquely Corresponding to one of the first sensors.
其中，該第二標識模組包括第二凸部，該第二凸部設置在該轉盤的外周壁上的與該轉盤的原點位置相對應的位置處，該第二凸部包括伸出該轉盤的上表面或下表面的第二延伸部。該第二檢測模組包括第二感測器和第二控制器，其中：該第二感測器為距離感測器，其設置在該轉盤外周壁的週邊，用以在該轉盤旋轉時，朝向該第二延伸部經過的路徑發射檢測信號，並接收來自該路徑上的各個位置的回饋信號，且將該回饋信號發送至該第二控制器；該第二控制器用於判斷該回饋信號是否來自該第二延伸部，若是，則根據該第二延伸部的位置而確定該轉盤到達原點位置。 The second marking module includes a second convex portion disposed at a position on an outer peripheral wall of the turntable corresponding to an origin position of the turntable, the second convex portion including the protruding portion a second extension of the upper or lower surface of the turntable. The second detecting module includes a second sensor and a second controller, wherein: the second sensor is a distance sensor disposed at a periphery of the outer peripheral wall of the turntable for rotating the turntable Transmitting a detection signal toward a path through which the second extension passes, and receiving a feedback signal from each position on the path, and transmitting the feedback signal to the second controller; the second controller is configured to determine whether the feedback signal is From the second extension, if so, the turntable is determined to arrive at the origin position based on the position of the second extension.
其中，該第一凸部包括第一延伸部，該第一延伸部沿與該第二延伸部相反的方向而延伸出該轉盤下表面或上表面；並且該第一感測器朝向該第一延伸部經過的路徑發射檢測信號。 Wherein the first protrusion comprises a first extension, the first extension extending out of the lower surface or the upper surface of the turntable in a direction opposite to the second extension; and the first sensor faces the first The path through which the extension passes transmits a detection signal.
其中，該第二標識模組被設置成沿該轉盤的厚度方向貫穿該轉盤的第二通孔，並且該第二通孔位於與該轉盤的原點位置相對應的位置處。該第二檢測模組包括第二感測器和第二控制器，其中：該第二感測器為對射感測器，其包括分別設置在該轉盤的上下兩側的發射端和接收端，該發射端用於在該轉盤旋轉時，朝向該承載面上的該第二通孔經過的路徑發射檢測信號；該接收端用於接收來自該發射端的且穿過該第二通孔的檢測信號，並將該檢測信號發送至該第二控制器；該第二控制器用於判斷該接收端是否接收到該檢測信號，若是，則確定該轉盤到達原點位置。 The second identification module is disposed to penetrate the second through hole of the turntable in a thickness direction of the turntable, and the second through hole is located at a position corresponding to an origin position of the turntable. The second detecting module includes a second sensor and a second controller, wherein: the second sensor is an opposite sensor, and the transmitting end and the receiving end respectively disposed on the upper and lower sides of the turntable The transmitting end is configured to emit a detection signal toward a path that the second through hole on the bearing surface passes when the turntable rotates; the receiving end is configured to receive the detection from the transmitting end and pass through the second through hole And sending the detection signal to the second controller; the second controller is configured to determine whether the receiving end receives the detection signal, and if so, determining that the dial reaches the origin position.
其中，該第一標識模組與該轉盤的中心之間的距離不等於該 第二標識模組與該轉盤的中心之間的距離。 Wherein the distance between the first identification module and the center of the turntable is not equal to the The distance between the second identification module and the center of the turntable.
其中，該第二控制器在每次確定該轉盤到達原點位置時重置該轉盤的旋轉角度。 Wherein, the second controller resets the rotation angle of the turntable each time the turntable is determined to reach the origin position.
為實現本發明的目的還提供一種裝載傳輸系統，包括裝卸腔室、傳輸腔室和反應腔室，其中，該裝卸腔室用於裝載或卸載晶片；該傳輸腔室設置在裝卸腔室和反應腔室之間，且設置有機械手，用以在該裝卸腔室和反應腔室之間傳輸晶片；該反應腔室包括轉盤定位裝置，用以將晶片旋轉至預定位置，該轉盤定位裝置採用本發明提供的上述轉盤定位裝置。 Also provided for the purpose of the present invention is a load transport system comprising a loading and unloading chamber, a transfer chamber and a reaction chamber, wherein the loading and unloading chamber is for loading or unloading a wafer; the transfer chamber is disposed in the loading and unloading chamber and reacting Between the chambers, and a robot is disposed to transfer the wafer between the loading and unloading chamber and the reaction chamber; the reaction chamber includes a turntable positioning device for rotating the wafer to a predetermined position, and the turntable positioning device is The above-mentioned turntable positioning device provided by the present invention.
為實現本發明的目的還提供一種電漿加工設備，其包括裝載傳輸系統，並且該裝載傳輸系統採用本發明提供的上述轉盤定位裝置。 Also provided for the purpose of the present invention is a plasma processing apparatus comprising a load transport system, and the load transport system employs the above-described turntable positioning device provided by the present invention.
本發明具有下述有益效果： 本發明提供的轉盤定位裝置，其到位檢測單元通過借助第一檢測模組檢測用於標識工作區域在轉盤上的位置的第一標識模組，可以判斷該工作區是否到達預定位置，從而可以及時獲知轉盤的工作區是否出現位置異常，這不僅可以保證工作程序的正常進行，而且可以避免發生機械故障，進而可以提高離子體加工的安全性和穩定性。 The invention has the following beneficial effects: The turntable positioning device provided by the present invention can detect whether the working area reaches a predetermined position by detecting the first identification module for identifying the position of the working area on the turntable by using the first detecting module. It is known whether the working area of the turntable is abnormal, which not only ensures the normal operation of the working program, but also avoids mechanical failure, thereby improving the safety and stability of the ion processing.
本發明提供的裝載傳輸系統，其包括本發明提供的上述轉盤定位裝置，這不僅可以保證將晶片旋轉至預定位置的工作程序正常進行，而且可以避免發生機械故障，進而可以提高離子體加工的安全性和穩定性。 The loading and delivery system provided by the invention comprises the above-mentioned rotary disk positioning device provided by the invention, which not only ensures the normal operation of rotating the wafer to a predetermined position, but also avoids mechanical failure, thereby improving the safety of ion processing. Sex and stability.
本發明提供的電漿加工設備其通過採用本發明提供的上述裝載傳輸系統，不僅可以保證將晶片旋轉至預定位置的工作程序正常進 行，而且可以避免發生機械故障，從而可以提高離子體加工設備的安全性和穩定性。 The plasma processing apparatus provided by the present invention can ensure not only the normal operation of rotating the wafer to a predetermined position by using the above-described loading and transport system provided by the present invention. OK, and mechanical failure can be avoided, which can improve the safety and stability of the ion processing equipment.
1‧‧‧裝卸腔室 1‧‧‧ loading and unloading chamber
2‧‧‧傳輸腔室 2‧‧‧Transmission chamber
3‧‧‧反應腔室 3‧‧‧Reaction chamber
21‧‧‧機械手 21‧‧‧ Robot
31、50‧‧‧轉盤 31, 50‧‧‧ Turntable
32‧‧‧靶材 32‧‧‧ Target
33‧‧‧頂針 33‧‧‧ thimble
34‧‧‧基座 34‧‧‧Base
35‧‧‧轉盤旋轉機構 35‧‧‧ Turntable rotating mechanism
36‧‧‧頂針升降機構 36‧‧‧ thimble lifting mechanism
37‧‧‧基座升降機構 37‧‧‧Base lifting mechanism
38、60、61‧‧‧通孔 38, 60, 61‧‧‧ through holes
40‧‧‧晶片 40‧‧‧ wafer
41‧‧‧原點凸起 41‧‧‧ origin bump
42‧‧‧透明觀察窗 42‧‧‧Transparent observation window
43‧‧‧鐳射漫反射感測器 43‧‧‧Laser diffuse reflection sensor
51‧‧‧工作區 51‧‧‧Workspace
52、53‧‧‧距離感測器 52, 53‧‧‧ distance sensor
54、55‧‧‧凸部 54, 55‧‧ ‧ convex
62‧‧‧對射感測器 62‧‧‧pair sensor
541、551‧‧‧延伸部 541, 551‧‧‧ Extension
第1圖為現有的一種裝載傳輸系統的示意圖；第2A圖為第1圖中反應腔室的俯視圖；第2B圖為沿第2A圖中的A-A線的剖視圖；第3圖為現有的一種轉盤定位裝置的俯視圖；第4A圖為本發明實施例一提供的一種轉盤定位裝置的俯視圖；第4B圖為第4A圖在A向上的側視圖；第5A圖為本發明實施例一提供的另一種轉盤定位裝置的俯視圖；第5B圖為第5A圖在A向上的側視圖；第6A圖為本發明實施例二提供的轉盤定位裝置的俯視圖；以及第6B圖為沿第6A圖中的B-B線的剖視圖。 1 is a schematic view of a conventional loading and transport system; FIG. 2A is a plan view of the reaction chamber in FIG. 1; FIG. 2B is a cross-sectional view taken along line AA of FIG. 2A; and FIG. 3 is a conventional turntable; FIG. 4A is a plan view of a turntable positioning device according to Embodiment 1 of the present invention; FIG. 4B is a side view of FIG. 4A in the A direction; FIG. 5A is another view of the first embodiment of the present invention; a top view of the turntable positioning device; FIG. 5B is a side view of the fifth AA in the A direction; FIG. 6A is a plan view of the turntable positioning device according to the second embodiment of the present invention; and FIG. 6B is a line BB along the sixth drawing Cutaway view.
為使本領域的技術人員更好地理解本發明的技術方案，下面結合附圖對本發明實施例提供的轉盤定位裝置、裝載傳輸系統及電漿加工設備進行詳細描述。 In order to enable those skilled in the art to better understand the technical solutions of the present invention, the turntable positioning device, the loading and transporting system and the plasma processing device provided by the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
本發明實施例提供的轉盤定位裝置包括轉盤、到位檢測單元和原點檢測單元。其中，在轉盤上設置有工作區，用以承載工件；到位檢測單元包括第一標識模組和第一檢測模組，第一標識模組用於標識工作區域在轉盤上的位置，第一檢測模組用於通過檢測第一標識模組來判斷工作 區域是否到達預定位置；原點檢測單元包括第二標識模組和第二檢測模組，第二標識模組用於標識原點位置，第二檢測模組用於通過檢測第二標識模組來判斷工作區域是否到達原點位置。借助到位檢測單元的第一檢測模組來檢測第一標識模組，可以判斷工作區域是否到達預定位置，從而可以及時獲知轉盤的工作區是否出現位置異常，這樣，不僅可以保證工作程序的正常進行，而且可以避免發生機械故障，進而可以提高離子體加工的安全性和穩定性。 The dial positioning device provided by the embodiment of the invention comprises a turntable, an in-position detecting unit and an origin detecting unit. Wherein, a working area is arranged on the turntable for carrying the workpiece; the in-position detecting unit comprises a first marking module and a first detecting module, and the first marking module is used for identifying the position of the working area on the turntable, the first detecting The module is used to judge the work by detecting the first identification module Whether the area reaches the predetermined position; the origin detecting unit includes a second marking module and a second detecting module, the second marking module is used for identifying the origin position, and the second detecting module is configured to detect the second marking module Determine if the work area has reached the origin position. The first detecting module is detected by the first detecting module of the in-position detecting unit, and it can be determined whether the working area reaches the predetermined position, so that the working area of the turntable can be known in time to be abnormal, so that the working procedure can be ensured not only. And can avoid mechanical failure, which can improve the safety and stability of ion processing.
實施例一 Embodiment 1
第4A圖為本發明實施例一提供的一種轉盤定位裝置的俯視圖。第4B圖為第4A圖在A向上的側視圖。請一併參閱第4A圖和第4B圖，在本實施例中，在轉盤50上設置有工作區51，工作區51的數量為多個，且沿轉盤50的周向間隔設置。 FIG. 4A is a top view of a turntable positioning device according to Embodiment 1 of the present invention. Fig. 4B is a side view of Fig. 4A in the A direction. Referring to FIG. 4A and FIG. 4B together, in the present embodiment, a work area 51 is provided on the turntable 50, and the number of the work areas 51 is plural, and is arranged along the circumferential direction of the turntable 50.
在到位檢測單元中，第一標識模組包括第一凸部54，第一凸部54設置在轉盤50的外周壁上，且數量和位置與工作區51的數量和位置一一對應；第一檢測模組包括第一距離感測器52和第一控制器(圖中未示出)，其中，第一距離感測器52設置在轉盤50外周壁的週邊，用以在轉盤50自其原點位置旋轉時，朝向第一凸部54經過的路徑發射檢測信號，並接收來自該路徑上各個位置的回饋信號，且將該回饋信號發送至第一控制器。 在本實施例中，第一距離感測器52的數量少於或等於工作區51的數量，且在轉盤50處於原點位置時，每個第一距離感測器52的位置與所有第一凸部54中的一個的位置相對應，並且各個第一距離感測器52對應不同的第一凸 部54，即，在轉盤50處於原點位置時，每個第一距離感測器52單獨且唯一地對應於一個第一凸部54。 In the in-position detecting unit, the first marking module includes a first convex portion 54 disposed on the outer peripheral wall of the turntable 50, and the number and position are in one-to-one correspondence with the number and position of the working area 51; The detecting module includes a first distance sensor 52 and a first controller (not shown), wherein the first distance sensor 52 is disposed at the periphery of the outer peripheral wall of the turntable 50 for the turntable 50 from its original When the point position is rotated, the detection signal is transmitted toward the path through which the first convex portion 54 passes, and the feedback signal from each position on the path is received, and the feedback signal is transmitted to the first controller. In the present embodiment, the number of the first distance sensors 52 is less than or equal to the number of the work areas 51, and when the turntable 50 is at the origin position, the position of each of the first distance sensors 52 is the same as all the first The positions of one of the convex portions 54 correspond, and each of the first distance sensors 52 corresponds to a different first convex Portion 54, i.e., each of the first distance sensors 52 individually and uniquely corresponds to a first protrusion 54 when the turntable 50 is in the home position.
本實施例中，工作區51和第一凸部54各自的數量均為八個；第一距離感測器52的數量為一個，且在轉盤50處於原點位置時，該第一距離感測器52與位於最上方的第一凸部54相對應。第一控制器用於在轉盤50旋轉至預定角度時，判斷回饋信號是否來自第一凸部54，若是，則確定工作區51到達預定位置；若否，則確定轉盤50的工作區51出現位置異常。所謂預定角度，是指預設的工作區51到達預定位置時需要轉盤50自其原點位置旋轉的角度。例如，在第4A圖中，若設定位於最下方的第一凸部54到達位於轉盤50的最上方的預定位置，則需要轉盤50自當前的原點位置旋轉180°，此時第一控制器判斷回饋信號是否來自第一凸部54，若是，則確定工作區51到達預定位置；若否，則確定轉盤50的工作區51出現位置異常。 In this embodiment, the number of the working area 51 and the first convex portion 54 are each eight; the number of the first distance sensors 52 is one, and the first distance sensing is performed when the turntable 50 is at the origin position. The device 52 corresponds to the first convex portion 54 located at the uppermost portion. The first controller is configured to determine whether the feedback signal is from the first convex portion 54 when the turntable 50 is rotated to a predetermined angle, and if so, determining that the working area 51 reaches the predetermined position; if not, determining that the working area 51 of the turntable 50 is abnormally positioned . The predetermined angle refers to an angle at which the preset working area 51 needs to be rotated from its origin position when it reaches a predetermined position. For example, in FIG. 4A, if the first convex portion 54 located at the lowermost position is set to a predetermined position located at the uppermost position of the turntable 50, the turntable 50 is required to be rotated by 180° from the current origin position, at which time the first controller It is judged whether the feedback signal is from the first convex portion 54, and if so, it is determined that the work area 51 reaches the predetermined position; if not, it is determined that the work area 51 of the turntable 50 is abnormal in position.
在原點檢測單元中，第二標識模組包括第二凸部55，第二凸部55設置在轉盤50的外周壁上，且位於與轉盤50的原點位置相對應的位置處，如第4A圖所示；第二檢測模組包括第二距離感測器53和第二控制器(圖中未示出)，其中，第二距離感測器53設置在轉盤50外周壁的週邊，用以在轉盤50旋轉時，朝向第二凸部55經過的路徑發射檢測信號，並接收來自該路徑上各個位置的回饋信號，且將回饋信號發送至第二控制器；第二控制器用於判斷回饋信號是否來自第二凸部55，若是，則根據第二凸部55的位置而確定轉盤50到達原點位置。 In the origin detecting unit, the second marking module includes a second convex portion 55 which is disposed on the outer peripheral wall of the turntable 50 and is located at a position corresponding to the origin position of the turntable 50, such as the 4A The second detection module includes a second distance sensor 53 and a second controller (not shown), wherein the second distance sensor 53 is disposed at the periphery of the outer peripheral wall of the turntable 50 for When the turntable 50 rotates, the detection signal is transmitted toward the path through which the second convex portion 55 passes, and the feedback signal from each position on the path is received, and the feedback signal is sent to the second controller; the second controller is used to determine the feedback signal Whether it is from the second convex portion 55, and if so, determines that the turntable 50 reaches the origin position based on the position of the second convex portion 55.
由於轉盤50的半徑會影響轉盤50的旋轉角度誤差，即，轉盤 50的半徑越大，則轉盤50的旋轉角度誤差越大，反之則越小，又由於轉盤50的旋轉角度誤差會隨著轉盤50的旋轉圈數的增加而不斷增大，最終導致轉盤50的旋轉角度誤差超出允許的安全範圍，從而造成對轉盤50的定位不準確。為了解決上述技術問題，本發明中，第二控制器在每次確定轉盤50到達原點位置時重置轉盤50的旋轉角度。即，在轉盤50旋轉的程序中，只要第二控制器判斷出回饋信號是來自第二凸部55，即刻將轉盤50的旋轉角度重置為零。通過借助第二控制器在每次確定轉盤50到達原點位置時重置轉盤50的旋轉角度，可以清除轉盤50旋轉每一圈所產生的旋轉角度誤差，相當於對轉盤50的原點位置重新定位，從而可以將轉盤50的旋轉角度誤差控制在允許的安全範圍內。 Since the radius of the turntable 50 affects the rotation angle error of the turntable 50, that is, the turntable The larger the radius of 50, the larger the rotation angle error of the turntable 50, and the smaller the reverse, the more the rotation angle error of the turntable 50 increases with the number of rotations of the turntable 50, eventually resulting in the turntable 50. The rotation angle error is outside the allowable safety range, resulting in inaccurate positioning of the turntable 50. In order to solve the above technical problem, in the present invention, the second controller resets the rotation angle of the turntable 50 each time it is determined that the turntable 50 reaches the home position. That is, in the program in which the turntable 50 rotates, as long as the second controller determines that the feedback signal is from the second convex portion 55, the rotation angle of the turntable 50 is immediately reset to zero. By resetting the rotation angle of the turntable 50 each time the dial 50 is determined to reach the origin position by the second controller, the rotation angle error generated by the rotation of the turntable 50 can be cleared, which is equivalent to re-positioning the origin of the turntable 50. Positioning, so that the rotation angle error of the turntable 50 can be controlled within an allowable safety range.
在本實施例中，多個第一凸部54中的一個與第二凸部55中的一個設置在同一位置上，且二者採用一體式結構，如第4B圖所示，並且，為了使第一距離感測器52僅能檢測到第一凸部54，且第二距離感測器53僅能檢測到第二凸部55，第一凸部54包括伸出轉盤50的上表面的第一延伸部541，且第二凸部55包括伸出轉盤的下表面的第二延伸部551，並且第一距離感測器52和第二距離感測器53分別朝向第一延伸部541和第二延伸部551經過的路徑發射檢測信號。 In the present embodiment, one of the plurality of first convex portions 54 and one of the second convex portions 55 are disposed at the same position, and both adopt a unitary structure, as shown in FIG. 4B, and The first distance sensor 52 can only detect the first convex portion 54, and the second distance sensor 53 can only detect the second convex portion 55, and the first convex portion 54 includes the first surface that protrudes from the upper surface of the turntable 50. An extension portion 541, and the second protrusion portion 55 includes a second extension portion 551 extending from a lower surface of the turntable, and the first distance sensor 52 and the second distance sensor 53 respectively face the first extension portion 541 and the first portion The path through which the second extension portion 551 passes transmits a detection signal.
由於第一延伸部541和第二延伸部551在豎直方向上具有高度差，這使得第一距離感測器52僅能檢測到第一延伸部541經過的路徑，且第二距離感測器53僅能檢測到第二延伸部551經過的路徑，從而可以保證第一距離感測器52/第二距離感測器53不會受到第二凸部55/第一凸部54的干 擾。此外，借助第一延伸部541/第二延伸部551，可以使第一距離感測器52/第二距離感測器53發射的檢測信號高於/低於轉盤50的外周壁，從而在進行到位檢測/原點檢測的程序中，只有當第一延伸部541/第二延伸部551經過第一距離感測器52/第二距離感測器53對應的位置時，第一距離感測器52/第二距離感測器53才接收到回饋信號，這不僅會提高第一距離感測器52和第二距離感測器53的檢測敏感度，而且無需對轉盤50的外周壁的平整性提出很高的要求，從而在提高了定位準確性的同時，降低了加工難度，進而降低了加工成本。 Since the first extension portion 541 and the second extension portion 551 have a height difference in the vertical direction, this allows the first distance sensor 52 to detect only the path through which the first extension portion 541 passes, and the second distance sensor 53 can only detect the path through which the second extension portion 551 passes, so that the first distance sensor 52 / the second distance sensor 53 can be prevented from being dried by the second convex portion 55 / the first convex portion 54 Disturb. In addition, with the first extension portion 541 / the second extension portion 551, the detection signal emitted by the first distance sensor 52 / the second distance sensor 53 can be higher/lower than the outer peripheral wall of the turntable 50, thereby proceeding In the in-position detection/origin detection process, the first distance sensor is only when the first extension portion 541 / the second extension portion 551 passes the position corresponding to the first distance sensor 52 / the second distance sensor 53 The 52/second distance sensor 53 receives the feedback signal, which not only improves the detection sensitivity of the first distance sensor 52 and the second distance sensor 53, but also does not require the flatness of the outer peripheral wall of the turntable 50. High requirements are put forward, which reduces the processing difficulty and reduces the processing cost while improving the positioning accuracy.
當然，在實際應用中，第一凸部的第一延伸部也可以設置成伸出轉盤的下表面的，且第二凸部的第二延伸部也可以設置成伸出轉盤的上表面。此外，也可以省去第一延伸部和第二延伸部，並使第一凸部的檢測面與第一距離感測器之間的水準間距不同於第二凸部的檢測面與第二距離感測器之間的水準間距，即，第一凸部與第二凸部在轉盤的徑向上的長度不同，以使第一距離感測器和第二距離感測器根據檢測到的距離識別第一凸部與第二凸部。或者，可以使第一延伸部和第二延伸部同時伸出轉盤的上表面或下表面，只要二者的高度不同即可。 Of course, in practical applications, the first extension of the first protrusion may also be disposed to extend beyond the lower surface of the turntable, and the second extension of the second protrusion may also be disposed to extend beyond the upper surface of the turntable. In addition, the first extension portion and the second extension portion may be omitted, and the level interval between the detection surface of the first protrusion portion and the first distance sensor is different from the detection surface and the second distance of the second protrusion portion. The level spacing between the sensors, that is, the lengths of the first protrusion and the second protrusion in the radial direction of the turntable are such that the first distance sensor and the second distance sensor are identified according to the detected distance The first convex portion and the second convex portion. Alternatively, the first extension portion and the second extension portion may be simultaneously extended from the upper surface or the lower surface of the turntable as long as the heights of the two are different.
需要說明的是，在本實施例中，第一檢測模組和第二檢測模組均採用鐳射反射式距離感測器進行檢測，但是本發明並不侷限於此，在實際應用中，還可以採用其他種類的感測器，而根據感測器種類的不同，可以相應地調整第一檢測模組和第二檢測模組的安裝方法、相對於轉盤的位置和距離等參數，而且第一識別模組和第二識別模組的結構、尺寸、材 料和安裝方式等參數也應相應地進行調整。只要原點檢測單元可以檢測轉盤的原點位置，且到位檢測單元可以檢測轉盤的工作區是否到達預定位置即可。 It should be noted that, in this embodiment, the first detecting module and the second detecting module are all detected by using a laser reflective distance sensor, but the present invention is not limited thereto, and in practical applications, Other types of sensors are used, and depending on the type of the sensor, the installation method of the first detection module and the second detection module, the position and distance relative to the turntable, and the like can be adjusted accordingly, and the first identification Structure, size and material of the module and the second identification module Parameters such as material and installation method should also be adjusted accordingly. As long as the origin detecting unit can detect the origin position of the dial, and the in-position detecting unit can detect whether the working area of the dial reaches the predetermined position.
還需要說明的是，在本實施例中，第一凸部54數量和位置與工作區51的數量和位置一一對應，且第一距離感測器52的數量少於或等於工作區51的數量，但是本發明並不侷限於此，在實際應用中，也可以採用下述設置方式：如第5A圖和第5B圖所示，使第一凸部54的數量少於或等於工作區的數量；在轉盤處於原點位置時，第一距離感測器52的數量和位置與工作區51的數量和位置一一對應，且每個第一凸部54的位置與所有第一距離感測器52中的一個的位置相對應，並且各個第一凸部54對應不同的第一距離感測器52，即，在轉盤50處於原點位置時，第一距離感測器52的位置與工作區51的位置一一對應，每個第一凸部54單獨且唯一地對應於一個第一距離感測器52。例如，在第5A圖中，工作區51和第一距離感測器52各自的數量均為八個；第一凸部54的數量為一個，且在轉盤50處於原點位置時，該第一凸部54與位於最上方的第一距離感測器52相對應。 It should be noted that, in this embodiment, the number and position of the first convex portions 54 are in one-to-one correspondence with the number and position of the working areas 51, and the number of the first distance sensors 52 is less than or equal to the working area 51. The number, but the present invention is not limited thereto. In practical applications, the following arrangement may also be adopted: as shown in FIGS. 5A and 5B, the number of the first convex portions 54 is less than or equal to the working area. Quantity; when the turntable is at the origin position, the number and position of the first distance sensors 52 correspond one-to-one with the number and position of the work areas 51, and the position of each first convex portion 54 is sensed with all the first distances The position of one of the devices 52 corresponds to each other, and each of the first convex portions 54 corresponds to a different first distance sensor 52, that is, the position and operation of the first distance sensor 52 when the turntable 50 is at the origin position. The positions of the areas 51 correspond one-to-one, and each of the first convex portions 54 individually and uniquely corresponds to one first distance sensor 52. For example, in FIG. 5A, the number of the work area 51 and the first distance sensor 52 are each eight; the number of the first convex portions 54 is one, and when the turntable 50 is at the origin position, the first The convex portion 54 corresponds to the first distance sensor 52 located at the uppermost position.
進一步需要說明的是，在本實施例中，第二凸部55與第一凸部54中的一個設置在同一位置上，換言之，轉盤50的原點位置與其中一個工作區51的位置相對應，但是本發明並不侷限於此，在實際應用中，轉盤的原點位置可以根據具體需要而自由設定，即，第二凸部的位置可以與第一凸部的位置不同，且二者相互獨立。 It should be further noted that, in the present embodiment, the second convex portion 55 is disposed at the same position as one of the first convex portions 54, in other words, the origin position of the turntable 50 corresponds to the position of one of the working regions 51. However, the present invention is not limited thereto. In practical applications, the origin position of the turntable can be freely set according to specific needs, that is, the position of the second convex portion can be different from the position of the first convex portion, and the two are mutually independent.
進一步需要說明的是，在本實施例中，工作區51的數量為多 個，且沿轉盤50的周向間隔設置，但是本發明並不侷限於此，在實際應用中，工作區也可以為一個，且根據具體需要設置在轉盤周向上的指定位置。 另外，所謂第一凸部位於與工作區相對應的位置處，是指第一凸部與工作區之間具有預設的位置關係，在確定第一凸部的位置時，可以根據該對應關係間接獲得工作區的位置。與之相類似的，所謂第二凸部位於與轉盤的原點位置相對應的位置處，是指第二凸部與轉盤的原點位置具有預設的位置關係，在確定第二凸部的位置時，可以根據該對應關係間接獲得轉盤的原點位置。 It should be further noted that, in this embodiment, the number of working areas 51 is large. And arranged along the circumferential direction of the turntable 50, but the present invention is not limited thereto. In practical applications, the working area may also be one, and is set at a specified position in the circumferential direction of the turntable according to specific needs. In addition, the first convex portion is located at a position corresponding to the working area, which means that the first convex portion has a preset positional relationship with the working area, and when determining the position of the first convex portion, the corresponding relationship may be Indirectly get the location of the workspace. Similarly, the so-called second convex portion is located at a position corresponding to the origin position of the turntable, which means that the second convex portion has a predetermined positional relationship with the origin position of the turntable, and the second convex portion is determined. In the position, the origin position of the turntable can be obtained indirectly according to the correspondence.
實施例二 Embodiment 2
第6A圖為本發明實施例二提供的轉盤定位裝置的俯視圖。 第6B圖為沿第6A圖中的B-B線的剖視圖。請一併參閱第6A圖和第6B圖，在本實施例中，在轉盤50上設置有工作區51，工作區51的數量為多個，且沿轉盤50的周向間隔設置。 FIG. 6A is a top view of a turntable positioning device according to Embodiment 2 of the present invention. Fig. 6B is a cross-sectional view taken along line B-B in Fig. 6A. Referring to FIGS. 6A and 6B together, in the present embodiment, a work area 51 is provided on the turntable 50, and the number of the work areas 51 is plural, and is arranged along the circumferential direction of the turntable 50.
在到位檢測單元中，第一標識模組包括設置在轉盤50的工作區承載面(即，轉盤50的用於承載工件的表面)上且貫穿轉盤50厚度的第一通孔61，並且第一通孔61的數量和位置與工作區51的數量和位置一一對應；第一檢測模組包括第一對射感測器63和第一控制器(圖中未示出)，其中，第一對射感測器63包括分別設置在轉盤50的上下兩側的發射端和接收端，該發射端用於在轉盤50自其原點位置旋轉時，朝向轉盤50的承載面上的第一通孔61經過的路徑發射檢測信號；該接收端用於接收來自發射端的穿過第一通孔63的檢測信號，且將該檢測信號發送至第一控制器。容易理 解，只有在發射端、通孔和接收端在豎直方向上處於一條直線的情況下，自發射端發出的檢測信號才可以穿過通孔，並由接收端接收。 In the in-position detecting unit, the first marking module includes a first through hole 61 disposed on the working area bearing surface of the turntable 50 (ie, the surface of the turntable 50 for carrying the workpiece) and penetrating the thickness of the turntable 50, and first The number and position of the through holes 61 are in one-to-one correspondence with the number and position of the working areas 51; the first detecting module includes a first pair of sensors 63 and a first controller (not shown), wherein The illuminating sensor 63 includes a transmitting end and a receiving end respectively disposed on the upper and lower sides of the turntable 50, and the transmitting end is configured to face the first pass on the carrying surface of the turntable 50 when the turntable 50 is rotated from the original position thereof The path through which the hole 61 passes transmits a detection signal; the receiving end is for receiving a detection signal from the transmitting end through the first through hole 63, and transmitting the detection signal to the first controller. Easy to understand Solution, only when the transmitting end, the through hole and the receiving end are in a straight line in the vertical direction, the detection signal sent from the transmitting end can pass through the through hole and be received by the receiving end.
在本實施例中，第一對射感測器63的數量少於或等於工作區51的數量，且在轉盤50處於原點位置時，每個第一對射感測器63的發射端和接收端的位置與所有第一通孔61中的一個的位置相對應，並且各個第一對射感測器63的發射端和接收端對應不同的第一通孔61，即，在轉盤50處於原點位置時，每個第一對射置感測器63的發射端和接收端單獨且唯一地對應於一個第一通孔61。例如，在第6A圖中，工作區51和第一通孔61各自的數量均為八個；第一對射感測器63的數量為一個，且在轉盤50處於原點位置時，該第一對射感測器63的發射端和接收端與位於轉盤50最右側的第一通孔61相對應。第一控制器用於在轉盤50旋轉至預定角度時，判斷接收端是否接收到檢測信號，若是，則確定工作區51到達預定位置；若否，則確定工作區51出現位置異常；所謂預定角度，是指預設的工作區51到達預定位置時需要轉盤50自其原點位置旋轉的角度。例如，在第6A圖中，若設定位於轉盤50最左側的第一通孔61到達位於轉盤50最右側的預定位置，則需要轉盤50自當前的原點位置旋轉180°，此時第一控制器判斷接收端是否接收到檢測信號，若是，則確定工作區51到達預定位置；若否，則確定轉盤50的工作區51出現位置異常。 In this embodiment, the number of the first pair of sensors 63 is less than or equal to the number of the working areas 51, and when the turntable 50 is at the origin position, the transmitting end of each of the first pair of sensors 63 and The position of the receiving end corresponds to the position of one of the first through holes 61, and the transmitting end and the receiving end of each of the first facing sensors 63 correspond to different first through holes 61, that is, the turntable 50 is in the original In the dot position, the transmitting end and the receiving end of each of the first pair of radiation sensors 63 individually and uniquely correspond to one first through hole 61. For example, in FIG. 6A, the number of the work area 51 and the first through hole 61 are each eight; the number of the first pair of proximity sensors 63 is one, and when the turntable 50 is at the origin position, the first The transmitting end and the receiving end of the pair of radiation sensors 63 correspond to the first through holes 61 located at the far right of the turntable 50. The first controller is configured to determine whether the receiving end receives the detection signal when the turntable 50 is rotated to a predetermined angle, and if yes, determine that the working area 51 reaches the predetermined position; if not, determine that the working area 51 is abnormally positioned; the predetermined angle, It refers to the angle at which the preset working area 51 needs to rotate from its origin position when it reaches the predetermined position. For example, in FIG. 6A, if the first through hole 61 located at the leftmost side of the turntable 50 is set to a predetermined position on the rightmost side of the turntable 50, the turntable 50 is required to be rotated by 180° from the current origin position, at which time the first control is performed. The device determines whether the receiving end receives the detection signal, and if so, determines that the working area 51 reaches the predetermined position; if not, determines that the working area 51 of the turntable 50 is in a position abnormality.
在原點檢測單元中，第二標識模組包括設置在轉盤50的工作區承載面上且貫穿轉盤50厚度的第二通孔60，並且第二通孔60位於與轉盤50的原點位置相對應的位置處，如第6B圖所示；第二檢測模組包括第二對 射感測器62和第二控制器(圖中未示出)，其中，第二對射感測器62包括分別設置在轉盤50的上下兩側的發射端和接收端，該發射端用於在轉盤50旋轉時，朝向轉盤50的承載面上的第二通孔60經過的路徑發射檢測信號；該接收端用於接收來自發射端的穿過第二通孔60的檢測信號，且將檢測信號發送至第二控制器；第二控制器用於判斷接收端是否接收到檢測信號，若是，則確定轉盤50到達原點位置。 In the origin detecting unit, the second marking module includes a second through hole 60 disposed on the working area bearing surface of the turntable 50 and passing through the thickness of the turntable 50, and the second through hole 60 is located at an origin position corresponding to the turntable 50. Position as shown in Figure 6B; the second detection module includes a second pair The sensor 62 and the second controller (not shown), wherein the second pair of sensors 62 include a transmitting end and a receiving end respectively disposed on the upper and lower sides of the turntable 50, the transmitting end being used for When the turntable 50 rotates, a detection signal is transmitted toward a path through which the second through hole 60 on the bearing surface of the turntable 50 passes; the receiving end is for receiving a detection signal from the transmitting end through the second through hole 60, and the detection signal is to be detected. Sending to the second controller; the second controller is for determining whether the receiving end receives the detection signal, and if so, determining that the turntable 50 reaches the origin position.
較佳地，第二控制器在每次確定轉盤50到達原點位置時重置轉盤50的旋轉角度，該重置方法與上述第一實施例相類似，在此不再贅述。 Preferably, the second controller resets the rotation angle of the turntable 50 each time the turntable 50 is determined to reach the origin position. The reset method is similar to that of the first embodiment described above, and details are not described herein again.
在本實施例中，為了使第一對射感測器63僅能檢測到第一通孔61，且第二對射感測器62僅能檢測到第二通孔60，第二通孔60與轉盤50之間的中心距L1不等於第一通孔61與轉盤50之間的中心距L2，如第6B圖所示，即，第一通孔61和第二通孔60分別位於轉盤50上的不同半徑的圓周上，從而可以保證第一對射感測器63/第二對射感測器62不會受到第二通孔60/第一通孔61的干擾。 In this embodiment, in order to enable the first pair of sensors 63 to detect only the first through hole 61, and the second pair of sensors 62 can only detect the second through hole 60, the second through hole 60 The center distance L1 between the turntable 50 and the turntable 50 is not equal to the center distance L2 between the first through hole 61 and the turntable 50, as shown in FIG. 6B, that is, the first through hole 61 and the second through hole 60 are respectively located on the turntable 50. On the circumference of the different radii, it is ensured that the first pair of the first sensor 63 / the second pair of sensors 62 are not disturbed by the second through hole 60 / the first through hole 61.
需要說明的是，在本實施例中，第一通孔61的數量和位置與工作區51的數量和位置一一對應，且第一對射感測器63的數量少於或等於工作區51的數量，但是本發明並不侷限於此，在實際應用中，也可以採用下述設置方式：第一通孔61的數量少於或等於工作區51的數量；在轉盤50處於原點位置時，第一對射感測器63的數量和位置與工作區51的數量和位置一一對應，且每個第一通孔61的位置與所有第一對射感測器63中的一個的位置相對應，並且各個第一通孔61對應不同的第一對射感測器63，即， 在轉盤50處於原點位置時，第一對射感測器63的位置和工作區51的位置一一對應，且每個第一通孔61單獨且唯一地對應於一個第一對射感測器63。 It should be noted that, in this embodiment, the number and position of the first through holes 61 are in one-to-one correspondence with the number and position of the working areas 51, and the number of the first pair of radiation sensors 63 is less than or equal to the working area 51. The number of the present invention is not limited thereto. In practical applications, the following arrangement may also be adopted: the number of the first through holes 61 is less than or equal to the number of the working areas 51; when the turntable 50 is at the origin position The number and position of the first pair of sensors 63 are in one-to-one correspondence with the number and position of the work areas 51, and the position of each of the first through holes 61 and the position of one of all the first pair of sensors 63 Correspondingly, and each of the first through holes 61 corresponds to a different first pair of radiation sensors 63, ie, When the turntable 50 is at the origin position, the position of the first pair of the sensor 63 is in one-to-one correspondence with the position of the work area 51, and each of the first through holes 61 individually and uniquely corresponds to a first pair of radiation sensing 63.
還需要說明的是，在實際應用中，第一標識模組和第二標識模組各自均可以根據實際情況而設置成前述實施例中該的凸部或者通孔的形式；並且根據第一標識模組和第二標識模組的具體形式，而設置第一檢測模組和第二檢測模組的具體實現方式，例如包括距離感測器或者對射感測器。 It should be noted that, in practical applications, each of the first identifier module and the second identifier module may be configured in the form of the protrusion or the through hole in the foregoing embodiment according to an actual situation; and according to the first identifier. The specific implementation of the first detection module and the second detection module, for example, including a distance sensor or a reflection sensor.
作為本發明另一方案，本發明還提供一種裝載傳輸系統，其包括裝卸腔室、傳輸腔室和反應腔室，其中，裝卸腔室用於裝載或卸載晶片；傳輸腔室設置在裝卸腔室和反應腔室之間，且其內設置有機械手，用以在裝卸腔室和反應腔室之間傳輸晶片；反應腔室包括轉盤定位裝置，用以將晶片旋轉至預定位置，該轉盤定位裝置採用了本發明上述各實施例提供的轉盤定位裝置。 As another aspect of the present invention, the present invention also provides a loading and transport system comprising a loading and unloading chamber, a transfer chamber and a reaction chamber, wherein the loading and unloading chamber is for loading or unloading the wafer; and the transfer chamber is disposed at the loading and unloading chamber And a reaction chamber, and a robot is disposed therein for transferring the wafer between the loading and unloading chamber and the reaction chamber; the reaction chamber includes a turntable positioning device for rotating the wafer to a predetermined position, the turntable positioning The device employs the turntable positioning device provided by the above embodiments of the present invention.
本發明實施例提供的裝載傳輸系統，其通過採用本發明實施例提供的上述轉盤定位裝置將晶片旋轉至預定位置，不僅可以保證工作程序的正常進行，而且可以避免發生機械故障，從而可以提高離子體加工的安全性和穩定性。 The loading and unloading system provided by the embodiment of the present invention can rotate the wafer to a predetermined position by using the above-mentioned turntable positioning device provided by the embodiment of the present invention, thereby not only ensuring the normal operation of the working program, but also avoiding mechanical failure, thereby improving the ion. Body safety and stability.
作為本發明又一方案，本發明還提供一種電漿加工設備，其包括裝載傳輸系統，該裝載傳輸系統採用了本發明上述實施例提供的轉盤定位裝置。 As still another aspect of the present invention, the present invention also provides a plasma processing apparatus comprising a load transport system using the turntable positioning device provided by the above embodiment of the present invention.
本發明實施例提供的電漿加工設備，其通過採用本發明提供 的上述裝載傳輸系統，不僅可以保證工作程序的正常進行，而且可以避免發生機械故障，從而可以提高離子體加工設備的安全性和穩定性。 A plasma processing apparatus provided by an embodiment of the present invention, which is provided by using the present invention The above-mentioned loading and transporting system can not only ensure the normal operation of the working program, but also avoid mechanical failure, thereby improving the safety and stability of the ion processing equipment.
可以理解的是，以上實施方式僅僅是為了說明本發明的原理 而採用的示例性實施方式，然而本發明並不侷限於此。對於本領域內的普通技術人員而言，在不脫離本發明的原理和實質的情況下，可以做出各種變型和改進，這些變型和改進也視為本發明的保護範圍。 It will be understood that the above embodiments are merely illustrative of the principles of the invention. While the exemplary embodiment is employed, the invention is not limited thereto. Various modifications and improvements can be made by those skilled in the art without departing from the spirit and scope of the invention. These modifications and improvements are also considered to be within the scope of the invention.
50‧‧‧轉盤 50‧‧‧ Turntable
51‧‧‧工作區 51‧‧‧Workspace
52、53‧‧‧距離感測器 52, 53‧‧‧ distance sensor
54、55‧‧‧凸部 54, 55‧‧ ‧ convex
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Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105063575B (en) * | 2015-09-15 | 2018-05-15 | 广东省中科宏微半导体设备有限公司 | Substrate pallet, substrate localization method and substrate alignment system |
| CN105203539A (en) * | 2015-10-15 | 2015-12-30 | 山东麦田生物技术有限公司 | Rotating disc type multi-project immune chromatographic quantitative analysis system |
| CN105300653A (en) * | 2015-12-09 | 2016-02-03 | 中国航空工业集团公司哈尔滨空气动力研究所 | Test section upper and lower rotating disk offset induction apparatus |
| CN106706947B (en) * | 2017-03-12 | 2018-06-19 | 济南海能仪器股份有限公司 | A kind of sample injection method of autosampler and kjeldahl apparatus detecting system |
| CN108987297B (en) * | 2017-05-31 | 2021-10-26 | 上海微电子装备（集团）股份有限公司 | Rotating device, chip bonding device and chip bonding method |
| CN107932166B (en) * | 2017-11-09 | 2020-10-23 | 广东天机工业智能系统有限公司 | Positioning method and device of multi-station turntable, storage medium and positioning equipment |
| CN108055624A (en) * | 2017-11-14 | 2018-05-18 | 佛山市南海科利华数控科技有限公司 | Convenient for the automatic voice coil winding machine scissors system of flying fork type of positioning |
| CN108381296B (en) * | 2018-03-23 | 2023-12-08 | 珠海格力智能装备有限公司 | Locating device and flange processing equipment with same |
| CN108688185B (en) * | 2018-04-04 | 2021-03-12 | 芜湖捷欧汽车部件有限公司 | Rotary conveying device of vacuum tank hot melting welding machine |
| TW201946581A (en) * | 2018-05-14 | 2019-12-16 | 瑞士商雀巢製品股份有限公司 | Apparatus for dispensing individual portions of beverage precursor for preparing a beverage therefrom |
| CN109018875A (en) * | 2018-08-23 | 2018-12-18 | 安徽纽创自动化装备有限公司 | A kind of automatic rotationally conveying device |
| CN111374516B (en) * | 2018-12-28 | 2021-12-03 | 浙江苏泊尔家电制造有限公司 | Cooking appliance and cooking method |
| CN110040446A (en) * | 2019-04-22 | 2019-07-23 | 苏州博众机器人有限公司 | A kind of delivering turntable and its delivering method |
| TWI686343B (en) * | 2019-06-26 | 2020-03-01 | 徐雅雯 | Positioning device for predicting feeding time and feeding position |
| KR20210026679A (en) * | 2019-08-30 | 2021-03-10 | 캐논 톡키 가부시키가이샤 | Deposition amount information acquiring apparatus, film forming apparatus, open-close apparatus, film forming method and manufacturing method of electronic device |
| CN110592560B (en) * | 2019-10-18 | 2022-02-22 | 北京北方华创微电子装备有限公司 | Process disc alignment method, process disc alignment device and semiconductor processing equipment |
| CN110817293B (en) * | 2019-11-23 | 2022-02-01 | 武汉佳悦涵发泡科技有限公司 | Disc type production platform |
| CN110919606A (en) * | 2019-11-29 | 2020-03-27 | 歌尔股份有限公司 | Automatic leveling and aligning device |
| CN111562222A (en) * | 2020-06-10 | 2020-08-21 | 重庆市机电设计研究院 | All-round visual detection system |
| CN111687063A (en) * | 2020-06-10 | 2020-09-22 | 重庆市机电设计研究院 | Omnibearing vision detection system and working method thereof |
| CN111933549B (en) * | 2020-07-28 | 2023-12-22 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment and method for detecting sliding sheets |
| CN113137942B (en) * | 2021-04-15 | 2022-12-06 | 珠海格力智能装备有限公司 | Positioning system and positioning method |
| CN114442554A (en) * | 2022-02-14 | 2022-05-06 | 众信方智(苏州)智能技术有限公司 | Control system and method for turntable machining system |
| CN114905167B (en) * | 2022-06-30 | 2024-01-02 | 广东舜元激光科技有限公司 | Cutting control method and system |
| CN115418629B (en) * | 2022-08-17 | 2024-01-12 | 杭州富芯半导体有限公司 | Method for thin film deposition |
| CN117049179A (en) * | 2023-07-11 | 2023-11-14 | 上海稷以科技有限公司 | Semiconductor automation device and automation control method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101131953A (en) * | 2006-08-23 | 2008-02-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Locating calibration device and locating calibration system |
| TW201120985A (en) * | 2009-07-22 | 2011-06-16 | Tokyo Electron Ltd | Treatment device and method for operating same |
| CN103144922A (en) * | 2012-12-25 | 2013-06-12 | 云南省烟草公司曲靖市公司 | Vertical lifting device of materials |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1308606B1 (en) * | 1999-02-12 | 2002-01-08 | Lpe Spa | DEVICE FOR HANDLING SUBSTRATES BY MEANS OF A SELF-LEVELING DEPRESSION SYSTEM IN INDUCTION EPISTAXIAL REACTORS WITH SUCCESSOR |
| CN102095895B (en) * | 2010-12-14 | 2012-09-26 | 边文超 | Calibration system of wind direction sensor |
| JP5791329B2 (en) * | 2011-03-31 | 2015-10-07 | 大陽日酸株式会社 | Vapor growth equipment |
| JP5538291B2 (en) * | 2011-04-13 | 2014-07-02 | パナソニック株式会社 | Plasma processing apparatus and plasma processing method |
| CN103130922B (en) * | 2011-11-29 | 2015-04-15 | 中国石油化工股份有限公司 | Catalyst carrier used for olefin polymerization and preparation method thereof |
| JP6042196B2 (en) * | 2011-12-22 | 2016-12-14 | キヤノンアネルバ株式会社 | Sputtering apparatus, sputtering apparatus control apparatus, and film forming method |
-
2013
- 2013-09-09 CN CN201710992688.XA patent/CN107818932B/en active Active
- 2013-09-09 CN CN201310406341.4A patent/CN104425331B/en active Active
- 2013-12-04 TW TW102144392A patent/TWI588077B/en active
- 2013-12-05 WO PCT/CN2013/088656 patent/WO2015032136A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101131953A (en) * | 2006-08-23 | 2008-02-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Locating calibration device and locating calibration system |
| TW201120985A (en) * | 2009-07-22 | 2011-06-16 | Tokyo Electron Ltd | Treatment device and method for operating same |
| CN103144922A (en) * | 2012-12-25 | 2013-06-12 | 云南省烟草公司曲靖市公司 | Vertical lifting device of materials |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104425331A (en) | 2015-03-18 |
| WO2015032136A1 (en) | 2015-03-12 |
| CN104425331B (en) | 2017-09-29 |
| CN107818932B (en) | 2020-02-14 |
| CN107818932A (en) | 2018-03-20 |
| TW201509777A (en) | 2015-03-16 |
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