TWI585146B - Composition for etching mask and pattern forming method - Google Patents
Composition for etching mask and pattern forming method Download PDFInfo
- Publication number
- TWI585146B TWI585146B TW102141263A TW102141263A TWI585146B TW I585146 B TWI585146 B TW I585146B TW 102141263 A TW102141263 A TW 102141263A TW 102141263 A TW102141263 A TW 102141263A TW I585146 B TWI585146 B TW I585146B
- Authority
- TW
- Taiwan
- Prior art keywords
- composition
- mask
- etching
- substrate
- pattern
- Prior art date
Links
- 238000005530 etching Methods 0.000 title claims description 41
- 239000000203 mixture Substances 0.000 title claims description 33
- 238000000034 method Methods 0.000 title claims description 25
- 239000000758 substrate Substances 0.000 claims description 33
- 238000007639 printing Methods 0.000 claims description 30
- 239000002904 solvent Substances 0.000 claims description 24
- 229920003986 novolac Polymers 0.000 claims description 22
- 239000002245 particle Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 15
- 239000004094 surface-active agent Substances 0.000 claims description 11
- 238000009835 boiling Methods 0.000 claims description 10
- 229910052747 lanthanoid Inorganic materials 0.000 claims description 5
- 150000002602 lanthanoids Chemical class 0.000 claims description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 229910052731 fluorine Inorganic materials 0.000 claims description 4
- 239000011737 fluorine Substances 0.000 claims description 4
- 239000002253 acid Substances 0.000 description 12
- 239000000976 ink Substances 0.000 description 10
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- -1 polyoxymethylene Polymers 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 6
- 230000000740 bleeding effect Effects 0.000 description 5
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 4
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 150000001299 aldehydes Chemical class 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- BJFHJALOWQJJSQ-UHFFFAOYSA-N (3-methoxy-3-methylpentyl) acetate Chemical compound CCC(C)(OC)CCOC(C)=O BJFHJALOWQJJSQ-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- FJJYHTVHBVXEEQ-UHFFFAOYSA-N 2,2-dimethylpropanal Chemical compound CC(C)(C)C=O FJJYHTVHBVXEEQ-UHFFFAOYSA-N 0.000 description 2
- OGRAOKJKVGDSFR-UHFFFAOYSA-N 2,3,5-trimethylphenol Chemical compound CC1=CC(C)=C(C)C(O)=C1 OGRAOKJKVGDSFR-UHFFFAOYSA-N 0.000 description 2
- QWBBPBRQALCEIZ-UHFFFAOYSA-N 2,3-dimethylphenol Chemical compound CC1=CC=CC(O)=C1C QWBBPBRQALCEIZ-UHFFFAOYSA-N 0.000 description 2
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 2
- XOUQAVYLRNOXDO-UHFFFAOYSA-N 2-tert-butyl-5-methylphenol Chemical compound CC1=CC=C(C(C)(C)C)C(O)=C1 XOUQAVYLRNOXDO-UHFFFAOYSA-N 0.000 description 2
- YCOXTKKNXUZSKD-UHFFFAOYSA-N 3,4-xylenol Chemical compound CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 2
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 2
- HMNKTRSOROOSPP-UHFFFAOYSA-N 3-Ethylphenol Chemical compound CCC1=CC=CC(O)=C1 HMNKTRSOROOSPP-UHFFFAOYSA-N 0.000 description 2
- IAVREABSGIHHMO-UHFFFAOYSA-N 3-hydroxybenzaldehyde Chemical compound OC1=CC=CC(C=O)=C1 IAVREABSGIHHMO-UHFFFAOYSA-N 0.000 description 2
- ASHGTJPOSUFTGB-UHFFFAOYSA-N 3-methoxyphenol Chemical compound COC1=CC=CC(O)=C1 ASHGTJPOSUFTGB-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- HXDOZKJGKXYMEW-UHFFFAOYSA-N 4-ethylphenol Chemical compound CCC1=CC=C(O)C=C1 HXDOZKJGKXYMEW-UHFFFAOYSA-N 0.000 description 2
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 description 2
- FFWSICBKRCICMR-UHFFFAOYSA-N 5-methyl-2-hexanone Chemical compound CC(C)CCC(C)=O FFWSICBKRCICMR-UHFFFAOYSA-N 0.000 description 2
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- QUKGYYKBILRGFE-UHFFFAOYSA-N benzyl acetate Chemical compound CC(=O)OCC1=CC=CC=C1 QUKGYYKBILRGFE-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- BTFQKIATRPGRBS-UHFFFAOYSA-N o-tolualdehyde Chemical compound CC1=CC=CC=C1C=O BTFQKIATRPGRBS-UHFFFAOYSA-N 0.000 description 2
- DTUQWGWMVIHBKE-UHFFFAOYSA-N phenylacetaldehyde Chemical compound O=CCC1=CC=CC=C1 DTUQWGWMVIHBKE-UHFFFAOYSA-N 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- RYNQKSJRFHJZTK-UHFFFAOYSA-N (3-methoxy-3-methylbutyl) acetate Chemical compound COC(C)(C)CCOC(C)=O RYNQKSJRFHJZTK-UHFFFAOYSA-N 0.000 description 1
- XJBWZINBJGQQQN-UHFFFAOYSA-N (4-methoxy-3-methylpentyl) acetate Chemical compound COC(C)C(C)CCOC(C)=O XJBWZINBJGQQQN-UHFFFAOYSA-N 0.000 description 1
- QAVJODPBTLNBSW-UHFFFAOYSA-N (4-methoxy-4-methylpentyl) acetate Chemical compound COC(C)(C)CCCOC(C)=O QAVJODPBTLNBSW-UHFFFAOYSA-N 0.000 description 1
- KJPRLNWUNMBNBZ-QPJJXVBHSA-N (E)-cinnamaldehyde Chemical compound O=C\C=C\C1=CC=CC=C1 KJPRLNWUNMBNBZ-QPJJXVBHSA-N 0.000 description 1
- DIIIISSCIXVANO-UHFFFAOYSA-N 1,2-Dimethylhydrazine Chemical compound CNNC DIIIISSCIXVANO-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- BPIUIOXAFBGMNB-UHFFFAOYSA-N 1-hexoxyhexane Chemical compound CCCCCCOCCCCCC BPIUIOXAFBGMNB-UHFFFAOYSA-N 0.000 description 1
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical class CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 description 1
- ZCONCJFBSHTFFD-UHFFFAOYSA-N 2,3,5-triethylphenol Chemical compound CCC1=CC(O)=C(CC)C(CC)=C1 ZCONCJFBSHTFFD-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- ZUAURMBNZUCEAF-UHFFFAOYSA-N 2-(2-phenoxyethoxy)ethanol Chemical compound OCCOCCOC1=CC=CC=C1 ZUAURMBNZUCEAF-UHFFFAOYSA-N 0.000 description 1
- FMRPQUDARIAGBM-UHFFFAOYSA-N 2-(2-phenoxyethoxy)ethyl acetate Chemical compound CC(=O)OCCOCCOC1=CC=CC=C1 FMRPQUDARIAGBM-UHFFFAOYSA-N 0.000 description 1
- DJCYDDALXPHSHR-UHFFFAOYSA-N 2-(2-propoxyethoxy)ethanol Chemical compound CCCOCCOCCO DJCYDDALXPHSHR-UHFFFAOYSA-N 0.000 description 1
- GWQAFGZJIHVLGX-UHFFFAOYSA-N 2-(2-propoxyethoxy)ethyl acetate Chemical compound CCCOCCOCCOC(C)=O GWQAFGZJIHVLGX-UHFFFAOYSA-N 0.000 description 1
- IXQGCWUGDFDQMF-UHFFFAOYSA-N 2-Ethylphenol Chemical compound CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- FPYUJUBAXZAQNL-UHFFFAOYSA-N 2-chlorobenzaldehyde Chemical compound ClC1=CC=CC=C1C=O FPYUJUBAXZAQNL-UHFFFAOYSA-N 0.000 description 1
- SUKZIEQXDVGCJR-UHFFFAOYSA-N 2-ethyl-4-prop-1-en-2-ylphenol Chemical compound CCC1=CC(C(C)=C)=CC=C1O SUKZIEQXDVGCJR-UHFFFAOYSA-N 0.000 description 1
- CUAXPJTWOJMABP-UHFFFAOYSA-N 2-methoxypentyl acetate Chemical compound CCCC(OC)COC(C)=O CUAXPJTWOJMABP-UHFFFAOYSA-N 0.000 description 1
- UITUMGKYHZMNKN-UHFFFAOYSA-N 2-methyl-4-prop-1-en-2-ylphenol Chemical compound CC(=C)C1=CC=C(O)C(C)=C1 UITUMGKYHZMNKN-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- WHFKYDMBUMLWDA-UHFFFAOYSA-N 2-phenoxyethyl acetate Chemical compound CC(=O)OCCOC1=CC=CC=C1 WHFKYDMBUMLWDA-UHFFFAOYSA-N 0.000 description 1
- WUQYBSRMWWRFQH-UHFFFAOYSA-N 2-prop-1-en-2-ylphenol Chemical compound CC(=C)C1=CC=CC=C1O WUQYBSRMWWRFQH-UHFFFAOYSA-N 0.000 description 1
- WJQOZHYUIDYNHM-UHFFFAOYSA-N 2-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC=C1O WJQOZHYUIDYNHM-UHFFFAOYSA-N 0.000 description 1
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 description 1
- QQOMQLYQAXGHSU-UHFFFAOYSA-N 236TMPh Natural products CC1=CC=C(C)C(O)=C1C QQOMQLYQAXGHSU-UHFFFAOYSA-N 0.000 description 1
- MPAGVACEWQNVQO-UHFFFAOYSA-N 3-acetyloxybutyl acetate Chemical compound CC(=O)OC(C)CCOC(C)=O MPAGVACEWQNVQO-UHFFFAOYSA-N 0.000 description 1
- SRWILAKSARHZPR-UHFFFAOYSA-N 3-chlorobenzaldehyde Chemical compound ClC1=CC=CC(C=O)=C1 SRWILAKSARHZPR-UHFFFAOYSA-N 0.000 description 1
- VBIKLMJHBGFTPV-UHFFFAOYSA-N 3-ethoxyphenol Chemical compound CCOC1=CC=CC(O)=C1 VBIKLMJHBGFTPV-UHFFFAOYSA-N 0.000 description 1
- NMUMFCGQLRQGCR-UHFFFAOYSA-N 3-methoxypentyl acetate Chemical compound CCC(OC)CCOC(C)=O NMUMFCGQLRQGCR-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- YYMPIPSWQOGUME-UHFFFAOYSA-N 3-propoxyphenol Chemical compound CCCOC1=CC=CC(O)=C1 YYMPIPSWQOGUME-UHFFFAOYSA-N 0.000 description 1
- CYEKUDPFXBLGHH-UHFFFAOYSA-N 3-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC(O)=C1 CYEKUDPFXBLGHH-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- LKVFCSWBKOVHAH-UHFFFAOYSA-N 4-Ethoxyphenol Chemical compound CCOC1=CC=C(O)C=C1 LKVFCSWBKOVHAH-UHFFFAOYSA-N 0.000 description 1
- AVPYQKSLYISFPO-UHFFFAOYSA-N 4-chlorobenzaldehyde Chemical compound ClC1=CC=C(C=O)C=C1 AVPYQKSLYISFPO-UHFFFAOYSA-N 0.000 description 1
- GQILQHFLUYJMSM-UHFFFAOYSA-N 4-methoxypentyl acetate Chemical compound COC(C)CCCOC(C)=O GQILQHFLUYJMSM-UHFFFAOYSA-N 0.000 description 1
- JAGRUUPXPPLSRX-UHFFFAOYSA-N 4-prop-1-en-2-ylphenol Chemical compound CC(=C)C1=CC=C(O)C=C1 JAGRUUPXPPLSRX-UHFFFAOYSA-N 0.000 description 1
- KIIIPQXXLVCCQP-UHFFFAOYSA-N 4-propoxyphenol Chemical compound CCCOC1=CC=C(O)C=C1 KIIIPQXXLVCCQP-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-UHFFFAOYSA-N Di-Et ester-Fumaric acid Natural products CCOC(=O)C=CC(=O)OCC IEPRKVQEAMIZSS-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-WAYWQWQTSA-N Diethyl maleate Chemical compound CCOC(=O)\C=C/C(=O)OCC IEPRKVQEAMIZSS-WAYWQWQTSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- TUVYSBJZBYRDHP-UHFFFAOYSA-N acetic acid;methoxymethane Chemical compound COC.CC(O)=O TUVYSBJZBYRDHP-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 229940007550 benzyl acetate Drugs 0.000 description 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229940117916 cinnamic aldehyde Drugs 0.000 description 1
- KJPRLNWUNMBNBZ-UHFFFAOYSA-N cinnamic aldehyde Natural products O=CC=CC1=CC=CC=C1 KJPRLNWUNMBNBZ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02366—Special surface textures of the substrate or of a layer on the substrate, e.g. textured ITO/glass substrate or superstrate, textured polymer layer on glass substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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- Inks, Pencil-Leads, Or Crayons (AREA)
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Description
本發明係關於一種蝕刻太陽能電池用基板時作為遮蔽劑所使用的蝕刻遮罩用組成物。
於太陽能電池製造步驟中，在將基板進行局部蝕刻處理時係使用遮蔽劑。以往，於此步驟中，雖使用光阻劑，但現在，係以削減步驟數為目的而有探討印刷型阻劑之適用。蝕刻太陽能電池用基板時之蝕刻液，係使用氟酸、硝酸等之強酸。因此，對於印刷型阻劑所要求的特性，係需要對於蝕刻時之蝕刻液的耐酸性，並能夠以印刷法進行圖型形成。
[專利文獻1]日本特開平9-293888號公報
於以往之印刷型阻劑中，在確保充分的耐酸
性，同時忠實地再現印刷設計而形成良好的圖型的部分，仍有改善的空間。此外，針對實施連續印刷時之印刷安定性，亦有改善的空間。
本發明係鑑於如此之課題而完成者，其目的為提供可提昇在將蝕刻遮罩用組成物印刷於太陽能電池用基板時之印刷性的技術。
本發明的一樣態係蝕刻遮罩用組成物。該蝕刻遮罩用組成物，係包含酚醛清漆樹脂(A)100質量份、SiO2粒子(B)20~100質量份、以及溶劑(C)之非感光性的太陽能電池用基板之蝕刻遮罩用組成物。
依據上述樣態之蝕刻遮罩用組成物，可提昇印刷於太陽能電池用基板時之印刷性。
於上述樣態之蝕刻遮罩用組成物中，溶劑(C)亦可包含沸點為190℃以上的溶劑(C1)。SiO2粒子(B)亦可為親水性。此外，亦可進一步具備矽系、丙烯酸系或者氟系之界面活性劑(D)。
本發明之其他樣態係圖型形成方法。該圖型形成方法係包含：使用上述任一樣態之太陽能電池用基板的蝕刻遮罩用組成物，藉由印刷法將遮罩圖型形成於基板上的步驟、將遮罩圖型進行烘烤的步驟、將基板蝕刻，將遮罩圖型進行轉印的步驟、以及將遮罩圖型去除的步驟。
依據本發明，可提昇在將蝕刻遮罩用組成物印刷於太陽能電池用基板時之耐酸性及印刷性。
10‧‧‧太陽能電池用基板
20‧‧‧遮罩圖型
[第1圖]第1圖(A)~第1圖(C)係顯示對基板之圖型形成步驟的概略剖面圖。
實施形態之蝕刻遮罩用組成物為非感光性，適合用作為將太陽能電池用基板進行局部蝕刻處理時所使用的蝕刻遮罩。
實施形態之蝕刻遮罩用組成物，係包含酚醛清漆樹脂(A)100質量份、SiO2粒子(B)20~100質量份、及溶劑(C)。以下，針對實施形態之蝕刻遮罩用組成物的各成分進行詳細地說明。
酚醛清漆樹脂(A)係可列舉：使下述例示之酚類、與下述例示之醛類，在鹽酸、硫酸、甲酸、草酸、對甲苯磺酸等之酸性觸媒下產生反應而得到的酚醛清漆樹脂等。
酚類係可列舉例如：酚；m-甲酚、p-甲酚、o-甲酚等之甲酚類；2,3-二甲酚、2,5-二甲酚、3,5-二甲酚、3,4-二甲酚等之二甲酚類；m-乙基酚、p-乙基酚、o-乙基酚、2,3,5-三甲基酚、2,3,5-三乙基酚、4-tert-丁基酚、3-
tert-丁基酚、2-tert-丁基酚、2-tert-丁基-4-甲基酚、2-tert-丁基-5-甲基酚等之烷基酚類；p-甲氧基酚、m-甲氧基酚、p-乙氧基酚、m-乙氧基酚、p-丙氧基酚、m-丙氧基酚等之烷氧基酚類；o-異丙烯基酚、p-異丙烯基酚、2-甲基-4-異丙烯基酚、2-乙基-4-異丙烯基酚等之異丙烯基酚類；苯基酚等之芳基酚類；4,4’-二羥基聯苯、雙酚A、間苯二酚、對苯二酚、五倍子酚等之聚羥基酚類等。此等係可單獨使用，此外，亦可將2種以上組合使用。此等酚類當中，尤其以m-甲酚、p-甲酚為佳。
醛類係可列舉例如：甲醛、聚甲醛、三 、乙醛、丙醛、丁醛、三甲基乙醛、丙烯醛、巴豆醛、環己基醛、糠醛、呋喃丙烯醛(furylacrolein)、苯甲醛、對苯二甲醛、苯基乙醛、α-苯基丙基醛、β-苯基丙基醛、o-羥基苯甲醛、m-羥基苯甲醛、p-羥基苯甲醛、o-甲基苯甲醛、m-甲基苯甲醛、p-甲基苯甲醛、o-氯苯甲醛、m-氯苯甲醛、p-氯苯甲醛、桂皮醛等。此等係可單獨使用，此外，亦可將2種以上組合使用。此等醛類當中，就取得容易度的觀點而言，較佳為甲醛。
酚醛清漆樹脂(A)係可由1種酚醛清漆樹脂所構成，亦可由2種以上之酚醛清漆樹脂所構成。酚醛清漆樹脂(A)為由2種以上之酚醛清漆樹脂所構成時，各自之酚醛清漆樹脂的Mw雖無特別限定，但較佳為調製成酚醛清漆樹脂(A)整體之Mw成為1000~100000。另外，酚醛清漆樹脂(A)，係於蝕刻遮罩用組成物之溶劑
(C)以外的成分(固體成分)中，較佳為含有20~80質量%，更佳為60~80質量%。
與以上所說明之酚醛清漆樹脂(A)共通的特性，係可列舉耐酸性優異。
SiO2粒子(B)之含量，相對於酚醛清漆樹脂(A)100質量份，為20~100質量份。若SiO2粒子(B)之含量相對於酚醛清漆樹脂(A)100質量份低於20質量份，則難以得到充分的印刷性。另一方面，若SiO2粒子(B)之含量相對於酚醛清漆樹脂(A)100質量份高於100質量份，則難以確保充分的耐酸性。SiO2粒子(B)之平均粒徑較佳為7nm~30nm。若SiO2粒子(B)之平均粒徑小於7nm，則粒子不易凝聚。另一方面，若SiO2粒子(B)之平均粒徑大於30nm，則增黏性、搖變性(thixotropy)會降低。此外，SiO2粒子(B)係以親水性為佳。此處所謂「親水性」，係指粒子表面具有羥基(OH基)。可藉由SiO2粒子(B)為親水性，而提高印刷精準度。
溶劑(C)之含量，係以蝕刻遮罩用組成物整體為基準，較佳為30~70質量%。
溶劑(C)較佳為包含沸點190℃以上之溶劑(C1)。溶劑(C1)之具體例係可列舉：乙二醇、己二醇、丙二醇二乙酸酯、1,3-丁二醇二乙酸酯、二乙二醇、二丙二醇、二乙二醇單甲基醚、二乙二醇單乙基醚、二乙二醇單丙基醚、二乙二醇單丁基醚、二乙二醇單苯基醚、
二乙二醇二乙基醚、二丙二醇單甲基醚、三丙二醇單甲基醚、乙二醇單丁基醚乙酸酯、乙二醇單苯基醚乙酸酯、二乙二醇單甲基醚乙酸酯、二乙二醇單乙基醚乙酸酯、二乙二醇單丙基醚乙酸酯、二乙二醇單苯基醚乙酸酯、二丙二醇單甲基醚乙酸酯、二乙二醇單丁基醚乙酸酯、丙三醇、苯甲醇、3-甲基-3-甲氧基丁基乙酸酯、3-乙基-3-甲氧基丁基乙酸酯、2-甲氧基戊基乙酸酯、3-甲氧基戊基乙酸酯、4-甲氧基戊基乙酸酯、2-甲基-3-甲氧基戊基乙酸酯、3-甲基-3-甲氧基戊基乙酸酯、3-甲基-4-甲氧基戊基乙酸酯、4-甲基-4-甲氧基戊基乙酸酯、二己基醚、乙酸苄酯、苯甲酸乙酯、馬來酸二乙酯、γ-丁內酯、萜品醇等。此等係可單獨使用，亦可將2種以上組合使用。
實施形態之蝕刻用組成物亦可包含上述之溶劑(C1)以外的溶劑。但，溶劑(C1)相對於溶劑整體之含量為70質量%以上，更佳為90質量%以上。
溶劑(C1)以外之溶劑(沸點未達190℃的溶劑(C2))係可列舉：環己酮、甲基-n-戊基酮、甲基異戊基酮、2-庚酮等之酮類；乙二醇、丙二醇等之多元醇類；丙二醇單甲基醚乙酸酯(PGMEA)、丙二醇單甲基醚(PGME)、二丙二醇二甲基醚、丙二醇丙基醚等之多元醇類的衍生物；其他乙酸丁酯、乙醯乙酸乙酯、乳酸丁酯、草酸二乙酯等之酯類。此等當中，較佳為丙二醇單甲基醚乙酸酯、2-庚酮、乙酸丁酯。
實施形態之蝕刻遮罩用組成物，亦可進一步
具備矽系、丙烯酸系或者氟系之界面活性劑(D)。
矽系之界面活性劑(D)係可列舉：將聚酯改質聚二甲基矽氧烷作為主成分之BYK-310(BYK-Chemie公司製)、將芳烷基改質聚甲基烷基矽氧烷作為主成分之BYK-323(BYK製)、將聚醚改質含有羥基之聚二甲基矽氧烷作為主成分之BYK-SILCLEAN3720(BYK製)、將聚醚改質甲基聚矽氧烷作為主成分之KF-353(信越化學工業(股)公司製)等。丙烯酸系之界面活性劑(D)係可列舉BYK-354(BYK製)。此外，氟系之界面活性劑(D)係可列舉KL-600(共榮社化學公司製)等。此等當中，係以矽系之界面活性劑為佳，且以聚二甲基矽氧烷系之界面活性劑為佳。界面活性劑(D)之添加量，係以蝕刻遮罩用組成物整體作為基準，較佳為0.001質量%~1.0質量%，更佳為0.01質量%~0.1質量%。
以上，已說明之蝕刻遮罩用組成物，係藉由包含耐酸性優異的酚醛清漆樹脂(A)作為樹脂成分，於藉由印刷而作為遮罩被形成於太陽能電池用基板的狀態中，可提昇對於蝕刻液之耐性。此外，相對於酚醛清漆樹脂(A)100質量份，藉由含有20~100質量份之SiO2粒子(B)，而可提昇印刷性。此外，藉由溶劑(C)，特別是包含沸點為190℃以上之溶劑(C1)，而可抑制印刷時蝕刻遮罩用組成物(油墨)乾燥，且提昇再印刷性(印刷安定性)或油墨吐出性。
此外，藉由蝕刻遮罩用組成物包含界面活性
劑(D)，可抑制於將該蝕刻遮罩用組成物印刷於太陽能電池用基板時，相對於所設定的印刷圖型寬度，實際上所印刷的圖型寬度變大，亦即，可抑制印刷出血(bleed)產生。
如第1圖(A)所示般，於在矽基板或銅、鎳、鋁等之金屬基板或者矽基板上堆積有該金屬膜、SiO2等之氧化膜或SiN等之氮化膜等的太陽能電池用基板10之上，使用上述之蝕刻遮罩用組成物，使用網版印刷法、噴墨印刷法、輥塗佈印刷法、凸版印刷法、凹版印刷法、平版印刷法等之印刷法來形成遮罩圖型20。另外，於形成遮罩圖型20前，亦可因應需要而進行基板之前處理。前處理係可列舉形成潑液性層的步驟，可列舉例如於日本特開2009-253145號公報所記載的步驟。接著，將遮罩圖型20加熱，並將遮罩圖型20進行烘烤。加熱條件，雖是依據蝕刻遮罩用組成物的成分、遮罩圖型20的膜厚等而適當設定，但例如為200℃、3分鐘。
接著，如第1圖(B)所示般，使用氟酸與硝酸之混酸等的蝕刻液來選擇性去除露出於遮罩圖型20之開口部的太陽能電池用基板，蝕刻遮罩圖型20之開口部(露出部)的太陽能電池基板，將遮罩圖型進行轉印。
接著，如第1圖(C)所示般，蝕刻處理後，將遮罩圖型20去除。去除方法係可列舉：在室溫下浸漬
於鹼水溶液、有機溶劑、市售之剝離液等5分鐘~10分鐘左右，而進行剝離的方法。鹼水溶液係有氫氧化鈉水溶液、四甲基銨氫氧化物(TMAH)水溶液等。有機溶劑係有丙二醇單甲基醚乙酸酯(PGMEA)、二甲基亞碸(DMSO)等。市售之剝離液係可使用有機溶劑系之剝離液105(東京應化工業公司製)等。其結果，可得到於太陽能電池基板10上轉印有對應於遮罩圖型20的凸部之圖型。另外，形成於太陽能電池用基板的凸部之功能，係可列舉電極或擴散層等。
藉由以上的步驟，可於太陽能電池用基板形成特定圖型之凸部。上述之蝕刻遮罩用組成物，由於耐酸性和圖型形成精準度優異，因此可於太陽能電池用基板精準度佳地形成所期望的圖型。此外，由於不需經過如同光微影法般之複雜的步驟，而以印刷法便可於太陽能電池用基板形成圖型，因此可將太陽能電池之製造過程簡化，甚至減低太陽能電池之製造成本。
以下，雖說明本發明之實施例，但此等實施例，只不過是適合說明本發明所用的例示，並不對於本發明作任何限定。
表1顯示實施例1-11及比較例1-12之蝕刻遮罩用組
成物的成分。實施例1-11及比較例1-12之蝕刻遮罩用組成物所使用的酚醛清漆樹脂1、酚醛清漆樹脂2，分別為質量平均分子量12000(m/p=60/40)、質量平均分子量2100(m/p=36/64)之酚醛清漆樹脂。表2顯示實施例1-11、比較例5-12所使用之填料的詳細內容。此外，表3顯示實施例1、2、4-11、比較例3-12所使用之界面活性劑的詳細內容。
藉由表1所示之各成分的組合，製作出由實施例1-11及比較例1-12之蝕刻遮罩用組成物所構成的油墨。
表2中，填料2與填料3之比重不同。由於填料3之比重較大，故容易處理。
將所製作出的各油墨藉由網版印刷法印刷於矽基板，形成印刷設計寬為100μm寬、150μm及200μm寬之3圖型。所形成的圖型，係於200℃之加熱板進行乾燥3分鐘。計測所得到的圖型之完成的線寬，確認出印刷性。依據以下的方式來分類關於印刷性的結果。將針對印刷性所
得到的結果顯示於表4。
◎(良好)：所有的圖型之印刷出血皆為20μm以下
○(可)：印刷出血20μm以下之圖型為2個
×(不良)：印刷出血20μm以下之圖型為1或0個
另外，印刷出血係藉由以下的式子算出。
印刷出血=完成線寬-印刷設計寬
使用E型黏度計(東機產業製、RE550型黏度計)，計測各油墨的黏度曲線，根據下述式子計算出黏度指數。
黏度指數=1rpm時之黏度/15rpm時之黏度
針對所得到的黏度指數依據以下的方式分類，評估出搖變性。將針對搖變性所得到的結果顯示於表4。
◎(良好)：黏度指數3.0以上
○(可)：黏度指數2.0以上且低於3.0
×(不良)：黏度指數低於2.0
如表4所示般，比較例1-12之各油墨，係印刷性及搖變性皆不良。相對於此，實施例1-14之各油墨，係確認出印刷性及搖變性皆具有○(可)以上之特性。尤其，若將實施例2與實施例3進行比較，則確認出藉由添加界面活性劑，印刷性更為提昇。若將實施例1與實施例6進行比較，則確認出填料的粒徑越小，則印刷性及搖變性越提昇。若將實施例1與實施例7進行比較，則確認出由於填料為親水性，因此印刷性及搖變性更為提昇。
針對上述之實施例1、8-10、12-14之各油墨，連續實施7擊(shot)網版印刷，確認出印刷安定性。針對關於印刷安定性的結果，將可無印刷模糊地印刷的擊數顯示於表5。另外，針對實施例9、10，溶劑的沸點係依據2種類之溶劑的沸點及混合比所求得的平均沸點。
依據表5可確認出，於包含沸點(包含平均沸點)為190℃以上的溶劑時，印刷安定性成為良好。確認出實施例1、8-10，係第1擊至第7擊於印刷圖型無印刷模糊，尤其，實施例1、8、9係第1擊至第7擊印刷圖型表面之平滑性亦高。
將實施例1-11之各油墨藉由網版印刷法印刷於矽基板，形成100μm寬及200μm寬的圖型。將所形成的圖型，於200℃之加熱板進行乾燥3分鐘。為了確認所形成的圖型之耐酸性，浸漬於5%氟酸水溶液(條件1)或者
10%硫酸水溶液(條件2)，藉由光學顯微鏡觀察圖型之表面狀態。其結果，確認出實施例1-11之各油墨，係條件1、條件2，膜狀態皆無變化，且並未產生圖型之剝離或龜裂。
Claims (4)
- 一種非感光性之太陽能電池用基板的蝕刻遮罩用組成物，其係包含：酚醛清漆樹脂(A)100質量份、SiO2粒子(B)20~100質量份、以及溶劑(C)；前述溶劑(C)係包含70質量%以上之沸點為190℃以上的溶劑(C1)。
- 如請求項1所記載之蝕刻遮罩組成物，其中SiO2粒子(B)為親水性。
- 如請求項1或2所記載之遮罩用組成物，其係進一步具備矽系、丙烯酸系或者氟系之界面活性劑(D)。
- 一種圖型形成方法，其係包含：使用如請求項1至3中任一項所記載之太陽能電池用基板的蝕刻遮罩用組成物，藉由印刷法將遮罩圖型形成於基板上的步驟、將遮罩圖型進行烘烤的步驟、將基板蝕刻，將遮罩圖型進行轉印的步驟、以及將遮罩圖型去除的步驟。
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