TWI584399B - Electronic parts conveyor and electronic parts inspection device - Google Patents
Electronic parts conveyor and electronic parts inspection device Download PDFInfo
- Publication number
- TWI584399B TWI584399B TW104122792A TW104122792A TWI584399B TW I584399 B TWI584399 B TW I584399B TW 104122792 A TW104122792 A TW 104122792A TW 104122792 A TW104122792 A TW 104122792A TW I584399 B TWI584399 B TW I584399B
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic component
- light
- inspection
- unit
- reflecting
- Prior art date
Links
- 238000007689 inspection Methods 0.000 title claims description 72
- 238000001514 detection method Methods 0.000 claims description 14
- 230000010287 polarization Effects 0.000 claims description 7
- 238000011084 recovery Methods 0.000 description 51
- 230000007723 transport mechanism Effects 0.000 description 17
- 230000032258 transport Effects 0.000 description 15
- 238000004064 recycling Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014146841A JP6331809B2 (ja) | 2014-07-17 | 2014-07-17 | 電子部品搬送装置および電子部品検査装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201618221A TW201618221A (zh) | 2016-05-16 |
| TWI584399B true TWI584399B (zh) | 2017-05-21 |
Family
ID=55271694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104122792A TWI584399B (zh) | 2014-07-17 | 2015-07-14 | Electronic parts conveyor and electronic parts inspection device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6331809B2 (ja) |
| TW (1) | TWI584399B (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6903268B2 (ja) * | 2016-12-27 | 2021-07-14 | 株式会社Ｎｓテクノロジーズ | 電子部品搬送装置および電子部品検査装置 |
| JP7362507B2 (ja) * | 2020-02-25 | 2023-10-17 | 株式会社Ｎｓテクノロジーズ | 電子部品搬送装置、電子部品検査装置およびポケット位置検出方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014010018A (ja) * | 2012-06-28 | 2014-01-20 | Seiko Epson Corp | ハンドラーおよび検査装置 |
| TW201404697A (zh) * | 2012-07-20 | 2014-02-01 | Seiko Epson Corp | 電子零件搬送裝置及電子零件檢查裝置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62205641A (ja) * | 1986-03-05 | 1987-09-10 | Mitsubishi Electric Corp | 半導体チツプの認識装置 |
| JP2002164416A (ja) * | 2000-09-13 | 2002-06-07 | Tokyo Electron Ltd | 被検出体の検出装置とこれを用いた処理システム |
| JP4497498B2 (ja) * | 2001-02-20 | 2010-07-07 | サンクス株式会社 | 真空槽用光電スイッチ及び真空搬送装置 |
| JPWO2003075027A1 (ja) * | 2002-03-07 | 2005-06-30 | ヤマハ発動機株式会社 | 電子部品検査装置 |
| US7440091B2 (en) * | 2004-10-26 | 2008-10-21 | Applied Materials, Inc. | Sensors for dynamically detecting substrate breakage and misalignment of a moving substrate |
| JP2007112626A (ja) * | 2005-09-20 | 2007-05-10 | Olympus Corp | 基板搬送装置及び基板検査装置並びに基板搬送方法 |
-
2014
- 2014-07-17 JP JP2014146841A patent/JP6331809B2/ja not_active Expired - Fee Related
-
2015
- 2015-07-14 TW TW104122792A patent/TWI584399B/zh not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014010018A (ja) * | 2012-06-28 | 2014-01-20 | Seiko Epson Corp | ハンドラーおよび検査装置 |
| TW201404697A (zh) * | 2012-07-20 | 2014-02-01 | Seiko Epson Corp | 電子零件搬送裝置及電子零件檢查裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6331809B2 (ja) | 2018-05-30 |
| JP2016025146A (ja) | 2016-02-08 |
| TW201618221A (zh) | 2016-05-16 |
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| Date | Code | Title | Description |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |