TWI584399B - Electronic parts conveyor and electronic parts inspection device - Google Patents

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

Conventionally, it has been known that a manufacturing device for manufacturing various parts such as an electronic component or a wafer can use a discrimination sensor that discriminates the type of the component.

For example, in Patent Document 1, the discrimination sensor includes: a light-emitting element that emits light; and a light-receiving element that is configured to be separated from the light-emitting element and that receives reflected light from the light-emitting element and reflects the light.

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-150528

However, in the invention described in Patent Document 1, the light-emitting element and the light-receiving element must be disposed in a positional relationship (suitable for light-receiving and light-receiving) in the manufacturing apparatus. Therefore, it is necessary to sufficiently separate the light-emitting element and the light-receiving element from each other. And configuration. Therefore, there is a problem in that it is necessary to ensure a wide area for discriminating the parts in accordance with the extent to which the light-emitting elements and the light-receiving elements are sufficiently separated.

Further, when the light-emitting element and the light-receiving element are arranged to face each other and used as a transmissive sensor, in order to allow the light from the light-emitting element to reach the light-receiving element, for example, it is necessary to mount the jig on the component or other Supporting the support member of the jig, etc., setting light Through the through hole. Therefore, there is a problem that the configuration of the manufacturing apparatus is complicated.

An object of the present invention is to provide an electronic component conveying apparatus and an electronic component inspection apparatus which are excellent in space saving in determining whether or not an electronic component is present in an electronic component arrangement portion.

This object is achieved by the present invention described below.

[Application Example 1]

An electronic component transporting apparatus according to the present invention includes: a moving portion that is movable; an electronic component arranging portion that is placed on the moving portion and is provided with an electronic component; and a detecting portion that includes a light emitting portion that emits light, and The light receiving portion of the light is received, and the presence or absence of the electronic component is determined based on the received light; and the reflecting portion is provided in the moving portion to reflect the light.

Thereby, in the area where the presence or absence of the electronic component is determined in the electronic component arrangement portion, the detection portion and the reflection portion can be arranged as close as possible to each other. Thereby, the province is excellent in space saving. In addition, since the reflection type integrated with the light-emitting portion and the light-receiving portion is used as the detection portion, the configuration of the region is simpler than in the case of using the transmission type.

[Application Example 2]

In the electronic component conveying apparatus of the present invention, the reflecting portion is preferably disposed between the moving portion and the electronic component placement portion.

Thereby, the reflection portion is protected by the electronic component arrangement portion, and damage of the reflection portion can be prevented.

[Application Example 3]

In the electronic component conveying apparatus of the present invention, the reflecting portion is preferably formed in a film shape or a plate shape.

Thereby, for example, when the reflecting portion is provided on the moving portion, the work can be easily performed. industry.

[Application Example 4]

In the electronic component conveying apparatus of the present invention, it is preferable that the electronic component placement unit has at least one recessed portion for housing the electronic component, and

At least one of the recesses overlaps the reflection portion when viewed from a direction in which the detection unit is disposed.

Thereby, the operation of replacing the reflecting portion with respect to each of the electronic component arrangement portions in which the number of the recessed portions is different can be omitted, that is, one reflecting portion can be used as it is.

[Application 5]

In the electronic component conveying apparatus of the present invention, it is preferable that the detecting unit determines that the electronic component is not placed when the light receiving unit receives the light reflected by the reflecting portion.

Thereby, when it is judged whether or not an electronic component is present in the electronic component arrangement portion, the determination can be accurately and quickly performed.

[Application Example 6]

In the electronic component conveying apparatus of the present invention, it is preferable that the detecting unit determines whether or not the electronic component is present after the electronic component has been subjected to at least one inspection.

After the inspection, there are multiple cases in which the classification corresponding to the inspection result is present. In this case, if there is no electronic component on the electronic component placement unit, there is a problem that hinders rapid classification. However, since the presence or absence of the electronic component is determined before the classification, it is possible to respond promptly in response to the presence or absence of the electronic component.

[Application Example 7]

In the electronic component conveying apparatus of the present invention, preferably, when the reflecting portion reflects the light, the direction of polarization of the light incident on the reflecting portion is different from the direction of polarization of the light reflected from the reflecting portion.

Thereby, a retroreflective type can be used as the detecting portion, whereby the reflected light can be used. Whether or not there is an accurate determination of the presence or absence of electronic components.

[Application Example 8]

In the electronic component conveying device of the present invention, the reflecting portion is preferably attached to the moving portion via a joining member.

Thereby, the reflection portion is fixed to the moving portion, and it is possible to prevent the positional shift in the movement of the moving portion, thereby making it possible to reflect the light from the light-emitting portion.

[Application Example 9]

An electronic component inspection apparatus according to the present invention includes: a moving portion that is movable; an electronic component placement portion that is placed on the moving portion and that mounts an electronic component; and a detection portion that includes a light-emitting portion that emits light, And receiving the light receiving portion of the light, and determining whether the electronic component is present or not by the reflection of the light; the reflecting portion being provided in the moving portion to reflect the light emitted from the detecting portion; and the detecting portion The above electronic parts are inspected.

Thereby, it is determined that the electronic component placement portion has an area where the electronic component is present, and the detection portion and the reflection portion can be arranged as close as possible to each other. Thereby, the province is excellent in space saving. In addition, since the reflection type integrated with the light-emitting portion and the light-receiving portion is used as the detection portion, the configuration of the region is simpler than in the case of using the transmission type.

1‧‧‧Inspection device (electronic parts inspection device)

11A‧‧‧Tray transport mechanism

11B‧‧‧Tray transport mechanism

12‧‧‧Temperature adjustment unit (soaking plate)

13‧‧‧Device Transfer Head

14‧‧‧Device Supply Department (Supply Shuttle)

15‧‧‧Tray transport mechanism

16‧‧‧Inspection Department

17‧‧‧Device transfer head

18‧‧‧Device Recycling Department (Recycling Shuttle)

19‧‧‧Recycling tray

20‧‧‧Device Transfer Head

21‧‧‧Tray transport mechanism

22A‧‧‧Tray transport mechanism

22B‧‧‧Tray transport mechanism

23‧‧‧Mobile Department

24‧‧‧Detection Department

25‧‧‧Reflection Department

80‧‧‧Control Department

90‧‧‧IC devices

181‧‧‧ recesses (grooves)

182‧‧‧through holes

183‧‧‧ lower surface

184‧‧‧ gap

200‧‧‧Tray

231‧‧‧Loading board

232‧‧‧linear guide

233‧‧‧ recess

241‧‧‧Lighting Department

242‧‧‧Receiving Department

243‧‧‧ polarizer

244‧‧‧ polarizer

251‧‧‧reflecting surface

252‧‧‧Corner

A1‧‧‧Tray supply area

A2‧‧‧Device supply area (supply area)

A3‧‧‧ inspection area

A4‧‧‧Device recycling area (recycling area)

A5‧‧‧Tray removal area

L1‧‧‧Out of light

L2‧‧‧ reflected light

L2'‧‧‧ reflected light

S101‧‧‧Steps

S102‧‧‧Steps

S103‧‧‧Steps

S104‧‧‧Steps

S105‧‧‧Steps

X‧‧‧ axis (direction)

Y‧‧‧ axis (direction)

Z‧‧‧ axis (direction)

Fig. 1 is a schematic plan view showing an embodiment of an electronic component inspection device according to the present invention.

FIG. 2 is a view for explaining the timing of detecting the presence or absence of an IC (Integrated Circuit) device in the device recovery portion of the electronic component inspection device shown in FIG. 1.

Fig. 3 is a view for explaining the timing of detecting the presence or absence of an IC device in the device recovery portion of the electronic component inspection device shown in Fig. 1.

Fig. 4 is a plan view showing the positional relationship between the device recovery portion and the reflection portion.

Fig. 5 is a plan view showing the positional relationship between the device collecting portion and the reflecting portion.

Fig. 6 is a perspective view showing a reflection state of light for detecting the presence or absence of an IC device.

Fig. 7 is an enlarged detailed view showing an enlarged state of reflection of light in Fig. 6.

Fig. 8 is a flow chart showing a control program of a control unit provided in the electronic component inspection device shown in Fig. 1.

Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on preferred embodiments shown in the drawings.

Fig. 1 is a schematic plan view showing an embodiment of an electronic component inspection device according to the present invention. 2 and 3 are views for explaining the timing of detecting the presence or absence of an IC device in the device recovery portion of the electronic component inspection device shown in Fig. 1. 4 and 5 are plan views showing the positional relationship between the device recovery portion and the reflection portion, respectively. Fig. 6 is a perspective view showing a reflection state of light for detecting the presence or absence of an IC device. Fig. 7 is an enlarged detailed view showing an enlarged state of reflection of light in Fig. 6. Fig. 8 is a flow chart showing a control program of a control unit provided in the electronic component inspection device shown in Fig. 1; In the following description, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are defined as an X-axis (first axis), a Y-axis (second axis), and a Z-axis (third axis). Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X-axis is also referred to as "X-direction", the direction parallel to the Y-axis is also referred to as "Y-direction", and the direction parallel to the Z-axis is also referred to as "Z-direction". Further, the upstream side of the transport direction of the electronic component is also simply referred to as "upstream side", and the downstream side is also simply referred to as "downstream side". Further, the "level" in the specification of the present application is not limited to a complete level, and includes a state of being slightly inclined (for example, less than about 5 degrees) with respect to the horizontal as long as it does not interfere with the conveyance of the electronic component.

The inspection device (electronic component inspection device) 1 shown in FIG. 1 is used, for example, for a BGA (Ball Grid Array) package or an LGA (Land grid array). Check the electrical characteristics of electronic components such as IC devices such as packages, LCD (Liquid Crystal Display), CIS (CMOS (Complementary Metal Oxide Semiconductor) Image Sensor, CMOS image sensor), Test (hereinafter referred to as "inspection") device. In the following, for the sake of convenience of explanation, the case where the IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as "IC device 90".

As shown in Fig. 1, the inspection apparatus 1 is divided into a tray supply area A1, a device supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, a device collection area (hereinafter simply referred to as "recycling area") A4, and a tray. Area A5 is removed. Further, the IC device 90 sequentially passes through the above-described respective areas from the tray supply area A1 to the tray removal area A5, and inspects the inspection area A3 on the way. Therefore, the inspection apparatus 1 is an electronic component transport apparatus provided in each area transport IC device 90, an inspection unit 16 that performs inspection in the inspection area A3, and a control unit 80.

The tray supply area A1 is a region to which the tray 200 is supplied, and a plurality of IC devices 90 in an unchecked state are arranged on the tray 200. In the tray supply area A1, a plurality of trays 200 can be stacked.

The supply area A2 supplies a plurality of IC devices 90 disposed on the tray 200 from the tray supply area A1 to the area of the inspection area A3. Further, the tray transport mechanisms 11A and 11B that transport the tray 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2.

In the supply area A2, a temperature adjustment unit (soak plate) 12, a device transfer head 13, and a tray transfer mechanism (first transfer device) 15 are provided.

The temperature adjustment unit 12 heats or cools a plurality of IC devices 90 to adjust the IC device 90 to a temperature suitable for inspection. In the configuration shown in FIG. 1, two temperature adjustment portions 12 are disposed and fixed in the Y direction. Moreover, the IC device 90 on the tray 200 carried in (transferred) from the tray supply area A1 by the tray transport mechanism 11A is transported, It is placed on any one of the temperature adjustment sections 12.

The device transfer head 13 is movably supported within the supply area A2. Thereby, the device transfer head 13 can be responsible for the transfer of the IC device 90 between the tray 200 and the temperature adjustment unit 12 carried in from the tray supply area A1, and the IC device 90 between the temperature adjustment unit 12 and the device supply unit 14 described below. Transfer.

The tray transport mechanism 15 is a mechanism that transports the empty tray 200 in a state in which all of the IC devices 90 have been removed in the X direction. Then, after the conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, a device supply unit (supply shuttle) 14, an inspection unit 16, a device transfer head 17, and a device recovery unit (recycling shuttle) 18 are provided.

The device supply unit 14 transports the temperature-adjusted IC device 90 to a device in the vicinity of the inspection unit 16. The device supply portion 14 is supported to be movable between the supply region A2 and the inspection region A3 in the X direction. Further, in the configuration shown in FIG. 1, two device supply units 14 are disposed in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported and placed on any one of the device supply units 14.

The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probes electrically connected to the terminals of the IC device 90 while the IC device 90 is held. Each probe is electrically connected to an inspection circuit unit provided in a test machine connected to the inspection unit 16. Moreover, the terminals of the IC device 90 are electrically connected (contacted) to the probe, and the IC device 90 is inspected via the probe. The inspection of the IC device 90 is performed based on the program stored in the above-described inspection control unit. Further, in the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled, and the IC device 90 can be controlled to a temperature suitable for inspection.

The device transfer head 17 is movably supported within the inspection area A3. Thereby, the device transfer head 17 can move the IC device 90 on the device supply portion 14 carried from the supply region A2. It is sent and placed on the inspection unit 16.

The device recovery unit 18 is a collection device that transports the IC device 90 that has been inspected by the inspection unit 16 to the collection area A4. The device recovery portion 18 is supported to be movable between the inspection region A3 and the recovery region A4 in the X direction. Further, in the configuration shown in FIG. 1, the device recovery unit 18 is disposed in the Y direction in the same manner as the device supply unit 14, and the IC device 90 on the inspection unit 16 is transported and placed in either of them. Device recovery unit 18. This transfer is performed by the device transfer head 17.

The recovery area A4 is the area where the IC device 90 of the inspection is completed. In the collection area A4, a recovery tray 19, a device transfer head 20, and a tray transfer mechanism 21 are provided. Further, in the collection area A4, the empty tray 200 is also prepared.

The recovery tray 19 is fixed in the collection area A4, and three are arranged along the X direction in the configuration shown in FIG. Further, the empty trays 200 are also arranged in three along the X direction. Then, the IC device 90 that has moved to the device recovery unit 18 of the recovery area A4 is transported and placed on any of the recovery trays 19 and the empty trays 200. Thereby, the IC device 90 is recovered and classified in accordance with the respective inspection results.

The device transfer head 20 is movably supported within the recovery area A4. Thereby, the device transfer head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.

The tray transport mechanism 21 is a mechanism that transports the empty tray 200 carried in from the tray removal area A5 in the X direction. Further, after the transfer, the empty tray 200 is placed at the position where the IC device 90 is collected, that is, it can be one of the above three empty trays 200.

The tray removal area A5 collects and removes the area of the tray 200 of the plurality of IC devices 90 in which the inspection has been completed. A plurality of trays 200 may be stacked in the tray removal area A5.

Further, the tray transport mechanisms 22A and 22B that transport the tray 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. Pallet transport mechanism 22A will be loaded The tray 200 in which the IC device 90 of the completed inspection is transported from the recovery area A4 to the tray removal area A5 is provided. The tray transport mechanism 22B is a mechanism that transports the empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.

The control unit 80 has, for example, a drive control unit. The drive control unit controls, for example, the tray transport mechanisms 11A and 11B, the temperature adjustment unit 12, the device transport head 13, the device supply unit 14, the tray transport mechanism 15, the inspection unit 16, the device transport head 17, the device recovery unit 18, and the device transport head 20. Driving of each of the tray transport mechanism 21 and the tray transport mechanisms 22A and 22B.

In addition, the inspection control unit of the tester checks the electrical characteristics and the like of the IC device 90 disposed in the inspection unit 16 based on, for example, a program stored in a memory (not shown).

In the inspection apparatus 1, when the IC device 90 is transported from the device collection unit 18 to the collection tray 19 in the recovery area A4, the conveyance system is responsible for the conveyance head 20. In this case, it is preferable that the device transfer head 20 is directed toward the IC device 90 when the IC device 90 is present in the device recovery portion 18. However, if not present, the device transfer head 20 is temporarily stopped, that is, it is made to stand by. .

Hereinafter, a configuration for determining whether or not the IC device 90 is present on the device recovery unit 18 will be described. Here, the case where it is applied to the collection area A4 is typically described as an example, but it may be applied to the supply area A2 or the inspection area A3 in addition to the collection area A4.

As shown in FIGS. 2 and 3, the device collecting portion 18 is formed in a plate shape and is provided with an electronic component arrangement portion of the IC device 90, and has at least one concave portion (groove) 181 opened on the upper surface. The IC device 90 can be disposed and housed in the recess 181. In the case where a plurality of concave portions 181 are formed, the arrangement of the concave portions 181 may be, for example, the arrangement shown in FIG. 4 or FIG. 5 . The device recovery portion 18 shown in FIG. 4 has four concave portions 181 arranged in a matrix of two rows along the X direction and two rows along the Y direction. The device recovery portion 18 shown in FIG. 5 has eight concave portions 181 arranged in a matrix of four rows along the X direction and two rows along the Y direction.

Further, a through hole 182 is formed in the bottom portion of the recessed portion 181 so as to penetrate the bottom portion at the center portion thereof. As described below, the through hole 182 is a transmission hole through which the outgoing light L1 can be transmitted (refer to the drawing). 3). The planar shape of the through hole 182 is circular in the present embodiment, but is not limited thereto, and may be, for example, a polygonal shape.

The constituent material of the device collecting portion 18 is not particularly limited, and for example, a metal material such as aluminum can be used. When the device recovery unit 18 contains aluminum, it is preferable to perform black chromate treatment on the device recovery unit 18. Thereby, the device recovery portion 18 becomes black, and reflection (diffusion) of light on the device recovery portion 18 can be suppressed or prevented.

As shown in FIGS. 2 and 3, the device collecting portion 18 is detachably mounted on the moving portion 23 which is movable in the X direction. Thereby, the device collecting portion 18 can be moved in the X direction together with the moving portion 23 in the placed state placed on the moving portion 23, thereby being able to travel between the inspection region A3 and the recovery region A4. Further, in the recovery area A4, the presence or absence of the IC device 90 on the device recovery portion 18 is judged.

The configuration of the moving portion 23 can be set, for example, to include a mounting plate 231 on which the device collecting portion 18 is placed, and a linear guide 232 that can support the mounting plate 231 by moving the mounting plate 231; And a motor and a ball screw, which are used as a drive source (not shown).

The detecting portion 24 for judging whether or not the IC device 90 is present is disposed on the positive side of the Z-axis of the device collecting portion 18 that has moved to the recovery region A4. The detecting unit 24 includes a light emitting unit 241 that emits (exposes) the emitted light L1 toward the concave portion 181 of the device collecting portion 18, and a light receiving unit 242 that receives the reflected light L2 that the emitted light L1 reflects through the reflecting portion 25. In the detecting unit 24, the light-emitting unit 241 is disposed adjacent to the light-receiving unit 242, and is unitized (integrated), and is a so-called "reflective type" photo-electric sensor.

As shown in FIG. 7 , the detecting unit 24 includes a polarizing mirror 243 disposed on the side of the light emitting unit 241 and a polarizing mirror 244 disposed on the side of the light receiving unit 242 . The polarizing mirror 243 and the polarizing mirror 244 have different polarization directions, that is, orthogonal to each other in the present embodiment.

The emitted light L1 passes through the polarizer 243, and becomes linearly polarized (for example, a longitudinal wave) that vibrates in one direction, and faces the device recovery portion 18. Thereafter, the outgoing light L1 passes through the reflecting portion 25 The retroreflection is directed toward the light receiving unit 242 as the reflected light L2. The reflected light L2 is a linearly polarized light that vibrates in a unidirectional direction (for example, a horizontal wave) orthogonal to the outgoing light L1, and can pass through the polarizing mirror 244. Further, the detecting unit 24 can accurately determine (detect) the presence or absence of the IC device 90 by using the presence or absence of the reflected light L2.

Further, as the detecting unit 24, in addition to the configuration shown in FIG. 2 or FIG. 3 in which the light-emitting portion 241 is adjacent to the light-receiving portion 242 and oriented in the same direction, coaxial regression can be used depending on the size of the through-hole 182 of the device collecting portion 18. Reflective type.

As shown in FIGS. 2 and 3, the reflecting portion 25 is a film-like (or plate-like) member having a reflecting surface 251 on the front side, and is provided on the placing plate 231 of the moving portion 23. The mounting plate 231 is formed with a recess 233 that is open on the upper surface thereof, and the reflecting portion 25 is housed and disposed in the recess 233. Such an arrangement complements the processing using the reflective photo-electrical sensor as the detecting unit 24, and the reflecting portion 25 and the detecting portion 24 can be gathered as close as possible. Thereby, the space saving of the recovery area A4 is excellent. Further, it is possible to accurately detect the presence or absence of the IC device 90 in accordance with the degree to which the reflection portion 25 and the detection portion 24 are close to each other, thereby preventing occurrence of false detection.

In addition, when a transmissive photo-sensing device in which the light-emitting portion 241 and the light-receiving portion 242 are dispersed and disposed as the detecting portion 24, which is different from the reflective photo-electrical sensor, is used, it is necessary to separately provide it in the recovery region A4. The member of the light-emitting portion 241 and the light-receiving portion 242 is disposed. Therefore, the composition in the recovery area A4 becomes complicated. On the other hand, in the inspection apparatus 1, since the reflection type photodetector is used as the detection part 24, the structure in the collection area A4 becomes simple.

Further, the reflection portion 25 is disposed between the moving portion 23 and the device collecting portion 18 attached to the moving portion 23. Thereby, the reflection portion 25 is protected by the device recovery portion 18, thereby preventing damage of the reflection portion 25.

As described above, the reflection portion 25 is housed in the concave portion 233 of the placing plate 231. The depth of the recess 233 is greater than the thickness of the reflecting portion 25. Thereby, a gap 184 is formed between the reflecting surface 251 of the reflecting portion 25 and the lower surface 183 of the device collecting portion 18. Thereby, when installed in the moving part 23 In the device recovery portion 18, the lower surface 183 of the device recovery portion 18 can be prevented from causing damage to the reflecting surface 251.

Further, the reflection portion 25 is configured such that light having a polarization direction different from the polarization direction of the incident light (exiting light L1) incident on the reflection portion 25 is reflected as reflected light L2 to the light receiving portion 242. As shown in FIG. 6, the reflecting surface 251 of the reflecting portion 25 includes a plurality of corners 252 which are regularly arranged. The term "corner" refers to a minute recess formed into a shape in which three planes are orthogonal to each other. Thereby, the reflection part 25 becomes a retroreflector. Again, in FIG. 6, one corner 252 is enlarged and typically depicted. Further, the reflecting portion 25 may also include a transparent particle member.

Further, it is preferable that the reflecting portion 25 is attached to the bottom of the concave portion 233 of the placing plate 231 via a joining member (not shown) such as a tape or an adhesive, for example. Thereby, the reflection portion 25 is fixed to the placing plate 231, and positional displacement during the movement of the placing plate 231 can be prevented. Thereby, the reflection portion 25 is in a state in which the emitted light L1 can be reflected in the recovery region A4. In addition, the attaching method of the reflecting portion 25 is not particularly limited, and examples thereof include a method of using a double-sided tape, a method of using an adhesive, and the like. In addition to the attachment method, a fixing method by screwing can also be used.

As shown in FIG. 4 and FIG. 5, the reflection portion 25 overlaps all of the concave portions 181 in the plan view of the reflection portion 25 regardless of the number of the concave portions 181 of the device collection portion 18, that is, the extent that all of the concave portions 181 are included once. size. Thereby, the operation of replacing the reflecting portion 25 for each device collecting portion 18 in which the number of the concave portions 181 is different can be omitted, that is, one reflecting portion 25 can be used as it is. Further, regardless of the number of the recessed portions 181, the entire emitted light L1 passing through the through holes 182 of the recessed portion 181 can be reflected by one reflecting portion 25.

Next, based on the flowchart shown in FIG. 8, the control program for judging whether or not the IC device 90 is present on the device recovery unit 18 will be described. Furthermore, the control program is stored in advance in the control unit 80.

The device recovery unit 18 that has moved from the inspection area A3 is in any one of the states shown in FIGS. 2 and 3 in the collection area A4. In this state, the device recovery unit 18 is disposed in the detection unit 24 and Between the reflection portions 25.

First, the detection unit 24 is operated to cause the emitted light L1 to be emitted from the light-emitting unit 241, and it is determined whether or not the light-receiving unit 242 has received the reflected light L2, that is, whether or not the reflected light L2 is present in the light-receiving unit 242 (step S101).

If it is determined in step S101 that the reflected light L2 is not received, it is determined that the IC device 90 is present in the device recovery unit 18 (step S102, see FIG. 2). Further, the emitted light L1 is reflected by the IC device 90 to become the reflected light L2', but the reflected light L2' does not become the light reflected by the retroreflection, but is the same longitudinal wave as the outgoing light L1. Therefore, it is determined that the light receiving unit 242 does not receive the reflected light L2 as a horizontal wave.

Then, the device transport head 20 is operated to face the IC device 90, and the IC device 90 is held, for example, and transported to the recovery tray 19 (step S103).

On the other hand, if it is determined in step S101 that the reflected light L2 has been received, it is determined that the IC device 90 is not present in the device recovery unit 18 (step S104, see FIG. 3).

Then, it is reported that the IC device 90 does not exist on the device recovery portion 18 (step S105). The report method is not particularly limited, and for example, a method using image display, a method using voice, a method using light emission, and the like can be used.

Moreover, when step S105 is executed, it is preferable to temporarily stop the device transfer head 20 and stand by.

Further, in the present embodiment, the judgment of the presence or absence of the IC device 90 is applied to the inspection of the IC device 90. After the inspection, there are a plurality of classifications corresponding to the inspection results (6 in the configuration shown in Fig. 1). In this case, if the IC device 90 on the device recovery unit 18 is not provided, there is a problem that hinders rapid classification. However, since the presence or absence of the IC device 90 has been determined before classification, it is possible to respond promptly in response to the presence or absence of the IC device 90.

As described above, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention have been described with reference to the embodiments. However, the present invention is not limited thereto, and the components constituting the electronic component conveying apparatus and the electronic component inspection apparatus may be replaced. Cheng can play the same function Arbitrary composition. Further, any constituent may be added.

Further, in the above embodiment, the reflecting portion includes a hard member formed into a film shape or a plate shape. However, the reflecting portion is not limited thereto and may include a coating film.

1‧‧‧Inspection device (electronic parts inspection device)

18‧‧‧Device Recycling Department (Recycling Shuttle)

23‧‧‧Mobile Department

24‧‧‧Detection Department

25‧‧‧Reflection Department

181‧‧‧ recesses (grooves)

182‧‧‧through holes

183‧‧‧ lower surface

184‧‧‧ gap

231‧‧‧Loading board

232‧‧‧linear guide

233‧‧‧ recess

241‧‧‧Lighting Department

242‧‧‧Receiving Department

251‧‧‧reflecting surface

A3‧‧‧ inspection area

A4‧‧‧Device recycling area (recycling area)

L1‧‧‧Out of light

L2‧‧‧ reflected light

X‧‧‧ axis (direction)

Y‧‧‧ axis (direction)

Z‧‧‧ axis (direction)

Claims (10)

An electronic component transporting apparatus comprising: a moving part movable; an electronic component arranging unit that is placed on the moving part and configured with an electronic component; and a detecting unit that includes a light emitting part that emits light and receives The light receiving unit determines whether or not the electronic component is present based on the received light, and the reflecting portion is provided in the moving portion to reflect the light. The electronic component transport apparatus of claim 1, wherein the reflection portion is disposed between the moving portion and the electronic component placement portion. The electronic component conveying apparatus according to claim 1 or 2, wherein the reflecting portion is formed in a film shape or a plate shape. The electronic component transporting apparatus according to claim 2, wherein the electronic component disposing unit has at least one recessed portion for accommodating the electronic component, and at least one of the recessed portion and the reflection when viewed from a direction in which the detecting portion is disposed The departments overlap. The electronic component transporting apparatus according to claim 3, wherein the electronic component disposing unit has at least one recessed portion for accommodating the electronic component, and at least one of the recessed portion and the reflection when viewed from a direction in which the detecting portion is disposed The departments overlap. The electronic component transport apparatus according to claim 1 or 2, wherein the detecting unit determines that the electronic component is not placed when the light receiving unit receives the light reflected by the reflecting unit. The electronic component transport apparatus according to claim 1 or 2, wherein the detecting unit determines the presence or absence of the electronic component after the electronic component has been subjected to at least one inspection. The electronic component conveying apparatus according to claim 1 or 2, wherein, when the reflecting portion reflects the light, the direction of polarization of the light incident on the reflecting portion is different from the direction of polarization of the light reflected from the reflecting portion. The electronic component conveying apparatus according to claim 1 or 2, wherein the reflecting portion is attached to the moving portion via a joining member. An electronic component inspection device comprising: a moving portion movable; an electronic component placement portion that is placed on the moving portion and placed on an electronic component; and a detection portion that includes a light emitting portion that emits light, and Receiving the light receiving portion of the light, and determining whether the electronic component is present or not by the reflection of the light; the reflecting portion being provided in the moving portion to reflect the light emitted from the detecting portion; and the inspection portion facing the light Check the electronic parts.