TWI637165B - Vision inspection module and device inspection system having the same - Google Patents

Abstract

The present invention relates to a component detecting system, and more particularly to a visual detecting module for performing visual inspection of a semiconductor component and a component detecting system including the same. The invention discloses a visual inspection module (50) for performing visual inspection of a planar shape of a polygonal semiconductor component (1), comprising: a single image obtaining section (100) for obtaining a first plane of a semiconductor component (1) a planar image and a side image of the polygonal side surface of the semiconductor element (1); the first optical path (L1), causing the first planar image of the first plane of the semiconductor element (1) to reach the single image obtaining portion ( 100); and an optical system, wherein side images of the polygonal side faces of the semiconductor element (1) each reach a single image obtaining portion (100), and a plurality of second optical paths (L2) are formed.

Description

Vision detection module and component detection system including the same

The present invention relates to a component detecting system, and more particularly to a visual inspection module for performing visual inspection of a semiconductor component and a component detecting system including the same.

When the semiconductor device component that completes the packaging process is tested for aging test, etc., it is loaded into the customer tray and shipped.

Further, on the surface of the semiconductor device component that is shipped from the factory, a mark program identified by a serial number, a manufacturer's logo, or the like is used according to a laser or the like.

Moreover, the semiconductor device component may be subjected to a final appearance of a lead or a ball grid, a crack, a scratch, or the like, and an appearance state of the semiconductor device component and a mark formed on the surface. A procedure for testing whether it is good or not.

In addition, it is additionally added to detect whether the appearance state and the flag of the semiconductor device element as described above are good, and depending on the detection time and the arrangement of each module, the time for all program execution and the size of the device are affected.

In particular, a plurality of modules for loading visual inspection of a plurality of components are loaded, and the size of the device is changed according to the configuration and arrangement of the unloading modules for detecting the detection results.

Also, the size of the device may limit the number of component detection systems installed within the component inspection line, or affect the installation cost for generating components based on the installation of a predetermined number of component inspection systems.

The object of the present invention is different from the above-mentioned disadvantages, and an object thereof is to obtain a visual inspection module capable of performing visual inspection on a surface of a semiconductor element and an image of a plurality of side surfaces adjacent to the surface thereof at one time. A component detection system including the module.

The present invention is directed to achieving the object of the invention as described above, and provides a visual inspection module 50 for performing visual inspection of a planar shape of a polygonal semiconductor component 1, characterized in that it comprises: obtaining a single image a first planar image of the first plane of the semiconductor element 1 and a side image of the polygonal side of the semiconductor element 1; a first optical path L1 that causes the first plane of the semiconductor element 1 a first planar image reaches the single image obtaining portion 100; and an optical system such that side images of the polygonal side faces of the semiconductor element 1 respectively reach the single image obtaining portion 100, and are formed Second optical path L2.

The focus distance correction unit 400 may be additionally included, mounted on the optical system, and correcting a difference in focus distance between the first optical path L1 and the second optical path L2.

The focus distance correction unit 400 may include a medium portion 410 mounted on the first light path L1 and the second light path L2, and including a transparent material medium having light permeable.

The focus distance correction portion 400 may include a frame portion 420 that is detachably coupled to the structure 520, and the medium portion 410 is detachably coupled to the frame portion 420.

The frame portion 420 is detachably coupled to the structure 520 by a magnetic force.

The optical system includes: a main reflective member 211 that causes a first planar image of the first plane to face the single image obtaining portion 100 and reflects; and an auxiliary reflective member 311 that is more than the semiconductor element 1 The side faces of the corner sides are mounted correspondingly, and the side images of the respective side faces of the polygonal sides of the semiconductor element 1 are directed toward the main reflection member 211 and reflected.

The main reflective member 211 has a semi-transmissive material through which light is transmitted, and the illumination system 540 is reflected from the reflective surface of the first planar image toward the first plane and toward the polygonal side of the semiconductor element 1. Each side illuminates light.

The focus distance correction unit 400 is mounted between the side faces of the polygonal sides of the semiconductor element 1 in the second optical path L2 and the main reflection member 211, and the second light path L2 At least one of the main reflection member 211 and the single image obtaining unit 100.

The focus distance correction unit 400 is mounted between each side surface of the polygonal side of the semiconductor element 1 in the second optical path L2 and the main reflection member 211, and the focus distance correction unit 400 and the auxiliary unit The reflecting member 311 is formed integrally.

The present invention discloses a component detecting system, comprising: a loading unit 10 loaded with a carrier 2 containing a plurality of semiconductor elements 1 and capable of linearly moving the carrier 2; a visual inspection module 50, The moving direction of the carriage 2 in the loading portion 10 is perpendicular, and is mounted on one side of the loading portion 10 to perform visual inspection of the semiconductor element 1; the first guide rail 68, and the bracket in the loading portion 10 The moving direction of 2 is formed vertically; and a first transfer tool 61 is moved along the first rail 68 and combined with the first rail 68 for performing visual inspection so as to be from the loading portion 10 to the vision The detecting module 50 picks up and transports the components; wherein the unloading portion 31, the unloading portion 32, and the unloading portion 33, in the loading portion 10, receive the bracket 2 that completes the visual inspection and is equipped with the semiconductor component 1, according to visual inspection As a result, the semiconductor element 1 is classified into the associated cradle 2, which is a visual inspection module having the structure as described above.

According to the visual inspection module and the component detection system including the same according to the present invention, images of the surface of the semiconductor element and a plurality of side surfaces adjacent to the surface thereof can be obtained at one time, and visual inspection can have various advantages of performing visual inspection quickly.

In particular, an image of a surface of a semiconductor element and a plurality of side surfaces adjacent to the surface thereof is obtained at one time, and a medium such as transparent glass is used to correct the difference in focus distances of mutually different optical paths so that it can be based on a single digital camera. Obtaining an image has the advantage of simplifying the structure of the module for performing visual inspection and reducing manufacturing costs.

1‧‧‧Semiconductor components

10‧‧‧Loading Department

100‧‧‧Single Image Acquisition Department

110‧‧‧ lens

2‧‧‧ bracket

31, 32, 33‧‧‧ Unloading Department

50‧‧‧Visual Inspection Module

61‧‧‧First Transfer Tool

62‧‧‧ sorting tools

68‧‧‧First rail

200‧‧‧ Vacant brackets

211‧‧‧Main reflector

311‧‧‧Auxiliary reflector

400‧‧‧Focus distance correction

410‧‧‧Media Department

420‧‧‧Framework

421, 422‧‧‧ frame parts

424, 524‧‧‧ magnets

429‧‧‧vacant space

520‧‧‧Structure

540‧‧‧Lighting system

545‧‧‧Light source

L1‧‧‧First light path

L2‧‧‧Second light path

1 is a plan view showing an embodiment of a component detecting system according to the present invention; FIG. 2a is a conceptual view showing an embodiment of the component detecting system of FIG. 1 in a side direction; FIG. 2b is a visual inspection of FIG. 2a. FIG. 3 is a plan view showing an embodiment of a focus distance correction unit in the visual inspection module of FIG. 2; FIG. 4 is a focus distance adjustment unit of FIG. FIG. 5 is a conceptual diagram showing the structure of another embodiment of the component detection system visual inspection module of FIG. 1 in a side direction; FIG. 6 is used in the visual inspection module of FIG. 2 or FIG. A conceptual diagram in which an image is obtained to present a concept of a running distance; and FIG. 7 is a conceptual diagram schematically showing an image obtained by the visual inspection module of FIG. 2 or 5.

Hereinafter, the drawings of the visual inspection module and the component detecting system including the same according to the present invention will be described below.

A component detecting system according to an embodiment of the present invention, as shown in FIG. 1, includes a loading portion 10 loaded with a carriage 2 containing a plurality of semiconductor elements 1, and linearly moving the carriage 2; a visual inspection mode The group 50 is perpendicular to the moving direction of the tray 2 in the loading portion 10, and is mounted on one side of the loading portion 10 to perform visual inspection of the semiconductor element 1; the first rail 68, and the loading portion 10 The moving direction of the carriage 2 is vertically arranged; and a first transfer tool 61 is moved along the first guide rail 68 and combined with the first guide rail 68 for performing visual inspection so as to be from the loading portion 10 to the vision The detecting module 50 picks up and transports the components; the loading portion 10 includes an unloading portion 31, an unloading portion 32, and an unloading portion 33, and receives the bracket 2 that completes the visual inspection and holds the semiconductor element 1, according to the vision The detection result classifies the semiconductor element 1 into the associated cradle 2.

The semiconductor element 1 herein may be a semiconductor element such as a memory for completing a semiconductor program, an SD random memory, a fast random memory, a CPU, or a GPU.

The carrier 2 is configured by loading and transferring a plurality of semiconductor elements 1 in a matrix of 8 × 10, and is generally standardized for a memory element or the like.

The loading unit 10 has a structure in which the inspection object semiconductor element 1 is held up to perform visual inspection loading, and can have various configurations.

For example, the loading unit 10 transfers the tray 2 containing the plurality of semiconductor elements 1 in a state of stabilizing the fixing grooves formed at the bracket 2.

The loading unit 10 can realize a plurality of structures, as shown in FIG. 1 and the Korean Patent Publication No. 10-2008-0092671, and can include a guide portion for guiding the movement of the carriage 2 on which the plurality of semiconductor elements 1 are mounted (not shown). And a drive unit (not shown) for moving the carriage 2 along with the guide portion.

The visual inspection module 50 is perpendicular to the moving direction of the cradle 2 in the loading unit 10, is mounted on the side of the loading unit 10, and can realize various structures in a structure for performing visual inspection of the semiconductor element 1.

Here, it is a matter of course that the visual inspection module 50 realizes various configurations according to the configuration of the system.

In particular, the visual inspection module 50 has a structure in which an image is obtained by using a digital camera, a scanner, or the like in appearance of the bottom surface of the semiconductor element 1, and the like, and various structures can be realized.

Here, based on the image obtained by the visual inspection module 50, the image is analyzed using software or the like, and then applied to visual inspection for whether or not a defect occurs.

In addition, the visual inspection module 50 preferably realizes various structures according to the type of visual detection, and visualizes either one of the upper surface and the bottom surface of the semiconductor element 1 (hereinafter referred to as 'first surface') and the side surface adjacent thereto. The detection is performed to constitute.

More specifically, the visual inspection module 50 is preferably a semiconductor element 1 having a straight quadrangular shape in a state of being picked up by the first transfer tool 61, as shown in FIG. 2a and FIG. The visual inspection of the sides is performed on the structure.

To this end, the visual inspection module 50, for example, as shown in FIGS. 2 to 5, is a visual inspection module for performing visual inspection of a semiconductor element 1 having a polygonal planar shape. 50, may include: a single image obtaining unit 100, obtaining a first planar image of the first plane of the semiconductor element 1 and a side image of the polygonal side surface of the semiconductor element 1; the first optical path L1, the first of the semiconductor element 1 a first planar image of a plane reaches the single image obtaining section 100; and an optical system such that side images of the polygonal side faces of the semiconductor element 1 each reach the single image obtaining section 100, and a plurality of second optical paths L2 are formed .

The single image obtaining unit 100 can realize various configurations in a configuration in which a first planar image of the first plane of the semiconductor element 1 and a side image of the polygonal side surface of the semiconductor element 1 are obtained.

For example, the single image obtaining section 100 can use a digital camera, a scanner, or the like.

Further, as shown in FIG. 7, the single image obtaining unit 100 analyzes the obtained image, and views the first planar image of the first plane of the semiconductor element 1 and the side surface of the polygonal side of the semiconductor element 1. The image is transmitted to a control unit (not shown), and after analyzing the image using a software or the like, it is applied to visual inspection such as failure or the like.

The optical system is configured such that a side image of the polygonal side surface of the semiconductor element 1 reaches the single image obtaining unit 100 to form a plurality of second optical paths L2, and various configurations can be realized.

Specifically, the optical system selects the number of the lens 110, the reflecting members 211, 311, the semi-transmissive members, the three turns, and the mounting position according to the mounting positions of the semiconductor element 1 and the single image obtaining unit 100.

In particular, the optical system may include: a main reflective member 211 that directs and reflects a first planar image of the first plane toward the single image obtaining portion 100; and an auxiliary reflective member 311, and a polygonal shape with the semiconductor element 1. The side faces of the sides are mounted correspondingly, and the side images of the respective side faces of the polygonal sides of the semiconductor element 1 are directed toward the main reflection member 211 and reflected.

The main reflection member 211 is a structure in which the first planar image of the first plane is directed toward the single image obtaining portion 10 and reflected, and various members such as a reflective member and a semi-transmissive member can be used.

The auxiliary reflection member 311 is mounted as a structure corresponding to each side surface of the polygonal side of the semiconductor element 1, and a side image of each side surface of the polygonal side of the semiconductor element 1 is directed toward the main reflection member 211 and reflected. Various components such as a reflective member and a semi-transmissive member.

In addition, the optical system is used for visual inspection, and is provided with an illumination system 540 that illuminates the first planar side, and the illumination system 540 can have a plurality of arrangements according to the illumination method.

The illumination system 540 can illuminate a variety of lights such as monochromatic light such as laser light, three-color light such as R, G, and B, and white light depending on the form of visual detection, and a plurality of light sources such as LED elements can be used.

Also, the illumination system 540 can implement a variety of configurations depending on the structure of the optical system.

For example, if the optical system includes the main reflective member 211 as described above, the main reflective member 211 may be provided with a light transmissive semi-transmissive material, in which case the illumination system 540 may be from the reflective surface that reflects the first planar image. Light is radiated to the first plane and each side surface of the polygonal side of the semiconductor element 1.

Further, as shown in FIG. 2, the illumination system 540 is configured such that the irradiation of the first plane and the irradiation of each side surface are performed in accordance with the individual light source 545. At this time, the auxiliary reflection member 311 as described above is provided with a semi-transmissive material through which light can pass, and the side surface of the reflective surface that reflects the side image is irradiated with light to each side surface of the polygonal side of the semiconductor element 1.

In addition, the first planar image and the side image are obtained by different optical paths, that is, via the first optical path L1 and the second optical path L2, and the focal lengths are different from each other due to the path difference of the optical path, and a single image obtaining device, That is, when an image is obtained from a digital camera, blurring occurs because the focus of either one of the first planar image and the side image cannot be accurately matched.

As shown in FIGS. 2 to 5, the visual inspection module 50 further includes a focal length correction unit 400 that is attached to the optical system and corrects the difference in focal length between the first optical path L1 and the second optical path L2.

The focus distance correction unit 400 is configured to correct the focus distances by passing through the first optical path L1 and the second optical path L2 and causing the focal lengths to be different from each other by the path difference of the optical path, thereby realizing various configurations.

As an embodiment, the focus distance correction unit 400 may include a medium portion 410 that is mounted on the optical paths L1, L2 and has a transparent material that is transparent to light.

The medium portion 410 is attached to the optical paths L1, L2 and has a structure for correcting the focal length, and is attached to the optical paths L1, L2 such as transparent glass or quartz, and is configured to correct the focal length due to the difference in the bending rate.

In particular, the preferred medium portion 410 is mounted on the second optical path L2 of the first optical path L1 and the second optical path L2.

Here, the medium portion 410 has a columnar shape such as a columnar or a multi-faceted prism having a predetermined thickness, in which the light incident surface and the transmission surface form a plane perpendicular to the optical path with respect to the optical path.

At this time, the thickness t of the medium portion 410 in the second optical path L2 direction is generated according to FIG. 6 and the following formula.

t=(1-1/n)/A ₁ -A ₂ (where t is the medium thickness in the direction of the optical path, n is the tortuosity of the medium, and is used to obtain the operating distance of the first planar image of A ₁ , A ₂ is Used to obtain the operating distance of the side image).

In addition, when the medium portion 410 has a slight error, the influence on the measurement result is reduced, and since the tight mounting is important, the focus distance correction portion 400 may include the detachable coupling with the structure 520 and the medium portion 410. A frame portion 420 that is detachably mounted.

The structure 520 is a device that is mounted on the component detecting system and has a structure for supporting the medium portion 410, and a variety of structures can be realized.

The frame portion 420 is detachably coupled to the structure 520, and a structure in which the medium portion 410 is detachably mounted can realize various structures.

For example, as shown in FIG. 3, the frame portion 420 has a vacant space 429 through which light is transmitted in the first optical path L1, and in a portion corresponding to the second optical path L2, the medium portion 410 can be mounted and according to the plurality of frame members 421, 422 to constitute.

Further, the frame portion 420 can be detachably coupled to the structure 520 by a magnetic force. For this purpose, a plurality of magnets 424 and 524 are attached to at least one of the frame portion 420 and the structure 520.

In addition, the focus distance correction portion 400 is combined with an optical system and can have various configurations.

For example, as shown in FIGS. 2 and 5, the focal length correction unit 400 is mounted at at least one of the following positions: between each side surface of the polygonal side of the semiconductor element 1 in the second optical path L2 and the main reflection member 211; The main reflection member 211 in the second optical path L2 is interposed between the single image obtaining unit 100.

Further, when the focal length correction unit 400 is attached between the respective side faces of the polygonal sides of the semiconductor element 1 in the second optical path L2 and the main reflection member 211, the focal length correction unit 400 can be integrally formed with the auxiliary reflection member 311.

According to the mounting manner of the focus distance correction unit 400 as described above, since the focus distances of the optical paths cause the focus distances to be different from each other, the single image obtaining device, that is, the image obtained by the digital camera, is due to the first planar image and the side view. If the focus of either side does not correspond to the blurring problem, it can be solved.

The first transfer tool 61 is moved in accordance with the first guide rail 68 and combined with the first guide rail 68 for performing visual inspection, and a structure for picking up the component transfer from the loading portion 10 to the visual inspection module 50 can realize various structures.

For example, it is preferable that the first transfer tool 61 includes a plurality of pick-up tools (not shown) for picking up the semiconductor element 1, the pick-up tool for increasing the detection speed or the like, and mounting a plurality of columns or a plurality of columns.

The pick-up tool can realize various structures as a structure for picking up the semiconductor element 1 by vacuum pressing.

The first guide rail 68 is configured such that it is disposed perpendicularly to the direction in which the carriage 2 of the loading unit 10 moves, and supports and transfers the first transfer tool 61 to be described later.

The unloading portion 31, the unloading portion 32, and the unloading portion 33 are received in the loading portion 10, the tray 2 containing the semiconductor element 1 that has completed visual inspection, and classifies the semiconductor element 1 in the carrier 2 based on the visual inspection result. The structure inside can realize a variety of structures.

Preferably, the unloading unit 31, the unloading unit 32, and the unloading unit 33 have a configuration similar to that of the loading unit 10, and are provided with good G, defective 1 or abnormal R1, defective 2, or abnormal 2R2 according to the numerical value of the detection result of the semiconductor element 1. Classification level.

Further, the unloading portion 31, the unloading portion 32, and the unloading portion 33 may be mounted with a plurality of parallel unloading bracket portions including a guide portion (not shown) mounted in parallel with the side of the loading portion 10 and for A drive unit (not shown) that transports the carriage 2 in accordance with the guide unit.

Further, the bracket 2 can be mutually transferred between the loading unit 10 and the unloading portion 31, the unloading portion 32, and the unloading portion 33 by means of a carriage transfer device (not shown), and further includes an unloading portion 31, The unloading portion 32 and the unloading portion 33 supply the vacant bracket portion 200 of the vacant bracket 2 of the semiconductor element 1 that is not mounted.

At this time, the vacant bracket portion 200 may include a guide portion (not shown) that is attached to the side of the loading portion 10 in parallel, and a driving portion (not shown) that moves the bracket 2 along the guide portion.

Further, in the unloading portion 31, the unloading portion 32, and the unloading portion 33, a sorting tool 62 for transferring the semiconductor may be additionally provided depending on the sorting level of each unloading bracket portion between the unloading bracket portions. Element 1.

The sorting tool 62 has the same or similar structure as the first transfer tool 61 as described above, and may have a multi-column structure or a column structure.

Further, the unloading unit 31, the unloading unit 32, and the unloading unit 33 are described in the state in which the cradle 2 loaded in the loading unit 10 is reloaded, and the unloading embodiment is taken as an example, and is formed in the pocket on which the semiconductor element 1 is mounted. The structure in which the tape carrier is loaded or unloaded, that is, the structure including the tape winding module and the like, which can be unloaded by the semiconductor element 1, can be any structure.

In addition, the present invention is a visual inspection module, and in particular, in the case where the structure of the focus distance correction portion mounted on the optical path is characterized, the structure of the disclosed component detection system is taken as an embodiment, and the visual inspection module according to the present invention does not. It is a matter of course that the component detection system mounting according to an embodiment of the present invention is installed.

The above description of the preferred embodiments of the present invention is intended to be illustrative, and the scope of the present invention is not limited by the embodiments of the same features, and the scope of the claims can be appropriately changed within the scope of the loading.

Claims (10)

A visual inspection module (50) for performing visual inspection of a planar shape of a polygonal semiconductor component (1), comprising: a single image obtaining portion (100) for obtaining a first plane of the semiconductor component (1) a first planar image and a side image of a polygonal side of the semiconductor component (1); a first optical path (L1) for causing a first planar image of the first plane of the semiconductor component (1) to reach a single image obtaining unit (100); an optical system that causes side images of the polygonal side faces of the semiconductor element (1) to reach the single image obtaining portion (100), respectively, and forms a plurality of second light paths (L2); and a focus distance correction portion (400) mounted on the optical system for correcting a difference in focus distance between the first optical path (L1) and the second optical path (L2); the focus distance The correction portion (400) is mounted on the first optical path (L1) and the second optical path (L2), and includes a medium portion (410) having a transparent material transparent to light, and a detachable structure (520) The frame portion (420) of the medium portion (410) is coupled and detachably disposed; the frame portion (420) is magnetically And detachably coupled to the structure (520); and the frame portion (420) includes a plurality of frame members (421, 422), the plurality of frame members (421, 422) being in the first The portion corresponding to the optical path (L1) forms a vacant space (429) through which light is transmitted, and the medium portion (410) may be provided at a portion corresponding to the second optical path (L2). The visual inspection module (50) of claim 1, wherein the optical system comprises: a main reflective member (211), the first planar image of the first plane is oriented toward the single image The image receiving portion (100) reflects; and the auxiliary reflecting member (311) is mounted corresponding to each side surface of the polygonal side of the semiconductor element (1), and the sides of the polygonal side of the semiconductor element (1) are made The side image is reflected toward the main reflective member (211). The visual inspection module (50) according to claim 2, wherein the main reflection member (211) has a light transmissive semi-transmissive material; and the visual inspection module (50) further includes illumination. System (540), reflecting the first plane Inside the reflecting surface of the image, light is applied to the first plane and to the respective sides of the polygonal side of the semiconductor element (1). The visual inspection module (50) according to claim 3, wherein the focus distance correction unit (400) is installed at least at any one of the following positions: in the second optical path (L2) Between each side of the polygonal side of the semiconductor element (1) and the main reflective member (211); the main reflective member (211) in the second optical path (L2) and the single image Obtained between the parts (100). The visual inspection module (50) according to claim 3, wherein the focus distance correction portion (400) is mounted in the second optical path (L2) The focal length correction portion (400) is integrally formed with the auxiliary reflection member (311) between each side surface of the angular side and the main reflection member (211). A component detecting system comprising: a loading portion (10) loaded with a carrier (2) containing a plurality of semiconductor elements (1) and linearly moving the carrier (2); a visual inspection module (50), It is perpendicular to the moving direction of the carriage (2) in the loading portion (10), and is mounted on one side of the loading portion (10), thereby performing visual inspection of the semiconductor element (1); the first guide rail (68) disposed perpendicular to a moving direction of the bracket (2) in the loading portion (10); and a first transfer tool (61) moving along the first rail (68) and The first rail (68) is coupled for performing visual inspection to transfer components from the loading portion (10) to the visual inspection module (50); the loading portion (10) includes: unloading a portion (31, 32, 33) receiving the carrier (2) that completes the visual inspection and containing the semiconductor component (1), and classifying the semiconductor component (1) into related states according to a visual inspection result The cradle (2), the visual inspection module (50) is the visual inspection module according to claim 1 of the patent application. The component detecting system of claim 6, wherein the optical system comprises: a main reflective member (211) that reflects a first planar image of the first plane toward the single image obtaining portion (100); and an auxiliary reflective member (311) that is more than the semiconductor element (1) Each side of the angular side is mounted correspondingly, and a side image of each side of the polygonal side of the semiconductor element (1) is reflected toward the main reflective member (211). The component detecting system according to claim 7, wherein the main reflecting member (211) has a light transmissive semi-transmissive material; the component detecting system further comprises: an illumination system (540), from the reflection Inside the reflecting surface of the first planar image, light is radiated to the first plane and each side of the polygonal side of the semiconductor element (1). The component detecting system according to claim 8, wherein the focus distance correcting portion (400) is installed at least at any one of the following positions: the semiconductor element in the second optical path (L2) (1) between each side of the polygonal side and the main reflecting member (211); between the main reflecting member (211) in the second optical path (L2) and the single image obtaining portion (100) . The component detecting system according to claim 8, wherein the focus distance correcting portion (400) is mounted on each of the polygonal sides of the semiconductor element (1) in the second optical path (L2) The focal length correction portion (400) is integrally formed with the auxiliary reflection member (311) between the side surface and the main reflection member (211).