KR20240025364A - Vision inspection module, vision inspection system having the same, and vision inspection method - Google Patents

Abstract

The present invention relates to vision inspection, and more specifically, to a vision inspection module that performs a vision inspection on a device, a device inspection system including the same, and a vision inspection method.
The present invention is a vision inspection module that has a polygonal planar shape and performs a vision inspection on the element 1 in the state picked up by the picker 631. It is installed in the movement path of the picker 631 and picks up the picker 631. a bottom image acquisition unit 480 that acquires a bottom image of the bottom of the device 1 picked up in ); One or more side image acquisition units installed adjacent to the bottom image acquisition unit 480 to acquire a side image of the side of the device 1 that has passed through the bottom image acquisition unit 480 in order to perform a vision inspection on the side of the device. Contains (470); A control unit that analyzes the bottom image acquired by the bottom image acquisition unit 480 and rotates the picker 631 so that the side of the device 1 is perpendicular to the optical axis of the side image acquisition unit 470. Discloses a vision inspection module characterized in that:

Description

Vision inspection module, device inspection system including the same, and vision inspection method {Vision inspection module, vision inspection system having the same, and vision inspection method}

The present invention relates to vision inspection, and more specifically, to a vision inspection module that performs a vision inspection of a device, a device inspection system including the same, and a vision inspection method.

Semiconductor devices that have completed the semiconductor process are loaded onto customer trays and shipped after completing certain inspections such as vision inspection.

Then, the semiconductor device that is shipped goes through a marking process in which serial numbers, manufacturer logos, etc. are displayed on its surface using a laser.

In addition, the semiconductor device is ultimately inspected to check the external condition of the semiconductor device, such as whether the lead or ball grid is in normal condition, whether there are cracks or scratches, and whether the marking formed on the surface is good. It goes through a process.

Meanwhile, as the above-mentioned inspection of the external condition of the semiconductor device and whether the marking is good is added, the time for performing the entire process and the size of the device are affected depending on the inspection time and the arrangement of each module.

In particular, the size of the device varies depending on the loading of a tray loaded with multiple devices, one or more modules for vision inspection of each device, and the configuration and arrangement of the unloading module according to the inspection results after inspection.

Additionally, the size of the device limits the number of device handlers that can be installed in the device inspection line or affects the installation cost for device production depending on the installation of a predetermined number of device handlers.

To solve these problems, a technology such as Patent Document 1 has been proposed, and the device handler according to Patent Document 1 improves the inspection speed for devices by efficiently arranging modules for vision inspection, etc., while reducing the size of the device. Ultimately, device production costs can be reduced.

Meanwhile, the device handler according to Patent Document 1 performs a vision inspection on the side of the device through a side inspection unit including a pair of image acquisition units that inspect the side of the rectangular device.

And when the side inspection of the device is performed by the side inspection unit according to Patent Document 2, the device can be picked up in the state shown in FIG. 5.

However, when the device is picked up as shown in FIG. 4, there is a problem in that the vision inspection is inaccurate or impossible because the distance on the side to the image acquisition unit varies during the vision inspection by the side inspection unit.

This problem also occurs in the case of Patent Document 2.

(Patent Document 1) KR 10-2017-0140964 A

(Patent Document 2) KR 10-2019-0106098 A

The purpose of the present invention is to provide a vision inspection module that can perform accurate and stable vision inspection by ensuring that the side of the device is perpendicular to the optical axis of the image acquisition unit when inspecting the side of a device having a polygonal planar shape, and a device including the same. The goal is to provide inspection systems and vision inspection methods.

The present invention was created to achieve the object of the present invention as described above, and the present invention is to perform a vision inspection on the element 1 in a state where the planar shape is polygonal and picked up by the picker 631. A vision inspection module, comprising: a bottom image acquisition unit 480 installed on the moving path of the picker 631 and acquiring a bottom image of the bottom of the device 1 picked up by the picker 631; One or more side image acquisition units installed adjacent to the bottom image acquisition unit 480 to acquire a side image of the side of the device 1 that has passed through the bottom image acquisition unit 480 in order to perform a vision inspection on the side of the device. Contains (470); A control unit that analyzes the bottom image acquired by the bottom image acquisition unit 480 and rotates the picker 631 so that the side of the device 1 is perpendicular to the optical axis of the side image acquisition unit 470. Discloses a vision inspection module characterized in that:

The side image acquisition unit 470 includes a first side image acquisition unit 471 and a second side image acquisition unit 472 installed as a pair across the movement path of the picker 631 that picks up the device 1. ) may include.

The device 1 has a rectangular planar shape, and after passing through the bottom image acquisition unit 480, it is moved to the first side image acquisition unit 471 and the second side image acquisition unit 472. A first vision inspection is performed on a pair of opposing first sides, and the picker 631 of the device 1 on which the first vision inspection was performed is rotated 90° and then the first side image acquisition unit 471. And it is moved back to the second side image acquisition unit 472 to perform a second vision inspection on a pair of second sides that are perpendicular to the first side and face each other.

The first side image acquisition unit 471 and the second side image acquisition unit 472 include a camera 510 that acquires an image of the long side or short side of the device 1, and the long side or short side of the device 1. An optical system 550 that guides light from the image of the side of the short side to the camera 510, and an optical distance that keeps the optical distance (L) constant from the long or short side of the device 1 to the camera 510. It may include an image acquisition module including adjustment means.

The optical distance adjusting means can change the length of the optical system 550 to keep the optical distance L from the long side or short side of the device 1 to the camera 510 constant.

The optical distance adjusting means moves the image acquisition module to adjust the distance between the image acquisition modules with respect to the side of the device 1, thereby adjusting the optical distance from the long side or short side of the device 1 to the camera 510. (L) can be kept constant.

The present invention also includes a loading unit 100 on which a tray 2 loaded with a plurality of elements 1 is loaded; A vision inspection module 1000 having the same configuration as above is installed on one side of the loading unit 100 and performs a vision inspection on the device 1; The first device picks up the device (1) from the tray (2) of the loading unit (100) and transfers it to the vision inspection module (1000), and transfers the device (1) that has completed the vision inspection to the tray (2) for loading. Disclosed is a device inspection system characterized by including a transfer tool (630).

The device inspection system may further include an unloading unit 300 that unloads trays 2 loaded with devices 1 that have completed the vision inspection.

The first transfer tool 630 is coupled to the main body 21 and adsorbs and fixes the back surface of the first plane (hereinafter, the second plane) of the element 1 and one or more It may include a plurality of pickers 631 arranged in a row.

The first transfer tool 630 may further include a picker rotation driving unit that rotates the picker 631 about a central axis parallel to the normal direction of the first plane.

The first transfer tool 630 is used to sequentially position a plurality of elements 1 picked up by a plurality of pickers 631 arranged in a row between the pair of first reflecting members 122. It may additionally include a linear movement driving unit that linearly moves the main body portion 21.

The device inspection system according to the present invention is a 3D vision inspection system that performs a 3D vision inspection on the bottom of the device 1, which is picked up and transported by the second transfer tool 610, which performs a 2D inspection on the bottom of the device 1. It may further include a vision inspection unit 410 and a 2D vision inspection unit 460 that performs a 2D vision inspection on the bottom of the element 1 picked up by the second transfer tool 610.

The 3D vision inspection unit 410 and the 2D vision inspection unit 460 may be placed in front of the vision inspection module 1000.

The present invention is also a vision inspection method for performing a vision inspection on an element 1 with a polygonal planar shape and picked up by a picker 631. The bottom surface of the element 1 picked up by the picker 631 is provided. A bottom image acquisition step (S10) of acquiring a bottom image of; It includes a side image acquisition step (S30) of acquiring a side image of the side of the device (1) to perform a vision inspection on the side of the device; Before performing the side image acquisition step (S30), analyze the bottom image acquired by the bottom image acquisition step (S10) so that the side of the device (1) is perpendicular to the optical axis for measuring the side image. ) Discloses a vision inspection method comprising an alignment step (S20) of rotating the picker 631 to pick up.

In the side image acquisition step (S30), a side image of a pair of opposite sides facing each other across the movement path of the picker 631 that picks up the element 1 can be acquired.

The device 1 has a rectangular planar shape, and the side image acquisition step (S30) is a primary step of performing a vision inspection on a pair of first sides that are opposed to each other among the sides of the device 1. Vision inspection step (S31); An element that rotates a picker 631 that picks up the element 1 after the first vision inspection step (S31) to perform a vision inspection on a pair of second sides that are perpendicular to the first side and face each other. Rotation step (S32); After the device rotation step (S32), a second vision inspection step (S33) of performing a vision inspection on the pair of second sides may be included.

In the second vision inspection step (S33), the vision inspection can be performed while maintaining the optical distance (L) from the long side or short side of the device 1 to the camera 510 constant.

In the second vision inspection step (S33), the optical distance (L) from the long side or short side of the device 1 to the camera 510 can be kept constant by varying the length of the optical system 550.

The second vision inspection step (S33) moves the image acquisition module including the camera 510 to adjust the distance between the image acquisition modules with respect to the side of the device 1 to the long side or The optical distance (L) from the short side to the camera 510 can be kept constant.

The vision inspection module, the device inspection system and vision inspection method including the same according to the present invention acquire a bottom image of the device and rotate the side that is the target of the vision inspection so that it is perpendicular to the optical axis of the image acquisition unit constituting the side vision inspection unit, It has the advantage of being able to perform accurate and stable vision inspection.

More specifically, the vision inspection module, the device inspection system and vision inspection method including the same according to the present invention acquire the bottom image of the device picked up to perform the vision inspection, and then perform the vision inspection by analyzing the acquired image. There is an advantage in performing an accurate and stable vision inspection by rotating the picker that picks up the element so that the target side is perpendicular to the optical axis of the image acquisition unit constituting the side vision inspection unit.

1 is a plan view showing an example of a device handler according to an embodiment of the present invention.
FIG. 2 is a conceptual diagram showing an example of the operation of the vision inspection unit of the device handler of FIG. 1.
Figure 3 is a conceptual diagram showing the operation of a modified example of the vision inspection unit in Figure 2.
Figure 4 is a side view showing the configuration of the vision inspection unit of Figure 2.
FIG. 5 is a conceptual diagram showing the alignment state of elements with respect to the vision inspection unit of FIG. 2.
FIG. 6 is a conceptual diagram showing another example of a vision inspection unit among the device handlers in FIG. 1.
FIG. 7 is a front view showing an example of an image acquisition module constituting the vision inspection unit of the device handler in FIG. 1.
FIGS. 8A and 8B are conceptual diagrams showing the operation of another modified example of the vision inspection unit of the device handler of FIG. 1.
FIGS. 9A and 9B are conceptual diagrams showing the operation of another modified example of the vision inspection unit of the device handler of FIG. 1.

Hereinafter, the vision inspection module, the device inspection system including the same, and the vision inspection method according to the present invention will be described with reference to the attached drawings.

A device inspection system according to an embodiment of the present invention includes a loading unit 100 on which a tray 2 loaded with a plurality of devices 1 is loaded; A vision inspection module 1000 installed on one side of the loading unit 100 to perform a vision inspection on the device 1; A first transfer tool that picks up elements (1) from the tray (2) of the loading unit (100) and transfers them to the vision inspection module (1000), and transfers the elements (1) that have completed the vision inspection to the tray (2) to load them. Includes (630).

Here, the device 1 can be any semiconductor device that has a polygonal shape, especially a rectangle, and has completed a semiconductor process, such as memory, SD RAM, flash RAM, CPU, or GPU.

The tray 2 is a configuration in which one or more devices 1 are loaded in a substrate arrangement of an n×m matrix (n and m are natural numbers of 2 or more), depending on the type or process stage of the loaded devices, such as memory devices. Standardization is common.

A seating groove (not shown) for seating the device 1 may be formed on the upper surface of the tray 2.

The loading unit 100 is a component that loads the tray 2 on which the device 1 to be inspected is loaded in order to perform a vision inspection, and various configurations are possible.

For example, the loading unit 100 is a guide that guides the movement of the tray 2 on which a plurality of elements 1 are loaded, as shown in FIG. 1 and Korean Patent Publication No. 10-2008-0092671. It may be configured to include a unit (not shown) and a driving unit (not shown) for moving the tray 2 along the guide unit.

The vision inspection module 1000 is installed on one side of the loading unit 100 and acquires an image of the device 1 using a camera, scanner, etc. to perform a vision inspection on the device 1. Therefore, various configurations are possible depending on the type of element 1 to be inspected, the type of inspection, and the configuration of the system.

For example, the vision inspection module 1000 may be installed on one side of the loading unit 100 perpendicular to the transport direction of the tray 2 within the loading unit 100, but is not limited to this.

Specifically, as shown in FIG. 1, when the transfer direction of the tray 2 within the loading unit 100 is the Y-axis direction, the vision inspection module 1000 is positioned on one side of the X-axis direction perpendicular to the Y-axis direction. can be installed in

Meanwhile, the vision inspection module 1000 is a vision inspection module that performs a vision inspection on the element 1 in a state picked up by the picker 631, and can be configured in various ways.

As an embodiment, the vision inspection module 1000 is installed in the movement path of the picker 631 of the first transfer tool 630, as shown in Figures 2 to 5, and picks up the picker 631. a bottom image acquisition unit 480 that acquires a bottom image of the bottom of the device (1); One or more side image acquisition units installed adjacent to the bottom image acquisition unit 480 to acquire a side image of the side of the device 1 that has passed through the bottom image acquisition unit 480 in order to perform a vision inspection on the side of the device. It may include (470).

The bottom image acquisition unit 480 is installed in the moving path of the picker 631 and acquires a bottom image of the bottom of the device 1 picked up by the picker 631, and various configurations are possible.

In particular, the bottom image acquisition unit 480 may be composed of a camera or a scanner in consideration of acquiring a bottom image of the bottom of the device 1.

In addition, the bottom image of the device 1 acquired by the bottom image acquisition unit 480 can be used to perform rotational alignment of the device 1, which will be described later, as well as the state of the bottom of the device 1, especially 2D inspection. You can.

Meanwhile, the bottom image acquisition unit 480 may be configured as in the embodiment of Korean Patent Publication No. 10-2010-0122140 and Patent Document 2.

The side image acquisition unit 470 is installed adjacent to the bottom image acquisition unit 480 and is installed on the side of the device 1 that passes through the bottom image acquisition unit 480 to perform a vision inspection on the side of the device. As a configuration for acquiring an image, various configurations are possible.

For example, the side image acquisition unit 470 may be the side inspection unit of Patent Document 1 or the vision inspection module of Patent Document 2.

In particular, as shown in FIG. 2, the side image acquisition unit 470 is a first side image acquisition unit 471 installed in a pair across the movement path of the picker 631 that picks up the device 1. ) and a second side image acquisition unit 472.

The first side image acquisition unit 471 and the second side image acquisition unit 472 are arranged at intervals in the Y-axis direction perpendicular to the moving direction of the device 1, that is, the X-axis direction, and the device ( It is a configuration that is installed as a pair across the movement path of the picker 631 that picked up 1), and various configurations are possible.

For example, the first side image acquisition unit 471 and the second side image acquisition unit 472 may include a camera and an optical system, and, as in Patent Document 2, are configured as one camera depending on the configuration of the optical system. It can be.

By the first side image acquisition unit 471 and the second side image acquisition unit 472, when the device 1 has a rectangular planar shape, after passing through the bottom image acquisition unit 480, the device 1 It is moved to the first side image acquisition unit 471 and the second side image acquisition unit 472, and a first vision inspection is performed on a pair of opposing first sides, and the device on which the first vision inspection was performed ( 1) After the picker 631 is rotated 90° (FIG. 2(b)), it is moved back to the first side image acquisition unit 471 and the second side image acquisition unit 472, and is then moved back to the first side image acquisition unit 471 and the second side image acquisition unit 472. A secondary vision inspection may be performed on a pair of second sides that are vertical and face each other.

Meanwhile, when the pickers 631 are arranged in a double row and transported as shown in FIG. 3, the side image acquisition unit 470 corresponds to the corresponding row, as shown in FIG. 3, and the first side image acquisition unit ( 471) and the second side image acquisition unit 472 may be arranged in pairs.

By the above configuration, the elements 1 picked up by the plurality of pickers 631 arranged in the X-axis direction form a row in the An image of the side of the device 1 can be acquired while moving between the pair of the acquisition unit 471 and the second side image acquisition unit 472.

And after the elements 1 in each row are moved in the first direction, for example, - An image of the side of the device 1 can be acquired while moving between the pair of the first side image acquisition unit 471 and the second side image acquisition unit 472 in the +X-axis direction.

Meanwhile, the element 1 picked up by the picker 631 when performing the first and second vision inspections needs to have its side perpendicular to the optical axis, that is, the Y-axis, of the side image acquisition unit 470.

However, the element 1 picked up by the picker 631 may be picked up by the picker 631 in a state that is not perpendicular to the Y axis, as shown in FIG. 5, depending on the pickup state. In this case, the side image acquisition unit As the measurement distance in the direction of the optical axis of (470) changes, the resolution of the image for the part outside the FOV may be unsuitable for vision inspection.

Here, the measurement distance is the optical distance from the surface of the subject to an imaging device such as a camera. If the measurement distance is outside the FOV range, there is a problem in that vision inspection becomes inaccurate or impossible due to poor clarity due to poor clarity.

Accordingly, before acquiring the side image by the side image acquisition unit 470, the angle formed between the optical axis of the side image acquisition unit 470, that is, the Y axis, and the side surface of the device 1 is perpendicular, that is, rotational alignment is required. .

Therefore, the present invention analyzes the bottom image acquired by the bottom image acquisition unit 480 and uses the picker 631 so that the side of the device 1 is perpendicular to the optical axis of the side image acquisition unit 470. It includes a control unit that rotates.

The control unit analyzes the bottom image acquired by the bottom image acquisition unit 480 and rotates the picker 631 so that the side of the device 1 is perpendicular to the optical axis of the side image acquisition unit 470. As a configuration, various configurations are possible with a circuit configuration rather than a physical configuration.

Specifically, as shown in FIG. 5, the control unit analyzes the bottom image of the device 1 and determines the angle error between the optical axis of the side image acquisition unit 470, that is, the Y axis, and the side of the device 1, That is, by calculating the angle deviation for 90° and rotating the picker 631 based on the calculated angle deviation, the side of the device 1 with respect to the optical axis of the side image acquisition unit 470 can be controlled to be perpendicular. there is.

Here, the control unit may rotate the picker 631, which picks up the element 1, by rotating the picker rotation driver, which will be described later, based on the calculated angle deviation.

Meanwhile, of course, the control unit can perform bottom image analysis and rotation control of the picker 631 as well as overall control of the device inspection system.

In addition, the vision inspection module and the control unit constitute one module, and are independent modules regardless of the specific configuration of the device inspection system, and can be applied to various device inspection systems that require vision inspection.

The first transfer tool 630 picks up the element 1 from the tray 2 of the loading unit 100 and transfers it to the vision inspection module 1000, and transfers the element 1 that has completed the vision inspection to the tray 2. ), and various configurations are possible by transporting and loading.

For example, as shown in Patent Document 2 and FIG. 4, the first transfer tool 630 is coupled to the main body and moves the back surface of the first plane (hereinafter referred to as the second plane) of the element 1. ) and may include a plurality of pickers 631 arranged in one or more rows.

The plurality of pickers 631 are preferably installed in a plurality of rows or double rows to increase inspection speed.

The picker 631 is configured to pick up the element 1 by adsorbing and fixing the second plane using vacuum pressure, and various configurations are possible.

The first transfer tool 630 may further include a picker rotation driving unit that rotates the picker 631 about a central axis (c) parallel to the normal direction (-Z axis direction) of the first plane.

In addition, the first transfer tool 630 uses a bottom image acquisition unit 480 and a side image acquisition unit 470 for a plurality of elements 1 picked up by a plurality of pickers 631 arranged in a row. It may further include a linear movement driving unit that linearly moves the main body to which the plurality of pickers 631 are combined so that it can be moved along the movement path to the vision inspection module 1000.

The first transfer tool 630 is a first guide rail 40 disposed in a direction perpendicular to the moving direction (Y-axis direction based on the drawing) of the tray 2 in the loading unit 100 (X-axis direction based on the drawing). It can be combined with the first guide rail 40 to move along.

The first guide rail 40 is arranged perpendicular to the direction of movement of the tray 2 in the loading unit 100, supports the first transfer tool 630, and guides its movement, and has various configurations. possible.

In addition, the device inspection system may further include an unloading unit 300 that unloads trays 2 loaded with devices 1 that have completed vision inspection.

The unloading unit 300 receives trays 2 containing devices 1 that have completed vision inspection from the loading unit 100 and sorts them into the corresponding trays 2 according to the results of the vision inspection, and has various configurations. possible.

The unloading unit 300 has a similar configuration to the loading unit 100, and is a first unloading unit 310 in which devices 1 of good quality (G) are unloaded according to the vision inspection results of the devices 1. ), a second unloading unit 320 where elements 1 determined as defective 1 or abnormal 1 (R1) are unloaded, and a second unloading unit 320 where elements 1 determined as defective 2 or abnormal 2 (R2) are unloaded. 3It may include an unloading unit 330.

And the unloading units 310, 320, and 330 include a guide unit (not shown) installed parallel to one side of the loading unit 100, and a driving unit (not shown) for moving the tray 2 along the guide unit. A plurality of unloading trays including may be installed in parallel.

Meanwhile, the tray 2 can be transferred between the loading unit 100 and the unloading units 310, 320, and 330 by a tray transfer device (not shown), and the unloading units 310, 320, and 330 ) may additionally include an empty tray unit (not shown) that supplies an empty tray 2 on which the semiconductor device 1 is not loaded.

Meanwhile, a sorting tool 620 may be separately installed in the unloading units 310, 320, and 330 to transfer the elements 1 between each unloading tray unit according to the classification level of each unloading tray unit. .

The sorting tool 620 has the same or similar configuration as the first transfer tool 630 described above, may have a double-row structure or a straight-line structure, and includes a second guide rail disposed in parallel with the first guide rail 40. It can be installed movably along (60).

Meanwhile, the unloading units 310, 320, and 330 have been described with reference to an embodiment in which the device 1 is loaded again on the tray 2 loaded by the loading unit 100 and then unloaded. However, the device 1 ) Any configuration is possible as long as it can contain and unload the device (1), including a so-called tape-and-reel module, which is loaded and unloaded on a carrier tape formed with a pocket to contain the device (1).

The device inspection system according to the present invention as described above, when performing a vision inspection on the side of the device, obtains a clear image of the side of the device by correcting the angle difference between the optical axis of the image acquisition unit for inspection of the side of the device and the side of the device. This makes it possible to greatly improve the reliability of vision inspection.

Meanwhile, the technical gist of the present invention is to correct the angular difference between the optical axis of the image acquisition unit for device side inspection and the device side when performing a vision inspection on the device side, regardless of the physical configuration for its implementation. It can be implemented using a vision inspection method.

That is, the vision inspection method according to the present invention is a vision inspection method that performs a vision inspection on the element 1 in a state where the planar shape has a polygonal shape and is picked up by the picker 631. A bottom image acquisition step (S10) of acquiring a bottom image of the bottom of the device (1); It includes a side image acquisition step (S30) of acquiring a side image of the side of the device (1) to perform a vision inspection on the side of the device; Before performing the side image acquisition step (S30), analyze the bottom image acquired by the bottom image acquisition step (S10) so that the side of the device (1) is perpendicular to the optical axis for measuring the side image. ) may include an alignment step (S20) of rotating the picker 631 that picks up.

The bottom image acquisition step (S10) is a step of acquiring a bottom image of the bottom of the device 1 picked up by the picker 631, and can be performed by various methods.

And the bottom image acquisition step (S10) can be performed in parallel with 2D inspection or 3D inspection, especially 2D inspection, of the bottom of the device 1.

The side image acquisition step (S30) includes a bottom image acquisition step (S10); This is a step of acquiring a side image of the side of the device (1) in order to perform a vision inspection on the side of the device, and can be performed by various methods.

For example, in the side image acquisition step (S30), side images of a pair of opposite sides facing each other across the movement path of the picker 631 that picks up the element 1 may be acquired.

Furthermore, when the device 1 has a rectangular planar shape, the side image acquisition step (S30) performs a vision inspection on a pair of first sides of the device 1 that are opposed to each other. The first vision inspection step (S31) and; An element that rotates a picker 631 that picks up the element 1 after the first vision inspection step (S31) to perform a vision inspection on a pair of second sides that are perpendicular to the first side and face each other. Rotation step (S32); After the device rotation step (S32), a second vision inspection step (S33) of performing a vision inspection on the pair of second sides may be included.

On the other hand, the vision inspection method according to the present invention analyzes the bottom image acquired by the bottom image acquisition step (S10) before performing the side image acquisition step (S30), and uses a device for the optical axis for measuring the side image ( It is characterized in that it additionally includes an alignment step (S20) of rotating the picker 631 that picks up the element 1 so that the side of 1) is vertical.

The alignment step (S20) analyzes the bottom image acquired by the bottom image acquisition step (S10) before performing the side image acquisition step (S30), and determines the alignment of the device (1) with respect to the optical axis for measuring the side image. This is a step of rotating the picker 631 that picks up the element 1 so that the side surface is vertical, and can be performed by various methods.

Meanwhile, the vision inspection module 1000 described above is a vision module that performs a vision inspection on the bottom and four sides of the device 1 having a rectangular planar shape, the so-called 5D vision inspection (5-side vision inspection). It functions.

Accordingly, in addition to the vision inspection by the vision inspection module 1000 according to the vision inspection characteristics, additional vision inspection is performed before and/or after the vision inspection by the vision inspection module 1000 depending on the vision inspection contents of the device 1. can be performed.

For example, the device inspection system according to the present invention includes a 3D vision inspection of the bottom of the device 1 that is picked up and transported by the second transfer tool 610, which performs a 2D inspection of the bottom of the device 1. It may include a 3D vision inspection unit 410 that performs a 2D vision inspection unit 460 that performs a 2D vision inspection of the bottom of the device 1 picked up by the second transfer tool 610.

The 3D vision inspection unit 410 is configured to perform a 3D vision inspection on the bottom of the device 1 that is picked up and transferred by the second transfer tool 610 and can be configured in various ways.

For example, the 3D vision inspection unit 410 includes a first image acquisition unit that acquires an image of the bottom of the element 1 that is picked up and transferred by the second transfer tool 610 for 3D vision inspection, In order to acquire an image of the first image acquisition unit, it may include a first light source unit that irradiates light to the bottom of the element 1 that is picked up and transferred by the second transfer tool 610.

And the 2D vision inspection unit 460 includes a second image acquisition unit that acquires an image of the bottom of the device 1 picked up by the second transfer tool 610 for 2D vision inspection, and a second image acquisition unit. It may include a second light source unit that irradiates light to the bottom of the element 1 picked up by sending it to the second transfer tool 610 for image acquisition.

Meanwhile, the 2D vision inspection unit 460 and the 3D vision inspection unit 410 may have various configurations and arrangements.

It may be configured as shown in the embodiment and FIGS. 2A and 2B in Korean Patent Publication No. 10-2010-0122140.

Here, the first light source unit of the 3D vision inspection unit 410 can have various configurations, and monochromatic light such as a laser, white light, etc. can be used.

In particular, when the three-dimensional shape to be measured is minute, the diffuse reflection of laser light is large and measurement is difficult, so it is preferable to use white light with less diffuse reflection.

In addition, the first light source unit of the 3D vision inspection unit 410 is preferably irradiated in a slit shape on the surface of the device 1, and is connected to an optical fiber that transmits light from the light source and is connected to the optical fiber to emit slit-shaped light to the device. It may be configured to include a slit portion for irradiating the surface of (1).

Meanwhile, the 2D vision inspection unit 460 and the 3D vision inspection unit 410 may be arranged in parallel with the vision inspection module 1000 described above, as shown in FIG. 1.

In particular, the 2D vision inspection unit 460 and the 3D vision inspection unit 410 may be installed on the front side of the vision inspection module 1000 and performed before the 5D vision inspection by the vision inspection module 1000.

On the other hand, when the planar shape of the device 1, which is the object of vision inspection, is rectangular, the lengths of the long and short sides are different, so when the device 1 is rotated and the vision inspection is performed as shown in Figures 2 and 3, the side of the device 1 Correction of the focus of the optical system is required.

Specifically, in acquiring an image of the side of the rectangular-shaped device 1, it is rotated from the long side to the short side or from the short side to the long side, as shown in FIGS. 6, 8a, and 8b.

At this time, the first measurement distance D1 formed by the short side of the rectangular element 1 with the first side image acquisition unit 471 and the second side image acquisition unit 472 is the long side of the element 1. This becomes smaller than the second measurement distance D2, and accordingly, the distance from the side of the device 1 to the camera 510 changes.

Accordingly, the vision inspection module according to the present invention can be configured so that the optical distance (L) to the element 1, which is a vision inspection target, can be adjusted, as shown in FIGS. 6 to 9B.

Specifically, the first side image acquisition unit 471 and the second side image acquisition unit 472 acquire images of the side of the long side or short side of the device 1, as shown in FIGS. 6 and 7. a camera 510 that guides light to the camera 510 to capture an image of the side of the long or short side of the device 1, and an optical system 550 that guides light from the long or short side of the device 1 to the camera 510. It may include an optical distance adjustment means that maintains the optical distance (L) constant.

The camera 510 is a component that acquires an image of the side of the long side or short side of the device 1, and may be configured as a camera made of an imaging device.

The optical system 550 is a component that guides light to the camera 510 to image the long or short side of the device 1, and may include one or more lenses, reflectors, etc.

For example, the optical system 550 may be composed of one or more lenses when the camera 510 faces the long or short side of the device 1.

As another example, when the camera 510 is oriented perpendicular to the side of the long or short side of the device 1, the optical system 550 may be configured to reflect, in addition to one or more lenses, to convert the optical path L to the vertical. It may include member 551.

Additionally, the optical system 550 may include a barrel 552, etc. to exclude interference from ambient light.

In addition, the optical system 550 allows the camera 510 to smoothly acquire images of the long or short side of the device 1. It may include a light irradiation unit 520 that irradiates light.

The light irradiation unit 520 is a configuration in which the camera 510 irradiates light to the long or short side of the device 1, and emits visible light, single light of a specific wavelength, etc. depending on the type and content of the vision inspection. Various configurations are possible, including research.

The optical distance adjusting means is a component that maintains the optical distance (L) constant from the long or short side of the device 1 to the camera 510, and can be configured in various ways depending on the method of controlling the optical distance (L). do.

As an example, the optical distance adjusting means, as shown in FIGS. 8A and 8B, changes the length of the optical system 550 made of lenses, mirrors, etc. to adjust the distance between the long side and the short side of the device 1 to the camera 510. The optical distance (L) reaching can be kept constant.

Specifically, the optical distance adjusting means varies the distance between the camera 510 and the reflection member 551 and the length of the lens barrel, thereby adjusting the optical distance from the long side or short side of the element 1 to the camera 510. The distance (L) can be kept constant.

In addition, as shown in FIGS. 8A and 8B, by moving the camera 510, the optical distance L from the long or short side of the device 1 to the camera 510 can be kept constant.

At this time, the optical distance L of the optical system 550 from the long side or short side of the device 1 to the camera 510 is varied.

As another example, the optical distance adjusting means, as shown in FIGS. 8A and 8B, each of the first side image acquisition unit 471 and the second side image acquisition unit 472 as one image acquisition module. By moving the image acquisition module, the distance between the image acquisition modules with respect to the side of the device 1 is adjusted to keep the optical distance (L) from the long or short side of the device 1 to the camera 510 constant. It can be maintained.

At this time, the optical distance adjusting means may include a linear movement unit 560 that linearly moves the image acquisition module so that the measurement distance increases or decreases with respect to the side of the device 1.

The linear movement unit 560 is a component that linearly moves the image acquisition module so that the measurement distance increases or decreases with respect to the side of the device 1, and various configurations are possible.

When the image acquisition target changes from the short side of the device 1 to the long side due to the rotation of the device 1, the first measurement distance D1 increases to the second measurement distance D2, or conversely, the long side of the device 1 increases. When changing from the second measurement distance (D2) to the first measurement distance (D1), the optical distance from the long or short side of the device 1 to the camera 510 is adjusted by the optical distance adjusting means. The distance (L) can be kept constant.

Meanwhile, the rectangular element 1 passes through the side image acquisition unit 470, undergoes a primary vision inspection of the first pair of sides, rotates 90°, and then passes through the side image acquisition unit 470 again. While doing so, a secondary vision inspection is performed on the second side of the pair.

At this time, after rotating 90° after the first vision inspection, it is necessary to check whether each element (1) has been properly rotated according to the rotation precision of each element (1).

Accordingly, the bottom image acquisition unit 480 is installed at the front and rear of the side image acquisition unit 470, respectively, based on the moving direction of the device 1, and 1 is obtained by the bottom image acquisition unit 480 installed in the front. The rotational state of each element (see Figure 5) before the primary vision test is inspected, and after the primary vision test and rotation of 90°, the rotational state of each element is checked by the rear image acquisition unit (not shown) installed at the rear (see Figure 5). ) can be inspected.

In the above, preferred embodiments of the present invention have been described by way of example, but the scope of the present invention is not limited to these specific embodiments and may be appropriately changed within the scope stated in the claims.

1: element
470: Side image inspection unit 480: Bottom image inspection unit

Claims (19)

A vision inspection module that has a polygonal planar shape and performs a vision inspection on the element 1 in the state picked up by the picker 631,
a bottom image acquisition unit 480 installed on the moving path of the picker 631 and acquiring a bottom image of the bottom of the device 1 picked up by the picker 631;
One or more side image acquisition units installed adjacent to the bottom image acquisition unit 480 to acquire a side image of the side of the device 1 that has passed through the bottom image acquisition unit 480 in order to perform a vision inspection on the side of the device. Contains (470);
A control unit that analyzes the bottom image acquired by the bottom image acquisition unit 480 and rotates the picker 631 so that the side of the device 1 is perpendicular to the optical axis of the side image acquisition unit 470. A vision inspection module characterized by: In claim 1,
The side image acquisition unit 470,
A vision test comprising a first side image acquisition unit 471 and a second side image acquisition unit 472 installed as a pair across the movement path of the picker 631 that picks up the device 1. module. In claim 2,
The device 1 has a rectangular planar shape,
After passing through the bottom image acquisition unit 480, it is moved to the first side image acquisition unit 471 and the second side image acquisition unit 472 to perform a primary vision inspection on a pair of first sides facing each other. is performed,
The device 1 on which the first vision inspection was performed is moved back to the first side image acquisition unit 471 and the second side image acquisition unit 472 after the picker 631 is rotated 90°, and the first side image acquisition unit 472 is moved to the first side image acquisition unit 472. A vision inspection module characterized in that a secondary vision inspection is performed on a pair of second sides that are perpendicular to the side and face each other. In claim 3,
The first side image acquisition unit 471 and the second side image acquisition unit 472,
A camera 510 that acquires an image of the long or short side of the device 1,
An optical system 550 that guides light to the camera 510 to image the long side or short side of the device 1,
A vision inspection module comprising an image acquisition module including an optical distance adjusting means for maintaining a constant optical distance (L) from the long side or short side of the device (1) to the camera (510). In claim 4,
The optical distance adjusting means is,
A vision inspection module, characterized in that the optical distance (L) from the long or short side of the element (1) to the camera (510) is kept constant by varying the length of the optical system (550). In claim 4,
The optical distance adjusting means moves the image acquisition module to adjust the distance between the image acquisition modules with respect to the side of the device 1, thereby adjusting the optical distance from the long side or short side of the device 1 to the camera 510. A vision inspection module characterized by maintaining (L) constant. a loading unit 100 on which a tray 2 loaded with a plurality of devices 1 is loaded;
A vision inspection module 1000 according to any one of claims 1 to 6, which is installed on one side of the loading unit 100 and performs a vision inspection on the device 1;
The first device picks up the device (1) from the tray (2) of the loading unit (100) and transfers it to the vision inspection module (1000), and transfers the device (1) that has completed the vision inspection to the tray (2) for loading. A device inspection system comprising a transfer tool (630). In claim 7,
The device inspection system is,
A device inspection system further comprising an unloading unit 300 that unloads trays 2 loaded with devices 1 that have completed the vision inspection. In claim 7,
The first transfer tool 630 is,
A body portion 21 and a plurality of pickers 631 that are coupled to the body portion 21 to adsorb and fix the back surface of the first plane (hereinafter, the second plane) of the device 1 and are arranged in one or more rows. A device inspection system comprising: In claim 9,
The first transfer tool 630 is a device inspection system characterized in that it further includes a picker rotation drive unit that rotates the picker 631 about a central axis parallel to the normal direction of the first plane. In claim 10,
The first transfer tool 630 is used to sequentially position a plurality of elements 1 picked up by a plurality of pickers 631 arranged in a row between the pair of first reflecting members 122. A device inspection system characterized in that it additionally includes a linear movement drive unit that linearly moves the main body portion (21). In claim 10,
a 3D vision inspection unit 410 that performs a 3D vision inspection of the bottom of the device 1 that is picked up and transported by the second transfer tool 610 that performs a 2D inspection of the bottom of the device 1;
A device inspection system further comprising a 2D vision inspection unit 460 that performs a 2D vision inspection on the bottom of the device 1 picked up by the second transfer tool 610. In claim 12,
The device inspection system, wherein the 3D vision inspection unit 410 and the 2D vision inspection unit 460 are disposed in front of the vision inspection module 1000. A vision inspection method that performs a vision inspection on an element (1) with a polygonal planar shape and picked up by a picker (631),
A bottom image acquisition step (S10) of acquiring a bottom image of the bottom of the device 1 picked up by the picker 631;
It includes a side image acquisition step (S30) of acquiring a side image of the side of the device (1) to perform a vision inspection on the side of the device;
Before performing the side image acquisition step (S30), analyze the bottom image acquired by the bottom image acquisition step (S10) so that the side of the device (1) is perpendicular to the optical axis for measuring the side image. ) A vision inspection method comprising an alignment step (S20) of rotating a picker (631) that picks up. In claim 14,
In the side image acquisition step (S30),
A vision inspection method characterized by acquiring a side image of a pair of opposing sides across the movement path of the picker 631 that picks up the element 1. In claim 15,
The device 1 has a rectangular planar shape,
In the side image acquisition step (S30),
A first vision inspection step (S31) of performing a vision inspection on a pair of first sides of the device 1 that are opposed to each other;
An element that rotates a picker 631 that picks up the element 1 after the first vision inspection step (S31) to perform a vision inspection on a pair of second sides that are perpendicular to the first side and face each other. Rotation step (S32);
A vision inspection method comprising a second vision inspection step (S33) of performing a vision inspection on the pair of second sides after the device rotation step (S32). In claim 16,
The second vision inspection step (S33) is,
A vision inspection method characterized in that the vision inspection is performed while maintaining a constant optical distance (L) from the long or short side of the device (1) to the camera (510). In claim 17,
The second vision inspection step (S33) is,
A vision inspection method characterized in that the optical distance (L) from the long or short side of the element (1) to the camera (510) is kept constant by varying the length of the optical system (550). In claim 4,
The second vision inspection step (S33) is,
By moving the image acquisition module including the camera 510, the distance between the image acquisition modules with respect to the side of the device 1 is adjusted to determine the optical distance from the long or short side of the device 1 to the camera 510. A vision inspection method characterized by maintaining (L) constant.

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