WO2006132490A1 - In-tray inspection apparatus and method of semiconductor package - Google Patents

In-tray inspection apparatus and method of semiconductor package Download PDF

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Publication number
WO2006132490A1
WO2006132490A1 PCT/KR2006/002173 KR2006002173W WO2006132490A1 WO 2006132490 A1 WO2006132490 A1 WO 2006132490A1 KR 2006002173 W KR2006002173 W KR 2006002173W WO 2006132490 A1 WO2006132490 A1 WO 2006132490A1
Authority
WO
WIPO (PCT)
Prior art keywords
tray
semiconductor package
image information
vision
vision probe
Prior art date
Application number
PCT/KR2006/002173
Other languages
French (fr)
Inventor
Sang-Yoon Lee
Yi-Bae Choi
Min-Gu Kang
Ssang-Gun Lim
Original Assignee
Intekplus Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intekplus Co., Ltd. filed Critical Intekplus Co., Ltd.
Priority to CN2006800194725A priority Critical patent/CN101189527B/en
Publication of WO2006132490A1 publication Critical patent/WO2006132490A1/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/07—Non contact-making probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Definitions

  • the present invention relates to an apparatus and a method for inspecting an external appearance of a semiconductor package, and more particularly to an apparatus for inspecting semiconductor packages in-tray in which the inspection time required to inspect the semiconductor packages accommodated in trays according to the semiconductor packages during the in-tray inspection for the semiconductor packages is shortened and interference due to shadow generated by projected light beam is minimized so that efficiency and reliability can be improved.
  • a semiconductor device must be precisely inspected before shipping after being manufactured by a manufacturing process. If the internal part of the semiconductor device enclosed by a package is inferior or an external appearance thereof is slightly inferior, the inferiorities have a fatal effect on the semiconductor device. Since the external inferiorities such as the inferiority of leads of the semiconductor device may be generated during the assembly of a printed circuit board, the inspection for leads of the semiconductor such as a Quad Flat Package (QFP) is one of very important processes. Generally, the inspection for the external inferiority of the leads of the semiconductor packages is carried out by various visual inspection methods using a vision probe.
  • QFP Quad Flat Package
  • the inspection for the semiconductor packages there is an in-tray inspection method for inspecting the external appearance of the semiconductor packages that are accommodated in a tray.
  • the in-tray inspection method carries out the visual inspection for the semiconductor packages in the accommodated state as described above with the vision probe, time required for the visual inspection can be shortened in comparison to other inspection methods and the inspection efficiency can be also improved.
  • the in-tray inspection method for the semiconductor packages due to a light beam projected to the semiconductor package, a shadow may be generated on the circumference of the semiconductor. Moreover, if the shadow is generated where the leads of the semiconductor package are located, it is impossible to obtain precise image information of the corresponding leads of the semiconductor package.
  • the height difference between the semiconductor package and the leads provided in the circumference of the semiconductor package and the height difference between partitions for defining accommodating grooves of the tray in which the semiconductor packages are accommodated and the semiconductor packages inserted into the accommodating grooves form steps on the circumferences of the semiconductor packages and the accommodating grooves.
  • the vision inspection is carried out by the in-tray inspection method, the vision inspection is carried out by arranging the vision probe to capture an image of the object side of the semiconductor package in the direction where the shadow is not generated by the light beam projected to the object side.
  • the vision probe when the vision probe is fixed in a predetermined direction to carry out the visual inspection for the semiconductor packages, since the arranging direction of the leads of the semiconductor packages is changed according to types of the semiconductor packages to be inspected, for example, since the leads are arranged in the lateral direction of the semiconductor packages in TSOPl (Thin Small Outline Package 1) , in the longitudinal direction in TS0P2 (Thin Small Outline Package 2) differently from TSOPl, and in the circumference of the semiconductor package in the QFP, it is actually impossible to carry out the vision inspection for various types of semiconductor packages using a single inspection apparatus.
  • TSOPl Thin Small Outline Package 1
  • TS0P2 Thin Small Outline Package 2
  • the present invention has been made in view of the above problems, and it is an object of the present invention to provide an in-tray inspection apparatus in which, when the in-tray inspection for semiconductor packages is carried out by a single inspection apparatus, the inspection time is reduced according to types of the semiconductor packages that are accommodated in trays and interference caused by shadow that is generated by a projected light beam is minimized so that efficiency and reliability of the inspection can be enhanced.
  • an in-tray inspection apparatus of a semiconductor package including first and second vision probes installed on transfer paths of a tray in which a semiconductor package is accommodated, and a central controller for comparing image information of the semiconductor package obtained by the first and second vision probes with reference image information about a semiconductor package in a corresponding lot to analyze and determine whether or not the semiconductor package is inferior, wherein the first vision probe is arranged in the same direction as the direction of rails on which the tray is transferred, and the second vision probe is arranged at a predetermined angle with respect to the first vision probe.
  • the second vision probe for taking a photograph of the external appearance of the semiconductor package is arranged at a predetermined angle with respect to the first vision probe arranged in the same direction as the direction of rails.
  • the most important inspection among the items of the semiconductor package to be inspected that is, the inspection of the external appearance of the leads and the inferiority inspection such as the inspection of the marking state, and whether or not foreign substance exists are carried out by a single inspection apparatus, time required for the inspection can be reduced and the efficiency thereof can be enhanced.
  • an in-tray inspection method of inspecting an external appearance of a semiconductor package accommodated in a tray including obtaining first image information about external appearances of semiconductor packages accommodated in the tray using image information that is inputted from a first vision probe arranged in the same direction as the direction of rails on which the tray is transferred, comparing the obtained first image information with stored first reference information about a corresponding semiconductor package to analyze and determine whether or not the semiconductor package is inferior, obtaining second image information about the external appearances of the semiconductor packages accommodated in the tray using the image information inputted from a second vision probe that is arranged at an angle with respect to the first vision probe, and comparing the obtained second image information with stored second reference information about the corresponding semiconductor package to analyze and determine whether or not the semiconductor package is inferior.
  • Fig. 1 is a schematic view illustrating an inspection apparatus according to a preferred embodiment of the present invention
  • Fig. 2 is a view illustrating arrangement of a vision probe of the inspection apparatus according to the preferred embodiment of the present invention.
  • Fig. 3 is a flowchart illustrating an in-tray inspection method according to the preferred embodiment of the present invention.
  • Fig. 1 is a schematic view illustrating an inspection apparatus according to a preferred embodiment of the present invention
  • Fig. 2 is a view illustrating arrangement of a vision probe of the inspection apparatus according to the preferred embodiment of the present invention.
  • the in-tray inspection apparatus includes an inspector 30 installed on traveling path of a tray for accommodating a semiconductor package (hereinafter referred to as an "object to be inspected") to take a picture of an external appearance of the object, and a central controller (not shown) for comparing image information of the object obtained by the inspector 30 with reference image information of the object in a corresponding lot to determine whether or not the object is defective.
  • an inspector 30 installed on traveling path of a tray for accommodating a semiconductor package (hereinafter referred to as an "object to be inspected") to take a picture of an external appearance of the object
  • a central controller not shown
  • the in-tray inspection apparatus includes a main body 10, a loading unit 21 on which trays for accommodating the objects to be inspected are loaded, a buffer 25 for temporarily accommodating a buffer tray T3 which accommodates the semiconductor packages for which the inspection has been completed, an inferior goods storage 23 on which inferior goods trays Tl for accommodating semiconductor packages determined as inferior goods are loaded, and an unloading unit 24 on which unloading trays T2 for accommodating semiconductor packages determined as normal goods as a result of the inspection are loaded.
  • the in-tray inspection apparatus further includes a tray transfer 40 including feeders 41 that are respectively connected to the loading unit 21, the buffer 25, the inferior goods storage 23, and the unloading unit 24 to move the tray loaded thereon forward and backward and rails 42 through which the feeders 41 move forward and backward on the main body, a transfer 50 reciprocally installed on the main body to transfer the tray between the loading unit 21, the buffer 25, the inferior goods storage 23, and the tray transfer 40 of the unloading unit 24, and a sorter 60 for picking up the inferior goods from the semiconductor packages, accommodated in the unloading tray T2 that is transferred to the unloading unit 24, and moving them to the inferior tray Tl, and for picking up the normal goods from the semiconductor packages accommodated in a buffer tray T3 and putting the same to the empty place from which the inferior goods are removed.
  • a tray transfer 40 including feeders 41 that are respectively connected to the loading unit 21, the buffer 25, the inferior goods storage 23, and the unloading unit 24 to move the tray loaded thereon forward and backward and rails 42 through which the feeders 41 move
  • the in-tray inspection apparatus includes an empty tray unit 22 for loading and accommodating an empty tray to supply a new tray to the tray transfer 40 that is connected to the inferior goods storage 23.
  • the in-tray inspection apparatus further includes an empty tray storage 26 provided in front of the buffer 25 such that the buffer trays T3 in which the semiconductor packages are completely sorted and processed are loaded.
  • the in-tray inspection apparatus constructed as described above sorts and unloads the objects in which the inspection has been completed, based on whether or not the objects are inferior, by the central controller.
  • the central controller compares two-dimensional image information and three- dimensional image information extracted from image information that is inputted from the inspector 30 with the stored reference image information to determine whether or not the corresponding object is inferior, and sorts the corresponding objects into an inferior goods tray Tl or an unloading tray T2 by controlling the sorter 60 according to the determination to unload the corresponding objects.
  • the inspector 30 for taking a photograph of the external appearance of the object includes the vision probe for inspecting the external appearance of the semiconductor packages.
  • the vision probe includes a first vision probe 31 and a second vision probe 32.
  • the first and second vision probes 31 and 32 for taking a photograph of the external appearance of the object can optionally or alternately take a photograph of a grid-shaped image or a surface image of the object according to a predetermined signal. Since the first and second vision probes for taking a photograph of the external appearance of the object are described in detail in Korean Patent No. 10- 449175 that is filed by the present applicant and is now patented, a detailed description of the structure and operation of the first and second vision probes will be omitted.
  • the vision probe 31 is arranged at a side of the loading unit 21 to take a photograph of the external appearance of the semiconductor packages accommodated in the tray that is transferred from the loading unit 21.
  • the first vision probe 31 is arranged in front of or at rear side of the object, that is, in the same direction as the direction where the object is transferred, to take a photograph of the upper side of the object P that is accommodated in the tray.
  • the second vision probe 32 is arranged at a place before the tray is transferred to the sorter 60, and according to the aspect of the present invention, is arranged to rotate at a predetermined angle with respect to the first vision probe 31. In other words, as shown in FIG. 2b, the second vision probe 32 is rotated at the predetermined angle with respect to the first vision probe 31.
  • the first and second vision probes 31 and 32 are arranged at the predetermined angle, therefore, the inspection for the external appearance of a Gull-Wing type of the object can be carried out by a single inspection apparatus.
  • the image information of the leads can be obtained by the first vision probe 31 provided in front of or at the rear upper side of the object P.
  • the first vision probe 31 since the first vision probe 31 is arranged perpendicular to the leads of the object P, the leads are not covered by the shadow due to the light beam projected from the first vision probe 31 when taking a photograph of the lead region of the object.
  • precise image information of the object can be obtained by the first vision probe 31.
  • the first vision probe 31 alternately takes a photograph of the grid-shaped image of the leads of the object P and the surface image of the pitch between the leads (hereinafter referred to as ⁇ 3D/2D' for the convenience) .
  • the in-tray inspection apparatus obtains the image information of the respective leads, required to analyze whether or not the leads installed in the object are inferior, by the first vision probe.
  • the second vision probe 32 is arranged at the predetermined angle with respect to the first vision probe 31 such that the second vision probe 32 takes a photograph of a surface image of the surface of the object that is accommodated in the tray, such as the printed marking state, or the surface image of the object so as to inspect the leads and the pins (hereinafter referred to as ⁇ 2D' for the convenience) .
  • the in-tray inspection apparatus obtains the 3D/2D information about the leads of the object by the first vision probe 31 so that the second vision probe 32 takes a photograph of the 2D other than the lead inspection.
  • the second vision probe 32 arranged at the predetermined angle with respect to the first vision probe 31, is preferably arranged at a side of both sides of the object perpendicular to the first vision probe 31.
  • the second vision probe 32 obtains the 3D/2D information of the TSOPl.
  • the second vision probe 32 is arranged perpendicular to the leads of the object P.
  • the second vision probe 32 can obtain the precise 3D/2D information of the object P.
  • the first vision probe 31 different from the case of the TS0P2 type, takes a photograph of the 2D about the surface of the object P that is accommodated in the tray.
  • the in-tray inspection apparatus obtains the 3D/2D information about the leads of the object using the second vision probe 32 so that the 2D information of the object P, required for other inspection other than the lead inspection by the first vision probe 31 that is performed before the inspection by the second vision probe 32, are obtained.
  • the first vision probe 31 and the second vision probe 32 obtain the 3D/2D information of the leads formed at both sides and at front and rear sides of the object P and the 2D information of the object P.
  • the leads formed at the lateral sides of the object P are arranged perpendicular to the first vision probe 31 and the second vision probe 32 is arranged in the same direction as the direction where the lateral leads are arranged, the 3D/2D with respect to the lateral leads and the 2D with respect to the surface are captured by the first vision probe 31.
  • the leads are formed in the front and rear sides of the object P, the front and rear leads are arranged perpendicular to the second vision probe 32 while the first vision probe 31 is arranged in the same direction as the direction where the front and rear leads are arranged, the 3D/2D with respect to the front and rear leads and the 2D with respect to the surface are captured by the second vision probe 32.
  • the in-tray inspection apparatus obtains the 3D/2D information about the lateral sides of the object by the first vision probe and the 3D/2D information about the front and rear sides of the object by the second vision probe, so that the in-tray inspection for the QFP type can be carried out.
  • the central controller obtains three-dimensional shape information and two-dimensional shape information about the leads of the object and two- dimensional shape information about the surface of the object, from the 3D/2D information and the 2D information which are inputted from the first vision probe 31 and the second vision probe 32.
  • the obtained three-dimensional shape information about the leads contains information about the height of the leads used to analyze how much the leads are bent.
  • the two-dimensional shape information about the leads contains the interval information between the leads, that is, the pitch information.
  • the two-dimensional shape information about the surface of the object contains the marking information printed on the surface of the object, and various surface information required to check whether foreign substance exists or not.
  • the central controller compares the obtained shape information of the object with the reference image information of an object in the corresponding lot to determine whether or not the semiconductor package is inferior and sorts the corresponding object into an inferior tray or a normal tray according to the determination result.
  • the in-tray inspection apparatus since the capturing mode of the first and second vision probes that are arranged at the predetermined angle can be adjusted according to the types of the objects, the in-tray inspection apparatus according to the preferred embodiment of the present invention can effectively obtain various image information required for the inspection so that the inspection time for the object to be inspected can be reduced.
  • the capturing mode of the first and second vision probes can be adjusted, images of the corresponding object are effectively distributed to take a photograph according to the types of the object to be inspected during the in-tray inspection so that the inspection time for the object can be reduced and the efficiency for the inspection can be enhanced.
  • the utility of the in-tray inspection apparatus can be enhanced.
  • the first and second vision probes whose capturing modes are determined by the types of the objects during the in-tray inspection, more precise 3D/2D information of the objects is obtained such that the inference by the shadow is minimized, so that the reliability of the in-tray inspection can be enhanced.
  • Fig. 3 is a flowchart illustrating an in-tray inspection method according to the preferred embodiment of the present invention.
  • the vision inspection method according to the preferred embodiment of the present invention is an in-tray inspection method of inspecting the external appearance of the object at a state that the objects are accommodated in the tray, and obtains first image information of the external appearance of the corresponding object using the captured information inputted from the first vision probe 31 (SlOO) .
  • the first vision probe 31 is arranged in the same direction as the direction of rails on which the tray is transferred, and optionally or alternately takes a photograph of 3D/2D or 2D of the object through a lens according to a predetermined signal.
  • the first vision probe 31 is set to a 3D/2D capturing mode with respect to the object P.
  • the object P is the TSOPl type
  • the ' first vision probe 31 is set to a 2D capturing mode with respect to the object P.
  • the first vision probe 31 is alternately set to the 3D/2D capturing mode with respect to the both sides of the object P and the 2D capturing mode with respect to the object.
  • the first vision probe is arranged perpendicular to a short side of the object and in the same direction as the direction of the long side of the object.
  • the object is the TSOP2 type
  • the first vision probe is arranged perpendicular to the leads so that the images for the 3D/2D can be more precisely captured.
  • the first vision probe is arranged at the short sides of the object, that is, the front and rear sides of the object.
  • the first vision probe projects the light beam, shadows generated by the semiconductor packages and partitions formed around the accommodating grooves in which the semiconductor packages are accommodated are generated in front or rear side of the transferring direction of the objects so that the interference with the leads formed at the lateral sides of the object due to the shadows is minimized to enable to take a photograph of a more precise image of 3D/2D.
  • the object is the TSOPl type
  • the leads are arranged in the same direction as the direction of the first vision probe, when the image of the 3D/2D is captured by the first vision probe in this arrangement, shadows are generated at the place where the leads are formed by the light beam projected from the first vision probe so that it is difficult to take a precise photograph of the 3D/2D.
  • the first vision probe takes a photograph of the 2D of the object.
  • the first vision probe takes a photograph of the 3D/2D with respect to the lateral sides of the objects and the second vision probe takes a photograph of the 3D/2D of the front and rear sides of the objects.
  • the image information inputted from the first vision probe is different to each other according to the types of the objects.
  • the image information inputted from the first vision probe is the 2D information of the object.
  • the image information inputted from the first vision probe is the 3D/2D information of the lateral sides of the object and the 2D information of the object.
  • the first image information of the object is extracted from the inputted image information.
  • the central controller when the inputted image information is the 3D information of the object, applies a bucket algorithm to the grid-shaped image obtained from the first vision probe to obtain an object phase of the object.
  • the central controller extracts a moire phase of the leads of the corresponding object using the obtained object phase and a stored reference phase of the object, and unwraps the moire phase to obtain actual height information of the leads of the object, that is, three-dimensional image information of a specific object.
  • the central controller obtains the pitch information of the leads from the inputted image information, that is, the two-dimensional information of the leads.
  • the central controller obtains the surface information of the object such as state information of the marking printed on the surface of the object or whether or not foreign substance exists, that is, the two-dimensional image information about the surface of the object from the image information inputted from the first vision probe.
  • the central controller compares the obtained first image information with the stored reference information of the first image of the corresponding object to determine whether or not the corresponding object is inferior (S200) .
  • the central controller obtains second image information about the external appearance of the corresponding object using the captured information inputted from the second vision probe 32 (S300) .
  • the second vision probe 32 is arranged at the predetermined angle with respect to the first vision probe 31.
  • the second vision probe 32 is arranged at a right angle with respect to the first vision probe 31.
  • the second vision probe 32, arranged at a right angle with respect to the first vision probe 31 is the same as the first vision probe 31, and optionally or alternately takes a photograph of the 3D/2D or the 2D with respect to the object through the lens according to the predetermined signal as described above.
  • the second vision probe is arranged at a right angle with respect to the first vision probe, the capturing mode thereof is reverse to the case of the first vision probe.
  • the second vision probe 32 is set to the 3D/2D capturing mode of the object P.
  • the second vision probe 32 is set to the 2D capturing mode of the object P.
  • the second vision probe 32 is alternately set to the 3D/2D capturing mode of the front and rear sides of the object and the 2D capturing mode of the object.
  • the image information inputted from the second vision probe 32 is the 3D/2D information about the object P. If the object P is the TS0P2 type, the image information inputted from the second vision probe 32 is the 2D information about the object. If the object P is the QFP type, the image information inputted from the second vision probe 32 is the 3D/2D information about the front and rear sides of the object and the 2D information about the object.
  • the second image information about the corresponding object is extracted using the inputted image information. Since the extracting process of the second image information is identical to the extracting process of the first image information, a detailed description thereof will be omitted.
  • the central controller compares the obtained second image information with a stored reference information about the corresponding object to determine whether or not the corresponding object is inferior (S400) .
  • the capturing modes of the first and second vision probes for taking a photograph of the external appearance of the semiconductor package are adjustable, so that the image of the corresponding object is effectively distributed and captured according to the type of the object to be inspected during the in-tray inspection. Therefore, the inspection time for the object can be reduced and the inspection efficiency can be enhanced.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The present invention relates to an apparatus and a method for inspecting external appearances of semiconductor packages, and more particularly to an in-tray apparatus for inspecting semiconductor packages to reduce the inspection time of the semiconductor packages in trays according to the semiconductor packages during the in-tray inspection and to minimize interference of shadow due to projected light beam so that efficiency and reliability are improved. The apparatus includes first and second vision probes on transfer paths of a tray accommodating semiconductor packages, and a central controller comparing image information obtained by the vision probes with reference image information about a semiconductor package in a corresponding lot to analyze and determine whether or not the semiconductor package is inferior. The first vision probe is aligned with rails on which the tray is transferred, and the second vision probe is arranged at a predetermined angle to the first vision probe.

Description

IN-TRAY INSPECTION APPARATUS AND METHOD OF SEMICONDUCTOR PACKAGE
BACKGROUND OF THE INVENTION
Field of the Invention
The present invention relates to an apparatus and a method for inspecting an external appearance of a semiconductor package, and more particularly to an apparatus for inspecting semiconductor packages in-tray in which the inspection time required to inspect the semiconductor packages accommodated in trays according to the semiconductor packages during the in-tray inspection for the semiconductor packages is shortened and interference due to shadow generated by projected light beam is minimized so that efficiency and reliability can be improved.
Description of the Related Art
A semiconductor device must be precisely inspected before shipping after being manufactured by a manufacturing process. If the internal part of the semiconductor device enclosed by a package is inferior or an external appearance thereof is slightly inferior, the inferiorities have a fatal effect on the semiconductor device. Since the external inferiorities such as the inferiority of leads of the semiconductor device may be generated during the assembly of a printed circuit board, the inspection for leads of the semiconductor such as a Quad Flat Package (QFP) is one of very important processes. Generally, the inspection for the external inferiority of the leads of the semiconductor packages is carried out by various visual inspection methods using a vision probe.
For example, as the inspection for the semiconductor packages, there is an in-tray inspection method for inspecting the external appearance of the semiconductor packages that are accommodated in a tray.
Since the in-tray inspection method carries out the visual inspection for the semiconductor packages in the accommodated state as described above with the vision probe, time required for the visual inspection can be shortened in comparison to other inspection methods and the inspection efficiency can be also improved.
However, in the in-tray inspection method for the semiconductor packages, due to a light beam projected to the semiconductor package, a shadow may be generated on the circumference of the semiconductor. Moreover, if the shadow is generated where the leads of the semiconductor package are located, it is impossible to obtain precise image information of the corresponding leads of the semiconductor package. In other words, when the semiconductor packages are accommodated in the tray, due to the structures of the tray and the semiconductor packages, the height difference between the semiconductor package and the leads provided in the circumference of the semiconductor package and the height difference between partitions for defining accommodating grooves of the tray in which the semiconductor packages are accommodated and the semiconductor packages inserted into the accommodating grooves form steps on the circumferences of the semiconductor packages and the accommodating grooves.
Thus, in the in-try inspection method, since a shadow is generated due to the step on the circumference of the semiconductor package when a light beam is projected to an object side of the semiconductor package for the visual inspection, the precise image information of the area where the shadow is generated cannot be obtained.
Therefore, when the vision inspection for the semiconductor packages is carried out by the in-tray inspection method, the vision inspection is carried out by arranging the vision probe to capture an image of the object side of the semiconductor package in the direction where the shadow is not generated by the light beam projected to the object side.
However, as described above, when the vision probe is fixed in a predetermined direction to carry out the visual inspection for the semiconductor packages, since the arranging direction of the leads of the semiconductor packages is changed according to types of the semiconductor packages to be inspected, for example, since the leads are arranged in the lateral direction of the semiconductor packages in TSOPl (Thin Small Outline Package 1) , in the longitudinal direction in TS0P2 (Thin Small Outline Package 2) differently from TSOPl, and in the circumference of the semiconductor package in the QFP, it is actually impossible to carry out the vision inspection for various types of semiconductor packages using a single inspection apparatus.
Thus, it is inconvenient to use specific inspection apparatuses whose a vision probe is fixed in a direction required for respective types of semiconductor packages. Moreover, since an additional inspection apparatus having the same inspection function must be purchased, operation expenses are increased.
SUMMARY OF THE INVENTION
Therefore, the present invention has been made in view of the above problems, and it is an object of the present invention to provide an in-tray inspection apparatus in which, when the in-tray inspection for semiconductor packages is carried out by a single inspection apparatus, the inspection time is reduced according to types of the semiconductor packages that are accommodated in trays and interference caused by shadow that is generated by a projected light beam is minimized so that efficiency and reliability of the inspection can be enhanced.
In accordance with an aspect of the present invention, the above and other objects can be accomplished by the provision of an in-tray inspection apparatus of a semiconductor package including first and second vision probes installed on transfer paths of a tray in which a semiconductor package is accommodated, and a central controller for comparing image information of the semiconductor package obtained by the first and second vision probes with reference image information about a semiconductor package in a corresponding lot to analyze and determine whether or not the semiconductor package is inferior, wherein the first vision probe is arranged in the same direction as the direction of rails on which the tray is transferred, and the second vision probe is arranged at a predetermined angle with respect to the first vision probe.
As described above, according to the in-tray inspection apparatus for semiconductor packages (hereinafter referred to as an λin-tray inspection apparatus' for the convenience) , the second vision probe for taking a photograph of the external appearance of the semiconductor package is arranged at a predetermined angle with respect to the first vision probe arranged in the same direction as the direction of rails. Thus, since more precise image of the object can be obtained during the in-tray inspection by minimizing the effect of the shadow that is generated by a light beam projected according to the type of semiconductor packages as the objects to be inspected, the reliability of the in-tray inspection can be enhanced.
Particularly, since the most important inspection among the items of the semiconductor package to be inspected, that is, the inspection of the external appearance of the leads and the inferiority inspection such as the inspection of the marking state, and whether or not foreign substance exists are carried out by a single inspection apparatus, time required for the inspection can be reduced and the efficiency thereof can be enhanced.
In accordance with another aspect of the present invention, the above and other objects can be accomplished by the provision of an in-tray inspection method of inspecting an external appearance of a semiconductor package accommodated in a tray, including obtaining first image information about external appearances of semiconductor packages accommodated in the tray using image information that is inputted from a first vision probe arranged in the same direction as the direction of rails on which the tray is transferred, comparing the obtained first image information with stored first reference information about a corresponding semiconductor package to analyze and determine whether or not the semiconductor package is inferior, obtaining second image information about the external appearances of the semiconductor packages accommodated in the tray using the image information inputted from a second vision probe that is arranged at an angle with respect to the first vision probe, and comparing the obtained second image information with stored second reference information about the corresponding semiconductor package to analyze and determine whether or not the semiconductor package is inferior.
BRIEF DESCRIPTION OF THE DRAWINGS
The above and other objects, features and other advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
Fig. 1 is a schematic view illustrating an inspection apparatus according to a preferred embodiment of the present invention;
Fig. 2 is a view illustrating arrangement of a vision probe of the inspection apparatus according to the preferred embodiment of the present invention; and
Fig. 3 is a flowchart illustrating an in-tray inspection method according to the preferred embodiment of the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings such that those skilled in the art can easily understand and implement the present invention.
Fig. 1 is a schematic view illustrating an inspection apparatus according to a preferred embodiment of the present invention, and Fig. 2 is a view illustrating arrangement of a vision probe of the inspection apparatus according to the preferred embodiment of the present invention.
As shown in FIG. 1, the in-tray inspection apparatus according to the preferred embodiment of the present invention includes an inspector 30 installed on traveling path of a tray for accommodating a semiconductor package (hereinafter referred to as an "object to be inspected") to take a picture of an external appearance of the object, and a central controller (not shown) for comparing image information of the object obtained by the inspector 30 with reference image information of the object in a corresponding lot to determine whether or not the object is defective. Moreover, the in-tray inspection apparatus according to the preferred embodiment of the present invention, as shown in the drawings, includes a main body 10, a loading unit 21 on which trays for accommodating the objects to be inspected are loaded, a buffer 25 for temporarily accommodating a buffer tray T3 which accommodates the semiconductor packages for which the inspection has been completed, an inferior goods storage 23 on which inferior goods trays Tl for accommodating semiconductor packages determined as inferior goods are loaded, and an unloading unit 24 on which unloading trays T2 for accommodating semiconductor packages determined as normal goods as a result of the inspection are loaded.
Moreover, the in-tray inspection apparatus further includes a tray transfer 40 including feeders 41 that are respectively connected to the loading unit 21, the buffer 25, the inferior goods storage 23, and the unloading unit 24 to move the tray loaded thereon forward and backward and rails 42 through which the feeders 41 move forward and backward on the main body, a transfer 50 reciprocally installed on the main body to transfer the tray between the loading unit 21, the buffer 25, the inferior goods storage 23, and the tray transfer 40 of the unloading unit 24, and a sorter 60 for picking up the inferior goods from the semiconductor packages, accommodated in the unloading tray T2 that is transferred to the unloading unit 24, and moving them to the inferior tray Tl, and for picking up the normal goods from the semiconductor packages accommodated in a buffer tray T3 and putting the same to the empty place from which the inferior goods are removed. Further the in-tray inspection apparatus according to the preferred embodiment of the present invention includes an empty tray unit 22 for loading and accommodating an empty tray to supply a new tray to the tray transfer 40 that is connected to the inferior goods storage 23. The in-tray inspection apparatus further includes an empty tray storage 26 provided in front of the buffer 25 such that the buffer trays T3 in which the semiconductor packages are completely sorted and processed are loaded. Thus, the in-tray inspection apparatus constructed as described above sorts and unloads the objects in which the inspection has been completed, based on whether or not the objects are inferior, by the central controller.
In other words, the central controller (not shown) compares two-dimensional image information and three- dimensional image information extracted from image information that is inputted from the inspector 30 with the stored reference image information to determine whether or not the corresponding object is inferior, and sorts the corresponding objects into an inferior goods tray Tl or an unloading tray T2 by controlling the sorter 60 according to the determination to unload the corresponding objects.
Meanwhile, according to an aspect of the present invention, the inspector 30 for taking a photograph of the external appearance of the object includes the vision probe for inspecting the external appearance of the semiconductor packages. The vision probe includes a first vision probe 31 and a second vision probe 32. In the preferred embodiment of the present invention, the first and second vision probes 31 and 32 for taking a photograph of the external appearance of the object can optionally or alternately take a photograph of a grid-shaped image or a surface image of the object according to a predetermined signal. Since the first and second vision probes for taking a photograph of the external appearance of the object are described in detail in Korean Patent No. 10- 449175 that is filed by the present applicant and is now patented, a detailed description of the structure and operation of the first and second vision probes will be omitted.
In the preferred embodiment of the present invention, the vision probe 31 is arranged at a side of the loading unit 21 to take a photograph of the external appearance of the semiconductor packages accommodated in the tray that is transferred from the loading unit 21. In other words, as shown in FIG. 2a, the first vision probe 31 is arranged in front of or at rear side of the object, that is, in the same direction as the direction where the object is transferred, to take a photograph of the upper side of the object P that is accommodated in the tray.
The second vision probe 32 is arranged at a place before the tray is transferred to the sorter 60, and according to the aspect of the present invention, is arranged to rotate at a predetermined angle with respect to the first vision probe 31. In other words, as shown in FIG. 2b, the second vision probe 32 is rotated at the predetermined angle with respect to the first vision probe 31.
As such, the first and second vision probes 31 and 32 are arranged at the predetermined angle, therefore, the inspection for the external appearance of a Gull-Wing type of the object can be carried out by a single inspection apparatus.
For example, if the object P is a TSOP2 type, the image information of the leads can be obtained by the first vision probe 31 provided in front of or at the rear upper side of the object P. In this embodiment, since the first vision probe 31 is arranged perpendicular to the leads of the object P, the leads are not covered by the shadow due to the light beam projected from the first vision probe 31 when taking a photograph of the lead region of the object. Thus, precise image information of the object can be obtained by the first vision probe 31. At this time, the first vision probe 31 alternately takes a photograph of the grid-shaped image of the leads of the object P and the surface image of the pitch between the leads (hereinafter referred to as λ3D/2D' for the convenience) .
By doing so, the in-tray inspection apparatus according to the preferred embodiment of the present invention obtains the image information of the respective leads, required to analyze whether or not the leads installed in the object are inferior, by the first vision probe.
In this preferred embodiment of the present invention, the second vision probe 32, as described above, is arranged at the predetermined angle with respect to the first vision probe 31 such that the second vision probe 32 takes a photograph of a surface image of the surface of the object that is accommodated in the tray, such as the printed marking state, or the surface image of the object so as to inspect the leads and the pins (hereinafter referred to as λ2D' for the convenience) .
In other words, if the object is the TSOP2 type, the in-tray inspection apparatus according to the preferred embodiment of the present invention obtains the 3D/2D information about the leads of the object by the first vision probe 31 so that the second vision probe 32 takes a photograph of the 2D other than the lead inspection.
At this time, the second vision probe 32, arranged at the predetermined angle with respect to the first vision probe 31, is preferably arranged at a side of both sides of the object perpendicular to the first vision probe 31.
If the object is a TSOPl type, since the leads of the TSOPl are formed perpendicular to the leads of the TS0P2, the second vision probe 32 obtains the 3D/2D information of the TSOPl.
In other words, if the object P is the TSOPl type, the second vision probe 32 is arranged perpendicular to the leads of the object P. Thus, since, when taking a photograph of the lead region of the object, the leads are not covered by the shadow due to the light beam projected from the second vision probe 32, the second vision probe 32 can obtain the precise 3D/2D information of the object P.
Thus, in this embodiment, the first vision probe 31, different from the case of the TS0P2 type, takes a photograph of the 2D about the surface of the object P that is accommodated in the tray.
Therefore, when the object P is the TSOPl type, the in-tray inspection apparatus according to the preferred embodiment of the present invention obtains the 3D/2D information about the leads of the object using the second vision probe 32 so that the 2D information of the object P, required for other inspection other than the lead inspection by the first vision probe 31 that is performed before the inspection by the second vision probe 32, are obtained.
In other embodiment, if the object P is QFP type, as shown in FIG. 2c, since the leads are formed on the circumference of the object P, the first vision probe 31 and the second vision probe 32 obtain the 3D/2D information of the leads formed at both sides and at front and rear sides of the object P and the 2D information of the object P.
In other words, in this embodiment, since the leads formed at the lateral sides of the object P are arranged perpendicular to the first vision probe 31 and the second vision probe 32 is arranged in the same direction as the direction where the lateral leads are arranged, the 3D/2D with respect to the lateral leads and the 2D with respect to the surface are captured by the first vision probe 31. On the contrary, when the leads are formed in the front and rear sides of the object P, the front and rear leads are arranged perpendicular to the second vision probe 32 while the first vision probe 31 is arranged in the same direction as the direction where the front and rear leads are arranged, the 3D/2D with respect to the front and rear leads and the 2D with respect to the surface are captured by the second vision probe 32.
As such, in the case of the QFP type whose leads are formed on the circumference thereof, the in-tray inspection apparatus according to the preferred embodiment of the present invention obtains the 3D/2D information about the lateral sides of the object by the first vision probe and the 3D/2D information about the front and rear sides of the object by the second vision probe, so that the in-tray inspection for the QFP type can be carried out.
Meanwhile, the central controller (not shown) obtains three-dimensional shape information and two-dimensional shape information about the leads of the object and two- dimensional shape information about the surface of the object, from the 3D/2D information and the 2D information which are inputted from the first vision probe 31 and the second vision probe 32. The obtained three-dimensional shape information about the leads contains information about the height of the leads used to analyze how much the leads are bent. Moreover, the two-dimensional shape information about the leads contains the interval information between the leads, that is, the pitch information. The two-dimensional shape information about the surface of the object contains the marking information printed on the surface of the object, and various surface information required to check whether foreign substance exists or not.
The technology for obtaining two-dimensional image information and three-dimensional image information of the corresponding object from the image information inputted from the vision probes will be described in detail when describing the following in-tray inspection method.
Moreover, the central controller compares the obtained shape information of the object with the reference image information of an object in the corresponding lot to determine whether or not the semiconductor package is inferior and sorts the corresponding object into an inferior tray or a normal tray according to the determination result.
Thus, since the capturing mode of the first and second vision probes that are arranged at the predetermined angle can be adjusted according to the types of the objects, the in-tray inspection apparatus according to the preferred embodiment of the present invention can effectively obtain various image information required for the inspection so that the inspection time for the object to be inspected can be reduced.
In other words, since the capturing mode of the first and second vision probes can be adjusted, images of the corresponding object are effectively distributed to take a photograph according to the types of the object to be inspected during the in-tray inspection so that the inspection time for the object can be reduced and the efficiency for the inspection can be enhanced. Thus, since a single apparatus can be used in general purpose for different types of semiconductor packages, the utility of the in-tray inspection apparatus can be enhanced.
Moreover, due to the first and second vision probes whose capturing modes are determined by the types of the objects during the in-tray inspection, more precise 3D/2D information of the objects is obtained such that the inference by the shadow is minimized, so that the reliability of the in-tray inspection can be enhanced.
Hereinafter, the in-tray inspection method for a semiconductor package using in-tray inspection apparatus according to the preferred embodiment of the present invention will be described with reference to FIGS. 1 to 3.
Fig. 3 is a flowchart illustrating an in-tray inspection method according to the preferred embodiment of the present invention. Prior to the description, it is assumed that the objects accommodated in the tray are arranged such that the long sides of the objects are arranged in the direction where the tray is transferred. The vision inspection method according to the preferred embodiment of the present invention is an in-tray inspection method of inspecting the external appearance of the object at a state that the objects are accommodated in the tray, and obtains first image information of the external appearance of the corresponding object using the captured information inputted from the first vision probe 31 (SlOO) .
At this time, the first vision probe 31 is arranged in the same direction as the direction of rails on which the tray is transferred, and optionally or alternately takes a photograph of 3D/2D or 2D of the object through a lens according to a predetermined signal.
For example, if the object P accommodated in the tray is the TSOP2 type, in the preferred embodiment of the present invention, the first vision probe 31 is set to a 3D/2D capturing mode with respect to the object P. In another embodiment of the present invention, if the object P is the TSOPl type, the' first vision probe 31 is set to a 2D capturing mode with respect to the object P. In still another embodiment of the present invention, if the object P is the QFP type, the first vision probe 31 is alternately set to the 3D/2D capturing mode with respect to the both sides of the object P and the 2D capturing mode with respect to the object.
In other words, the first vision probe is arranged perpendicular to a short side of the object and in the same direction as the direction of the long side of the object. Thus, if the object is the TSOP2 type, the first vision probe is arranged perpendicular to the leads so that the images for the 3D/2D can be more precisely captured.
In more detail, the first vision probe is arranged at the short sides of the object, that is, the front and rear sides of the object. Thus, since when the first vision probe projects the light beam, shadows generated by the semiconductor packages and partitions formed around the accommodating grooves in which the semiconductor packages are accommodated are generated in front or rear side of the transferring direction of the objects so that the interference with the leads formed at the lateral sides of the object due to the shadows is minimized to enable to take a photograph of a more precise image of 3D/2D.
On the other hand, if the object is the TSOPl type, since the leads are arranged in the same direction as the direction of the first vision probe, when the image of the 3D/2D is captured by the first vision probe in this arrangement, shadows are generated at the place where the leads are formed by the light beam projected from the first vision probe so that it is difficult to take a precise photograph of the 3D/2D.
Thus, if the object is the TSOP2 type, the first vision probe takes a photograph of the 2D of the object.
If the object is the QFP type, due to the features of the objects as described above, the first vision probe takes a photograph of the 3D/2D with respect to the lateral sides of the objects and the second vision probe takes a photograph of the 3D/2D of the front and rear sides of the objects. Thus, the image information inputted from the first vision probe is different to each other according to the types of the objects. In other words, if the object is the TSOP2 type, the image information inputted from the first vision probe is the 2D information of the object. If the object is the QFP type, the image information inputted from the first vision probe is the 3D/2D information of the lateral sides of the object and the 2D information of the object. As such, when the image information is inputted from the first vision probe, the first image information of the object is extracted from the inputted image information.
In other words, when the inputted image information is the 3D information of the object, the central controller applies a bucket algorithm to the grid-shaped image obtained from the first vision probe to obtain an object phase of the object. The central controller extracts a moire phase of the leads of the corresponding object using the obtained object phase and a stored reference phase of the object, and unwraps the moire phase to obtain actual height information of the leads of the object, that is, three-dimensional image information of a specific object.
When the inputted image information is the 2D information of the ,lead of the object, the central controller obtains the pitch information of the leads from the inputted image information, that is, the two-dimensional information of the leads.
However, when the inputted image information is the 2D information of the surface of the object, the central controller obtains the surface information of the object such as state information of the marking printed on the surface of the object or whether or not foreign substance exists, that is, the two-dimensional image information about the surface of the object from the image information inputted from the first vision probe.
Meanwhile, after obtaining the first image information about the corresponding object from the image information captured by the first vision probe 31, the central controller compares the obtained first image information with the stored reference information of the first image of the corresponding object to determine whether or not the corresponding object is inferior (S200) .
Next, the central controller obtains second image information about the external appearance of the corresponding object using the captured information inputted from the second vision probe 32 (S300) .
At this time, the second vision probe 32 is arranged at the predetermined angle with respect to the first vision probe 31. In the preferred embodiment of the present invention, the second vision probe 32 is arranged at a right angle with respect to the first vision probe 31. As such, the second vision probe 32, arranged at a right angle with respect to the first vision probe 31, is the same as the first vision probe 31, and optionally or alternately takes a photograph of the 3D/2D or the 2D with respect to the object through the lens according to the predetermined signal as described above. Thus, since the second vision probe is arranged at a right angle with respect to the first vision probe, the capturing mode thereof is reverse to the case of the first vision probe.
For example, if the object P accommodated in the tray is the TSOPl type, in an embodiment of the present invention, the second vision probe 32 is set to the 3D/2D capturing mode of the object P. In another embodiment of the present invention, if the object P is the TSOP2 type, the second vision probe 32 is set to the 2D capturing mode of the object P. Moreover, in still another embodiment of the present invention, if the object P is the QFP type, the second vision probe 32 is alternately set to the 3D/2D capturing mode of the front and rear sides of the object and the 2D capturing mode of the object. Thus, the image information, inputted from the second vision probe 32, is different from each other according to the types of the objects. In other words, if the object is the TSOPl type, the image information inputted from the second vision probe 32 is the 3D/2D information about the object P. If the object P is the TS0P2 type, the image information inputted from the second vision probe 32 is the 2D information about the object. If the object P is the QFP type, the image information inputted from the second vision probe 32 is the 3D/2D information about the front and rear sides of the object and the 2D information about the object.
As such, when the image information is inputted from the second vision probe 32, the second image information about the corresponding object is extracted using the inputted image information. Since the extracting process of the second image information is identical to the extracting process of the first image information, a detailed description thereof will be omitted.
Meanwhile, after obtaining the first image information about the corresponding object from the image information captured by the second vision probe, the central controller compares the obtained second image information with a stored reference information about the corresponding object to determine whether or not the corresponding object is inferior (S400) .
As described above, according to the in-tray inspection apparatus for semiconductor packages and the in-tray inspection method thereof, the capturing modes of the first and second vision probes for taking a photograph of the external appearance of the semiconductor package are adjustable, so that the image of the corresponding object is effectively distributed and captured according to the type of the object to be inspected during the in-tray inspection. Therefore, the inspection time for the object can be reduced and the inspection efficiency can be enhanced.
Moreover, more precise image information about the leads of the object is obtained, in the direction where the interference due to shadows is minimized by the first and second vision probes whose capturing modes are set according to the types of the object during the in-tray inspection, so that the reliability of the in-tray inspection can be enhanced.
Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.

Claims

WHAT IS CLAIMED IS:
1. An in-tray inspection apparatus of a semiconductor package comprising: first and second vision probes installed on transfer paths of a tray in which a semiconductor package is accommodated; and a central controller for comparing image information of the semiconductor package obtained by the first and second vision probes with reference image information about a semiconductor package in a corresponding lot to analyze and determine whether or not the semiconductor package is inferior, wherein the first vision probe is arranged in the same direction as the direction of rails on which the tray is transferred, and
the second vision probe is arranged at a predetermined angle with respect to the first vision probe.
2. The in-tray inspection apparatus according to claim 1, wherein the second vision probe is arranged at a right angle with respect to the first vision probe.
3. The in-tray inspection apparatus according to claims 1 or 2, wherein the first and second vision probes optionally or alternately take a photograph of a grid-shaped image of the semiconductor package or a surface image of the semiconductor package through lenses thereof.
4. The in-tray inspection apparatus according to claim 3, wherein when the semiconductor package is a TS0P2 type, the first vision probe alternately takes a photograph of the grid-shaped image and the surface image, and the second vision probe takes a photograph of the surface image.
5. The in-tray inspection apparatus according to claim 3, wherein when the semiconductor package a TSOPl type, the first vision probe takes a photograph of the surface image, and the second vision probe alternately takes a photograph of the grid-shaped image and the surface image.
6. The in-tray inspection apparatus according to claim 3, wherein when the semiconductor package is a QFP type, the first and second vision probes alternately take a photograph of the grid-shaped image and the surface image.
7. An in-tray inspection method of inspecting an external appearance of a semiconductor package accommodated in a tray, comprising: obtaining first image information about external appearances of semiconductor packages accommodated in the tray using image information that is inputted from a first vision probe arranged in the same direction as the direction of rails on which the tray is transferred; comparing the obtained first image information with stored first reference information about a corresponding semiconductor package to analyze and determine whether or not the semiconductor package is inferior; obtaining second image information about the external appearances of the semiconductor packages accommodated in the tray using the image information inputted from a second vision probe that is arranged at an angle with respect to the first vision probe; and
comparing the obtained second image information with stored second reference information about the corresponding semiconductor package to analyze and determine whether or not the semiconductor package is inferior.
8. The in-tray inspection method according to claim 7, wherein the second vision probe is arranged at a right angle with respect to the first vision probe.
9. The in-tray inspection method according to claims 7 or 8, wherein the first and second vision probes optionally or alternately take a photograph of a grid-shaped image of the semiconductor package or a surface image of the semiconductor package through lenses thereof.
10. The in-tray inspection method according to claim 9, wherein when the semiconductor package is a TSOP2 type, the image information inputted from the first vision probe is grid-shaped image information and surface image information about the semiconductor package, and the image information inputted from the second vision probe is surface image information about the semiconductor package.
11. The in-tray inspection method according to claim 9, wherein when the semiconductor package a TSOPl type, the image information inputted from the first vision probe is surface image information about the semiconductor package and the image information inputted from the second vision probe is grid-shaped image information and the surface image information about the semiconductor package.
12. The in-tray inspection method according to claim 9, wherein when the semiconductor package is a QFP type, the image information inputted from the first and second vision probes is grid-shaped image information and the surface image information about the semiconductor package.
PCT/KR2006/002173 2005-06-07 2006-06-07 In-tray inspection apparatus and method of semiconductor package WO2006132490A1 (en)

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