TWI578871B - The manufacturing method of laminates - Google Patents

The manufacturing method of laminates Download PDF

Info

Publication number
TWI578871B
TWI578871B TW100127223A TW100127223A TWI578871B TW I578871 B TWI578871 B TW I578871B TW 100127223 A TW100127223 A TW 100127223A TW 100127223 A TW100127223 A TW 100127223A TW I578871 B TWI578871 B TW I578871B
Authority
TW
Taiwan
Prior art keywords
prepreg
insulating layer
producing
laminate according
layer
Prior art date
Application number
TW100127223A
Other languages
English (en)
Chinese (zh)
Other versions
TW201230912A (en
Inventor
Hirohisa Narahashi
Shigeo Nakamura
Original Assignee
Ajinomoto Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Kk filed Critical Ajinomoto Kk
Publication of TW201230912A publication Critical patent/TW201230912A/zh
Application granted granted Critical
Publication of TWI578871B publication Critical patent/TWI578871B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/268—Release layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW100127223A 2010-08-11 2011-08-01 The manufacturing method of laminates TWI578871B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010179966A JP5540984B2 (ja) 2010-08-11 2010-08-11 積層板の製造方法

Publications (2)

Publication Number Publication Date
TW201230912A TW201230912A (en) 2012-07-16
TWI578871B true TWI578871B (zh) 2017-04-11

Family

ID=45850655

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100127223A TWI578871B (zh) 2010-08-11 2011-08-01 The manufacturing method of laminates

Country Status (3)

Country Link
JP (1) JP5540984B2 (ko)
KR (1) KR101901116B1 (ko)
TW (1) TWI578871B (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6098988B2 (ja) * 2012-09-28 2017-03-22 味の素株式会社 支持体含有プレポリマーシート
KR101423400B1 (ko) * 2012-12-10 2014-07-24 주식회사 두산 다층 인쇄 회로 기판 및 그 제조 방법
KR101423401B1 (ko) * 2012-12-10 2014-07-24 주식회사 두산 다층 인쇄 회로 기판 및 그 제조 방법
KR101420939B1 (ko) * 2012-12-10 2014-07-17 주식회사 두산 다층 인쇄 회로 기판 및 그 제조 방법
JP6225643B2 (ja) * 2013-10-31 2017-11-08 味の素株式会社 積層板の製造方法
KR101652174B1 (ko) * 2014-10-06 2016-08-29 주식회사 두산 프리프레그 및 이를 포함하는 금속박 적층판 및 인쇄회로기판
JP2016082036A (ja) * 2014-10-15 2016-05-16 日本ゼオン株式会社 表面処理基板および導体付き基板
JP6961942B2 (ja) * 2015-04-16 2021-11-05 東洋紡株式会社 フレキシブル基板用透明フィルム及びフレキシブル回路基板
JP6471622B2 (ja) 2015-06-18 2019-02-20 住友ベークライト株式会社 ビルドアップ材、積層板、プリント配線基板、半導体装置および積層板の製造方法
JP6790658B2 (ja) * 2016-09-23 2020-11-25 昭和電工マテリアルズ株式会社 配線板用積層板及び配線板
JP6660513B1 (ja) * 2018-03-28 2020-03-11 積水化学工業株式会社 樹脂材料及び多層プリント配線板
CN110216774A (zh) * 2019-06-20 2019-09-10 浙江远大勤业住宅产业化有限公司 一种预制件叠合板的生产工艺
WO2023012864A1 (ja) * 2021-08-02 2023-02-09 昭和電工マテリアルズ株式会社 配線基板を製造する方法、及び配線基板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200936371A (en) * 2007-10-24 2009-09-01 Ube Industries Metal foil laminated polyimide resin substrate
WO2009119621A1 (ja) * 2008-03-25 2009-10-01 味の素株式会社 絶縁樹脂シート及び該絶縁樹脂シートを用いた多層プリント配線板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3929957B2 (ja) * 2003-09-30 2007-06-13 株式会社ダイフク・ロジスティック・テクノロジー 自動倉庫及びその運転方法
MY151516A (en) * 2007-03-20 2014-05-30 Sumitomo Bakelite Co Method for manufacturing laminated board,and laminated board
TWI621638B (zh) * 2008-11-28 2018-04-21 味之素股份有限公司 Resin composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200936371A (en) * 2007-10-24 2009-09-01 Ube Industries Metal foil laminated polyimide resin substrate
WO2009119621A1 (ja) * 2008-03-25 2009-10-01 味の素株式会社 絶縁樹脂シート及び該絶縁樹脂シートを用いた多層プリント配線板の製造方法

Also Published As

Publication number Publication date
JP5540984B2 (ja) 2014-07-02
TW201230912A (en) 2012-07-16
KR20120024417A (ko) 2012-03-14
JP2012039021A (ja) 2012-02-23
KR101901116B1 (ko) 2018-09-27

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