TWI571525B - A crystalline laminated structure, and a semiconductor device - Google Patents

A crystalline laminated structure, and a semiconductor device Download PDF

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Publication number
TWI571525B
TWI571525B TW104110315A TW104110315A TWI571525B TW I571525 B TWI571525 B TW I571525B TW 104110315 A TW104110315 A TW 104110315A TW 104110315 A TW104110315 A TW 104110315A TW I571525 B TWI571525 B TW I571525B
Authority
TW
Taiwan
Prior art keywords
film
crystalline
oxide semiconductor
crystalline oxide
thin film
Prior art date
Application number
TW104110315A
Other languages
English (en)
Chinese (zh)
Other versions
TW201536945A (zh
Inventor
人羅俊實
織田真也
Original Assignee
Flosfia股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Flosfia股份有限公司 filed Critical Flosfia股份有限公司
Publication of TW201536945A publication Critical patent/TW201536945A/zh
Application granted granted Critical
Publication of TWI571525B publication Critical patent/TWI571525B/zh

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6757Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/213Channel regions of field-effect devices
    • H10D62/221Channel regions of field-effect devices of FETs
    • H10D62/235Channel regions of field-effect devices of FETs of IGFETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40Crystalline structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass
    • H10P14/24
    • H10P14/265
    • H10P14/2921
    • H10P14/2925
    • H10P14/2926
    • H10P14/3238
    • H10P14/3434
    • H10P14/3438
    • H10P14/3442
    • H10P14/3446
    • H10P14/3451
    • H10P14/3458
    • H10P14/22

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical & Material Sciences (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thin Film Transistor (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
TW104110315A 2014-03-31 2015-03-30 A crystalline laminated structure, and a semiconductor device TWI571525B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014072780 2014-03-31

Publications (2)

Publication Number Publication Date
TW201536945A TW201536945A (zh) 2015-10-01
TWI571525B true TWI571525B (zh) 2017-02-21

Family

ID=52146229

Family Applications (3)

Application Number Title Priority Date Filing Date
TW104110315A TWI571525B (zh) 2014-03-31 2015-03-30 A crystalline laminated structure, and a semiconductor device
TW107112140A TWI665327B (zh) 2014-03-31 2015-03-30 結晶性氧化物半導體薄膜及半導體裝置
TW105143387A TWI625413B (zh) 2014-03-31 2015-03-30 結晶性氧化物半導體薄膜

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW107112140A TWI665327B (zh) 2014-03-31 2015-03-30 結晶性氧化物半導體薄膜及半導體裝置
TW105143387A TWI625413B (zh) 2014-03-31 2015-03-30 結晶性氧化物半導體薄膜

Country Status (5)

Country Link
US (2) US10090388B2 (enExample)
EP (1) EP2933825B1 (enExample)
JP (2) JP6379369B2 (enExample)
CN (4) CN110176493A (enExample)
TW (3) TWI571525B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180097073A1 (en) * 2016-10-03 2018-04-05 Flosfia Inc. Semiconductor device and semiconductor system including semiconductor device
JP7166522B2 (ja) * 2017-08-21 2022-11-08 株式会社Flosfia 結晶膜の製造方法
TWI831755B (zh) * 2017-11-15 2024-02-11 日商Flosfia股份有限公司 p型氧化物半導體膜及其形成方法
KR102415439B1 (ko) * 2018-08-01 2022-06-30 이데미쓰 고산 가부시키가이샤 결정 구조 화합물, 산화물 소결체, 스퍼터링 타깃, 결정질 산화물 박막, 아모르퍼스 산화물 박막, 박막 트랜지스터, 및 전자 기기
JP7115688B2 (ja) * 2019-01-25 2022-08-09 株式会社デンソー 成膜装置及び半導体装置の製造方法
JP7045014B2 (ja) * 2019-08-28 2022-03-31 信越化学工業株式会社 積層構造体の製造方法
JP7306640B2 (ja) * 2019-08-28 2023-07-11 信越化学工業株式会社 結晶性酸化物膜
JP7290740B2 (ja) * 2019-09-30 2023-06-13 日本碍子株式会社 α-Ga2O3系半導体膜
JP6994694B2 (ja) * 2020-02-27 2022-01-14 信越化学工業株式会社 成膜用霧化装置及びこれを用いた成膜装置
JP7200205B2 (ja) 2020-12-15 2023-01-06 信越化学工業株式会社 成膜方法
TW202242209A (zh) 2021-04-28 2022-11-01 日商信越化學工業股份有限公司 積層結構體、半導體裝置以及積層結構體的製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013027480A (ja) * 2011-07-27 2013-02-07 Aisin Seiki Co Ltd 暖房椅子
WO2013035844A1 (ja) * 2011-09-08 2013-03-14 株式会社タムラ製作所 Ga2O3系半導体素子

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000188257A (ja) * 1998-12-22 2000-07-04 Sharp Corp 結晶性シリコン系半導体薄膜の製造方法
JP2000232222A (ja) * 1999-02-10 2000-08-22 Nec Corp 半導体装置の製造方法
US6573161B1 (en) * 1999-03-05 2003-06-03 Seiko Epson Corporation Thin film semiconductor device fabrication process
US20070287221A1 (en) * 2006-06-12 2007-12-13 Xerox Corporation Fabrication process for crystalline zinc oxide semiconductor layer
US7476615B2 (en) * 2006-11-01 2009-01-13 Intel Corporation Deposition process for iodine-doped ruthenium barrier layers
JP2009091212A (ja) * 2007-10-10 2009-04-30 Nippon Light Metal Co Ltd 酸化ガリウム単結晶基板及びその製造方法
JP2010080719A (ja) * 2008-09-26 2010-04-08 Yamaguchi Univ 半導体発光素子及びその製造方法
KR101811203B1 (ko) 2009-12-25 2017-12-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 이를 제작하기 위한 방법
US8410474B2 (en) * 2010-01-21 2013-04-02 Hitachi, Ltd. Graphene grown substrate and electronic/photonic integrated circuits using same
US10032239B2 (en) * 2010-06-10 2018-07-24 United Parcel Service Of America, Inc. Enhanced payments for shipping
US8987728B2 (en) * 2011-03-25 2015-03-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing semiconductor device
WO2012173108A1 (ja) * 2011-06-15 2012-12-20 住友電気工業株式会社 導電性酸化物およびその製造方法ならびに酸化物半導体膜
JP5793732B2 (ja) 2011-07-27 2015-10-14 高知県公立大学法人 ドーパントを添加した結晶性の高い導電性α型酸化ガリウム薄膜およびその生成方法
US20140217470A1 (en) 2011-09-08 2014-08-07 Tamura Corporation Ga2O3 SEMICONDUCTOR ELEMENT
JP2013191824A (ja) * 2012-02-15 2013-09-26 Sharp Corp 酸化物半導体及びこれを含む半導体接合素子
JP2013201211A (ja) 2012-03-23 2013-10-03 Sony Corp 薄膜トランジスタ、薄膜トランジスタの製造方法および電子機器
JP5397794B1 (ja) 2013-06-04 2014-01-22 Roca株式会社 酸化物結晶薄膜の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013027480A (ja) * 2011-07-27 2013-02-07 Aisin Seiki Co Ltd 暖房椅子
WO2013035844A1 (ja) * 2011-09-08 2013-03-14 株式会社タムラ製作所 Ga2O3系半導体素子

Also Published As

Publication number Publication date
JP2018203614A (ja) 2018-12-27
CN110310996A (zh) 2019-10-08
CN110310996B (zh) 2020-09-08
CN110176493A (zh) 2019-08-27
JP2015199649A (ja) 2015-11-12
US20150279944A1 (en) 2015-10-01
CN104952927B (zh) 2019-08-13
TW201536945A (zh) 2015-10-01
US20190013384A1 (en) 2019-01-10
JP6539921B2 (ja) 2019-07-10
TW201829824A (zh) 2018-08-16
US10090388B2 (en) 2018-10-02
TWI665327B (zh) 2019-07-11
US11038026B2 (en) 2021-06-15
CN104952927A (zh) 2015-09-30
JP6379369B2 (ja) 2018-08-29
CN110299414A (zh) 2019-10-01
TWI625413B (zh) 2018-06-01
EP2933825A1 (en) 2015-10-21
TW201713790A (zh) 2017-04-16
EP2933825B1 (en) 2017-07-05

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