TWI568507B - 基板清洗裝置、基板清洗方法及非臨時性記憶媒體 - Google Patents

基板清洗裝置、基板清洗方法及非臨時性記憶媒體 Download PDF

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Publication number
TWI568507B
TWI568507B TW103118328A TW103118328A TWI568507B TW I568507 B TWI568507 B TW I568507B TW 103118328 A TW103118328 A TW 103118328A TW 103118328 A TW103118328 A TW 103118328A TW I568507 B TWI568507 B TW I568507B
Authority
TW
Taiwan
Prior art keywords
nozzle
substrate
cleaning liquid
gas
cleaning
Prior art date
Application number
TW103118328A
Other languages
English (en)
Chinese (zh)
Other versions
TW201519966A (zh
Inventor
大河內厚
吉原孝介
一之宮博
西畑廣
內藤亮一郎
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW201519966A publication Critical patent/TW201519966A/zh
Application granted granted Critical
Publication of TWI568507B publication Critical patent/TWI568507B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
TW103118328A 2013-05-28 2014-05-26 基板清洗裝置、基板清洗方法及非臨時性記憶媒體 TWI568507B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013112395 2013-05-28
JP2014014864A JP6007925B2 (ja) 2013-05-28 2014-01-29 基板洗浄装置、基板洗浄方法及び記憶媒体
JP2014058221A JP6102807B2 (ja) 2013-05-28 2014-03-20 基板洗浄装置、基板洗浄方法及び記憶媒体

Publications (2)

Publication Number Publication Date
TW201519966A TW201519966A (zh) 2015-06-01
TWI568507B true TWI568507B (zh) 2017-02-01

Family

ID=52338346

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103118328A TWI568507B (zh) 2013-05-28 2014-05-26 基板清洗裝置、基板清洗方法及非臨時性記憶媒體

Country Status (3)

Country Link
JP (2) JP6007925B2 (https=)
KR (1) KR102126591B1 (https=)
TW (1) TWI568507B (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI622091B (zh) 2015-06-18 2018-04-21 思可林集團股份有限公司 基板處理裝置
JP6613206B2 (ja) * 2015-06-18 2019-11-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6960489B2 (ja) * 2016-03-31 2021-11-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP6807162B2 (ja) * 2016-04-13 2021-01-06 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置及びコンピュータ読み取り可能な記録媒体
CN107470225A (zh) * 2017-08-28 2017-12-15 广州沃安实业有限公司 一种清洗机
JP7034634B2 (ja) 2017-08-31 2022-03-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
TWI643683B (zh) * 2017-10-19 2018-12-11 Scientech Corporation 流體供應裝置
JP2019169624A (ja) * 2018-03-23 2019-10-03 株式会社Ｓｃｒｅｅｎホールディングス 現像方法
JP7536583B2 (ja) * 2020-04-28 2024-08-20 東京エレクトロン株式会社 ノズルユニット、液処理装置及び液処理方法
JP7594903B2 (ja) * 2020-12-23 2024-12-05 東京エレクトロン株式会社 現像装置及び現像方法
CN116092967B (zh) * 2021-11-08 2025-08-29 长鑫存储技术有限公司 半导体清洗装置及方法
CN114927441B (zh) * 2022-05-31 2026-04-21 北京北方华创微电子装备有限公司 半导体清洗设备
CN115069639B (zh) * 2022-05-31 2023-11-14 江苏卓玉智能科技有限公司 半导体晶圆的清洗装置
CN119487617A (zh) 2022-07-14 2025-02-18 东京毅力科创株式会社 基片处理装置、基片处理方法和基片处理程序
CN120311276A (zh) * 2024-01-12 2025-07-15 盛美半导体设备(上海)股份有限公司 电镀装置及基板清洁方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005050724A1 (ja) * 2003-11-18 2005-06-02 Tokyo Electron Limited 基板洗浄方法、基板洗浄装置およびコンピュータ読み取り可能な記録媒体
US20080053487A1 (en) * 2006-08-29 2008-03-06 Tomohiro Goto Substrate processing method and substrate processing apparatus
TW201249554A (en) * 2008-04-03 2012-12-16 Tokyo Electron Ltd Substrate cleaning method, substrate cleaning apparatus, and storage medium

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7837804B2 (en) * 2004-04-23 2010-11-23 Tokyo Electron Limited Substrate cleaning method, substrate cleaning equipment, computer program, and program recording medium
KR100846690B1 (ko) * 2004-06-04 2008-07-16 도쿄엘렉트론가부시키가이샤 기판 세정 방법 및 컴퓨터로 판독 가능한 기억 매체
JP4324527B2 (ja) * 2004-09-09 2009-09-02 東京エレクトロン株式会社 基板洗浄方法及び現像装置
WO2008041211A2 (en) * 2006-10-02 2008-04-10 Sez Ag Device and method for removing liquid from a surface of a disc-like article
JP5090089B2 (ja) * 2006-10-19 2012-12-05 大日本スクリーン製造株式会社 基板処理装置
JP4780808B2 (ja) * 2009-02-03 2011-09-28 東京エレクトロン株式会社 現像処理方法及び現像処理装置
JP5538102B2 (ja) * 2010-07-07 2014-07-02 株式会社Ｓｏｋｕｄｏ 基板洗浄方法および基板洗浄装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005050724A1 (ja) * 2003-11-18 2005-06-02 Tokyo Electron Limited 基板洗浄方法、基板洗浄装置およびコンピュータ読み取り可能な記録媒体
US20080053487A1 (en) * 2006-08-29 2008-03-06 Tomohiro Goto Substrate processing method and substrate processing apparatus
TW201249554A (en) * 2008-04-03 2012-12-16 Tokyo Electron Ltd Substrate cleaning method, substrate cleaning apparatus, and storage medium

Also Published As

Publication number Publication date
KR20140139969A (ko) 2014-12-08
JP2015008267A (ja) 2015-01-15
JP2015008273A (ja) 2015-01-15
KR102126591B1 (ko) 2020-06-24
JP6102807B2 (ja) 2017-03-29
TW201519966A (zh) 2015-06-01
JP6007925B2 (ja) 2016-10-19

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