TWI566293B - Substrate cleaning method and substrate cleaning system - Google Patents

Substrate cleaning method and substrate cleaning system Download PDF

Info

Publication number
TWI566293B
TWI566293B TW102131988A TW102131988A TWI566293B TW I566293 B TWI566293 B TW I566293B TW 102131988 A TW102131988 A TW 102131988A TW 102131988 A TW102131988 A TW 102131988A TW I566293 B TWI566293 B TW I566293B
Authority
TW
Taiwan
Prior art keywords
substrate
wafer
liquid
processing unit
processing
Prior art date
Application number
TW102131988A
Other languages
English (en)
Chinese (zh)
Other versions
TW201428838A (zh
Inventor
金子都
折居武彥
菅野至
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW201428838A publication Critical patent/TW201428838A/zh
Application granted granted Critical
Publication of TWI566293B publication Critical patent/TWI566293B/zh

Links

Classifications

    • H10P50/00—
    • H10P70/15—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/0209—Cleaning of wafer backside
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H10P70/20—
    • H10P70/23—
    • H10P70/56—
    • H10P72/0412—
    • H10P72/0414—
    • H10P72/0436—
    • H10P72/0448—
    • H10P72/7608—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW102131988A 2012-11-26 2013-09-05 Substrate cleaning method and substrate cleaning system TWI566293B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012257081A JP6000822B2 (ja) 2012-11-26 2012-11-26 基板洗浄方法および基板洗浄システム

Publications (2)

Publication Number Publication Date
TW201428838A TW201428838A (zh) 2014-07-16
TWI566293B true TWI566293B (zh) 2017-01-11

Family

ID=50772191

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102131988A TWI566293B (zh) 2012-11-26 2013-09-05 Substrate cleaning method and substrate cleaning system

Country Status (4)

Country Link
US (1) US9443712B2 (enExample)
JP (1) JP6000822B2 (enExample)
KR (1) KR101822950B1 (enExample)
TW (1) TWI566293B (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6302700B2 (ja) 2013-03-18 2018-03-28 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6351993B2 (ja) 2013-03-18 2018-07-04 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6455962B2 (ja) * 2013-03-18 2019-01-23 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
US20150064911A1 (en) * 2013-08-27 2015-03-05 Tokyo Electron Limited Substrate processing method, substrate processing apparatus and storage medium
JP6308910B2 (ja) 2013-11-13 2018-04-11 東京エレクトロン株式会社 基板洗浄方法、基板洗浄システムおよび記憶媒体
JP5977727B2 (ja) 2013-11-13 2016-08-24 東京エレクトロン株式会社 基板洗浄方法、基板洗浄システムおよび記憶媒体
US9799539B2 (en) * 2014-06-16 2017-10-24 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles
JP6425517B2 (ja) * 2014-11-28 2018-11-21 東京エレクトロン株式会社 基板処理方法、基板処理装置および記憶媒体
JP6588819B2 (ja) * 2015-12-24 2019-10-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6630213B2 (ja) * 2016-03-30 2020-01-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理方法およびプログラム記録媒体
US10734255B2 (en) 2016-05-25 2020-08-04 Tokyo Electron Limited Substrate cleaning method, substrate cleaning system and memory medium
CN116646279A (zh) 2017-01-05 2023-08-25 株式会社斯库林集团 基板清洗装置及基板清洗方法
JP6951229B2 (ja) * 2017-01-05 2021-10-20 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
JP6945314B2 (ja) * 2017-03-24 2021-10-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6994307B2 (ja) * 2017-03-27 2022-01-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
WO2018190278A1 (ja) * 2017-04-13 2018-10-18 Jsr株式会社 半導体基板洗浄用組成物
WO2019009054A1 (ja) * 2017-07-03 2019-01-10 東京エレクトロン株式会社 基板処理システム、基板洗浄方法および記憶媒体
JP7051334B2 (ja) * 2017-08-31 2022-04-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
WO2019044199A1 (ja) * 2017-08-31 2019-03-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7136543B2 (ja) * 2017-08-31 2022-09-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7008489B2 (ja) * 2017-12-05 2022-01-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7227758B2 (ja) 2018-05-31 2023-02-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
EP3576133B1 (en) 2018-05-31 2023-11-22 SCREEN Holdings Co., Ltd. Substrate processing method
JP7227757B2 (ja) * 2018-05-31 2023-02-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
KR102680866B1 (ko) 2019-07-16 2024-07-04 삼성전자주식회사 기판 세정 장치 및 이를 이용한 기판 세정 방법
JP7545890B2 (ja) 2020-12-28 2024-09-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理システムおよび基板処理方法
KR102523437B1 (ko) * 2020-12-29 2023-04-18 세메스 주식회사 기판 처리 장치 및 방법
DE102024117724A1 (de) * 2024-06-24 2025-12-24 Ams-Osram International Gmbh Vorrichtung, wafer und verfahren zur herstellung eines elektronischen bauelements

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04253332A (ja) * 1991-01-28 1992-09-09 Toshiba Corp 半導体ウェーハ処理装置
JPH11162816A (ja) * 1997-11-28 1999-06-18 Oki Electric Ind Co Ltd スピン式レジスト塗布装置およびウェーハ処理方法
JP2008060368A (ja) * 2006-08-31 2008-03-13 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2008177471A (ja) * 2007-01-22 2008-07-31 Tokyo Electron Ltd 基板の処理方法、塗布膜除去装置及び基板処理システム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5879572A (en) 1996-11-19 1999-03-09 Delco Electronics Corporation Method of protecting silicon wafers during wet chemical etching
JP3739220B2 (ja) 1998-11-19 2006-01-25 大日本スクリーン製造株式会社 基板処理方法及びその装置
US6245677B1 (en) * 1999-07-28 2001-06-12 Noor Haq Backside chemical etching and polishing
US7451774B2 (en) * 2000-06-26 2008-11-18 Applied Materials, Inc. Method and apparatus for wafer cleaning
JP4217870B2 (ja) 2002-07-15 2009-02-04 日本電気株式会社 有機シロキサン共重合体膜、その製造方法、成長装置、ならびに該共重合体膜を用いた半導体装置
US7520790B2 (en) * 2003-09-19 2009-04-21 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method of display device
JP2005322782A (ja) * 2004-05-10 2005-11-17 Sumitomo Heavy Ind Ltd 薄板の枚葉型回転処理装置及び方法
JP2009135169A (ja) 2007-11-29 2009-06-18 Tokyo Electron Ltd 基板処理システムおよび基板処理方法
JP2012019025A (ja) * 2010-07-07 2012-01-26 Tokyo Electron Ltd 液処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04253332A (ja) * 1991-01-28 1992-09-09 Toshiba Corp 半導体ウェーハ処理装置
JPH11162816A (ja) * 1997-11-28 1999-06-18 Oki Electric Ind Co Ltd スピン式レジスト塗布装置およびウェーハ処理方法
JP2008060368A (ja) * 2006-08-31 2008-03-13 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2008177471A (ja) * 2007-01-22 2008-07-31 Tokyo Electron Ltd 基板の処理方法、塗布膜除去装置及び基板処理システム

Also Published As

Publication number Publication date
TW201428838A (zh) 2014-07-16
KR101822950B1 (ko) 2018-01-29
JP2014107313A (ja) 2014-06-09
KR20140067893A (ko) 2014-06-05
US20140144464A1 (en) 2014-05-29
US9443712B2 (en) 2016-09-13
JP6000822B2 (ja) 2016-10-05

Similar Documents

Publication Publication Date Title
TWI566293B (zh) Substrate cleaning method and substrate cleaning system
TWI552220B (zh) Substrate cleaning system, substrate cleaning method and memory media
TWI600056B (zh) Substrate cleaning device and substrate cleaning method
JP6356295B2 (ja) 基板洗浄装置、基板洗浄方法および記憶媒体
JP6585242B2 (ja) 基板洗浄装置、基板洗浄方法および記憶媒体
JP6279037B2 (ja) 基板洗浄方法および基板洗浄システム
TWI653663B (zh) 顯影單元、基板處理裝置、顯影方法及基板處理方法
CN104624561B (zh) 基板清洗方法、基板清洗系统
TWI584370B (zh) A substrate processing method, a substrate processing apparatus, and a memory medium
CN209747470U (zh) 基板清洗系统