TWI563611B - - Google Patents

Info

Publication number
TWI563611B
TWI563611B TW103108890A TW103108890A TWI563611B TW I563611 B TWI563611 B TW I563611B TW 103108890 A TW103108890 A TW 103108890A TW 103108890 A TW103108890 A TW 103108890A TW I563611 B TWI563611 B TW I563611B
Authority
TW
Taiwan
Application number
TW103108890A
Other languages
Chinese (zh)
Other versions
TW201448133A (zh
Inventor
Shinji Takase
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of TW201448133A publication Critical patent/TW201448133A/zh
Application granted granted Critical
Publication of TWI563611B publication Critical patent/TWI563611B/zh

Links

TW103108890A 2013-04-19 2014-03-13 樹脂密封裝置及樹脂密封方法 TW201448133A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013088410A JP5934139B2 (ja) 2013-04-19 2013-04-19 樹脂封止装置及び樹脂封止方法

Publications (2)

Publication Number Publication Date
TW201448133A TW201448133A (zh) 2014-12-16
TWI563611B true TWI563611B (ko) 2016-12-21

Family

ID=51709421

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103108890A TW201448133A (zh) 2013-04-19 2014-03-13 樹脂密封裝置及樹脂密封方法

Country Status (4)

Country Link
JP (1) JP5934139B2 (ko)
KR (1) KR101643451B1 (ko)
CN (1) CN104112679B (ko)
TW (1) TW201448133A (ko)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6560498B2 (ja) * 2015-01-27 2019-08-14 Towa株式会社 樹脂封止方法及び樹脂成形品の製造方法
JP6430342B2 (ja) * 2015-08-11 2018-11-28 Towa株式会社 樹脂成形装置及び樹脂成形方法並びに成形型
JP6598642B2 (ja) * 2015-11-09 2019-10-30 Towa株式会社 樹脂封止装置及び樹脂封止方法
TWI575620B (zh) * 2016-03-10 2017-03-21 南茂科技股份有限公司 指紋辨識晶片封裝結構的製作方法及製作設備
CN207398072U (zh) * 2017-06-05 2018-05-22 日月光半导体制造股份有限公司 用于半导体封装制程的封装模具
KR101986645B1 (ko) * 2017-07-19 2019-07-03 동아정밀(주) 트랜스퍼 몰드의 압축코어장치
CN108058352A (zh) * 2017-12-30 2018-05-22 宁国市欧泰橡塑制品有限公司 一种护线套注压成型设备
JP6655150B1 (ja) * 2018-10-19 2020-02-26 Towa株式会社 搬送装置、樹脂成形装置、搬送方法、及び樹脂成形品の製造方法
JP7160770B2 (ja) * 2019-07-22 2022-10-25 アピックヤマダ株式会社 樹脂モールド装置
JP6845903B1 (ja) * 2019-09-18 2021-03-24 Towa株式会社 成形型、樹脂成形装置及び樹脂成形品の製造方法
JP6837530B1 (ja) * 2019-10-17 2021-03-03 Towa株式会社 樹脂成形方法及び樹脂成形装置
JP7360368B2 (ja) * 2020-08-18 2023-10-12 Towa株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP7430125B2 (ja) * 2020-08-28 2024-02-09 Towa株式会社 成形型、樹脂成形装置、及び樹脂成形品の製造方法
JP7341105B2 (ja) * 2020-08-28 2023-09-08 Towa株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7341106B2 (ja) * 2020-08-28 2023-09-08 Towa株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7360369B2 (ja) * 2020-08-28 2023-10-12 Towa株式会社 樹脂成形装置、及び樹脂成形品の製造方法
KR102456172B1 (ko) * 2020-10-15 2022-10-19 토와한국 주식회사 금형 모듈을 포함하는 반도체 소자 몰딩 장치
JP2024014263A (ja) * 2022-07-22 2024-02-01 Towa株式会社 搬送装置、樹脂成形装置、及び樹脂成形品の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020056942A1 (en) * 2000-08-16 2002-05-16 Seng Toh Kok Method for molding semiconductor components

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5846477A (en) * 1994-12-08 1998-12-08 Nitto Denko Corporation Production method for encapsulating a semiconductor device
JPH09193177A (ja) * 1996-01-17 1997-07-29 Apic Yamada Kk 樹脂モールド方法及びこれに用いるリリースフィルム
TWI327756B (en) * 2002-11-29 2010-07-21 Apic Yamada Corp Resin molding machine
KR20120028639A (ko) * 2010-09-15 2012-03-23 한미반도체 주식회사 트랜스퍼 몰딩장치
JP5906528B2 (ja) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020056942A1 (en) * 2000-08-16 2002-05-16 Seng Toh Kok Method for molding semiconductor components

Also Published As

Publication number Publication date
KR101643451B1 (ko) 2016-07-27
CN104112679B (zh) 2017-10-13
CN104112679A (zh) 2014-10-22
TW201448133A (zh) 2014-12-16
JP2014212246A (ja) 2014-11-13
KR20140125716A (ko) 2014-10-29
JP5934139B2 (ja) 2016-06-15

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