TWI562308B - - Google Patents

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Publication number
TWI562308B
TWI562308B TW102120538A TW102120538A TWI562308B TW I562308 B TWI562308 B TW I562308B TW 102120538 A TW102120538 A TW 102120538A TW 102120538 A TW102120538 A TW 102120538A TW I562308 B TWI562308 B TW I562308B
Authority
TW
Taiwan
Application number
TW102120538A
Other versions
TW201413895A (zh
Inventor
xiao-chun Tan
Original Assignee
Silergy Semiconductor Technology Hangzhou Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Silergy Semiconductor Technology Hangzhou Ltd filed Critical Silergy Semiconductor Technology Hangzhou Ltd
Publication of TW201413895A publication Critical patent/TW201413895A/zh
Application granted granted Critical
Publication of TWI562308B publication Critical patent/TWI562308B/zh

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    • H—ELECTRICITY
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
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    • H01L2924/30107—Inductance

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
TW102120538A 2012-09-11 2013-06-10 多晶片封裝結構及其封裝方法 TW201413895A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210334500.XA CN102832189B (zh) 2012-09-11 2012-09-11 一种多芯片封装结构及其封装方法

Publications (2)

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TW201413895A TW201413895A (zh) 2014-04-01
TWI562308B true TWI562308B (zh) 2016-12-11

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US (1) US9129947B2 (zh)
CN (1) CN102832189B (zh)
TW (1) TW201413895A (zh)

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* Cited by examiner, † Cited by third party
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CN103441124B (zh) 2013-08-27 2016-01-06 矽力杰半导体技术(杭州)有限公司 电压调节器的叠层封装方法及相应的叠层封装装置
JP6300488B2 (ja) * 2013-10-22 2018-03-28 キヤノン株式会社 撮像装置、固体撮像素子及びカメラ
CN103545297A (zh) 2013-10-25 2014-01-29 矽力杰半导体技术(杭州)有限公司 多芯片叠合封装结构及其制作方法
CN103531560A (zh) 2013-10-31 2014-01-22 矽力杰半导体技术(杭州)有限公司 芯片的封装结构及其制造方法
CN103700639B (zh) 2013-12-31 2017-09-01 矽力杰半导体技术(杭州)有限公司 封装组件及其制造方法
CN103730444B (zh) 2014-01-20 2017-06-27 矽力杰半导体技术(杭州)有限公司 封装组件及其制造方法
CN103762214B (zh) * 2014-01-24 2016-08-17 矽力杰半导体技术(杭州)有限公司 应用于开关型调节器的集成电路组件
CN103824853B (zh) * 2014-02-24 2017-04-12 矽力杰半导体技术(杭州)有限公司 应用于开关型调节器的集成电路组件
CN107481957B (zh) * 2017-07-31 2018-06-05 广东工业大学 一种多芯片同步倒装机构及其封装工艺
CN108449835B (zh) * 2018-04-03 2024-01-05 矽力杰半导体技术(杭州)有限公司 封装结构以及led照明模组
CN110610927A (zh) * 2019-08-02 2019-12-24 安徽国晶微电子有限公司 多芯片封装互联结构
EP4084069A4 (en) * 2020-01-23 2023-05-17 Huawei Technologies Co., Ltd. CHIP DEVICE, CIRCUIT AND WIRELESS COMMUNICATION DEVICE
CN111354718B (zh) * 2020-03-23 2022-02-25 江苏中科智芯集成科技有限公司 含多芯片封装结构的芯片排列布线方法、装置及电子设备
CN111696983B (zh) * 2020-06-24 2024-03-15 悦虎晶芯电路(苏州)股份有限公司 多芯片水平封装的芯片模组、晶圆结构和加工方法
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