TWI560048B - - Google Patents

Info

Publication number
TWI560048B
TWI560048B TW100127508A TW100127508A TWI560048B TW I560048 B TWI560048 B TW I560048B TW 100127508 A TW100127508 A TW 100127508A TW 100127508 A TW100127508 A TW 100127508A TW I560048 B TWI560048 B TW I560048B
Authority
TW
Taiwan
Application number
TW100127508A
Other versions
TW201208871A (en
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW201208871A publication Critical patent/TW201208871A/zh
Application granted granted Critical
Publication of TWI560048B publication Critical patent/TWI560048B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002—Inhomogeneous material in general
    • H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H01B17/62—Insulating-layers or insulating-films on metal bodies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372—Particulate matter

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW100127508A 2010-08-06 2011-08-03 Metal foil coated with filled resin layer and process for producing metal foil coated with filled resin layer TW201208871A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010177120A JP5636224B2 (ja) 2010-08-06 2010-08-06 フィラー含有樹脂層付金属箔及びフィラー含有樹脂層付金属箔の製造方法

Publications (2)

Publication Number Publication Date
TW201208871A TW201208871A (en) 2012-03-01
TWI560048B true TWI560048B (zh) 2016-12-01

Family

ID=45559466

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100127508A TW201208871A (en) 2010-08-06 2011-08-03 Metal foil coated with filled resin layer and process for producing metal foil coated with filled resin layer

Country Status (6)

Country Link
US (1) US9396834B2 (zh)
JP (1) JP5636224B2 (zh)
KR (2) KR101979174B1 (zh)
CN (1) CN102933389B (zh)
TW (1) TW201208871A (zh)
WO (1) WO2012017967A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8441965B2 (en) * 2010-08-05 2013-05-14 Apple Inc. Methods and apparatus for reducing data transmission overhead
JP5975370B2 (ja) * 2013-11-18 2016-08-23 株式会社村田製作所 バリスタ機能付き積層型半導体セラミックコンデンサとその製造方法
CN103837101B (zh) * 2014-01-10 2016-08-17 西安近代化学研究所 一种黑索金颗粒表面粗糙度检测方法
JP6448558B2 (ja) * 2014-02-10 2019-01-09 日本碍子株式会社 多孔質板状フィラー集合体及びその製造方法、並びに多孔質板状フィラー集合体を含む断熱膜
JP6742785B2 (ja) * 2015-08-13 2020-08-19 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルムおよびプリント配線板
US10395798B2 (en) 2015-12-16 2019-08-27 Mitsubishi Materials Corporation Heat-resistant insulated wire and electrodeposition liquid used to form insulating layer therefor
WO2017154167A1 (ja) * 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法
JP7221487B2 (ja) * 2018-02-14 2023-02-14 積水ポリマテック株式会社 熱伝導性シート
CN113825641B (zh) * 2019-05-13 2023-10-31 大日本印刷株式会社 阻隔膜、使用其的波长转换片以及使用其的显示装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007131946A (ja) * 2005-10-14 2007-05-31 Mitsui Mining & Smelting Co Ltd フレキシブル銅張積層板、そのフレキシブル銅張積層板を用いて得られるフレキシブルプリント配線板、そのフレキシブル銅張積層板を用いて得られるフィルムキャリアテープ、そのフレキシブル銅張積層板を用いて得られる半導体装置、フレキシブル銅張積層板の製造方法及びフィルムキャリアテープの製造方法
JP2007173714A (ja) * 2005-12-26 2007-07-05 Kyocera Corp 積層セラミックコンデンサおよびその製法
US20070207337A1 (en) * 2004-03-16 2007-09-06 Mitsui Mining & Smelting Co., Ltd. Electrodeposited Copper Foil with Carrier Foil on which a Resin Layer for Forming Insulating Layer is Formed, Copper-Clad Laminate, Printed Wiring Board, Method for Manufacturing Multilayer Copper-Clad Laminate, and Method for Manufacturing Printed Wiring Board
JP2009113465A (ja) * 2007-10-17 2009-05-28 Hitachi Chem Co Ltd 薄膜複合材料及びこれを用いた配線板用材料、配線板ならびに電子部品
JP2009532521A (ja) * 2006-03-31 2009-09-10 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 高周波数回路用途において有用なポリイミド系組成物を調製する方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2762386B2 (ja) * 1993-03-19 1998-06-04 三井金属鉱業株式会社 銅張り積層板およびプリント配線板
US5686172A (en) * 1994-11-30 1997-11-11 Mitsubishi Gas Chemical Company, Inc. Metal-foil-clad composite ceramic board and process for the production thereof
JP2008140786A (ja) 2005-03-28 2008-06-19 Pioneer Electronic Corp ゲート絶縁膜、有機トランジスタ、有機ｅｌ表示装置の製造方法、ディスプレイ
CN101291808A (zh) * 2005-08-19 2008-10-22 旭化成株式会社 层叠体及其制造方法
CN1972557A (zh) * 2005-10-14 2007-05-30 三井金属矿业株式会社 挠性覆铜层压板和薄膜载带及其制造方法、以及挠性印刷电路板、半导体装置
JP2007180217A (ja) * 2005-12-27 2007-07-12 Tdk Corp 積層セラミック電子部品の製造方法
JP5258283B2 (ja) * 2007-12-27 2013-08-07 富士フイルム株式会社 金属箔付基板、及びその作製方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070207337A1 (en) * 2004-03-16 2007-09-06 Mitsui Mining & Smelting Co., Ltd. Electrodeposited Copper Foil with Carrier Foil on which a Resin Layer for Forming Insulating Layer is Formed, Copper-Clad Laminate, Printed Wiring Board, Method for Manufacturing Multilayer Copper-Clad Laminate, and Method for Manufacturing Printed Wiring Board
JP2007131946A (ja) * 2005-10-14 2007-05-31 Mitsui Mining & Smelting Co Ltd フレキシブル銅張積層板、そのフレキシブル銅張積層板を用いて得られるフレキシブルプリント配線板、そのフレキシブル銅張積層板を用いて得られるフィルムキャリアテープ、そのフレキシブル銅張積層板を用いて得られる半導体装置、フレキシブル銅張積層板の製造方法及びフィルムキャリアテープの製造方法
JP2007173714A (ja) * 2005-12-26 2007-07-05 Kyocera Corp 積層セラミックコンデンサおよびその製法
JP2009532521A (ja) * 2006-03-31 2009-09-10 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 高周波数回路用途において有用なポリイミド系組成物を調製する方法
JP2009113465A (ja) * 2007-10-17 2009-05-28 Hitachi Chem Co Ltd 薄膜複合材料及びこれを用いた配線板用材料、配線板ならびに電子部品

Also Published As

Publication number Publication date
CN102933389A (zh) 2013-02-13
WO2012017967A1 (ja) 2012-02-09
JP2012035492A (ja) 2012-02-23
KR101889047B1 (ko) 2018-08-20
JP5636224B2 (ja) 2014-12-03
US9396834B2 (en) 2016-07-19
KR20180080344A (ko) 2018-07-11
KR20130114594A (ko) 2013-10-17
US20130177739A1 (en) 2013-07-11
TW201208871A (en) 2012-03-01
CN102933389B (zh) 2014-12-17
KR101979174B1 (ko) 2019-05-15

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