TWI557517B - A detection device, a lithographic apparatus, and a manufacturing method of the device - Google Patents

A detection device, a lithographic apparatus, and a manufacturing method of the device Download PDF

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Publication number
TWI557517B
TWI557517B TW103126742A TW103126742A TWI557517B TW I557517 B TWI557517 B TW I557517B TW 103126742 A TW103126742 A TW 103126742A TW 103126742 A TW103126742 A TW 103126742A TW I557517 B TWI557517 B TW I557517B
Authority
TW
Taiwan
Prior art keywords
light
substrate
optical member
indicator
range display
Prior art date
Application number
TW103126742A
Other languages
English (en)
Chinese (zh)
Other versions
TW201514634A (zh
Inventor
Akio Akamatsu
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of TW201514634A publication Critical patent/TW201514634A/zh
Application granted granted Critical
Publication of TWI557517B publication Critical patent/TWI557517B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW103126742A 2013-10-08 2014-08-05 A detection device, a lithographic apparatus, and a manufacturing method of the device TWI557517B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013211430A JP6228420B2 (ja) 2013-10-08 2013-10-08 検出装置、リソグラフィ装置、および物品の製造方法

Publications (2)

Publication Number Publication Date
TW201514634A TW201514634A (zh) 2015-04-16
TWI557517B true TWI557517B (zh) 2016-11-11

Family

ID=52791741

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103126742A TWI557517B (zh) 2013-10-08 2014-08-05 A detection device, a lithographic apparatus, and a manufacturing method of the device

Country Status (4)

Country Link
JP (1) JP6228420B2 (ru)
KR (2) KR101783514B1 (ru)
CN (1) CN104516214B (ru)
TW (1) TWI557517B (ru)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6926596B2 (ja) * 2017-03-31 2021-08-25 ウシオ電機株式会社 露光装置および露光方法
WO2020126810A1 (en) * 2018-12-20 2020-06-25 Asml Holding N.V. Apparatus for and method of simultaneously acquiring parallel alignment marks

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120099107A1 (en) * 2010-10-25 2012-04-26 Samsung Electronics Co., Ltd. Workpiece Alignment Device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0721586B2 (ja) * 1985-09-30 1995-03-08 株式会社ニコン 像形成光学装置
US5148214A (en) * 1986-05-09 1992-09-15 Canon Kabushiki Kaisha Alignment and exposure apparatus
JPS62262426A (ja) * 1986-05-09 1987-11-14 Canon Inc 露光装置
JP3074579B2 (ja) * 1992-01-31 2000-08-07 キヤノン株式会社 位置ずれ補正方法
KR100464854B1 (ko) * 2002-06-26 2005-01-06 삼성전자주식회사 반도체 기판의 정렬 방법 및 정렬 장치
US7388663B2 (en) * 2004-10-28 2008-06-17 Asml Netherlands B.V. Optical position assessment apparatus and method
WO2007094407A1 (ja) * 2006-02-16 2007-08-23 Nikon Corporation 露光装置、露光方法及びデバイス製造方法
KR101634893B1 (ko) * 2006-08-31 2016-06-29 가부시키가이샤 니콘 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법
CN101526750B (zh) * 2009-01-13 2011-06-29 上海微电子装备有限公司 用于光刻设备的对准系统及应用其的光刻设备
CN101950132A (zh) * 2010-08-17 2011-01-19 中国科学院光电技术研究所 纳米光刻掩模硅片间隙测量及调平装置
CN102141738B (zh) * 2011-04-02 2012-09-19 中国科学院光电技术研究所 一种用于投影光刻纳米量级自动调焦系统
US8842294B2 (en) * 2011-06-21 2014-09-23 Canon Kabushiki Kaisha Position detection apparatus, imprint apparatus, and position detection method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120099107A1 (en) * 2010-10-25 2012-04-26 Samsung Electronics Co., Ltd. Workpiece Alignment Device

Also Published As

Publication number Publication date
KR20170016421A (ko) 2017-02-13
KR101783514B1 (ko) 2017-09-29
JP6228420B2 (ja) 2017-11-08
CN104516214A (zh) 2015-04-15
KR101828739B1 (ko) 2018-02-12
JP2015076491A (ja) 2015-04-20
CN104516214B (zh) 2017-04-26
TW201514634A (zh) 2015-04-16
KR20150041579A (ko) 2015-04-16

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