TWI557517B - A detection device, a lithographic apparatus, and a manufacturing method of the device - Google Patents
A detection device, a lithographic apparatus, and a manufacturing method of the device Download PDFInfo
- Publication number
- TWI557517B TWI557517B TW103126742A TW103126742A TWI557517B TW I557517 B TWI557517 B TW I557517B TW 103126742 A TW103126742 A TW 103126742A TW 103126742 A TW103126742 A TW 103126742A TW I557517 B TWI557517 B TW I557517B
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- substrate
- optical member
- indicator
- range display
- Prior art date
Links
- 238000001514 detection method Methods 0.000 title claims description 58
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 230000003287 optical effect Effects 0.000 claims description 113
- 239000000758 substrate Substances 0.000 claims description 88
- 230000010287 polarization Effects 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 5
- 238000012360 testing method Methods 0.000 claims description 2
- 238000001459 lithography Methods 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 10
- 238000005286 illumination Methods 0.000 description 9
- 241000276498 Pollachius virens Species 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013211430A JP6228420B2 (ja) | 2013-10-08 | 2013-10-08 | 検出装置、リソグラフィ装置、および物品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201514634A TW201514634A (zh) | 2015-04-16 |
| TWI557517B true TWI557517B (zh) | 2016-11-11 |
Family
ID=52791741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103126742A TWI557517B (zh) | 2013-10-08 | 2014-08-05 | A detection device, a lithographic apparatus, and a manufacturing method of the device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6228420B2 (enrdf_load_stackoverflow) |
| KR (2) | KR101783514B1 (enrdf_load_stackoverflow) |
| CN (1) | CN104516214B (enrdf_load_stackoverflow) |
| TW (1) | TWI557517B (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6926596B2 (ja) * | 2017-03-31 | 2021-08-25 | ウシオ電機株式会社 | 露光装置および露光方法 |
| WO2020126810A1 (en) * | 2018-12-20 | 2020-06-25 | Asml Holding N.V. | Apparatus for and method of simultaneously acquiring parallel alignment marks |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120099107A1 (en) * | 2010-10-25 | 2012-04-26 | Samsung Electronics Co., Ltd. | Workpiece Alignment Device |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0721586B2 (ja) * | 1985-09-30 | 1995-03-08 | 株式会社ニコン | 像形成光学装置 |
| US5148214A (en) * | 1986-05-09 | 1992-09-15 | Canon Kabushiki Kaisha | Alignment and exposure apparatus |
| JPS62262426A (ja) * | 1986-05-09 | 1987-11-14 | Canon Inc | 露光装置 |
| JP3074579B2 (ja) * | 1992-01-31 | 2000-08-07 | キヤノン株式会社 | 位置ずれ補正方法 |
| KR100464854B1 (ko) * | 2002-06-26 | 2005-01-06 | 삼성전자주식회사 | 반도체 기판의 정렬 방법 및 정렬 장치 |
| US7388663B2 (en) * | 2004-10-28 | 2008-06-17 | Asml Netherlands B.V. | Optical position assessment apparatus and method |
| KR20080101865A (ko) * | 2006-02-16 | 2008-11-21 | 가부시키가이샤 니콘 | 노광 장치, 노광 방법 및 디바이스 제조 방법 |
| CN101410945B (zh) * | 2006-08-31 | 2013-03-27 | 株式会社尼康 | 与移动体驱动、图案形成、曝光相关的方法和装置 |
| CN101526750B (zh) * | 2009-01-13 | 2011-06-29 | 上海微电子装备有限公司 | 用于光刻设备的对准系统及应用其的光刻设备 |
| CN101950132A (zh) * | 2010-08-17 | 2011-01-19 | 中国科学院光电技术研究所 | 纳米光刻掩模硅片间隙测量及调平装置 |
| CN102141738B (zh) * | 2011-04-02 | 2012-09-19 | 中国科学院光电技术研究所 | 一种用于投影光刻纳米量级自动调焦系统 |
| JP5713961B2 (ja) * | 2011-06-21 | 2015-05-07 | キヤノン株式会社 | 位置検出装置、インプリント装置及び位置検出方法 |
-
2013
- 2013-10-08 JP JP2013211430A patent/JP6228420B2/ja active Active
-
2014
- 2014-08-05 TW TW103126742A patent/TWI557517B/zh active
- 2014-09-28 CN CN201410506206.1A patent/CN104516214B/zh active Active
- 2014-09-29 KR KR1020140130019A patent/KR101783514B1/ko active Active
-
2017
- 2017-02-02 KR KR1020170015116A patent/KR101828739B1/ko active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120099107A1 (en) * | 2010-10-25 | 2012-04-26 | Samsung Electronics Co., Ltd. | Workpiece Alignment Device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015076491A (ja) | 2015-04-20 |
| JP6228420B2 (ja) | 2017-11-08 |
| KR101783514B1 (ko) | 2017-09-29 |
| CN104516214A (zh) | 2015-04-15 |
| KR20170016421A (ko) | 2017-02-13 |
| KR20150041579A (ko) | 2015-04-16 |
| TW201514634A (zh) | 2015-04-16 |
| CN104516214B (zh) | 2017-04-26 |
| KR101828739B1 (ko) | 2018-02-12 |
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