TWI553663B - 用於印刷電極之組合物 - Google Patents

用於印刷電極之組合物 Download PDF

Info

Publication number
TWI553663B
TWI553663B TW099129532A TW99129532A TWI553663B TW I553663 B TWI553663 B TW I553663B TW 099129532 A TW099129532 A TW 099129532A TW 99129532 A TW99129532 A TW 99129532A TW I553663 B TWI553663 B TW I553663B
Authority
TW
Taiwan
Prior art keywords
composition
weight
oxide
organometallic compound
metal
Prior art date
Application number
TW099129532A
Other languages
English (en)
Chinese (zh)
Other versions
TW201120913A (en
Inventor
賈格 法蘭克 克萊恩
史蒂芬 賀米司
喬根 卡克祖
Original Assignee
巴地斯顏料化工廠
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 巴地斯顏料化工廠 filed Critical 巴地斯顏料化工廠
Publication of TW201120913A publication Critical patent/TW201120913A/zh
Application granted granted Critical
Publication of TWI553663B publication Critical patent/TWI553663B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/30—Coatings
    • H10F77/306—Coatings for devices having potential barriers
    • H10F77/311—Coatings for devices having potential barriers for photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Photovoltaic Devices (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Printing Methods (AREA)
TW099129532A 2009-09-04 2010-09-01 用於印刷電極之組合物 TWI553663B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP09169548 2009-09-04

Publications (2)

Publication Number Publication Date
TW201120913A TW201120913A (en) 2011-06-16
TWI553663B true TWI553663B (zh) 2016-10-11

Family

ID=43466380

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099129532A TWI553663B (zh) 2009-09-04 2010-09-01 用於印刷電極之組合物

Country Status (10)

Country Link
US (1) US9396833B2 (enExample)
EP (1) EP2474004B1 (enExample)
JP (1) JP5984671B2 (enExample)
KR (1) KR101874125B1 (enExample)
CN (1) CN102576575B (enExample)
ES (1) ES2536696T3 (enExample)
MY (1) MY158807A (enExample)
SG (1) SG178931A1 (enExample)
TW (1) TWI553663B (enExample)
WO (1) WO2011026852A1 (enExample)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5898097B2 (ja) 2010-02-17 2016-04-06 ビーエーエスエフ ソシエタス・ヨーロピアBasf Se 太陽電池間の導電性接着剤の調製方法
KR101428131B1 (ko) * 2010-10-28 2014-08-07 엘지이노텍 주식회사 전도성 페이스트 조성물
WO2012058358A1 (en) * 2010-10-28 2012-05-03 Ferro Corporation Solar cell metallizations containing metal additive
US8512463B2 (en) 2011-04-05 2013-08-20 E I Du Pont De Nemours And Company Thick film paste containing bismuth-tellurium-oxide and its use in the manufacture of semiconductor devices
EP2607327A1 (en) * 2011-12-23 2013-06-26 Heraeus Precious Metals GmbH & Co. KG Thick-film composition containing antimony oxides and their use in the manufacture of semi-conductor devices
JP6246135B2 (ja) * 2012-01-18 2017-12-13 ヘレウス プレシャス メタルズ ノース アメリカ コンショホーケン エルエルシー 有機亜鉛化合物を含有する太陽電池の金属化
CN104254924A (zh) * 2012-03-16 2014-12-31 三洋电机株式会社 太阳能电池组件
US8845932B2 (en) 2012-04-26 2014-09-30 E I Du Pont De Nemours And Company Thick film paste containing bismuth-tellurium-oxide and its use in the manufacture of semiconductor devices
US10263126B2 (en) * 2012-12-27 2019-04-16 Applied Caviatation, Inc. Cavitation apparatus and method of using same
KR101587683B1 (ko) 2013-02-15 2016-01-21 제일모직주식회사 태양전지 전극 형성용 조성물 및 이로부터 제조된 전극
JP6077892B2 (ja) * 2013-03-08 2017-02-08 兵庫県 導体形成用ペースト
KR101596548B1 (ko) * 2013-03-27 2016-02-22 제일모직주식회사 태양전지 전극 형성용 조성물 및 이로부터 제조된 전극
KR101590227B1 (ko) * 2013-06-05 2016-01-29 제일모직주식회사 태양전지 전극 형성용 조성물 및 이로부터 제조된 전극
DE102013107693B4 (de) * 2013-07-18 2021-05-06 Pictiva Displays International Limited Verfahren zum Ausbilden einer Leiterbahnstruktur auf einer Elektrodenfläche eines elektronischen Bauelementes
CN103745763B (zh) * 2014-01-21 2016-04-27 江苏欧耐尔新型材料有限公司 太阳能电池背面电极浆料及其制备方法
US20170141249A1 (en) * 2014-07-21 2017-05-18 Sun Chemical Corporation A silver paste containing organobismuth compounds and its use in solar cells
TWI521548B (zh) * 2014-12-08 2016-02-11 碩禾電子材料股份有限公司 一種含無鉛玻璃熔塊之導電漿(四)
TWI563517B (en) * 2015-05-22 2016-12-21 Chuan Hsi Res Co Ltd Conductive paste composition, conductive structure and method of producing the same
CN104979035B (zh) * 2015-06-26 2017-05-03 武汉优乐光电科技有限公司 一种无铅复合玻璃粘结剂太阳能电池正银浆料
CN106531818B (zh) * 2015-09-15 2017-12-01 比亚迪股份有限公司 太阳能电池正极栅线和太阳能电池及其制作方法
KR102553644B1 (ko) * 2016-02-17 2023-07-11 나믹스 가부시끼가이샤 도전성 페이스트
CN106057277A (zh) * 2016-06-03 2016-10-26 常州聚和新材料股份有限公司 一种用于形成背钝化太阳电池背面银电极的银浆
CN106653148A (zh) * 2016-12-16 2017-05-10 杭州杭硕新材料科技有限公司 一种晶硅太阳能电池背面电极银浆及其制备方法
CN107634012B (zh) * 2017-09-13 2021-05-07 京东方科技集团股份有限公司 一种封装基板及其制备方法、显示面板、显示装置
US10851257B2 (en) * 2017-11-08 2020-12-01 Eastman Kodak Company Silver and copper nanoparticle composites
DE102018111132A1 (de) * 2018-05-09 2019-11-14 Lpkf Laser & Electronics Aktiengesellschaft Verwendung einer Komponente in einer Zusammensetzung, Zusammensetzung für den Lasertransferdruck sowie Lasertransferdruckverfahren
CN109493993B (zh) * 2018-12-07 2020-11-27 浙江中希电子科技有限公司 一种用于晶硅太阳能电池正面电极的银浆料及其制备方法
JP7263771B2 (ja) * 2018-12-28 2023-04-25 凸版印刷株式会社 塗布剤、吐出物及び塗布装置
FR3104600B1 (fr) * 2019-12-11 2022-04-22 Genesink Sa Encre à base de nanoparticules d’argent
WO2021119428A2 (en) * 2019-12-12 2021-06-17 Bert Thin Films, Llc Pastes for solar cells, solar cells, and methods of making same
US12686224B2 (en) 2021-11-09 2026-07-21 Wuhan DR Laser Technology Corp., LTD Pattern transfer printing systems and methods
IL297544A (en) * 2021-10-22 2023-05-01 Wuhan Dr Laser Tech Corp Ltd Sheets and methods for transferring a pattern with a release layer and/or paste mixtures
US20250196510A1 (en) * 2022-12-21 2025-06-19 Heliosonic Gmbh Printing process using particles of non-amorphous carbon allotropes
US20240218194A1 (en) * 2022-12-22 2024-07-04 Trustees Of Boston University 3d printing materials
KR102823138B1 (ko) * 2023-11-24 2025-06-23 (주)창성 니켈 페이스트 조성물, 이를 제조하는 방법 및 이를 포함하는 전극

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101189719A (zh) * 2005-06-03 2008-05-28 费罗公司 无铅太阳能电池接触层
CN101336488A (zh) * 2006-02-02 2008-12-31 E.I.内穆尔杜邦公司 用于太阳能电池电极和太阳能电池的糊料

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10210146A1 (de) 2002-03-07 2003-09-25 Aurentum Innovationstechnologi Qualitätsdruckverfahren und Druckmaschine sowie Drucksbustanz hierfür
US20040055635A1 (en) * 2002-09-19 2004-03-25 Hiroshi Nagakubo Conductive paste, method for manufacturing solar battery, and solar battery
JP4496216B2 (ja) * 2004-06-23 2010-07-07 ハリマ化成株式会社 導電性金属ペースト
JP4393938B2 (ja) 2004-07-16 2010-01-06 信越化学工業株式会社 電極材料及び太陽電池、並びに太陽電池の製造方法
US20060231802A1 (en) * 2005-04-14 2006-10-19 Takuya Konno Electroconductive thick film composition, electrode, and solar cell formed therefrom
US7494607B2 (en) * 2005-04-14 2009-02-24 E.I. Du Pont De Nemours And Company Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom
US7326367B2 (en) * 2005-04-25 2008-02-05 E.I. Du Pont De Nemours And Company Thick film conductor paste compositions for LTCC tape in microwave applications
JP4844805B2 (ja) * 2005-05-20 2011-12-28 住友電気工業株式会社 金属被膜の形成方法
JP4918994B2 (ja) * 2005-05-30 2012-04-18 住友電気工業株式会社 金属被膜の形成方法および金属配線
JP2007012371A (ja) * 2005-06-29 2007-01-18 E I Du Pont De Nemours & Co 導電組成物およびプラズマディスプレイの背面基板の製造方法
JP5070808B2 (ja) * 2005-11-11 2012-11-14 三菱マテリアル株式会社 太陽電池の電極形成用組成物及び該電極の形成方法並びに該形成方法により得られた電極を用いた太陽電池
WO2007125879A1 (ja) * 2006-04-25 2007-11-08 Sharp Corporation 太陽電池電極用導電性ペースト
KR101394704B1 (ko) 2006-06-30 2014-05-16 미쓰비시 마테리알 가부시키가이샤 태양 전지의 전극 형성용 조성물 및 그 전극의 형성 방법, 그리고 그 형성 방법에 의해 얻어진 전극을 사용한 태양 전지
JP5422878B2 (ja) * 2006-10-24 2014-02-19 東レ株式会社 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法
JP5151230B2 (ja) * 2007-02-23 2013-02-27 三菱マテリアル株式会社 太陽電池の電極形成用組成物及び該電極の形成方法並びに該形成方法により得られた電極を用いた太陽電池の製造方法
US8383011B2 (en) * 2008-01-30 2013-02-26 Basf Se Conductive inks with metallo-organic modifiers
KR20100126505A (ko) 2008-03-13 2010-12-01 바스프 에스이 금속층을 기재에 도포하기 위한 방법 및 분산액 및 금속화가능한 열가소성 몰딩 화합물
TWI470041B (zh) 2008-06-09 2015-01-21 Basf Se 用於施加金屬層之分散液
RU2505889C2 (ru) 2008-06-18 2014-01-27 Басф Се Способ изготовления электродов для солнечных батарей
US8789466B2 (en) 2008-10-02 2014-07-29 Basf Se Method for printing substrates
PH12011501221A1 (en) 2008-12-17 2010-06-24 Basf Se Method and printing press for printing a substrate
JP2012512065A (ja) 2008-12-17 2012-05-31 ビーエーエスエフ ソシエタス・ヨーロピア 基体を印刷する印刷機及び印刷方法
WO2010069902A1 (de) 2008-12-17 2010-06-24 Basf Se Verfahren und druckmaschine zum bedrucken eines substrats
EP2379332B1 (de) 2008-12-17 2014-02-26 Basf Se Verfahren zum bedrucken eines substrates

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101189719A (zh) * 2005-06-03 2008-05-28 费罗公司 无铅太阳能电池接触层
CN101336488A (zh) * 2006-02-02 2008-12-31 E.I.内穆尔杜邦公司 用于太阳能电池电极和太阳能电池的糊料

Also Published As

Publication number Publication date
CN102576575A (zh) 2012-07-11
TW201120913A (en) 2011-06-16
SG178931A1 (en) 2012-04-27
EP2474004A1 (de) 2012-07-11
ES2536696T3 (es) 2015-05-27
JP2013504152A (ja) 2013-02-04
KR101874125B1 (ko) 2018-07-03
CN102576575B (zh) 2015-11-25
JP5984671B2 (ja) 2016-09-06
WO2011026852A1 (de) 2011-03-10
EP2474004B1 (de) 2015-02-25
US9396833B2 (en) 2016-07-19
KR20120045067A (ko) 2012-05-08
US20120161081A1 (en) 2012-06-28
MY158807A (en) 2016-11-15

Similar Documents

Publication Publication Date Title
US9396833B2 (en) Composition for printing electrodes
TWI553659B (zh) 用於印刷導線軌之組合物及製造太陽能電池的方法
JP6396335B2 (ja) 太陽電池電極形成用組成物及びこれを用いて製造された電極
JP6392354B2 (ja) 太陽電池電極形成用組成物及びこれによって製造された電極
TWI521545B (zh) 一種含無鉛玻璃熔塊之導電漿(二)
TWI505294B (zh) 一種含無鉛玻璃熔塊之導電漿(六)
TWI521548B (zh) 一種含無鉛玻璃熔塊之導電漿(四)
TWI591652B (zh) 一種含無鉛玻璃熔塊之導電漿(五)
CN104916348B (zh) 用于太阳能电池电极的导电浆料
KR101596548B1 (ko) 태양전지 전극 형성용 조성물 및 이로부터 제조된 전극
KR20150010512A (ko) 태양전지 전극 형성용 조성물 및 이로부터 제조된 전극
JP2016521014A (ja) 太陽電池電極形成用組成物及びこれを用いて製造された電極
TWI521546B (zh) 一種含無鉛玻璃熔塊之導電漿(三)
KR101648245B1 (ko) 태양전지 전극 형성용 조성물 및 이로부터 제조된 전극
KR102495578B1 (ko) 은 미립자 분산액
JP2019507937A (ja) 太陽電池電極調製用ペースト組成物、太陽電池の電極及び太陽電池
JP2010202910A (ja) 銀ナノ粒子及びこの銀ナノ粒子を用いた組成物並びにこの組成物を用いた導電性塗膜

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees