ES2536696T3 - Composición para imprimir electrodos - Google Patents
Composición para imprimir electrodos Download PDFInfo
- Publication number
- ES2536696T3 ES2536696T3 ES10747636.8T ES10747636T ES2536696T3 ES 2536696 T3 ES2536696 T3 ES 2536696T3 ES 10747636 T ES10747636 T ES 10747636T ES 2536696 T3 ES2536696 T3 ES 2536696T3
- Authority
- ES
- Spain
- Prior art keywords
- weight
- agents
- composition
- tin
- additives
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000203 mixture Substances 0.000 title abstract 3
- 239000003795 chemical substances by application Substances 0.000 abstract 5
- 239000000654 additive Substances 0.000 abstract 3
- 239000002245 particle Substances 0.000 abstract 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 2
- 238000010521 absorption reaction Methods 0.000 abstract 2
- 230000014759 maintenance of location Effects 0.000 abstract 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract 2
- 230000005855 radiation Effects 0.000 abstract 2
- 229910052718 tin Inorganic materials 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 abstract 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 abstract 1
- 230000000996 additive effect Effects 0.000 abstract 1
- 239000002518 antifoaming agent Substances 0.000 abstract 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 239000008139 complexing agent Substances 0.000 abstract 1
- 239000003431 cross linking reagent Substances 0.000 abstract 1
- 239000006185 dispersion Substances 0.000 abstract 1
- 238000001035 drying Methods 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- 230000008020 evaporation Effects 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910003437 indium oxide Inorganic materials 0.000 abstract 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 abstract 1
- 239000001023 inorganic pigment Substances 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 229910052746 lanthanum Inorganic materials 0.000 abstract 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 abstract 1
- 239000011159 matrix material Substances 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 abstract 1
- 150000002902 organometallic compounds Chemical class 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 239000004014 plasticizer Substances 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 239000013008 thixotropic agent Substances 0.000 abstract 1
- 239000011135 tin Substances 0.000 abstract 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 abstract 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 abstract 1
- 229910052721 tungsten Inorganic materials 0.000 abstract 1
- 239000010937 tungsten Substances 0.000 abstract 1
- 229910001930 tungsten oxide Inorganic materials 0.000 abstract 1
- 239000000080 wetting agent Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/30—Coatings
- H10F77/306—Coatings for devices having potential barriers
- H10F77/311—Coatings for devices having potential barriers for photovoltaic cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Conductive Materials (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Photovoltaic Devices (AREA)
- Printing Plates And Materials Therefor (AREA)
- Printing Methods (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP09169548 | 2009-09-04 | ||
| EP09169548 | 2009-09-04 | ||
| PCT/EP2010/062775 WO2011026852A1 (de) | 2009-09-04 | 2010-09-01 | Zusammensetzung zum drucken von elektroden |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2536696T3 true ES2536696T3 (es) | 2015-05-27 |
Family
ID=43466380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES10747636.8T Active ES2536696T3 (es) | 2009-09-04 | 2010-09-01 | Composición para imprimir electrodos |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US9396833B2 (enExample) |
| EP (1) | EP2474004B1 (enExample) |
| JP (1) | JP5984671B2 (enExample) |
| KR (1) | KR101874125B1 (enExample) |
| CN (1) | CN102576575B (enExample) |
| ES (1) | ES2536696T3 (enExample) |
| MY (1) | MY158807A (enExample) |
| SG (1) | SG178931A1 (enExample) |
| TW (1) | TWI553663B (enExample) |
| WO (1) | WO2011026852A1 (enExample) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MX2012009464A (es) | 2010-02-17 | 2012-09-12 | Basf Se | Proceso para producir uniones conductoras de electricidad entre celdas solares. |
| KR101428131B1 (ko) * | 2010-10-28 | 2014-08-07 | 엘지이노텍 주식회사 | 전도성 페이스트 조성물 |
| JP6043291B2 (ja) * | 2010-10-28 | 2016-12-14 | ヘレウス プレシャス メタルズ ノース アメリカ コンショホーケン エルエルシー | 金属添加剤を含有する太陽電池メタライゼーション材料 |
| US8512463B2 (en) | 2011-04-05 | 2013-08-20 | E I Du Pont De Nemours And Company | Thick film paste containing bismuth-tellurium-oxide and its use in the manufacture of semiconductor devices |
| EP2607327A1 (en) * | 2011-12-23 | 2013-06-26 | Heraeus Precious Metals GmbH & Co. KG | Thick-film composition containing antimony oxides and their use in the manufacture of semi-conductor devices |
| KR20140114881A (ko) * | 2012-01-18 | 2014-09-29 | 헤레우스 프레셔스 메탈즈 노스 아메리카 콘쇼호켄 엘엘씨 | 유기 아연 화합물을 포함하는 태양 전지 금속화 |
| CN104254924A (zh) * | 2012-03-16 | 2014-12-31 | 三洋电机株式会社 | 太阳能电池组件 |
| US8845932B2 (en) | 2012-04-26 | 2014-09-30 | E I Du Pont De Nemours And Company | Thick film paste containing bismuth-tellurium-oxide and its use in the manufacture of semiconductor devices |
| KR101683412B1 (ko) * | 2012-12-27 | 2016-12-06 | 어플라이드 캐비테이션 아이엔씨. | 공동화 장치 및 공동화 장치의 이용 방법 |
| KR101587683B1 (ko) * | 2013-02-15 | 2016-01-21 | 제일모직주식회사 | 태양전지 전극 형성용 조성물 및 이로부터 제조된 전극 |
| JP6077892B2 (ja) * | 2013-03-08 | 2017-02-08 | 兵庫県 | 導体形成用ペースト |
| KR101596548B1 (ko) * | 2013-03-27 | 2016-02-22 | 제일모직주식회사 | 태양전지 전극 형성용 조성물 및 이로부터 제조된 전극 |
| KR101590227B1 (ko) * | 2013-06-05 | 2016-01-29 | 제일모직주식회사 | 태양전지 전극 형성용 조성물 및 이로부터 제조된 전극 |
| DE102013107693B4 (de) | 2013-07-18 | 2021-05-06 | Pictiva Displays International Limited | Verfahren zum Ausbilden einer Leiterbahnstruktur auf einer Elektrodenfläche eines elektronischen Bauelementes |
| CN103745763B (zh) * | 2014-01-21 | 2016-04-27 | 江苏欧耐尔新型材料有限公司 | 太阳能电池背面电极浆料及其制备方法 |
| WO2016014246A1 (en) * | 2014-07-21 | 2016-01-28 | Sun Chemical Corporation | A silver paste containing organobismuth compounds and its use in solar cells |
| TWI521548B (zh) * | 2014-12-08 | 2016-02-11 | 碩禾電子材料股份有限公司 | 一種含無鉛玻璃熔塊之導電漿（四） |
| TWI563517B (en) * | 2015-05-22 | 2016-12-21 | Chuan Hsi Res Co Ltd | Conductive paste composition, conductive structure and method of producing the same |
| CN104979035B (zh) * | 2015-06-26 | 2017-05-03 | 武汉优乐光电科技有限公司 | 一种无铅复合玻璃粘结剂太阳能电池正银浆料 |
| CN106531818B (zh) * | 2015-09-15 | 2017-12-01 | 比亚迪股份有限公司 | 太阳能电池正极栅线和太阳能电池及其制作方法 |
| CN108604475B (zh) * | 2016-02-17 | 2020-09-25 | 纳美仕有限公司 | 导电性糊剂 |
| CN106057277A (zh) * | 2016-06-03 | 2016-10-26 | 常州聚和新材料股份有限公司 | 一种用于形成背钝化太阳电池背面银电极的银浆 |
| CN106653148A (zh) * | 2016-12-16 | 2017-05-10 | 杭州杭硕新材料科技有限公司 | 一种晶硅太阳能电池背面电极银浆及其制备方法 |
| CN107634012B (zh) * | 2017-09-13 | 2021-05-07 | 京东方科技集团股份有限公司 | 一种封装基板及其制备方法、显示面板、显示装置 |
| US10851257B2 (en) * | 2017-11-08 | 2020-12-01 | Eastman Kodak Company | Silver and copper nanoparticle composites |
| DE102018111132A1 (de) * | 2018-05-09 | 2019-11-14 | Lpkf Laser & Electronics Aktiengesellschaft | Verwendung einer Komponente in einer Zusammensetzung, Zusammensetzung für den Lasertransferdruck sowie Lasertransferdruckverfahren |
| CN109493993B (zh) * | 2018-12-07 | 2020-11-27 | 浙江中希电子科技有限公司 | 一种用于晶硅太阳能电池正面电极的银浆料及其制备方法 |
| JP7263771B2 (ja) * | 2018-12-28 | 2023-04-25 | 凸版印刷株式会社 | 塗布剤、吐出物及び塗布装置 |
| FR3104600B1 (fr) * | 2019-12-11 | 2022-04-22 | Genesink Sa | Encre à base de nanoparticules d’argent |
| CN119403289A (zh) * | 2019-12-12 | 2025-02-07 | 伯特薄膜有限责任公司 | 用于太阳能电池的糊料、太阳能电池及其制造方法 |
| IL297544A (en) * | 2021-10-22 | 2023-05-01 | Wuhan Dr Laser Tech Corp Ltd | Sheets and methods for transferring a pattern with a release layer and/or paste mixtures |
| US20240218194A1 (en) * | 2022-12-22 | 2024-07-04 | Trustees Of Boston University | 3d printing materials |
| KR102823138B1 (ko) * | 2023-11-24 | 2025-06-23 | (주)창성 | 니켈 페이스트 조성물, 이를 제조하는 방법 및 이를 포함하는 전극 |
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| DE10210146A1 (de) | 2002-03-07 | 2003-09-25 | Aurentum Innovationstechnologi | Qualitätsdruckverfahren und Druckmaschine sowie Drucksbustanz hierfür |
| US20040055635A1 (en) * | 2002-09-19 | 2004-03-25 | Hiroshi Nagakubo | Conductive paste, method for manufacturing solar battery, and solar battery |
| EP1780732B1 (en) * | 2004-06-23 | 2009-04-01 | Harima Chemicals, Inc. | Conductive metal paste |
| JP4393938B2 (ja) | 2004-07-16 | 2010-01-06 | 信越化学工業株式会社 | 電極材料及び太陽電池、並びに太陽電池の製造方法 |
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| US20060231802A1 (en) * | 2005-04-14 | 2006-10-19 | Takuya Konno | Electroconductive thick film composition, electrode, and solar cell formed therefrom |
| US7326367B2 (en) * | 2005-04-25 | 2008-02-05 | E.I. Du Pont De Nemours And Company | Thick film conductor paste compositions for LTCC tape in microwave applications |
| JP4844805B2 (ja) * | 2005-05-20 | 2011-12-28 | 住友電気工業株式会社 | 金属被膜の形成方法 |
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| JP2007235082A (ja) * | 2006-02-02 | 2007-09-13 | E I Du Pont De Nemours & Co | 太陽電池電極用ペースト |
| EP2015367A4 (en) * | 2006-04-25 | 2011-10-05 | Sharp Kk | ELECTROCONDUCTIVE PULP FOR SOLAR BATTERY ELECTRODE |
| TWI399759B (zh) | 2006-06-30 | 2013-06-21 | Mitsubishi Materials Corp | 形成太陽電池之電極用組成物及該電極之形成方法以及使用依該形成方法所得電極之太陽電池 |
| JP5422878B2 (ja) * | 2006-10-24 | 2014-02-19 | 東レ株式会社 | 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法 |
| JP5151229B2 (ja) * | 2007-02-23 | 2013-02-27 | 三菱マテリアル株式会社 | 太陽電池の電極形成用組成物及び該電極の形成方法並びに該形成方法により得られた電極を用いた太陽電池の製造方法 |
| US8383011B2 (en) * | 2008-01-30 | 2013-02-26 | Basf Se | Conductive inks with metallo-organic modifiers |
| KR20100126505A (ko) | 2008-03-13 | 2010-12-01 | 바스프 에스이 | 금속층을 기재에 도포하기 위한 방법 및 분산액 및 금속화가능한 열가소성 몰딩 화합물 |
| TWI470041B (zh) | 2008-06-09 | 2015-01-21 | Basf Se | 用於施加金屬層之分散液 |
| CA2728055C (en) | 2008-06-18 | 2017-04-04 | Basf Se | Process for producing electrodes for solar cells |
| DK2342296T3 (da) | 2008-10-02 | 2013-11-25 | Basf Se | Fremgangsmåde til trykning på substrater |
| PH12011501221A1 (en) | 2008-12-17 | 2010-06-24 | Basf Se | Method and printing press for printing a substrate |
| EP2385900B1 (de) | 2008-12-17 | 2013-02-20 | Basf Se | Druckmaschine sowie verfahren zum bedrucken eines substrates |
| WO2010069902A1 (de) | 2008-12-17 | 2010-06-24 | Basf Se | Verfahren und druckmaschine zum bedrucken eines substrats |
| CN102317078B (zh) | 2008-12-17 | 2014-05-28 | 巴斯夫欧洲公司 | 印刷基底的方法和印刷机 |
-
2010
- 2010-09-01 SG SG2012014429A patent/SG178931A1/en unknown
- 2010-09-01 TW TW099129532A patent/TWI553663B/zh not_active IP Right Cessation
- 2010-09-01 ES ES10747636.8T patent/ES2536696T3/es active Active
- 2010-09-01 WO PCT/EP2010/062775 patent/WO2011026852A1/de not_active Ceased
- 2010-09-01 JP JP2012527305A patent/JP5984671B2/ja not_active Expired - Fee Related
- 2010-09-01 MY MYPI2012000952A patent/MY158807A/en unknown
- 2010-09-01 CN CN201080042425.9A patent/CN102576575B/zh not_active Expired - Fee Related
- 2010-09-01 EP EP10747636.8A patent/EP2474004B1/de not_active Not-in-force
- 2010-09-01 US US13/394,011 patent/US9396833B2/en not_active Expired - Fee Related
- 2010-09-01 KR KR1020127008776A patent/KR101874125B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP5984671B2 (ja) | 2016-09-06 |
| TW201120913A (en) | 2011-06-16 |
| EP2474004B1 (de) | 2015-02-25 |
| CN102576575B (zh) | 2015-11-25 |
| MY158807A (en) | 2016-11-15 |
| WO2011026852A1 (de) | 2011-03-10 |
| KR20120045067A (ko) | 2012-05-08 |
| EP2474004A1 (de) | 2012-07-11 |
| US9396833B2 (en) | 2016-07-19 |
| SG178931A1 (en) | 2012-04-27 |
| CN102576575A (zh) | 2012-07-11 |
| TWI553663B (zh) | 2016-10-11 |
| US20120161081A1 (en) | 2012-06-28 |
| JP2013504152A (ja) | 2013-02-04 |
| KR101874125B1 (ko) | 2018-07-03 |
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