TWI550606B - 再新率調整技術 - Google Patents

再新率調整技術 Download PDF

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TWI550606B
TWI550606B TW103121925A TW103121925A TWI550606B TW I550606 B TWI550606 B TW I550606B TW 103121925 A TW103121925 A TW 103121925A TW 103121925 A TW103121925 A TW 103121925A TW I550606 B TWI550606 B TW I550606B
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麥爾文K 班尼迪特
艾利克L 波皮
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惠普發展公司有限責任合夥企業
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Description

再新率調整技術
本發明係有關於再新率調整技術。
發明背景
一記憶體裝置包含有記憶體胞元來儲存數值。記憶體裝置的一實例類型為動態隨機存取記憶體(DRAM)裝置。隨著記憶體製造技術的進步,記憶體胞元的特徵尺寸已經減少,以增加在一記憶體裝置中的記憶體胞元密度。增加該記憶體胞元密度可在該記憶體裝置中提供增加的儲存容量。然而,隨著該記憶體胞元其特徵尺寸的減小,該記憶體裝置可能會變得更容易出現錯誤。
發明概要
依據本發明之一實施例,係特地提出一種方法,其包含有:藉由一記憶體控制器判定記憶體之一列已經被激活到一臨界率,其中該臨界率小於一列字錘率;藉由該記憶體控制器提高一區域的一再新率,該區域包含記憶體之該列和記憶體之一相鄰列,以對該判定做出回應來防止一列字錘錯誤;以及藉由該記憶體控制器降低該區域的該再新率,該區域包含記憶體之該列和記憶體之該相鄰列, 該降低係基於後續於該提高的一種記憶體規定。
100‧‧‧系統
102‧‧‧記憶體
104‧‧‧記憶體控制器
106‧‧‧激活率
108‧‧‧再新率
200‧‧‧系統
202‧‧‧記憶體裝置
204‧‧‧記憶體控制器
206‧‧‧激活率
208‧‧‧再新率
210‧‧‧字線
212‧‧‧記憶體之一列和記憶體 之一相鄰列
300‧‧‧流程圖
302~306‧‧‧方塊
400‧‧‧流程圖
402~410‧‧‧方塊
500‧‧‧流程圖
502~508‧‧‧方塊
600‧‧‧流程圖
602~606‧‧‧方塊
700‧‧‧流程圖
702~708‧‧‧方塊
圖1係根據一實例實現方式的一系統方塊圖。
圖2係根據一實例實現方式的一系統方塊圖。
圖3-7係根據實例實現方式所描繪出的技術流程圖,該等技術係與圖1或圖2的系統相關聯。
較佳實施例之詳細說明
計算系統可以根據不同的目來使用各式各樣的記憶體。一種類型的記憶體,依電性記憶體,由於其具優良的運作特性,故可被用作為系統記憶體。隨著依電性記憶體的進步,某些特徵已經引起了先前未曾發生過的錯誤。舉例來說,動態隨機存取記憶體(DRAM)裝置被製造出來的等特徵尺寸正以比之前更加靠近的方式把組件們彼此放在一起。當一控制器反覆地存取同一或鄰近的記憶體位置時,對在其附近位置的記憶體存在有潛在的影響。
更具體地說,電荷可被選擇性地儲存在一動態隨機存取記憶體(DRAM)裝置其基於電容器的記憶體胞元中來表示相對應的儲存資料。因為漏電流會降低該儲存的電荷量,該DRAM裝置的該等記憶體胞元要被週期性地再新,其涉及到讀出儲存在該DRAM裝置之該等記憶體胞元中的資料,和把該資料重新寫回到該等記憶體胞元中。
以一足夠高的速率重複激活一給定列(舉例來說,每一再新週期激活達數千次的量級)可能會降低儲存在 鄰近字線中的資料(這是在DRAM中的一種自然發生現象,肇因於該等DRAM特徵其相當靠近的間距),就算這些字線被定期地再新也一樣。這種重複激活錯誤可被定義為一種列字錘錯誤。換句話說,當該等激活率超過一特定的臨界值時,該週期性的再新間隔可能不足以保持該儲存的資料。
本發明描述了方法和系統可減輕上述的問題。更具體地說,本發明揭露了一種記憶體控制器,其具有一種可檢測和識別出侵略者列的能力。當如此的列被識別出時,該記憶體控制器可以調用一提高的再新率。只要持續的激活發生,該記憶體控制器會維持該提高的再新率。一旦激活下降,該記憶體控制器會把該再新率回復到一預定的速率。這可以消除僅單方面提高再新率之高效能成本,同時保持一種可防止列字錘效應的水平。
參考圖1,根據本發明的一實例,該圖描繪了一系統的一方塊圖。該系統100包含有一記憶體裝置102和一記憶體控制器104。
記憶體裝置102可以是包含有一字線和位元線陣列之任何的記憶體,該陣列易受列字錘錯誤的影響。就本發明的目的而言,在該等圖示中所討論的記憶體裝置將被稱為動態隨機存取記憶體(DRAM),然而,本發明並不侷限於此。此外,該DRAM可以與其他的DRAM一起被佈置以形成一雙行記憶體模組(DIMM)。
記憶體控制器104是一電路,其管理進入和流出記憶體裝置102的資料流。雖記憶體控制器104被圖示為一 獨立的元件,但其並不侷限於此。反而,記憶體控制器104可以被集成到其他的組件中,諸如一微處理器(圖中未示出)。此外,參考到記憶體控制器104所討論之各種不同的方面可以被併入到記憶體裝置102中。
在該所示的實例中,該系統100包含有記憶體裝置102,其易受各種類型錯誤的影響,其中包括列字錘錯誤。該記憶體控制器104,其耦合到該記憶體裝置102,將在一段時間內調整該記憶體裝置其一區域的再新率108,該區域包括記憶體之該列和記憶體之一相鄰列,以回應於記憶體之該列的激活率106接近一列字錘率的一判定。
在一實例中,該記憶體控制器104可相容於各種不同的規格,包括但並不侷限於雙資料速率3(DDR3)或雙倍資料速率4(DDR4)。由於它們的架構,該記憶體控制器104可具有可檢測並識別出侵略者列的能力,其中一侵略者列係該記憶體裝置102的一列,其在一段時間內接收到一預定數量的激活。在其他實例中,侵略者列可以透過非該記憶體控制器104的組件來確定。
在各種實例中,識別出侵略者列會包括判定一激活率106,其係在影響一列字錘錯誤之前於一段時間內一列會接收到的激活數。這個激活率160可被決定使得該記憶體控制器104可在如此錯誤發生之前具有足夠的空間可識別並減輕該列字錘的效應。
為了回應於識別出一激活率106和一侵略者列(例如,該記憶體裝置之一受影響的列),該記憶體控制器104 可調整一區域的再新率108,該區域包括記憶體之該列和記憶體之一個或多個相鄰列,或者是記憶體之該列和記憶體之該鄰列的該再新率。調整該再新率108可包括提高該再新率。在各種實例中,該再新率108的提高可以做變化,但在至少一個實例中該提高的再新率為該預設速率的2倍(2x)。在該提高開始後,該提高的再新率108可能會持續一段時間。在不同的實例中,該段時間可以是預定好的,使得在識別出之後該提高的再新率會持續一固定的時間量,或者,該提高的再新率可以是動態的,使得只要該激活率仍然高於一預定的臨界值,該提高的再新率108就會被維持。
參考圖2,根據本發明的一實例,該圖描繪了另一系統方塊圖。該系統200包含有一具有數條字線的記憶體裝置202。該記憶體裝置202耦合到一記憶體控制器204。該記憶體裝置202和該記憶體控制器204大體上類似於參照圖1所做的討論。
在圖2中,該記憶體控制器204可監控記憶體裝置202之字線210的激活率206。該記憶體控制器204可判定字線210之一的激活率在一段時間內是否正在接收一預定數目的激活,例如在一預設的再新週期內。該激活的預定數目係用來指出記憶體之該列正接近一列字錘率,其中該列字錘率是一種可能會使記憶體之其他列受到影響的激活率。
為了回應判定記憶體210之一列的該激活率正接近一列字錘率,該記憶體控制器會調整記憶體之該列和記 憶體之一相鄰列的再新率108,如在圖2中的212所示。在各種實例中,調整記憶體之該列和記憶體之該相鄰列的該再新率可以包括調整該記憶體裝置的再新率、該記憶體裝置之一區域的再新率、或識別出列的再新率。該再新率可以被提高一個倍數,諸如兩倍。一旦被提高,該記憶體控制器204會維持該提高的再新率208一段時間。
在一實例中,該段時間可基於在接近該列字錘率之後記憶體之該列的激活率保持在高於一臨界值的時間長度來決定。換句話說,一旦被提高,該記憶體控制器可以使用一個或多個其他的臨界值作為在其上的度量以決定該提高的再新速率應該要被保持多長的時間。
在另一實例中,該記憶體控制器204將維持該提高的再新率208直到記憶體之該列的激活率降低到低於一臨界值一段時間為止。該臨界值會被決定成使得在該降低不久之後需提高該再新率的可能性不高。其他的實例是可被預期的。
參考圖3-7,根據本發明的各種實例,各種不同的流程圖被圖示出。該等流程圖僅是為了說明的目的,並不意味著限制本發明的操作要依照任何特定的順序,也不旨在表明對於所有的實例所有的操作都是必需的。更確切地說,在各種不同的實例中,操作的順序可能會與在該等圖示中所示出者不同。
參考圖3,根據本發明的一實例,一第一流程圖300被圖示出。該流程圖300可開始並進展到302,在那裡一 記憶體控制器,例如在圖1~2中所示出的該記憶體控制器,可判定一記憶體之一列是否已經被激活達一臨界率,其中該臨界率小於一列字錘率。如果該記憶體控制器判定記憶體之該列尚未被激活超過一臨界率,該方法如圖所示做持續監控。
相反的是,如果該記憶體控制器判定記憶體之該列已被激活超過一臨界率,該流程圖會繼續至304,在那裡該記憶體控制器可以提高記憶體之該列和記憶體之一相鄰列的再新率。提高該再新率係回應於在302的判定,並可以防止或減輕一列字錘錯誤。
在提高該再新率的回應於中,在306該記憶體控制器可以降低記憶體之該列和記憶體之該相鄰列的再新率。降低該再新率係基於在該提高之後的一種記憶體規定。一種記憶體規定,如本說明書所使用的,是一種用於降低該再新率之預定的運作特性或規則。一旦降低該再新率,該流程圖會結束。結束,可能包括該記憶體裝置之數個字線其激活率的持續監控。
參考圖4,根據本發明的一實例其圖示出另一流程圖。該流程圖400可開始並繼續到402,在那裡一記憶體控制器可判定記憶體之一列是否已經被激活達一臨界率,其中該臨界率小於一列字錘率。在不同的實例中,該臨界率可被決定成使得達到該臨界率的列還不會觸發一列字錘錯誤,但萬一再接收到額外激活的話,基本上還是有可能觸發的。如果該記憶體控制器判定該臨界值尚未到達,該 記憶體控制器會繼續監控該記憶體裝置的該等列。
相反的是,如果該記憶體控制器判定記憶體之該列已被激活達該臨界率,該流程圖會繼續至404,在那裡該記憶體控制器可以提高該再新率為原來的兩倍。在各種其他的實例中,該提高的倍數可能會有所不同。一旦在404提高了該再新率,該記憶體控制器會在406監控記憶體之該列,以判定記憶體之該列是否正不斷地以該臨界率被激活。
如果該記憶體控制器判定記憶體之該列正不斷地以該臨界率被存取,則在406該記憶體控制器會維持該提高的再新率,並繼續監控。相反的是,如果該記憶體控制器判定該激活率並沒高於該臨界率,則在410該記憶體控制器可基於一種記憶體規定降低記憶體之該列和記憶體之該相鄰列的再新率。在各種不同的實例中,在降低該再新率之前,該記憶體控制器可以插入一個延遲408來在410朝向一降低的再新率移動的過程中實現一滯後作用。
一旦降低該再新率,該方法會結束。在各種不同的實例中,結束可能包括在402對各種臨界率的繼續監控。
參考圖5,根據各種不同的實例另一流程圖被圖示出。該流程圖500可開始並進展到502,在那裡一記憶體控制器可判定記憶體之一列是否已經以一臨界率被激活,其中該臨界率小於一列字錘率。在各種不同的實例中,該臨界率可被決定成使得達到該臨界率的列還不會觸發一列字錘錯誤,但萬一再接收到額外激活的話,基本上還是有可能觸發的。如果該記憶體控制器判定該臨界值尚未到 達,該記憶體控制器會繼續監控該記憶體裝置的該等列。
相反的是,如果該記憶體控制器判定該臨界率已到達,記憶體之該列的激活率正逼近該列字錘率,舉例來說藉由判定一激活計數在一段時間內已經達到一預定的臨界值,在504該記憶體控制器可提高該再新率為原來的兩倍。一旦在504提高了該再新率,該記憶體控制器會在506啟動一計時器。然後在506該記憶體控制器可判定該計時器是否已經失效。一旦該計時器失效,該記憶體控制器然後會降低記憶體之該列和記憶體之該相鄰列的再新率。該再新率會被降低至一預設的再新率。然後該方法會結束。在各種不同的實例中,結束,可能包括該記憶體裝置在502繼續做監控。
參考圖6,另一流程圖被圖示出。該流程圖600可開始並進展到602,在那裡一計算裝置可監控在一記憶體裝置中記憶體之一列的激活率。在604該計算裝置可判定記憶體之該列的激活率是否逼近一列字錘率。為了對判定該激活率並未逼近該列字錘率做出回應,該計算裝置會在602繼續監控該激活率。
相反的是,如果在604該計算裝置判定該激活率正逼近該列字錘率,則該計算裝置會調整記憶體之該列和記憶體之該相鄰列的再新率直到記憶體之該列的激活率降低為止。然後該方法可結束。如先前所陳述,結束,在各種不同的實例中可能包括該等激活率的繼續監控。
參考圖7,根據一實例另一流程圖被圖示出。該 流程圖700可開始並進展到702,在那裡一計算裝置可監控記憶體之一列的激活率。基於該監控,該計算裝置可判定在一段時間內一激活計數是否已經達到一預定的臨界值。如果該計算裝置並不判定該激活計數已經達到一預定的臨界值,該計算裝置可以繼續監控該激活率。
相反的是,如果在704該計算裝置判定該激活計數高於一臨界值的話,那麼該計算裝置可在706用一預先設定的倍數提高該再新率。在記憶體之該列的該激活率之後,該計算裝置可提高該再新率一段時間。在708,一旦該預設的時間段期滿時,該計算裝置會把該再新率返回到一預設的再新率。然後該方法可結束。結束,正如前面所解釋的,可能包括一個或多個記憶體裝置之激活率的持續監控。
雖然在本說明書中已被揭露的實例數量有限,但本領域的習知技藝者在理解本發明的優點之後,將會意識到可從其做出許多的修改和變化。本說明書旨在指出所附的請求項包含所有的這些修改和變化。
300‧‧‧流程圖
302~306‧‧‧方塊

Claims (15)

  1. 一種用於再新率調整之方法,其包含有:藉由一記憶體控制器判定記憶體之一列已經以一臨界率被致動,其中該臨界率小於一列字錘率;響應於該判定,藉由該記憶體控制器提高含有記憶體之該列和記憶體之一相鄰列之一區域的一再新率,來防止一列字錘錯誤;以及藉由該記憶體控制器,於該提高之後基於一種記憶體規定,降低含有記憶體之該列和記憶體之該相鄰列之該區域的該再新率。
  2. 如請求項1之方法,其中基於該記憶體規定降低含有記憶體之該列和記憶體之該相鄰列的該區域之該再新率,包含基於一段時間的期滿來降低該再新率。
  3. 如請求項1之方法,其更包含有:在提高該再新率之後,透過該記憶體控制器監視記憶體之該列,來判定記憶體之該列是否正不斷地以該臨界率被致動;以及其中基於該記憶體規定降低含有記憶體之該列和記憶體之該相鄰列的該區域之該再新率,包含基於該監視指出記憶體之該列並未正以該臨界率被致動,而降低該再新率。
  4. 如請求項3之方法,其更包含有:在該監視指出記憶體之該列並未正以該臨界率被 致動之後,藉由該記憶體延遲該降低之步驟達一段時間。
  5. 如請求項1之方法,其中提高該再新率包括把該再新率提高為原來的兩倍。
  6. 如請求項1之方法,其中提高含有記憶體之該列和記憶體之該相鄰列的該區域之該再新率,包括包含有記憶體之該列和記憶體之該相鄰列的一裝置提高該再新率。
  7. 如請求項1之方法,其中降低含有記憶體之該列和記憶體之該相鄰列的該區域之該再新率,包括把該再新率還原為一預設的再新率。
  8. 一種用於再新率調整之方法,其包含有:藉由一計算裝置監視在一記憶體裝置中記憶體之一列的致動率;藉由該計算裝置判定記憶體之該列的該致動率正逼近一列字錘率;以及藉由該計算裝置調整記憶體之該列和記憶體之一相鄰列的一再新率,直到記憶體之該列的該致動率降低為止。
  9. 如請求項8之方法,其中判定記憶體之該列的該致動率正逼近該列字錘率,包含判定一致動計數在一段時間中已經達到一預定臨界值。
  10. 如請求項8之方法,其中調整記憶體之該列和記憶體之該相鄰列的該再新率,包含把包括有記憶體之該列和記憶體之該相鄰列的一區域之再新率以一預設的倍數提 高,直到記憶體之該列的該致動率降低到一預定臨界值為止。
  11. 如請求項8之方法,其中調整記憶體之該列和記憶體之該相鄰列的該再新率,包含調整該記憶體裝置中包括記憶體之該列的一區域的再新率。
  12. 如請求項8之方法,其中調整含有記憶體之該列和記憶體之該相鄰列的區域之該再新率,包含在記憶體之該列的致動率降低之後調整該再新率達一段時間。
  13. 一種記憶體系統,該系統包含有:一記憶體裝置,以及耦合到該記憶體裝置的一記憶體控制器,該記憶體控制器用來響應於記憶體之一列的致動率逼近一列字錘率的判定,調整記憶體之該列和記憶體之一相鄰列的再新率達一段時間。
  14. 如請求項13系統,其中該段時間係基於記憶體之該列的該致動率在逼近該列字錘率之後仍然高於一臨界值的一時間長度來決定。
  15. 如請求項13之系統,其中該記憶體控制器係用來提高記憶體之該列和記憶體之該相鄰列的該再新率,直到記憶體之該列的該致動率降低到低於一臨界值達一段時間為止。
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Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9269436B2 (en) * 2013-03-12 2016-02-23 Intel Corporation Techniques for determining victim row addresses in a volatile memory
US9449671B2 (en) * 2013-03-15 2016-09-20 Intel Corporation Techniques for probabilistic dynamic random access memory row repair
US9047978B2 (en) 2013-08-26 2015-06-02 Micron Technology, Inc. Apparatuses and methods for selective row refreshes
KR20170024307A (ko) 2015-08-25 2017-03-07 삼성전자주식회사 내장형 리프레쉬 콘트롤러 및 이를 포함하는 메모리 장치
KR102329673B1 (ko) 2016-01-25 2021-11-22 삼성전자주식회사 해머 리프레쉬 동작을 수행하는 메모리 장치 및 이를 포함하는 메모리 시스템
KR20180064940A (ko) 2016-12-06 2018-06-15 삼성전자주식회사 해머 리프레쉬 동작을 수행하는 메모리 시스템
US10332579B2 (en) * 2017-11-30 2019-06-25 Nanya Technology Corporation DRAM and method for operating the same
US10580475B2 (en) 2018-01-22 2020-03-03 Micron Technology, Inc. Apparatuses and methods for calculating row hammer refresh addresses in a semiconductor device
US11152050B2 (en) 2018-06-19 2021-10-19 Micron Technology, Inc. Apparatuses and methods for multiple row hammer refresh address sequences
US10490250B1 (en) 2018-08-14 2019-11-26 Micron Technology, Inc. Apparatuses for refreshing memory of a semiconductor device
US11054995B2 (en) * 2018-09-07 2021-07-06 Micron Technology, Inc. Row hammer protection for a memory device
US10825534B2 (en) * 2018-10-26 2020-11-03 Intel Corporation Per row activation count values embedded in storage cell array storage cells
US10770127B2 (en) 2019-02-06 2020-09-08 Micron Technology, Inc. Apparatuses and methods for managing row access counts
US11043254B2 (en) 2019-03-19 2021-06-22 Micron Technology, Inc. Semiconductor device having cam that stores address signals
US10950288B2 (en) 2019-03-29 2021-03-16 Intel Corporation Refresh command control for host assist of row hammer mitigation
US11264096B2 (en) 2019-05-14 2022-03-01 Micron Technology, Inc. Apparatuses, systems, and methods for a content addressable memory cell with latch and comparator circuits
US11158364B2 (en) 2019-05-31 2021-10-26 Micron Technology, Inc. Apparatuses and methods for tracking victim rows
US11158373B2 (en) 2019-06-11 2021-10-26 Micron Technology, Inc. Apparatuses, systems, and methods for determining extremum numerical values
US10832792B1 (en) 2019-07-01 2020-11-10 Micron Technology, Inc. Apparatuses and methods for adjusting victim data
US11139015B2 (en) 2019-07-01 2021-10-05 Micron Technology, Inc. Apparatuses and methods for monitoring word line accesses
US11386946B2 (en) 2019-07-16 2022-07-12 Micron Technology, Inc. Apparatuses and methods for tracking row accesses
US10943636B1 (en) 2019-08-20 2021-03-09 Micron Technology, Inc. Apparatuses and methods for analog row access tracking
US10964378B2 (en) 2019-08-22 2021-03-30 Micron Technology, Inc. Apparatus and method including analog accumulator for determining row access rate and target row address used for refresh operation
US11200942B2 (en) 2019-08-23 2021-12-14 Micron Technology, Inc. Apparatuses and methods for lossy row access counting
US11222682B1 (en) 2020-08-31 2022-01-11 Micron Technology, Inc. Apparatuses and methods for providing refresh addresses
US11462291B2 (en) 2020-11-23 2022-10-04 Micron Technology, Inc. Apparatuses and methods for tracking word line accesses
US11482275B2 (en) 2021-01-20 2022-10-25 Micron Technology, Inc. Apparatuses and methods for dynamically allocated aggressor detection
US11600314B2 (en) 2021-03-15 2023-03-07 Micron Technology, Inc. Apparatuses and methods for sketch circuits for refresh binning
US11664063B2 (en) 2021-08-12 2023-05-30 Micron Technology, Inc. Apparatuses and methods for countering memory attacks
US11688451B2 (en) 2021-11-29 2023-06-27 Micron Technology, Inc. Apparatuses, systems, and methods for main sketch and slim sketch circuit for row address tracking
CN115906087B (zh) * 2023-03-09 2023-07-07 长鑫存储技术有限公司 行锤攻击保护方法与存储器

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5883849A (en) * 1997-06-30 1999-03-16 Micron Technology, Inc. Method and apparatus for simultaneous memory subarray testing
US20100172200A1 (en) * 2006-12-22 2010-07-08 Fujitsu Limited Memory device, memory controller and memory system
US20100188914A1 (en) * 2006-04-14 2010-07-29 Jin-Hong Ahn Self refresh operation of semiconductor memory device
US20100208537A1 (en) * 2009-02-19 2010-08-19 Pelley Iii Perry H Dynamic random access memory (dram) refresh
US20100257415A1 (en) * 2009-04-01 2010-10-07 Faraday Technology Corp. Instruction-based programmable memory built-in self test circuit and address generator thereof
US7821861B2 (en) * 2007-12-25 2010-10-26 Industrial Technology Research Institute Memory device and refresh method thereof
US7966447B2 (en) * 2007-07-06 2011-06-21 Hewlett-Packard Development Company, L.P. Systems and methods for determining refresh rate of memory based on RF activities
US20110283060A1 (en) * 2009-01-22 2011-11-17 Ware Frederick A Maintenance Operations in a DRAM
US20120250388A1 (en) * 2008-12-30 2012-10-04 Jeddeloh Joe M Variable memory refresh devices and methods

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4754425A (en) 1985-10-18 1988-06-28 Gte Communication Systems Corporation Dynamic random access memory refresh circuit selectively adapted to different clock frequencies
DE10337855B4 (de) * 2003-08-18 2005-09-29 Infineon Technologies Ag Schaltung und Verfahren zur Auswertung und Steuerung einer Auffrischungsrate von Speicherzellen eines dynamischen Speichers
JP4566621B2 (ja) 2004-05-14 2010-10-20 富士通セミコンダクター株式会社 半導体メモリ
US6958944B1 (en) 2004-05-26 2005-10-25 Taiwan Semiconductor Manufacturing Co., Ltd. Enhanced refresh circuit and method for reduction of DRAM refresh cycles
KR20050120344A (ko) 2004-06-18 2005-12-22 엘지전자 주식회사 데이터 백업에 의한 에스디램의 셀프 리프레쉬 소모전류절감 방법
US7305518B2 (en) * 2004-10-20 2007-12-04 Hewlett-Packard Development Company, L.P. Method and system for dynamically adjusting DRAM refresh rate
TWI303763B (en) * 2006-01-25 2008-12-01 Via Tech Inc Device and method for controlling refresh rate of memory
US7827861B2 (en) 2007-06-01 2010-11-09 Second Wind, Inc. Position correction in sodar and meteorological lidar systems
KR101873526B1 (ko) 2011-06-09 2018-07-02 삼성전자주식회사 에러 정정회로를 구비한 온 칩 데이터 스크러빙 장치 및 방법
US9449671B2 (en) * 2013-03-15 2016-09-20 Intel Corporation Techniques for probabilistic dynamic random access memory row repair
WO2014193412A1 (en) * 2013-05-31 2014-12-04 Hewlett-Packard Development Company, L.P. Memory error determination

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5883849A (en) * 1997-06-30 1999-03-16 Micron Technology, Inc. Method and apparatus for simultaneous memory subarray testing
US20100188914A1 (en) * 2006-04-14 2010-07-29 Jin-Hong Ahn Self refresh operation of semiconductor memory device
US20100172200A1 (en) * 2006-12-22 2010-07-08 Fujitsu Limited Memory device, memory controller and memory system
US7966447B2 (en) * 2007-07-06 2011-06-21 Hewlett-Packard Development Company, L.P. Systems and methods for determining refresh rate of memory based on RF activities
US7821861B2 (en) * 2007-12-25 2010-10-26 Industrial Technology Research Institute Memory device and refresh method thereof
US20120250388A1 (en) * 2008-12-30 2012-10-04 Jeddeloh Joe M Variable memory refresh devices and methods
US20110283060A1 (en) * 2009-01-22 2011-11-17 Ware Frederick A Maintenance Operations in a DRAM
US20100208537A1 (en) * 2009-02-19 2010-08-19 Pelley Iii Perry H Dynamic random access memory (dram) refresh
US20100257415A1 (en) * 2009-04-01 2010-10-07 Faraday Technology Corp. Instruction-based programmable memory built-in self test circuit and address generator thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Huang, R. F. et al.," Alternate hammering test for application-specific DRAMs and an industrial case study", Design Automation Conference (DAC), 2012 49th ACM/EDAC/IEEE, 3-7 June 2012 *

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