TWI545860B - 用於積體電路裝置之插座 - Google Patents
用於積體電路裝置之插座 Download PDFInfo
- Publication number
- TWI545860B TWI545860B TW101103129A TW101103129A TWI545860B TW I545860 B TWI545860 B TW I545860B TW 101103129 A TW101103129 A TW 101103129A TW 101103129 A TW101103129 A TW 101103129A TW I545860 B TWI545860 B TW I545860B
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive
- layer
- substrate
- contact pins
- conductive contact
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 139
- 239000000463 material Substances 0.000 claims description 40
- 239000004020 conductor Substances 0.000 claims description 33
- 239000003990 capacitor Substances 0.000 description 46
- 230000000694 effects Effects 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920000945 Amylopectin Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 230000004323 axial length Effects 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000636 poly(norbornene) polymer Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/6608—Structural association with built-in electrical component with built-in single component
- H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/045—Sockets or component fixtures for RF or HF testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011019951A JP6157048B2 (ja) | 2011-02-01 | 2011-02-01 | Ｉｃデバイス用ソケット |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201246728A TW201246728A (en) | 2012-11-16 |
| TWI545860B true TWI545860B (zh) | 2016-08-11 |
Family
ID=45554867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101103129A TWI545860B (zh) | 2011-02-01 | 2012-01-31 | 用於積體電路裝置之插座 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6157048B2 (enrdf_load_stackoverflow) |
| TW (1) | TWI545860B (enrdf_load_stackoverflow) |
| WO (1) | WO2012106103A1 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105137132B (zh) * | 2015-09-28 | 2018-05-15 | 国网浙江省电力公司丽水供电公司 | 高压电容器外保护用熔断器监测支架及在线监视方法 |
| US20180184517A1 (en) * | 2016-12-22 | 2018-06-28 | Google Llc | Multi-layer ic socket with an integrated impedance matching network |
| US20200003802A1 (en) * | 2018-07-02 | 2020-01-02 | Powertech Technology Inc. | Testing socket and testing apparatus |
| JP7452317B2 (ja) * | 2020-08-05 | 2024-03-19 | オムロン株式会社 | ソケット、ソケットユニット、検査治具および検査治具ユニット |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06297634A (ja) * | 1993-04-19 | 1994-10-25 | Toshiba Chem Corp | 銅張積層板及び多層銅張積層板 |
| JPH1141812A (ja) * | 1997-07-23 | 1999-02-12 | Hitachi Ltd | 電力系統用自励式変換器の制御装置 |
| JP3792445B2 (ja) * | 1999-03-30 | 2006-07-05 | 日本特殊陶業株式会社 | コンデンサ付属配線基板 |
| US6558181B2 (en) * | 2000-12-29 | 2003-05-06 | Intel Corporation | System and method for package socket with embedded power and ground planes |
| TWI277992B (en) * | 2002-10-30 | 2007-04-01 | Matsushita Electric Ind Co Ltd | Sheet capacitor, IC socket using the same, and manufacturing method of sheet capacitor |
| CN1695408A (zh) * | 2003-01-31 | 2005-11-09 | 富士通株式会社 | 多层印刷电路板、电子设备、安装方法 |
| JP4259928B2 (ja) | 2003-06-11 | 2009-04-30 | 株式会社リコー | 移送物体検出装置，原稿読取装置および画像形成装置 |
| JP2005310814A (ja) * | 2004-04-16 | 2005-11-04 | Alps Electric Co Ltd | キャパシタ内蔵基板 |
| JP2006165289A (ja) * | 2004-12-08 | 2006-06-22 | Alps Electric Co Ltd | 中継基板 |
| US7438581B1 (en) * | 2005-05-16 | 2008-10-21 | Myoungsoo Jeon | Socket having printed circuit board body portion |
| US7663387B2 (en) * | 2007-09-27 | 2010-02-16 | Yokowo Co., Ltd. | Test socket |
| JP4659087B2 (ja) * | 2008-12-17 | 2011-03-30 | パナソニック株式会社 | 差動平衡信号伝送基板 |
-
2011
- 2011-02-01 JP JP2011019951A patent/JP6157048B2/ja not_active Expired - Fee Related
-
2012
- 2012-01-17 WO PCT/US2012/021504 patent/WO2012106103A1/en active Application Filing
- 2012-01-31 TW TW101103129A patent/TWI545860B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012159425A (ja) | 2012-08-23 |
| WO2012106103A1 (en) | 2012-08-09 |
| JP6157048B2 (ja) | 2017-07-05 |
| TW201246728A (en) | 2012-11-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |