TWI538976B - 熱硬化型黏晶膜 - Google Patents

熱硬化型黏晶膜 Download PDF

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Publication number
TWI538976B
TWI538976B TW103116730A TW103116730A TWI538976B TW I538976 B TWI538976 B TW I538976B TW 103116730 A TW103116730 A TW 103116730A TW 103116730 A TW103116730 A TW 103116730A TW I538976 B TWI538976 B TW I538976B
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Taiwan
Prior art keywords
film
weight
resin
die
semiconductor wafer
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TW103116730A
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English (en)
Chinese (zh)
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TW201439273A (zh
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林美希
高本尚英
大西謙司
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日東電工股份有限公司
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Publication of TW201439273A publication Critical patent/TW201439273A/zh
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  • Engineering & Computer Science (AREA)
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  • Health & Medical Sciences (AREA)
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  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
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JP2014216488A (ja) * 2013-04-25 2014-11-17 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
JP6322026B2 (ja) * 2014-03-31 2018-05-09 日東電工株式会社 ダイボンドフィルム、ダイシングシート付きダイボンドフィルム、半導体装置、及び、半導体装置の製造方法
JP6068386B2 (ja) * 2014-03-31 2017-01-25 日東電工株式会社 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP6431343B2 (ja) * 2014-11-21 2018-11-28 日東電工株式会社 接着シート、ダイシングシート付き接着シート、積層シート及び半導体装置の製造方法
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JP6889398B2 (ja) * 2017-07-20 2021-06-18 昭和電工マテリアルズ株式会社 放熱性ダイボンディングフィルム及びダイシングダイボンディングフィルム
JP7033004B2 (ja) * 2018-05-24 2022-03-09 日東電工株式会社 ダイシングダイボンドフィルムおよび半導体装置製造方法
WO2021084778A1 (ja) * 2019-10-28 2021-05-06 昭和電工マテリアルズ株式会社 フィルム状接着剤及びその分断性評価方法、ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに半導体装置
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WO2010074060A1 (ja) 2010-07-01
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