TWI538976B - 熱硬化型黏晶膜 - Google Patents

熱硬化型黏晶膜 Download PDF

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Publication number
TWI538976B
TWI538976B TW103116730A TW103116730A TWI538976B TW I538976 B TWI538976 B TW I538976B TW 103116730 A TW103116730 A TW 103116730A TW 103116730 A TW103116730 A TW 103116730A TW I538976 B TWI538976 B TW I538976B
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TW
Taiwan
Prior art keywords
film
weight
resin
die
semiconductor wafer
Prior art date
Application number
TW103116730A
Other languages
English (en)
Chinese (zh)
Other versions
TW201439273A (zh
Inventor
林美希
高本尚英
大西謙司
Original Assignee
日東電工股份有限公司
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Application filed by 日東電工股份有限公司 filed Critical 日東電工股份有限公司
Publication of TW201439273A publication Critical patent/TW201439273A/zh
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Publication of TWI538976B publication Critical patent/TWI538976B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
    • H10W74/114—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H10W72/013—
    • H10W72/073—
    • H10W72/30—
    • H10W74/016—
    • H10W74/47—
    • H10W74/476—
    • H10W90/00—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/07338—
    • H10W72/07352—
    • H10W72/075—
    • H10W72/07533—
    • H10W72/321—
    • H10W72/325—
    • H10W72/352—
    • H10W72/353—
    • H10W72/354—
    • H10W72/381—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/884—
    • H10W74/00—
    • H10W90/231—
    • H10W90/732—
    • H10W90/734—
    • H10W90/754—
    • H10W99/00—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
TW103116730A 2008-12-24 2009-12-23 熱硬化型黏晶膜 TWI538976B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008328341 2008-12-24
JP2009288001A JP2010171402A (ja) 2008-12-24 2009-12-18 熱硬化型ダイボンドフィルム

Publications (2)

Publication Number Publication Date
TW201439273A TW201439273A (zh) 2014-10-16
TWI538976B true TWI538976B (zh) 2016-06-21

Family

ID=42287669

Family Applications (2)

Application Number Title Priority Date Filing Date
TW103116730A TWI538976B (zh) 2008-12-24 2009-12-23 熱硬化型黏晶膜
TW098144526A TWI504715B (zh) 2008-12-24 2009-12-23 熱硬化型黏晶膜

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW098144526A TWI504715B (zh) 2008-12-24 2009-12-23 熱硬化型黏晶膜

Country Status (6)

Country Link
US (1) US20120153508A1 (enExample)
JP (1) JP2010171402A (enExample)
KR (1) KR20110099116A (enExample)
CN (1) CN102265388A (enExample)
TW (2) TWI538976B (enExample)
WO (1) WO2010074060A1 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201043674A (en) * 2009-04-17 2010-12-16 Furukawa Electric Co Ltd Adhesive thin film and wafer processing tape
JP2012241063A (ja) * 2011-05-17 2012-12-10 Nitto Denko Corp 半導体装置製造用の接着シート
TW201305306A (zh) * 2011-07-25 2013-02-01 日東電工股份有限公司 接著片及其用途
JP5798834B2 (ja) * 2011-08-08 2015-10-21 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5888805B2 (ja) * 2011-09-01 2016-03-22 日東電工株式会社 接着フィルム及びダイシング・ダイボンドフィルム
JP5951207B2 (ja) * 2011-09-14 2016-07-13 リンテック株式会社 ダイシング・ダイボンディングシート
JP6144548B2 (ja) * 2012-08-01 2017-06-07 日東電工株式会社 透明導電性積層フィルム、その製造方法及びタッチパネル
JP6435088B2 (ja) 2013-04-09 2018-12-05 日東電工株式会社 半導体装置の製造に用いられる接着シート、ダイシングテープ一体型接着シート、半導体装置、及び、半導体装置の製造方法
JP2014216488A (ja) * 2013-04-25 2014-11-17 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
JP6068386B2 (ja) * 2014-03-31 2017-01-25 日東電工株式会社 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP6322026B2 (ja) * 2014-03-31 2018-05-09 日東電工株式会社 ダイボンドフィルム、ダイシングシート付きダイボンドフィルム、半導体装置、及び、半導体装置の製造方法
JP6431343B2 (ja) * 2014-11-21 2018-11-28 日東電工株式会社 接着シート、ダイシングシート付き接着シート、積層シート及び半導体装置の製造方法
EP3355341A4 (en) 2015-11-04 2019-05-01 LINTEC Corporation HARDENABLE RESIN FOIL AND FIRST PROTECTIVE FOIL WRAP
CN109005665B (zh) * 2016-03-30 2020-12-25 琳得科株式会社 半导体加工用片
JP6204639B1 (ja) * 2016-03-30 2017-09-27 三井化学東セロ株式会社 半導体装置の製造方法
JP6879690B2 (ja) * 2016-08-05 2021-06-02 スリーエム イノベイティブ プロパティズ カンパニー 放熱用樹脂組成物、その硬化物、及びこれらの使用方法
TWI723211B (zh) * 2016-09-23 2021-04-01 日商住友電木股份有限公司 熱硬化性樹脂組成物、樹脂密封基板及電子裝置
WO2018137224A1 (zh) * 2017-01-25 2018-08-02 深圳市汇顶科技股份有限公司 晶片封装结构及封装方法
JP6889398B2 (ja) * 2017-07-20 2021-06-18 昭和電工マテリアルズ株式会社 放熱性ダイボンディングフィルム及びダイシングダイボンディングフィルム
JP7033004B2 (ja) * 2018-05-24 2022-03-09 日東電工株式会社 ダイシングダイボンドフィルムおよび半導体装置製造方法
CN114600225A (zh) * 2019-10-28 2022-06-07 昭和电工材料株式会社 膜状黏合剂及其分断性评价方法、切割晶粒接合一体型膜及其制造方法以及半导体装置
JP7689440B2 (ja) * 2020-05-26 2025-06-06 日東電工株式会社 ダイボンドフィルム及びダイシングダイボンドフィルム
KR102698798B1 (ko) * 2021-12-14 2024-08-27 (주)이녹스첨단소재 스페이서용 필름 및 이를 이용한 스페이서 형성 방법
CN115260963B (zh) * 2022-09-27 2022-12-27 武汉市三选科技有限公司 低模量垂直堆叠封装用薄膜黏晶胶、其制备方法及应用

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4664005B2 (ja) * 2004-05-11 2011-04-06 リンテック株式会社 接着剤層付き半導体チップの製造方法
WO2006088180A1 (ja) * 2005-02-21 2006-08-24 Nitto Denko Corporation 半導体装置の製造方法
JP4780653B2 (ja) * 2005-02-21 2011-09-28 日東電工株式会社 半導体装置の製造方法
JP2006303472A (ja) * 2005-03-23 2006-11-02 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP4876451B2 (ja) * 2005-06-27 2012-02-15 日立化成工業株式会社 接着シート
JP5380806B2 (ja) * 2006-08-31 2014-01-08 日立化成株式会社 接着シート、一体型シート、半導体装置、及び半導体装置の製造方法
JP4620028B2 (ja) * 2006-10-19 2011-01-26 日東電工株式会社 基板加工用粘着シート
JP2008258429A (ja) * 2007-04-05 2008-10-23 Sekisui Chem Co Ltd 絶縁フィルム、電子部品装置の製造方法及び電子部品装置

Also Published As

Publication number Publication date
JP2010171402A (ja) 2010-08-05
CN102265388A (zh) 2011-11-30
WO2010074060A1 (ja) 2010-07-01
US20120153508A1 (en) 2012-06-21
TW201439273A (zh) 2014-10-16
TWI504715B (zh) 2015-10-21
TW201033319A (en) 2010-09-16
KR20110099116A (ko) 2011-09-06

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