TWI537335B - 難燃性環氧樹脂及含有該環氧樹脂為必要成分之組成物，及硬化物 - Google Patents

難燃性環氧樹脂及含有該環氧樹脂為必要成分之組成物，及硬化物 Download PDF

Info

Publication number
TWI537335B
TWI537335B TW101112968A TW101112968A TWI537335B TW I537335 B TWI537335 B TW I537335B TW 101112968 A TW101112968 A TW 101112968A TW 101112968 A TW101112968 A TW 101112968A TW I537335 B TWI537335 B TW I537335B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
phosphorus
molecular weight
phenolic
phenol
Prior art date
Application number
TW101112968A
Other languages
English (en)
Chinese (zh)
Other versions
TW201319160A (zh
Inventor
村井秀征
三宅力
Original Assignee
新日鐵住金化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新日鐵住金化學股份有限公司 filed Critical 新日鐵住金化學股份有限公司
Publication of TW201319160A publication Critical patent/TW201319160A/zh
Application granted granted Critical
Publication of TWI537335B publication Critical patent/TWI537335B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5397—Phosphine oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C08J2363/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
TW101112968A 2011-11-11 2012-04-12 難燃性環氧樹脂及含有該環氧樹脂為必要成分之組成物，及硬化物 TWI537335B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011247987A JP5911700B2 (ja) 2011-11-11 2011-11-11 難燃性エポキシ樹脂及び該エポキシ樹脂を必須成分とする組成物、硬化物

Publications (2)

Publication Number Publication Date
TW201319160A TW201319160A (zh) 2013-05-16
TWI537335B true TWI537335B (zh) 2016-06-11

Family

ID=48310693

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101112968A TWI537335B (zh) 2011-11-11 2012-04-12 難燃性環氧樹脂及含有該環氧樹脂為必要成分之組成物，及硬化物

Country Status (4)

Country Link
JP (1) JP5911700B2 (ja)
KR (1) KR101903190B1 (ja)
CN (1) CN103102470B (ja)
TW (1) TWI537335B (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6135175B2 (ja) * 2013-02-20 2017-05-31 三菱化学株式会社 多官能エポキシ樹脂組成物、硬化性エポキシ樹脂組成物及び硬化物
CN103878924A (zh) * 2014-03-27 2014-06-25 苏州益群模具有限公司 高压注塑的方法
JP6670045B2 (ja) * 2015-03-13 2020-03-18 日鉄ケミカル＆マテリアル株式会社 オキサゾリドン環含有エポキシ樹脂、その製造方法、エポキシ樹脂組成物及び硬化物
WO2018070051A1 (ja) * 2016-10-14 2018-04-19 日立化成株式会社 エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料
CN112585189B (zh) * 2018-08-27 2023-08-01 日铁化学材料株式会社 环氧树脂组合物、预浸体、层叠板、电路基板用材料、硬化物及含磷环氧树脂的制造方法
JP7211829B2 (ja) * 2019-01-23 2023-01-24 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物及びその硬化物
JP2020122034A (ja) * 2019-01-29 2020-08-13 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物及びその硬化物
JP7387413B2 (ja) * 2019-12-04 2023-11-28 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物、それを使用した積層板及びプリント回路基板
CN114192081A (zh) * 2020-09-02 2022-03-18 洛阳尖端技术研究院 自修复微胶囊、自修复电磁屏蔽修补腻子及制备方法
CN113337081B (zh) * 2021-06-28 2022-05-03 浙江华正新材料股份有限公司 复合阻燃剂及其制备方法和应用

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2823057B2 (ja) * 1990-12-20 1998-11-11 日本化薬株式会社 エポキシ樹脂の製造方法
JP3611435B2 (ja) * 1997-10-22 2005-01-19 住友ベークライト株式会社 難燃性樹脂組成物、これを用いたプリプレグ及び積層板
JP4036011B2 (ja) * 2002-02-26 2008-01-23 日立化成工業株式会社 難燃性熱硬化樹脂組成物，それを用いたプリプレグ及び電気配線板用積層板
JP5334373B2 (ja) * 2007-03-05 2013-11-06 新日鉄住金化学株式会社 新規なリン含有エポキシ樹脂、該エポキシ樹脂を必須成分とするエポキシ樹脂組成物及びその硬化物
JP5686512B2 (ja) * 2009-11-05 2015-03-18 新日鉄住金化学株式会社 リン含有エポキシ樹脂、樹脂組成物、およびその難燃性硬化物

Also Published As

Publication number Publication date
JP5911700B2 (ja) 2016-04-27
TW201319160A (zh) 2013-05-16
KR20130052495A (ko) 2013-05-22
CN103102470A (zh) 2013-05-15
CN103102470B (zh) 2016-09-07
JP2013103974A (ja) 2013-05-30
KR101903190B1 (ko) 2018-10-01

Similar Documents

Publication Publication Date Title
TWI537335B (zh) 難燃性環氧樹脂及含有該環氧樹脂為必要成分之組成物，及硬化物
TWI598371B (zh) Phosphorus-containing epoxy resin and the epoxy resin as an essential component of the composition, hardened material
TWI823991B (zh) 環氧樹脂組成物、預浸體、積層板、電路基板用材料、硬化物以及含磷環氧樹脂的製造方法
WO2022124252A1 (ja) 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物
TW202330705A (zh) 多元羥基樹脂、環氧樹脂、該等樹脂的製造方法、環氧樹脂組成物及其硬化物
TWI844752B (zh) 環氧樹脂組成物、使用其的預浸體、層疊板及印刷電路板、以及硬化物
CN102757547B (zh) 含磷和氮的环氧树脂
TWI538929B (zh) 含有磷與氮之環氧樹脂
TWI481635B (zh) 含磷及氮的環氧樹脂
JP6246126B2 (ja) シアヌル酸変性リン含有エポキシ樹脂の製造方法、該シアヌル酸変性リン含有エポキシ樹脂を含む樹脂組成物、及びその硬化物
TW202033602A (zh) 酚樹脂及其製造方法、環氧樹脂、環氧樹脂組成物、預浸體、積層板、印刷配線基板及硬化物
TW202208483A (zh) 環氧樹脂組成物、預浸體、積層板、印刷配線基板及硬化物
JP2015124251A (ja) リン含有エポキシ樹脂、その製造方法、それを含むエポキシ樹脂組成物、硬化物及び銅張り積層板