KR101903190B1 - 난연성 에폭시 수지 및 그 에폭시 수지를 필수 성분으로 하는 조성물, 경화물 - Google Patents

난연성 에폭시 수지 및 그 에폭시 수지를 필수 성분으로 하는 조성물, 경화물 Download PDF

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KR101903190B1
KR101903190B1 KR1020120044502A KR20120044502A KR101903190B1 KR 101903190 B1 KR101903190 B1 KR 101903190B1 KR 1020120044502 A KR1020120044502 A KR 1020120044502A KR 20120044502 A KR20120044502 A KR 20120044502A KR 101903190 B1 KR101903190 B1 KR 101903190B1
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KR
South Korea
Prior art keywords
epoxy resin
phosphorus
type epoxy
area
molecular weight
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KR1020120044502A
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English (en)
Korean (ko)
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KR20130052495A (ko
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히데유키 무라이
지카라 미야케
Original Assignee
신닛테츠 수미킨 가가쿠 가부시키가이샤
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Publication of KR20130052495A publication Critical patent/KR20130052495A/ko
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Publication of KR101903190B1 publication Critical patent/KR101903190B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5397—Phosphine oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C08J2363/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
KR1020120044502A 2011-11-11 2012-04-27 난연성 에폭시 수지 및 그 에폭시 수지를 필수 성분으로 하는 조성물, 경화물 KR101903190B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2011-247987 2011-11-11
JP2011247987A JP5911700B2 (ja) 2011-11-11 2011-11-11 難燃性エポキシ樹脂及び該エポキシ樹脂を必須成分とする組成物、硬化物

Publications (2)

Publication Number Publication Date
KR20130052495A KR20130052495A (ko) 2013-05-22
KR101903190B1 true KR101903190B1 (ko) 2018-10-01

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KR1020120044502A KR101903190B1 (ko) 2011-11-11 2012-04-27 난연성 에폭시 수지 및 그 에폭시 수지를 필수 성분으로 하는 조성물, 경화물

Country Status (4)

Country Link
JP (1) JP5911700B2 (ja)
KR (1) KR101903190B1 (ja)
CN (1) CN103102470B (ja)
TW (1) TWI537335B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6135175B2 (ja) * 2013-02-20 2017-05-31 三菱化学株式会社 多官能エポキシ樹脂組成物、硬化性エポキシ樹脂組成物及び硬化物
CN103878924A (zh) * 2014-03-27 2014-06-25 苏州益群模具有限公司 高压注塑的方法
JP6670045B2 (ja) * 2015-03-13 2020-03-18 日鉄ケミカル＆マテリアル株式会社 オキサゾリドン環含有エポキシ樹脂、その製造方法、エポキシ樹脂組成物及び硬化物
WO2018070051A1 (ja) * 2016-10-14 2018-04-19 日立化成株式会社 エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料
KR20210047861A (ko) * 2018-08-27 2021-04-30 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 인 함유 에폭시 수지, 에폭시 수지 조성물, 프리프레그, 적층판, 회로기판용 재료 및 경화물
JP7211829B2 (ja) * 2019-01-23 2023-01-24 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物及びその硬化物
JP2020122034A (ja) * 2019-01-29 2020-08-13 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物及びその硬化物
JP7387413B2 (ja) * 2019-12-04 2023-11-28 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物、それを使用した積層板及びプリント回路基板
CN113337081B (zh) * 2021-06-28 2022-05-03 浙江华正新材料股份有限公司 复合阻燃剂及其制备方法和应用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003246844A (ja) * 2002-02-26 2003-09-05 Hitachi Chem Co Ltd 難燃性熱硬化樹脂組成物，それを用いたプリプレグ及び電気配線板用積層板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2823057B2 (ja) * 1990-12-20 1998-11-11 日本化薬株式会社 エポキシ樹脂の製造方法
JP3611435B2 (ja) * 1997-10-22 2005-01-19 住友ベークライト株式会社 難燃性樹脂組成物、これを用いたプリプレグ及び積層板
JP5334373B2 (ja) * 2007-03-05 2013-11-06 新日鉄住金化学株式会社 新規なリン含有エポキシ樹脂、該エポキシ樹脂を必須成分とするエポキシ樹脂組成物及びその硬化物
JP5686512B2 (ja) * 2009-11-05 2015-03-18 新日鉄住金化学株式会社 リン含有エポキシ樹脂、樹脂組成物、およびその難燃性硬化物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003246844A (ja) * 2002-02-26 2003-09-05 Hitachi Chem Co Ltd 難燃性熱硬化樹脂組成物，それを用いたプリプレグ及び電気配線板用積層板

Also Published As

Publication number Publication date
CN103102470A (zh) 2013-05-15
TWI537335B (zh) 2016-06-11
JP2013103974A (ja) 2013-05-30
CN103102470B (zh) 2016-09-07
JP5911700B2 (ja) 2016-04-27
TW201319160A (zh) 2013-05-16
KR20130052495A (ko) 2013-05-22

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