TWI525311B - Wiring forming apparatus, maintenance method, and wiring forming method - Google Patents

Wiring forming apparatus, maintenance method, and wiring forming method Download PDF

Info

Publication number
TWI525311B
TWI525311B TW102137486A TW102137486A TWI525311B TW I525311 B TWI525311 B TW I525311B TW 102137486 A TW102137486 A TW 102137486A TW 102137486 A TW102137486 A TW 102137486A TW I525311 B TWI525311 B TW I525311B
Authority
TW
Taiwan
Prior art keywords
gas
maintenance
wiring
wiring forming
supply
Prior art date
Application number
TW102137486A
Other languages
English (en)
Chinese (zh)
Other versions
TW201428258A (zh
Inventor
Tetsuya Okumura
Takeshi Saito
Masami Sano
Original Assignee
Nihon Micronics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Micronics Kk filed Critical Nihon Micronics Kk
Publication of TW201428258A publication Critical patent/TW201428258A/zh
Application granted granted Critical
Publication of TWI525311B publication Critical patent/TWI525311B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Nozzles (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
  • Special Spraying Apparatus (AREA)
TW102137486A 2012-12-27 2013-10-17 Wiring forming apparatus, maintenance method, and wiring forming method TWI525311B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012284324A JP6049067B2 (ja) 2012-12-27 2012-12-27 配線形成装置、メンテナンス方法および配線形成方法

Publications (2)

Publication Number Publication Date
TW201428258A TW201428258A (zh) 2014-07-16
TWI525311B true TWI525311B (zh) 2016-03-11

Family

ID=50997446

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102137486A TWI525311B (zh) 2012-12-27 2013-10-17 Wiring forming apparatus, maintenance method, and wiring forming method

Country Status (4)

Country Link
JP (1) JP6049067B2 (ja)
KR (1) KR101492735B1 (ja)
CN (1) CN103906367B (ja)
TW (1) TWI525311B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017164565A1 (ko) * 2016-03-24 2017-09-28 주식회사 프로텍 점성 용액 도포 장치 및 점성 용액 도포 방법
US20190210060A1 (en) * 2016-07-11 2019-07-11 Toshiba Mitsubishi-Electric Industrial Systems Corporation Mist coating forming apparatus and mist coating forming method
CN110035832B (zh) * 2019-03-08 2021-04-02 璞真生活有限公司 雾化喷嘴及雾化装置
JP7408985B2 (ja) * 2019-10-07 2024-01-09 Ｔｏｐｐａｎホールディングス株式会社 印刷方法、印刷装置及び印刷物
JP6994694B2 (ja) * 2020-02-27 2022-01-14 信越化学工業株式会社 成膜用霧化装置及びこれを用いた成膜装置
CN111330767A (zh) * 2020-03-16 2020-06-26 Tcl华星光电技术有限公司 涂布机控制方法、装置和存储介质

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61242663A (ja) * 1985-04-20 1986-10-28 Toyota Motor Corp 塗装ブ−スの排熱回収方法
KR20020060353A (ko) * 2001-01-10 2002-07-18 박종섭 반도체 제조를 위한 코터 장비의 점착촉진제 결로 방지장치
JP3739287B2 (ja) 2001-02-14 2006-01-25 東京エレクトロン株式会社 減圧乾燥方法及び塗布膜形成装置
JP4759916B2 (ja) * 2002-12-13 2011-08-31 東京エレクトロン株式会社 処理装置
JP4607474B2 (ja) * 2004-02-12 2011-01-05 東京エレクトロン株式会社 成膜装置
JP4150356B2 (ja) * 2004-05-13 2008-09-17 東京エレクトロン株式会社 成膜装置及び成膜方法
JP2007038202A (ja) * 2005-02-25 2007-02-15 Ntn Corp パターン修正方法およびパターン修正装置
JP4759760B2 (ja) * 2005-07-22 2011-08-31 本多電子株式会社 微細霧化粒子洗浄装置
WO2009069210A1 (ja) 2007-11-29 2009-06-04 Kabushiki Kaisha Nihon Micronics 霧化装置、霧化方法、配線形成装置及び配線形成方法
JP5338100B2 (ja) * 2008-03-25 2013-11-13 株式会社Ｉｈｉ 塗装装置の噴射量制御方法及び装置
CN101314154A (zh) * 2008-07-01 2008-12-03 攀钢集团研究院有限公司 一种清除雾化器堵塞物的方法
JP2011251231A (ja) * 2010-06-01 2011-12-15 Panasonic Corp インクジェットヘッドおよびそれを搭載したインクジェット装置
JP5693104B2 (ja) * 2010-08-31 2015-04-01 キヤノン株式会社 インクジェット記録装置
JP5608874B2 (ja) * 2010-11-19 2014-10-15 本多電子株式会社 炭酸ガスによる変質防止超音波処理装置
JP5599701B2 (ja) * 2010-12-16 2014-10-01 株式会社日本マイクロニクス 配線形成装置

Also Published As

Publication number Publication date
CN103906367A (zh) 2014-07-02
KR101492735B1 (ko) 2015-02-11
JP2014127619A (ja) 2014-07-07
JP6049067B2 (ja) 2016-12-21
CN103906367B (zh) 2017-01-04
TW201428258A (zh) 2014-07-16
KR20140085294A (ko) 2014-07-07

Similar Documents

Publication Publication Date Title
TWI525311B (zh) Wiring forming apparatus, maintenance method, and wiring forming method
TWI466731B (zh) 成膜裝置
JP5190164B2 (ja) 基板処理システムにおける材料蒸着方法及び装置
TW200807520A (en) Methods and apparatus for cleaning a substrate
US10639665B2 (en) Substrate processing apparatus and standby method for ejection head
US7644871B2 (en) Flux spray atomization and splash control
TW201330933A (zh) 不用工具能夠分解組裝的低吐出量用液體材料噴射閥
CN105432155B (zh) 喷嘴装置
JP2009255079A (ja) 塗装装置の噴射量制御方法及び装置
JP5889710B2 (ja) 成膜装置および成膜方法
KR101284538B1 (ko) 배선 형성 장치
US20080238589A1 (en) Air cap design for controlling spray flux
JP5130616B2 (ja) 薄膜形成装置
JP5190465B2 (ja) 霧化装置、霧化方法、配線形成装置及び配線形成方法
JP4787943B2 (ja) 静電気除去装置ならびにそれを用いる半導体素子の供給および／または搬送装置、粉体の供給および／または搬送装置
JP2008272649A (ja) 薄膜形成方法および薄膜形成装置
JP2004074118A (ja) 薬液塗布装置
US20080237364A1 (en) Flux air cap and spray nozzle designs
JP2013128875A (ja) 液体材料塗布装置及びその洗浄方法
JP2010172877A (ja) 塗布装置及びノズルの待機方法
JP2007080992A (ja) パターン修正方法
JP2000015147A (ja) 静電塗布方法及び静電塗布装置
JP2007144280A (ja) パターン修正装置
JP2005305224A (ja) 液体塗布装置
KR101681829B1 (ko) 마스크 세척 장치