TWI525311B - Wiring forming apparatus, maintenance method, and wiring forming method - Google Patents
Wiring forming apparatus, maintenance method, and wiring forming method Download PDFInfo
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- TWI525311B TWI525311B TW102137486A TW102137486A TWI525311B TW I525311 B TWI525311 B TW I525311B TW 102137486 A TW102137486 A TW 102137486A TW 102137486 A TW102137486 A TW 102137486A TW I525311 B TWI525311 B TW I525311B
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- 238000000034 method Methods 0.000 title claims description 147
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- 238000000889 atomisation Methods 0.000 claims description 48
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Nozzles (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
- Special Spraying Apparatus (AREA)
Description
本發明，係有關於配線形成裝置、維修方法及配線形成方法。更詳細而言，係有關於能夠進行細微之圖案的形成，並且能夠使用在對於被形成在液晶顯示器等之平面面板顯示器的基板上之配線等的修復中之配線形成裝置、該配線形成裝置之維修方法及配線形成方法。 The present invention relates to a wiring forming apparatus, a maintenance method, and a wiring forming method. More specifically, it is possible to use a wiring forming device for repairing wiring or the like on a substrate formed on a substrate of a flat panel display such as a liquid crystal display, and a wiring forming device. Maintenance method and wiring formation method.
近年來，伴隨著液晶顯示器、電漿顯示器以及有機EL顯示器等之平面面板顯示器的大型化和高精細化，被形成在半導體基板等之基板上的配線和電極等之圖案的細微化係日益進展。而，伴隨著圖案之細微化，在配線等或電漿顯示器之隔牆(rib)等處所產生的缺陷係成為問題。作為此種缺陷，例如，在配線的情況時，係存在有圖案之一部分有所缺損並導致斷線之開路缺陷等。因此，係對於能夠抑制此種缺陷之發生並提高製造良率的電極和配線等之形成技術的提昇有所要求。並且，亦對於在發生有缺陷的情況時而能夠將其作修復之修復技術有所要求。 In recent years, with the increase in size and definition of flat panel displays such as liquid crystal displays, plasma displays, and organic EL displays, the miniaturization of patterns such as wirings and electrodes formed on substrates such as semiconductor substrates is progressing. . However, with the miniaturization of the pattern, defects such as wiring or the like of a rib or the like of the plasma display are a problem. As such a defect, for example, in the case of wiring, there is a defect in one of the patterns, an open defect in the disconnection, and the like. Therefore, there is a demand for improvement in the formation technique of electrodes, wiring, and the like which can suppress the occurrence of such defects and improve the manufacturing yield. Moreover, there is also a need for a repairing technique that can be repaired in the event of a defect.
作為將開路缺陷等作修復之修復技術，係周知有下述之方法：亦即是，在基板上之配線有所斷線的缺陷部分處，將附著於塗布針前端之導電性糊作塗布，並一面使塗布位置在電極之長度方向上橫移一面進行複數次塗布而作修復(例如，參考專利文獻1)。 As a repairing technique for repairing an open defect or the like, there is known a method in which a conductive paste adhering to a tip end of a coating needle is applied to a defect portion where a wiring on a substrate is broken. Further, the coating position is applied by applying a plurality of times while traversing the coating position in the longitudinal direction of the electrode (for example, refer to Patent Document 1).
又，係周知有在基板上而進行配線圖案之形成等的噴霧方式之開路修復裝置等的配線形成裝置(例如，參考專利文獻2)。 In addition, a wiring forming device such as a spray type open-circuit repairing device that performs a wiring pattern formation on a substrate is known (for example, refer to Patent Document 2).
[專利文獻1]日本特開2000-299059號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-299059
[專利文獻2]日本特開2007-152219號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2007-152219
然而，在專利文獻1所記載一般之修復方法中，由於係一面在配線之缺陷部分和糊槽之間進行多數次的往返而對於塗布針補充導電性糊，一面進行塗布，因此若是缺陷部分越長，則在修復中所耗費的時間係變得越長。又，由於係將導電性糊塗布為將圓形之塗布部配置為一列的形狀，因此係會有像是發生從配線之寬幅而超出的部份等的情況，要將修復部分控制為所期望之形狀一事係為困難。 However, in the general repair method described in Patent Document 1, since the conductive paste is applied to the coating needle while performing a plurality of round trips between the defective portion of the wiring and the paste tank, the coating portion is coated. Long, the time spent in repairing becomes longer. In addition, since the conductive paste is applied in such a manner that the circular coating portions are arranged in a line, the portion that exceeds the width of the wiring may be formed, and the repaired portion is controlled to be The shape of the desired thing is difficult.
因此，係對於在基板上而進行配線圖案之形成等的噴霧方式之開路修復裝置等的配線形成裝置有所注目。 Therefore, attention has been paid to a wiring forming apparatus such as a spray type open-circuit repairing device that forms a wiring pattern on a substrate.
噴霧方式之配線形成裝置，例如，係具備有將配線形成用之糊狀材料霧化為霧狀之霧化裝置、和將藉由霧化裝置而霧化了的糊狀材料朝向基板上之缺陷部分而噴射之噴嘴、和將霧化裝置和噴嘴作連接之通連管，而構成之，並使用霧化了的糊狀材料，來以將基板上之缺陷部分作修復的方式而進行配線圖案之形成。 The wiring forming apparatus of the spray method includes, for example, an atomizing device that atomizes the paste-like material for forming a mist into a mist, and a defect that the paste-like material atomized by the atomizing device faces the substrate a partially sprayed nozzle and a communication tube connecting the atomizing device and the nozzle, and using the atomized paste material to perform wiring pattern repairing the defective portion on the substrate Formation.
在此種噴霧方式之配線形成裝置中，由於係能夠一面補充糊狀材料一面進行噴射，因此相較於使塗布針在基板上之缺陷部分和糊槽之間而進行多數次之往返的專利文獻1等之中所記載之修復方法，係能夠將缺陷部分迅速地修復。 In the wiring forming apparatus of such a spray method, since it is possible to perform the ejection while replenishing the paste material, the patent document is often reciprocated as compared with the defect portion of the coating needle on the substrate and the paste tank. The repair method described in the first paragraph can quickly repair the defective portion.
然而，在先前技術之噴霧方式的配線形成裝置中，會有在將霧化裝置和噴嘴作連接之通連管內而附著有糊狀材料之霧，而在通連管內所積蓄之霧成為結露並於噴嘴中流動的情形。其結果，在先前技術之噴霧方式的配線形成裝置中，係會有噴嘴處之噴射成為不安定或者是通連管內之結露流動並堵塞塗布噴嘴的情況。 However, in the wiring forming apparatus of the prior art spraying method, there is a mist in which a paste material is adhered in a connecting pipe connecting the atomizing device and the nozzle, and the mist accumulated in the connecting pipe becomes Condensation and flow in the nozzle. As a result, in the wiring forming apparatus of the prior art spraying method, there is a case where the ejection at the nozzle becomes unstable or the dew condensation flow in the communication tube and the coating nozzle is blocked.
若是噴嘴處之噴射成為不安定，則係成為無法進行安定之配線圖案之形成。進而，若是噴嘴堵塞，則無法進行配線圖案之形成。因此，在先前技術之噴霧方式的配線形成裝置中，係為了抑制上述一般之結露或者是結 露朝向噴嘴流動的情況，而需要頻繁地進行通連管之交換。其結果，配線形成裝置之稼動時間係變短，而會有使生產性降低的情況。 If the ejection at the nozzle is unstable, the wiring pattern that cannot be stabilized is formed. Further, if the nozzle is clogged, the formation of the wiring pattern cannot be performed. Therefore, in the wiring forming apparatus of the prior art spray method, in order to suppress the above-mentioned general condensation or knot The flow is directed toward the nozzle, and the exchange of the communication tubes is required frequently. As a result, the timing of the wiring forming device is shortened, and the productivity is lowered.
因此，係對於抑制在將霧化裝置與噴嘴之間作連接的通連管內之結露並抑制結露流動至噴嘴處的情況而能夠安定地形成配線圖案之配線形成技術有所要求。 Therefore, there is a demand for a wiring forming technique capable of stably forming a wiring pattern by suppressing condensation in a connecting pipe that connects the atomizing device and the nozzle and suppressing condensation from flowing to the nozzle.
本發明，係為有鑑於此種問題而進行者。 The present invention has been made in view of such problems.
亦即是，本發明之目的，係在於提供一種能夠安定地形成配線圖案之配線形成裝置。 That is, an object of the present invention is to provide a wiring forming apparatus capable of stably forming a wiring pattern.
又，本發明之目的，係在於提供一種以能夠安定地形成配線圖案的方式而對於配線形成裝置進行維修之維修方法。 Moreover, an object of the present invention is to provide a maintenance method for repairing a wiring forming apparatus in such a manner that a wiring pattern can be stably formed.
又，本發明之目的，係在於提供一種能夠安定地形成配線圖案之配線形成方法。 Moreover, an object of the present invention is to provide a wiring forming method capable of stably forming a wiring pattern.
本發明之其他目的以及優點，應可根據以下之記載而更為明瞭。 Other objects and advantages of the present invention will become apparent from the following description.
本發明之第1形態，係有關於一種配線形成裝置，其係具備有將糊狀材料霧化之霧化裝置、和噴射藉由該霧化裝置而作了霧化的糊狀材料之噴嘴、和將該霧化裝置和該噴嘴作連接之通連管，並將霧化後的糊狀材料作塗布而進行配線形成，該配線形成裝置，其特徵為，係具備有：第1氣體供給部，係被設置在通連管之與霧化裝置 間的連接部側處，並將第1維修氣體供給至該通連管內；和吸引部，係被設置在通連管之與霧化裝置間的連接部側以及與噴嘴間的連接部側之其中一方處，並對該通連管內進行吸引；和第2氣體供給部，係被設置在通連管之與霧化裝置間的連接部側以及與噴嘴間的連接部側的並未被設置有吸引部者之連接部側處，並將第2維修氣體供給至該通連管內。 According to a first aspect of the invention, there is provided a wiring forming apparatus comprising: an atomizing device for atomizing a paste material; and a nozzle for spraying a paste material atomized by the atomizing device; And a connecting tube that connects the atomizing device and the nozzle, and the atomized paste material is applied to form a wiring, and the wiring forming device is characterized in that: the first gas supply unit is provided , is set in the connection tube and the atomization device The first service gas is supplied to the communication pipe at the side of the connection portion, and the suction portion is provided on the connection portion side between the communication pipe and the atomization device and the connection portion side with the nozzle One of the suction pipes is suctioned; and the second gas supply unit is provided on the side of the connection portion between the communication pipe and the atomization device and the connection portion between the nozzle and the nozzle. The side of the connection portion where the suction portion is provided is provided, and the second maintenance gas is supplied into the communication tube.
在本發明之第1形態中，較理想，吸引部，係被設置在通連管之與霧化裝置間的連接部側處，第2氣體供給部，係被設置在該通連管之與噴嘴間的連接部側處。 In the first aspect of the present invention, preferably, the suction portion is provided on the side of the connection portion between the communication tube and the atomization device, and the second gas supply portion is provided in the communication tube. At the side of the joint between the nozzles.
在本發明之第1形態中，較理想，第1維修氣體係為惰性氣體。 In the first aspect of the present invention, preferably, the first maintenance gas system is an inert gas.
在本發明之第1形態中，較理想，第2維修氣體係為空氣。 In the first aspect of the invention, preferably, the second maintenance gas system is air.
在本發明之第1形態中，較理想，係具備有：控制部，係對於在第1氣體供給部處之第1維修氣體之供給、和吸引部之吸引、以及在第2氣體供給部處之第2維修氣體之供給，而分別進行控制，並構成為以使該吸引與第2維修氣體之供給一同進行，且使第1維修氣體之供給、和第2維修氣體之供給以及吸引，分別在配線形成之空閒中而進行的方式，來進行控制。 In the first aspect of the present invention, preferably, the control unit includes a supply of the first maintenance gas at the first gas supply unit, a suction of the suction unit, and a second gas supply unit. The supply of the second maintenance gas is separately controlled, and the suction is performed together with the supply of the second maintenance gas, and the supply of the first maintenance gas and the supply and suction of the second maintenance gas are respectively performed. Control is performed in such a manner that the wiring is formed in an idle state.
在本發明之第1形態中，較理想，控制部，係以在進行了吸引以及第2維修氣體之供給後，於進行配 線形成之前，進行第1維修氣體之供給的方式，來進行控制。 In the first aspect of the present invention, preferably, the control unit performs the distribution after the suction and the supply of the second maintenance gas are performed. Before the formation of the wire, the control of the supply of the first maintenance gas is performed.
在本發明之第1形態中，較理想，控制部，係以在進行了吸引以及第2維修氣體之供給後，於進行第1維修氣體之供給之前，進行用以使霧化了的糊狀材料之塗布安定化之塗布的方式，來進行控制。 In the first aspect of the present invention, it is preferable that the control unit performs the atomization after the supply of the first maintenance gas after the supply of the suction and the second maintenance gas is performed. The coating of the material is stabilized by the coating method to control.
在本發明之第1形態中，較理想，控制部，係以在進行了第1維修氣體之供給後，於進行配線形成之前，進行用以使霧化了的糊狀材料之塗布安定化之塗布的方式，來進行控制。 In the first aspect of the present invention, it is preferable that the control unit stabilizes the application of the atomized paste material before the wiring is formed after the supply of the first maintenance gas is performed. The method of coating is used for control.
本發明之第2形態，係有關於一種維修方法，其係為進行配線形成裝置之維修的維修方法，該配線形成裝置，係具備有將糊狀材料霧化之霧化裝置、和噴射藉由該霧化裝置而作了霧化的糊狀材料之噴嘴、和將該霧化裝置和該噴嘴作連接之通連管，並構成為將霧化後的糊狀材料作塗布而進行配線形成，該維修方法，其特徵為，係具備有：第1氣體供給工程，係在配線形成之空閒中，從通連管之與霧化裝置間的連接部側起來對於通連管內供給第1維修氣體；和第2氣體供給工程，係從通連管之與霧化裝置間的連接部側以及與噴嘴間的連接部側之其中一方起來對通連管內進行吸引，並從另外一方而對於通連管內供給第2維修氣體。 According to a second aspect of the present invention, there is provided a maintenance method for performing maintenance of a wiring forming device, wherein the wiring forming device includes an atomizing device for atomizing a paste material, and spraying The atomizing device is configured to form a nozzle for atomizing the paste material, and a connecting tube for connecting the atomizing device and the nozzle, and configured to apply the atomized paste material to form a wiring. In the maintenance method, the first gas supply process is provided, and the first maintenance is performed in the communication pipe from the connection portion side between the communication pipe and the atomization device in the idle state in which the wiring is formed. The gas and the second gas supply project attract the inside of the communication pipe from one of the connection portion side between the communication pipe and the atomization device and the connection portion side between the nozzles, and the other is The second maintenance gas is supplied into the communication pipe.
在本發明之第2形態中，較理想，第2氣體供給工程之吸引，係從被設置在通連管之與霧化裝置間的 連接部側起而進行，第2氣體供給部之供給，係從被設置在該通連管之與噴嘴間的連接部側處起來進行。 In the second aspect of the present invention, preferably, the suction of the second gas supply project is provided between the communication tube and the atomization device. The connection portion is moved from the side, and the supply of the second gas supply unit is performed from the side of the connection portion between the communication tube and the nozzle.
在本發明之第2形態中，較理想，第1維修氣體係為惰性氣體。 In the second aspect of the present invention, preferably, the first maintenance gas system is an inert gas.
在本發明之第2形態中，較理想，第2維修氣體係為空氣。 In the second aspect of the present invention, preferably, the second maintenance gas system is air.
在本發明之第2形態中，較理想，在第2氣體供給工程之後，係於進行配線形成之前，設置有第1氣體供給工程。 In the second aspect of the present invention, preferably, after the second gas supply process, the first gas supply process is provided before the wiring is formed.
在本發明之第2形態中，較理想，在第2氣體供給工程之後，係於第1氣體供給工程之前，設置有使霧化了的糊材料之塗布安定化的安定化工程。 In the second aspect of the present invention, it is preferable that after the second gas supply process, a stabilization project for stabilizing the coating of the atomized paste material is provided before the first gas supply process.
在本發明之第2形態中，較理想，在第1氣體供給工程之後，係於進行配線形成之前，設置有使霧化了的糊材料之塗布安定化的安定化工程。 In the second aspect of the present invention, it is preferable to stabilize the coating of the atomized paste material before the formation of the wiring after the first gas supply process.
在本發明之第2形態中，較理想，第1氣體供給工程之頻度，係為第2氣體供給工程之頻度的2~10倍。 In the second aspect of the present invention, preferably, the frequency of the first gas supply process is 2 to 10 times the frequency of the second gas supply process.
在本發明之第2形態中，較理想，在第2氣體供給工程中之第2維修氣體的流量，係為在第1氣體供給工程中之第1維修氣體的流量之100~1000倍。 In the second aspect of the present invention, it is preferable that the flow rate of the second maintenance gas in the second gas supply project is 100 to 1000 times the flow rate of the first maintenance gas in the first gas supply process.
本發明之第3形態，係有關於一種配線形成方法，其特徵為，係具備有：配線形成工程，係使用將糊狀材料霧化之霧化裝置、和噴射藉由該霧化裝置而作了霧 化的糊狀材料之噴嘴、以及將該霧化裝置和該噴嘴作連接之通連管，來將藉由霧化裝置所霧化了的糊狀材料從噴嘴作噴射並進行塗布，而進行配線形成；和第1氣體供給工程，係從通連管之與霧化裝置間的連接部側起來對於通連管內供給第1維修氣體；和第2氣體供給工程，係從通連管之與霧化裝置間的連接部側以及與噴嘴間的連接部側之其中一方起來對通連管內進行吸引，並從另外一方而對於通連管內供給第2維修氣體。 According to a third aspect of the present invention, there is provided a wiring forming method comprising: a wiring forming process using an atomizing device for atomizing a paste material, and spraying by the atomizing device Fog The nozzle of the paste material and the communication tube connecting the atomizing device and the nozzle to spray and apply the paste material atomized by the atomizing device from the nozzle to perform wiring And the first gas supply project is to supply the first maintenance gas to the communication pipe from the connection portion side between the communication pipe and the atomization device; and the second gas supply project is the connection from the communication pipe One of the connection portion side between the atomization device and the connection portion side between the nozzles sucks the inside of the communication tube, and the second maintenance gas is supplied to the communication tube from the other side.
在本發明之第3形態中，較理想，第2氣體供給工程，係使吸引從被設置在通連管之與霧化裝置間的連接部側起而進行，並使第2氣體供給之供給從被設置在該通連管之與噴嘴間的連接部側處起來進行。 In the third aspect of the present invention, it is preferable that the second gas supply process is performed such that the suction is performed from the side of the connection portion provided between the communication tube and the atomization device, and the supply of the second gas is supplied. It is carried out from the side of the joint portion between the communication pipe and the nozzle.
在本發明之第3形態中，較理想，在第1氣體供給工程以及第2氣體供給工程之後，係設置有使霧化了的糊材料之塗布安定化的安定化工程。 In the third aspect of the present invention, it is preferable that after the first gas supply process and the second gas supply process, a stabilization process for stabilizing the coating of the atomized paste material is provided.
若依據本發明之第1形態，則係提供一種能夠安定地形成配線圖案之配線形成裝置。 According to the first aspect of the present invention, a wiring forming apparatus capable of stably forming a wiring pattern is provided.
又，若依據本發明之第2形態，則係提供一種以能夠安定地形成配線圖案的方式而對於配線形成裝置進行維修之維修方法。 Moreover, according to the second aspect of the present invention, a maintenance method for repairing the wiring forming apparatus so that the wiring pattern can be stably formed is provided.
又，若依據本發明之第3形態，則係提供一種能夠安定地形成配線圖案之配線形成方法。 Moreover, according to the third aspect of the present invention, a wiring forming method capable of stably forming a wiring pattern is provided.
1、100、1000‧‧‧配線形成裝置 1, 100, 1000‧‧‧ wiring forming device
2‧‧‧霧化裝置 2‧‧‧Atomizing device
3‧‧‧噴嘴 3‧‧‧ nozzle
4、24、41、104‧‧‧通連管 4, 24, 41, 104‧‧‧Connected
11‧‧‧霧化部 11‧‧‧Atomization Department
12‧‧‧恆溫用液體 12‧‧‧Constant liquid
13‧‧‧恆溫槽 13‧‧‧ thermostat
14‧‧‧混合物 14‧‧‧Mixture
15‧‧‧材料收容容器 15‧‧‧Material storage container
16‧‧‧超音波產生裝置 16‧‧‧Ultrasonic generating device
17‧‧‧蓋體 17‧‧‧ Cover
18‧‧‧流體導入口 18‧‧‧ fluid inlet
19‧‧‧流體導出口 19‧‧‧ Fluid outlet
20‧‧‧內部管 20‧‧‧Internal pipe
21‧‧‧溶媒補給裝置 21‧‧‧Solvent replenishing device
22‧‧‧溶媒補給部 22‧‧‧Solvent Replenishment Department
23‧‧‧溫度控制部 23‧‧‧ Temperature Control Department
25‧‧‧溶媒 25‧‧‧Solvent
26‧‧‧載體氣體源 26‧‧‧ Carrier gas source
32‧‧‧霧流轉換裝置 32‧‧‧Mist stream conversion device
33‧‧‧噴嘴部 33‧‧‧Nozzle Department
34‧‧‧鞘套氣體供給管 34‧‧‧sheath gas supply pipe
42‧‧‧放出開口 42‧‧‧ release opening
51、52、53、54、55、56、57‧‧‧自動閥 51, 52, 53, 54, 55, 56, 57‧‧‧ automatic valves
61‧‧‧第1氣體供給部 61‧‧‧1st gas supply department
62‧‧‧第1氣體供給管 62‧‧‧1st gas supply pipe
63‧‧‧吸引部 63‧‧‧Attraction
64‧‧‧吸引管 64‧‧‧ suction tube
65‧‧‧第2氣體供給部 65‧‧‧2nd gas supply department
66‧‧‧第2氣體供給管 66‧‧‧2nd gas supply pipe
67‧‧‧第1維修氣體源 67‧‧‧1st maintenance gas source
68‧‧‧吸引裝置 68‧‧‧Attraction device
69‧‧‧第2維修氣體源 69‧‧‧2nd maintenance gas source
70‧‧‧鞘套氣體源 70‧‧‧sheath gas source
[圖1]對於本發明之第1實施形態的配線形成裝置作展示之圖。 Fig. 1 is a view showing a wiring forming apparatus according to a first embodiment of the present invention.
[圖2]對於本發明之成為比較例的配線形成裝置作展示之圖。 Fig. 2 is a view showing a wiring forming apparatus which is a comparative example of the present invention.
[圖3]對於本發明之第2實施形態的配線形成方法之第1例作展示之流程圖。 Fig. 3 is a flow chart showing a first example of a wiring forming method according to a second embodiment of the present invention.
[圖4]對於本發明之第2實施形態的配線形成方法之第2例作展示之流程圖。 Fig. 4 is a flow chart showing a second example of the wiring forming method according to the second embodiment of the present invention.
[圖5]對於本發明之第2實施形態的配線形成方法之主要的步驟中之自動閥的開閉狀態作了整理之表。 [Fig. 5] A table showing the opening and closing states of the automatic valves in the main steps of the wiring forming method according to the second embodiment of the present invention.
[圖6]對於本發明之第3實施形態的配線形成裝置作展示之圖。 Fig. 6 is a view showing a wiring forming apparatus according to a third embodiment of the present invention.
本發明之配線形成裝置，係為能夠使用噴霧方式而在基板上進行細微圖案之形成的配線形成裝置。 The wiring forming device of the present invention is a wiring forming device capable of forming a fine pattern on a substrate by a spray method.
本發明之配線形成裝置，係能夠對於半導體晶片或液晶顯示器等之平面面板顯示器的基板之上而供給糊狀材料並形成配線圖案。又，係能夠合適地使用在對於配線圖案之一部分有所缺損的斷線部分等之開路缺陷部分進行修復的用途中。本發明之配線形成裝置，係能夠作為 噴霧式之開路修復裝置而合適地使用。 In the wiring forming apparatus of the present invention, a paste material can be supplied onto a substrate of a flat panel display such as a semiconductor wafer or a liquid crystal display to form a wiring pattern. Moreover, it is possible to suitably use an application for repairing an open defect portion such as a broken portion which is defective in one of the wiring patterns. The wiring forming device of the present invention can be used as A spray type open circuit repairing device is suitably used.
在本發明中所使用之噴霧方式，係為使糊狀材料附著在基板上之方法，並為將糊狀材料作成霧狀態(霧化狀態)，而與噴墨方式等之使用有噴嘴之方式相同的，藉由以噴嘴所致之噴射，來將該霧狀之糊狀材料吹出附著而形成所期望之細微形狀之塗膜的方法。之後，藉由對於所形成的基板上之塗膜而例如使用雷射光等來進行加熱燒成，係能夠形成所期望之形狀的配線圖案。 The spraying method used in the present invention is a method in which a paste material is adhered to a substrate, and the paste material is in a fogged state (atomized state), and a nozzle is used in an inkjet method or the like. Similarly, a method in which the mist-like paste material is blown and adhered by spraying by a nozzle to form a coating film of a desired fine shape is obtained. Thereafter, by heating and baking the coating film on the formed substrate, for example, using laser light or the like, it is possible to form a wiring pattern having a desired shape.
在噴霧方式中，係能夠藉由將從噴嘴而來之噴射例如設為以螺旋狀來使霧噴出的方式而作了集中之噴射，來形成細微之線狀的配線圖案。本發明之配線形成裝置，係為了將糊狀材料設為霧狀態(霧化狀態)，而使用後述之構造的霧化裝置。又，本發明之配線形成裝置，係為了使噴射出之霧狀的糊狀材料收束並成為適於進行細微之圖案的形成，因此係使用有噴嘴。作為此噴嘴，例如，係可使用如同在日本特表2008-522814號公報中所記載一般之以形成由內側之包含有霧化了的糊狀材料之載體氣體氣體流和從外側而將該載體氣體氣體流作包圍之鞘套氣體氣體流所成之環狀擴散噴流的方式所構成者。 In the spray method, it is possible to form a fine line-shaped wiring pattern by focusing the ejection from the nozzle, for example, by spraying the mist in a spiral shape. In the wiring forming apparatus of the present invention, an atomizing device having a structure described later is used in order to set the paste material to a mist state (atomized state). Moreover, in the wiring forming apparatus of the present invention, a nozzle is used in order to converge the sprayed paste-like material and to form a fine pattern. As the nozzle, for example, a carrier gas gas stream containing an atomized paste-like material from the inner side and a carrier gas from the outer side can be used as described in Japanese Laid-Open Patent Publication No. 2008-522814. The gas gas flow is formed by a method of forming a circular diffusion jet formed by a sheath gas gas flow.
進而，本發明之配線形成裝置，係具備有從先前起便有所要求之對於安定之配線圖案之形成而言為有效的構造。 Further, the wiring forming apparatus of the present invention has a structure which is effective for forming a stable wiring pattern which has been required from the past.
以下，針對本發明之實施形態的配線形成裝置作說明，並針對以能夠使用此而安定地在基板上形成配 線圖案的方式來進行該裝置之維修的本發明之實施形態之維修方法作說明，再針對本發明之實施形態的配線形成方法作說明。 Hereinafter, a wiring forming apparatus according to an embodiment of the present invention will be described, and a configuration can be stably formed on a substrate so that it can be used. The maintenance method of the embodiment of the present invention in which the maintenance of the device is performed by the method of the line pattern will be described, and the wiring forming method according to the embodiment of the present invention will be described.
圖1，係為對於本發明之第1實施形態的配線形成裝置作展示之圖。 Fig. 1 is a view showing a wiring forming apparatus according to a first embodiment of the present invention.
如圖1中所示一般，本發明之第1實施形態的配線形成裝置1，係由霧化裝置2、和噴嘴3、以及將霧化裝置2和噴嘴3作連接之通連管4，而構成之。並且，係使用藉由霧化裝置2而霧化了的糊狀材料，來從噴嘴3來進行噴射，並例如在基板W上形成糊狀材料之塗膜，而能夠進行配線圖案之形成。 As shown in FIG. 1, the wiring forming apparatus 1 according to the first embodiment of the present invention is composed of an atomizing device 2, a nozzle 3, and a communication pipe 4 for connecting the atomizing device 2 and the nozzle 3, and Constituting it. Further, by using the paste material atomized by the atomizing device 2, the nozzle 3 is ejected, and a coating film of a paste material is formed on the substrate W, for example, to form a wiring pattern.
圖2，係為對於本發明之成為比較例的配線形成裝置作展示之圖。 Fig. 2 is a view showing a wiring forming apparatus which is a comparative example of the present invention.
如圖2中所示一般，成為比較例之配線形成裝置1000，係為由先前技術所得者，並與本發明之第1實施形態的配線形成裝置1相同的，係由霧化裝置2、和噴嘴3、以及將霧化裝置2和噴嘴3作連接之通連管4，而構成之。並且，配線形成裝置1000，係使用藉由霧化裝置2而霧化了的糊狀材料，來從噴嘴3來進行噴射，並在基板W上形成糊狀材料之塗膜，而能夠進行配線圖案之形成。另外，在圖2所示之成為比較例之配線形成裝置1000中，針對與本發明之第1實施形態之配線形成裝置1 共通的構成要素，係附加相同之元件符號。並且，針對其詳細內容，係與以下所進行之配線形成裝置1所對應的構成要素相同地，而省略重複之說明。 As shown in FIG. 2, the wiring forming apparatus 1000 which is a comparative example is the same as the wiring forming apparatus 1 of the first embodiment of the present invention, which is obtained by the prior art, and is composed of the atomizing device 2, and The nozzle 3 and the communication tube 4 that connects the atomizing device 2 and the nozzle 3 are configured. Further, the wiring forming apparatus 1000 uses the paste material atomized by the atomizing device 2 to eject from the nozzle 3, and forms a coating film of a paste material on the substrate W, thereby enabling wiring pattern formation. Formation. Further, in the wiring forming apparatus 1000 which is a comparative example shown in FIG. 2, the wiring forming apparatus 1 according to the first embodiment of the present invention Common components are attached with the same component symbols. In addition, the detailed description of the components is the same as the components corresponding to the wiring forming apparatus 1 performed below, and the overlapping description will be omitted.
而，當對於本發明之第1實施形態之配線形成裝置1和成為比較例之配線形成裝置1000作了比較的情況時，可以得知，於配線形成裝置1中，與通連管4作連接之吸引部63、第1氣體供給部61、第2氣體供給部65以及自動閥53、54等，係為特徵性之構造部分。本發明之第1實施形態之配線形成裝置1，係藉由具備有圖1中所示之構造，而能夠與配線圖案之形成一同地來容易地實行維修，藉由此，係成為能夠進行安定之配線圖案之形成。 When the wiring forming apparatus 1 of the first embodiment of the present invention is compared with the wiring forming apparatus 1000 of the comparative example, it can be seen that the wiring forming apparatus 1 is connected to the communication tube 4. The suction unit 63, the first gas supply unit 61, the second gas supply unit 65, the automatic valves 53, 54 and the like are characteristic structural portions. The wiring forming apparatus 1 according to the first embodiment of the present invention can be easily repaired together with the formation of the wiring pattern by providing the structure shown in Fig. 1, whereby the stability can be stabilized. The formation of the wiring pattern.
以下，針對本發明之第1實施形態的配線形成裝置1，更進而對於各構成要素作詳細說明。 Hereinafter, the wiring forming apparatus 1 according to the first embodiment of the present invention will be described in detail with respect to each constituent element.
首先，作為本發明之第1實施形態之配線形成裝置1所使用的糊狀材料，除了金屬奈米糊以外，係可使用使透明導電材料之微粒子在溶劑中作了分散者。於此，所謂金屬奈米糊，係為由金屬奈米粒子和用以保持該金屬奈米粒子之奈米狀態的溶劑所成之糊狀的混合物，金屬奈米粒子之凝集係被抑制，並展現被保持為奈米狀態(分散狀態)的狀態。此時，作為溶劑，係可列舉出石油系混合溶劑以及酯系溶劑等。作為金屬奈米糊，係可列舉出銀奈米糊、金奈米糊以及銅奈米糊等。 First, as the paste material used in the wiring forming apparatus 1 according to the first embodiment of the present invention, in addition to the metal nano paste, the fine particles of the transparent conductive material may be dispersed in a solvent. Here, the metal nano paste is a paste-like mixture of metal nanoparticles and a solvent for holding the nano-state of the metal nanoparticles, and the agglomerates of the metal nanoparticles are suppressed, and The state in which the display is maintained in the nano state (distributed state). In this case, examples of the solvent include petroleum-based mixed solvents and ester-based solvents. Examples of the metal nanopaste include a silver nano paste, a golden rice paste, and a copper nano paste.
接下來，本發明之第1實施形態之配線形成 裝置1的霧化裝置2，係將上述之糊狀材料霧化並設為霧狀態(霧化狀態)，再供給至與噴嘴3作連接之通連管4，而用以供給至噴嘴3處之裝置。如圖1中所示一般，霧化裝置2，係具備有霧化部11和溶媒補給裝置21，而構成之。 Next, the wiring of the first embodiment of the present invention is formed. The atomizing device 2 of the apparatus 1 atomizes the above-mentioned paste material into a mist state (atomized state), and supplies it to the communication pipe 4 connected to the nozzle 3 for supply to the nozzle 3 Device. As shown in Fig. 1, generally, the atomizing device 2 is provided with an atomizing portion 11 and a solvent supply device 21.
如圖1中所示一般，霧化裝置2之溶媒補給裝置21，係具備有溶媒補給部22和溫度控制部23。而，溶媒補給部22，係為用以將使溶媒25作了霧化(氣化)的氣體和由惰性氣體所成之載體氣體混合並補給至霧化部11處之裝置。載體氣體，係從藉由通連管24而作了連接的載體氣體源26來作供給。作為在載體氣體中所使用之惰性氣體，例如係可列舉出氮氣、氬氣以及氦氣等。 As shown in FIG. 1, generally, the solvent supply device 21 of the atomization device 2 includes a solvent supply unit 22 and a temperature control unit 23. Further, the solvent supply unit 22 is a device for mixing a gas obtained by atomizing (gasifying) the solvent 25 and a carrier gas made of an inert gas, and supplying it to the atomizing unit 11. The carrier gas is supplied from a carrier gas source 26 connected by a communication tube 24. Examples of the inert gas used in the carrier gas include nitrogen gas, argon gas, helium gas, and the like.
溶媒補給裝置21之溶媒補給部22，係經由自動閥51而與通連管24作連接，該通連管24係與載體氣體源26相連接。又，另一方面，溶媒補給部22，係經由通連管41而與霧化部11作連接。溶媒補給裝置21之溶媒補給部22，係將從載體氣體源26所供給而來之載體氣體和使溶媒25作了霧化(氣化)的氣體作混合，並供給至霧化部11處(將溶媒25作補給)之裝置。 The solvent supply unit 22 of the solvent supply device 21 is connected to the communication pipe 24 via an automatic valve 51, and the communication pipe 24 is connected to the carrier gas source 26. On the other hand, the solvent supply unit 22 is connected to the atomization unit 11 via the communication tube 41. The solvent supply unit 22 of the solvent supply device 21 mixes the carrier gas supplied from the carrier gas source 26 with the gas that atomizes (vaporizes) the solvent 25, and supplies it to the atomization unit 11 ( A device for replenishing the solvent 25).
溶媒補給裝置21之溫度控制部23，係為用以對於溶媒補給部22進行溫度控制之裝置。溫度控制部23，係將溶媒補給部22保持為一定溫度並將溶媒補給量保持為一定之量。溫度控制部23，係具備有圍繞溶媒補給部22之加熱器等的加熱手段以及溫度感測器(均未圖 示)，而構成之。藉由此，藉由以溫度感測器來檢測出溫度並藉由加熱手段來對於溫度進行調整並保持為一定，載體氣體濃度係恆常成為一定，就算是外部溫度所有變化，也不會受到其影響，供給至霧化部11處之溶媒補給量係成為一定，霧化部11之長壽命化係成為可能。又，藉由使溶媒補給部22之溫度成為可變，係能夠使溶媒補給量改變，而成為能夠與霧流之混合部的變化相對應。 The temperature control unit 23 of the solvent supply device 21 is a device for controlling the temperature of the solvent supply unit 22. The temperature control unit 23 maintains the solvent supply unit 22 at a constant temperature and maintains the amount of solvent replenishment to a constant amount. The temperature control unit 23 includes a heating means such as a heater surrounding the solvent supply unit 22, and a temperature sensor (all of which are not shown). Show), and constitute it. Therefore, by detecting the temperature with a temperature sensor and adjusting the temperature by the heating means and keeping it constant, the carrier gas concentration is constant, even if all changes in the external temperature are not received. The influence of the amount of the solvent supplied to the atomizing unit 11 is constant, and the long life of the atomizing unit 11 is possible. Further, by changing the temperature of the solvent supply unit 22, the amount of the solvent supply can be changed to correspond to the change in the mixed portion of the mist flow.
另外，在通連管41中，係能夠以不會使其內部冷卻的方式而設置液化防止用加熱器(未圖示)。液化防止用加熱器，係防止被霧化之輸送途中的混合氣體中之溶媒25液化。 Further, in the communication pipe 41, a liquefaction preventing heater (not shown) can be provided so as not to cool the inside. The liquefaction preventing heater prevents liquefaction of the solvent 25 in the mixed gas during the atomization.
接著，霧化裝置2之霧化部11，係為用以將糊材料霧化並導入從溶媒補給部21而來之混合氣體而作出霧流之裝置。如圖1中所示一般，霧化部11，係經由通連管4而與噴嘴3作連接，並使霧化後的糊材料之霧流通過通連管4來供給至噴嘴3處。另外，在通連管4中，係能夠以不會使其內部冷卻的方式而設置液化防止用加熱器(未圖示)。液化防止用加熱器，係防止被霧化之輸送途中的霧流中之後述的溶媒液化。 Next, the atomizing unit 11 of the atomizing device 2 is a device for atomizing the paste material and introducing the mixed gas from the solvent supply unit 21 to form a mist flow. As shown in FIG. 1, generally, the atomizing portion 11 is connected to the nozzle 3 via the communication tube 4, and the mist flow of the atomized paste material is supplied to the nozzle 3 through the communication tube 4. Further, in the communication pipe 4, a liquefaction preventing heater (not shown) can be provided so as not to cool the inside. The liquefaction preventing heater prevents liquefaction of a solvent described later in the mist flow during the atomization.
霧化部11，係具備有將純水等之身為特定溫度之恆溫水的恆溫用液體12作收容之恆溫槽13。在恆溫槽13之恆溫用液體12中，係浸漬有材料收容容器15，該材料收容容器15，係收容有混合物14，該混合物14，係為上述之糊狀材料(例如金奈米糊)和將糊材料之除了 金屬奈米粒子以外的可溶性之成分溶解並使金屬奈米粒子作分散之溶媒、例如二甲苯等之溶媒(以下，亦有稱作稀釋劑的情況)的混合物14。 The atomizing unit 11 is provided with a thermostatic chamber 13 for accommodating a constant temperature liquid 12 which is a constant temperature water having a specific temperature such as pure water. The constant temperature liquid 12 of the thermostatic chamber 13 is impregnated with a material storage container 15 containing a mixture 14 which is a paste material (for example, a golden rice paste) and In addition to the paste material The soluble component other than the metal nanoparticles is dissolved and the metal nanoparticles are dispersed as a solvent, for example, a mixture 14 of a solvent such as xylene (hereinafter also referred to as a diluent).
在霧化部11中，係進行由超音波所進行之糊狀材料之霧化，但是，當糊狀材料為金屬奈米糊的情況時，由於若是僅存在有金屬奈米糊則霧化係為困難，因此係使用上述之與稀釋劑之間的混合物14。故而，在稀釋劑中，係以選擇性地添加霧化特性為良好之溶液為理想。 In the atomization unit 11, atomization of the paste material by ultrasonic waves is performed. However, when the paste material is a metal nano paste, the atomization system is used if only the metal nano paste is present. For the sake of difficulty, the mixture 14 between the above and the diluent is used. Therefore, in the diluent, it is preferred to selectively add a solution having a good atomization property.
在霧化部11處，材料收容容器15，係在恆溫槽13內，例如被作傾斜設置。又，在恆溫槽13之內部的材料收容容器15之最低的位置之近旁處，係被設置有超音波產生裝置16。超音波產生裝置16，係為藉由其之超音波振動，而經由恆溫用液體12和材料收容容器15來對於混合物14供給用以使其霧化之能量，並將混合物14霧化且進而使糊狀材料霧化者。 At the atomizing portion 11, the material housing container 15 is housed in the thermostatic chamber 13, and is, for example, inclined. Further, an ultrasonic generating device 16 is provided in the vicinity of the lowest position of the material storage container 15 inside the thermostatic chamber 13. The ultrasonic generating device 16 supplies the energy for atomizing the mixture 14 via the thermostatic liquid 12 and the material storage container 15 by the ultrasonic vibration thereof, and atomizes the mixture 14 and thereby Paste material atomizer.
亦即是，在本發明之第1實施形態之配線形成裝置1中，產生霧之機制，係為對於由糊狀材料和稀釋劑所成之混合物14，而藉由超音波產生裝置16來經由恆溫用液體12而照射超音波，並使用此超音波之能量來促進霧化者。於此，恆溫用液體12，係作為超音波振動之傳導媒體以及加熱媒體而起作用。 In the wiring forming apparatus 1 according to the first embodiment of the present invention, the mechanism for generating mist is a mixture 14 made of a paste material and a diluent, and the ultrasonic generating device 16 is used. The thermostatic liquid 12 is used to illuminate the ultrasonic waves, and the energy of the ultrasonic waves is used to promote the atomizer. Here, the constant temperature liquid 12 functions as a conductive medium for ultrasonic vibration and a heating medium.
材料收容容器15之上部開口，係構成為藉由蓋體17而被堵塞。蓋體17，係具備有流體導入口18以及流體導出口19。在流體導出口19處，材料收容容器15 之內部側，係與內部管20相連接，又，材料收容容器15之外部側，係被與經由自動閥53而和噴嘴3作連接之通連管4相連接。在流體導入口18處，材料收容容器15之外部側，係與和溶媒補給部22作連接之通連管41相連接，材料收容容器15之內部側，係與放出開口42相連接。 The upper portion of the material storage container 15 is opened to be blocked by the lid body 17. The lid body 17 is provided with a fluid introduction port 18 and a fluid outlet port 19. At the fluid outlet 19, the material containment container 15 The inner side is connected to the inner tube 20, and the outer side of the material storage container 15 is connected to the communication tube 4 connected to the nozzle 3 via the automatic valve 53. At the fluid introduction port 18, the outer side of the material storage container 15 is connected to the communication pipe 41 connected to the solvent supply portion 22, and the inner side of the material storage container 15 is connected to the discharge opening 42.
藉由此，從溶媒補給裝置21之溶媒補給部22所供給的載體氣體以及溶媒25之混合氣體，係從流體導入口18而被導入至材料收容容器15內部，並被導入至內部管20之內部，而成為依序經由內部管20、流體導出口19、自動閥53以及通連管4來供給至噴嘴3側。此時，藉由超音波振動能量而作了霧化的混合物14之氣體，亦係被導入至此流動中，並從內部管20之最下端的開口而被導入至內部管20之內部，而成為依序經由內部管20、流體導出口19、自動閥53以及通連管4來供給至噴嘴3側。 By this, the carrier gas supplied from the solvent supply unit 22 of the solvent supply device 21 and the mixed gas of the solvent 25 are introduced into the material storage container 15 from the fluid introduction port 18, and are introduced into the inner tube 20. The inside is supplied to the nozzle 3 side via the inner tube 20, the fluid outlet 19, the automatic valve 53, and the communication tube 4 in this order. At this time, the gas of the mixture 14 atomized by the ultrasonic vibration energy is also introduced into the flow, and is introduced into the inner tube 20 from the lowermost opening of the inner tube 20, thereby becoming The inner tube 20, the fluid outlet 19, the automatic valve 53, and the communication tube 4 are sequentially supplied to the nozzle 3 side.
接著，本發明之第1實施形態之配線形成裝置1的噴嘴3，係如圖1中所示一般，由霧流轉換裝置32和噴嘴部33所構成。噴嘴3，係在霧流轉換裝置32之上游側處，經由自動閥54而與通連管4作連接，並與霧化裝置2相連接。 Next, the nozzle 3 of the wiring forming apparatus 1 according to the first embodiment of the present invention is constituted by the mist flow converting device 32 and the nozzle portion 33 as shown in Fig. 1 . The nozzle 3 is connected to the communication pipe 4 via an automatic valve 54 at the upstream side of the mist flow conversion device 32, and is connected to the atomization device 2.
噴嘴3之霧流轉換裝置32，係在將藉由霧化裝置2而霧化了的糊狀材料之霧流從噴嘴部33來進行噴射時，對於內側之糊狀材料之霧流，而供給將其從外側來 作包入之鞘套氣體並形成鞘套氣體流。 The mist flow conversion device 32 of the nozzle 3 supplies a mist flow of the paste material atomized by the atomization device 2 from the nozzle portion 33, and supplies the mist flow to the inner paste material. Bring it from the outside The sheath gas is encased and forms a sheath gas flow.
此鞘套氣體，係如圖1中所示一般，從經由自動閥52而與鞘套氣體源70作連接之鞘套氣體供給管34，來供給至噴嘴3之霧流轉換裝置32處。而，霧流轉換裝置32，係將藉由霧化裝置2而霧化了的糊狀材料之霧流，以使其之流徑成為既定之值並且使霧流以螺旋狀而旋轉的方式，來進行轉換。 This sheath gas is supplied from the sheath gas supply pipe 34 connected to the sheath gas source 70 via the automatic valve 52 to the mist flow conversion device 32 of the nozzle 3 as shown in Fig. 1 . In the mist flow conversion device 32, the mist flow of the paste material atomized by the atomization device 2 is such that the flow path thereof has a predetermined value and the mist flow is spirally rotated. To convert.
噴嘴3之噴嘴部33，係被設置在霧流轉換裝置32之前端處，並構成為從其之前端來噴射上述一般之轉換後的霧流。噴嘴3，係將藉由霧化裝置2而霧化了的糊狀材料吹附於基板W上而作塗布。 The nozzle portion 33 of the nozzle 3 is provided at the front end of the mist flow conversion device 32, and is configured to eject the above-described general converted mist flow from the front end thereof. The nozzle 3 is coated by applying a paste-like material atomized by the atomizing device 2 onto the substrate W.
另外，針對霧流轉換裝置32和噴嘴部33，係可使用既存之裝置。 Further, for the mist flow conversion device 32 and the nozzle portion 33, an existing device can be used.
接著，針對在本發明之第1實施形態的配線形成裝置1中之將霧化裝置2和噴嘴3作連接之通連管4，而作說明。 Next, a description will be given of a connecting pipe 4 in which the atomizing device 2 and the nozzle 3 are connected to each other in the wire forming apparatus 1 according to the first embodiment of the present invention.
在使用有噴霧方式的第1實施形態之配線形成裝置1中，將霧化裝置2和噴嘴3作連接之通連管4，係如同上述一般，為會有附著糊狀材料之霧並且所積蓄之霧成為結露而於噴嘴3中流動的疑慮之構成構件。 In the wiring forming apparatus 1 of the first embodiment in which the spraying method is used, the connecting tube 4 in which the atomizing device 2 and the nozzle 3 are connected is as described above, and there is a mist which adheres to the paste material and is accumulated. The mist becomes a constituent member of the doubt that the condensation flows in the nozzle 3.
如圖1中所示一般，配線形成裝置1之通連管4，係在與霧化裝置2之間的連接部側處，具備有用以對於通連管4內而供給第1維修氣體之第1氣體供給部61。又，通連管4，係在與霧化裝置2之間的連接部側 處，具備有用以對於通連管4內進行吸引之吸引部63，在通連管4之與噴嘴3之間的連接部側處，係具備有對於通連管4內而供給第2維修氣體之第2氣體供給部65。 As shown in FIG. 1, the communication pipe 4 of the wiring forming apparatus 1 is provided at the side of the connection portion with the atomizing device 2, and is provided with a first supply of the first maintenance gas to the inside of the communication pipe 4. 1 gas supply unit 61. Further, the communication pipe 4 is on the side of the connection portion with the atomizing device 2 A suction portion 63 for sucking the inside of the communication pipe 4 is provided, and a second service gas is supplied to the communication pipe 4 at the connection portion side between the communication pipe 4 and the nozzle 3. The second gas supply unit 65.
第1氣體供給部61、吸引部63以及第2氣體供給部65，係以分別設置在通連管4之終端近旁處為理想。 It is preferable that the first gas supply unit 61, the suction unit 63, and the second gas supply unit 65 are provided in the vicinity of the terminal of the communication tube 4, respectively.
亦即是，本發明之第1實施形態之配線形成裝置1，係具備有被設置在通連管4之霧化裝置2之間的連接部側處並對於通連管4內供給第1維修氣體之第1氣體供給部61。並且，配線形成裝置1，係具備有被設置在通連管4之與霧化裝置2之間的連接部側處並對於通連管4內進行吸引之吸引部63。進而，配線形成裝置1，係具備有被設置在通連管4之並未被設置有吸引部63的與噴嘴3之間的連接部側處並對於通連管4內供給第2維修氣體之第2氣體供給部65。 In other words, the wiring forming apparatus 1 according to the first embodiment of the present invention includes the connection portion side provided between the atomizing devices 2 of the communication tube 4 and supplies the first maintenance to the communication tube 4 The first gas supply unit 61 of the gas. Further, the wiring forming device 1 is provided with a suction portion 63 that is provided on the side of the connection portion between the communication tube 2 and the atomization device 2 and that sucks the inside of the communication tube 4. Further, the wiring forming apparatus 1 is provided on the side of the connection portion between the nozzle 3 and the nozzle 3 that is not provided with the suction portion 63 of the communication tube 4, and supplies the second maintenance gas to the inside of the communication tube 4. The second gas supply unit 65.
通連管4之第1氣體供給部61，係具備有以對於通連管4內而供給第1維修氣體的方式來與第1維修氣體源67作連接之第1氣體供給管62、和自動閥57。又，第1氣體供給部61，係構成為經由自動閥57而與通連管4之和霧化裝置2之間的連接部側之終端近旁相連接。此時，作為第1維修氣體，較理想，係使用不會有與糊狀材料之間產生反應之擔憂的惰性氣體。作為能夠作為第1維修氣體來使用之惰性氣體，例如係可列舉出氮氣、氬氣以及氦氣等。 The first gas supply unit 61 of the communication pipe 4 is provided with a first gas supply pipe 62 that is connected to the first maintenance gas source 67 so that the first maintenance gas is supplied to the communication pipe 4, and an automatic Valve 57. Further, the first gas supply unit 61 is configured to be connected to the vicinity of the terminal on the connection side between the communication unit 2 and the atomization device 2 via the automatic valve 57. In this case, as the first maintenance gas, an inert gas which does not cause a reaction with the paste material is preferably used. Examples of the inert gas that can be used as the first maintenance gas include nitrogen gas, argon gas, and helium gas.
在本發明之第1實施形態之配線形成裝置1中，第1氣體供給部61，係對於通連管4內，例如供給身為惰性氣體之第1維修氣體，藉由此，係能夠使附著在通連管4內之包含有糊狀材料之霧的揮發成分揮發，並使附著物之量減少。 In the wiring forming apparatus 1 according to the first embodiment of the present invention, the first gas supply unit 61 supplies the first maintenance gas which is an inert gas to the inside of the communication tube 4, whereby the adhesion can be made. The volatile component of the mist containing the paste material in the communication tube 4 is volatilized, and the amount of the deposit is reduced.
又，通連管4之吸引部63，係為為了對於通連管4內進行吸引，並例如使糊狀材料之霧附著所形成的結露在通連管4中移動，而將其從通連管4內吸出，所設置者。吸引部63，係以對於通連管4內進行吸引的方式，而例如具備有和由吸引幫浦等所成之吸引裝置68作連接的吸引管64、和能夠對於由吸引裝置68所致之吸引效果進行控制的自動閥56。又，吸引部63，係構成為經由自動閥56而與通連管4之和霧化裝置2之間的連接部側之終端近旁相連接。 Further, the suction portion 63 of the communication tube 4 is configured to move the inside of the communication tube 4, for example, to cause the condensation formed by the mist of the paste material to move in the communication tube 4, thereby moving it from the communication unit. The tube 4 is sucked out and set. The suction unit 63 is provided with a suction pipe 64 connected to a suction device 68 formed by a suction pump or the like, and can be caused by the suction device 68, for example, by suctioning the inside of the communication pipe 4. An automatic valve 56 that controls the suction effect. Further, the suction portion 63 is configured to be connected to the vicinity of the terminal on the connection portion side between the communication tube 2 and the atomization device 2 via the automatic valve 56.
通連管4之第2氣體供給部65，係具備有以對於通連管4內而供給第2維修氣體的方式來與第2維修氣體源69作連接之第2氣體供給管66、和自動閥55。又，第2氣體供給部65，係構成為經由自動閥55而與通連管4之和噴嘴3之間的連接部側之終端近旁相連接。在本發明之第1實施形態之配線形成裝置1中，第2氣體供給部65，係為以能夠有效率地進行由吸引部63所致之通連管4內的結露之吸出的方式，而作了設置者。亦即是，在通連管4處，係藉由第2氣體供給部65而從噴嘴3側來供給第2維修氣體，並且藉由吸引部63來從霧化裝置 2側而進行吸引。其結果，配線形成裝置1，係利用從噴嘴3側起而朝向霧化裝置2側之第2維修氣體的流動來使結露移動，並以高效率而將通連管4內之結露排出。 The second gas supply unit 65 of the communication pipe 4 is provided with a second gas supply pipe 66 that is connected to the second maintenance gas source 69 so that the second maintenance gas is supplied to the communication pipe 4, and an automatic Valve 55. Further, the second gas supply unit 65 is configured to be connected to the vicinity of the terminal on the connection portion side between the communication tube 4 and the nozzle 3 via the automatic valve 55. In the wiring forming apparatus 1 according to the first embodiment of the present invention, the second gas supply unit 65 is configured to efficiently perform the suction of the condensation in the communication tube 4 by the suction unit 63. Made the setter. In other words, in the communication pipe 4, the second maintenance gas is supplied from the nozzle 3 side by the second gas supply unit 65, and the atomization device is supplied from the atomization device by the suction portion 63. At the 2 side, the attraction is performed. As a result, the wiring forming apparatus 1 moves the dew condensation by the flow of the second maintenance gas toward the atomizing device 2 from the nozzle 3 side, and discharges the condensation in the communication pipe 4 with high efficiency.
此時，作為第2維修氣體，除了與上述之第1維修氣體相同之惰性氣體以外，亦可使用空氣。又，較理想，係利用容易獲取並且能夠簡單的準備而能夠以低成本來作利用之空氣，更理想，係利用能夠對於水份之附著在通連管4內的情況作抑制之乾燥空氣(dry air)。 In this case, as the second maintenance gas, air may be used in addition to the inert gas similar to the above-described first maintenance gas. Further, it is preferable to use air which can be easily utilized and can be easily used for low cost, and it is more preferable to use dry air which can suppress the adhesion of moisture to the inside of the communication pipe 4 ( Dry air).
另外，本發明之第1實施形態之配線形成裝置1，係可具備有用以將被塗布在基板W上之糊狀材料進行燒成固化的燒成處理裝置(未圖示)。燒成處理裝置，係以使用CW(Continuous Wave)雷射來構成為理想。燒成處理裝置，係藉由並非使用脈衝雷射而使用CW雷射，而能夠確實地照射糊狀材料並進行燒成而在基板W上形成配線圖案。 In addition, the wiring forming apparatus 1 according to the first embodiment of the present invention may include a baking processing apparatus (not shown) for baking and solidifying the paste material applied to the substrate W. The firing processing apparatus is preferably constructed using a CW (Continuous Wave) laser. In the firing processing apparatus, a CW laser is used instead of a pulsed laser, and the paste material can be reliably irradiated and fired to form a wiring pattern on the substrate W.
具備有以上的構成之本發明之第1實施形態之配線形成裝置1，係能夠對於會有糊狀材料之霧附著並成為結露而在噴嘴3中流動的擔憂之通連管4，而供給由第1維修氣體之供給所進行的維修。進而，配線形成裝置1，係能夠進行第2之維修氣體的供給以及吸引，而進行以相異之方法所致之通連管4之維修。亦即是，本發明之第1實施形態之配線形成裝置1，係成為能夠進行使用有第1氣體供給部61、吸引部63以及第2氣體供給部65之維修，而成為能夠安定地形成配線圖案。 The wiring forming apparatus 1 according to the first embodiment of the present invention having the above-described configuration is capable of supplying a communication tube 4 that is likely to flow in the nozzle 3 due to fogging of the paste material and causing condensation to flow. Maintenance of the supply of the first maintenance gas. Further, in the wiring forming apparatus 1, the supply and the suction of the second maintenance gas can be performed, and the maintenance of the communication pipe 4 by the different method can be performed. In the wiring forming apparatus 1 according to the first embodiment of the present invention, the first gas supply unit 61, the suction unit 63, and the second gas supply unit 65 can be used for maintenance, and the wiring can be stably formed. pattern.
此時，本發明之第1實施形態之配線形成裝置1，係能夠使用身為控制部之控制裝置(未圖示)，來自動進行由糊狀材料之塗布所致的配線圖案之形成和裝置的維修。在控制裝置處，係連接有上述之各自動閥51~57。 In the wiring forming apparatus 1 according to the first embodiment of the present invention, it is possible to automatically form and form a wiring pattern by application of a paste material using a control device (not shown) that is a control unit. Maintenance. At the control device, the above-described automatic valves 51 to 57 are connected.
亦即是，在配線形成裝置1之身為控制部的控制裝置處，係被連接有將溶媒補給裝置21之溶媒補給部22和載體氣體源26之間作連接之自動閥51。又，在控制裝置處，係被連接有將霧化部11之材料收容容器15和通連管4之間作連接之自動閥53。又，在控制裝置處，係被連接有將噴嘴3和通連管4之間作連接之自動閥54。又，在控制裝置處，係被連接有將鞘套氣體源70和噴嘴3之鞘套氣體供給管34之間作連接之自動閥52。又，在控制裝置處，係被連接有將第1氣體供給管62和通連管4之終端近旁之間作連接之自動閥57。又，在控制裝置處，係被連接有將吸引管64和通連管4之終端近旁之間作連接之自動閥56。又，在控制裝置處，係被連接有將第2氣體供給管65和通連管4之終端近旁之間作連接之自動閥55。 In other words, the automatic valve 51 that connects the solvent supply unit 22 of the solvent supply device 21 and the carrier gas source 26 is connected to the control device of the wiring forming device 1 as the control unit. Further, an automatic valve 53 for connecting the material storage container 15 of the atomizing portion 11 and the communication tube 4 is connected to the control device. Further, at the control device, an automatic valve 54 for connecting the nozzle 3 and the communication pipe 4 is connected. Further, at the control device, an automatic valve 52 for connecting the sheath gas source 70 and the sheath gas supply pipe 34 of the nozzle 3 is connected. Further, an automatic valve 57 that connects the first gas supply pipe 62 and the terminal of the communication pipe 4 is connected to the control device. Further, at the control device, an automatic valve 56 for connecting the suction pipe 64 and the terminal of the communication pipe 4 is connected. Further, an automatic valve 55 for connecting the second gas supply pipe 65 and the terminal of the communication pipe 4 is connected to the control device.
其結果，本發明之第1實施形態之配線形成裝置1，係能夠藉由控制裝置之控制，來對於自動閥51~57之閥開度分別相互獨立地進行自動調整。又，配線形成裝置1，係能夠藉由控制裝置之控制，來將載體氣體、第1維修氣體、第2維修氣體以及鞘套氣體等之流量設定 為所期望之值。 As a result, in the wiring forming apparatus 1 according to the first embodiment of the present invention, the valve opening degrees of the automatic valves 51 to 57 can be automatically adjusted independently of each other by the control of the control device. Further, the wiring forming device 1 can set the flow rates of the carrier gas, the first maintenance gas, the second maintenance gas, and the sheath gas by the control of the control device. For the expected value.
並且，配線形成裝置1，係藉由控制裝置之控制，來使用藉由霧化裝置2而霧化了的糊狀材料，來從噴嘴3而進行噴射並作塗布，而在基板W上形成糊狀材料之塗膜並進行配線圖案之形成。另一方面，配線形成裝置1，係能夠在該配線圖案之形成和下一個配線圖案之形成之間，亦即是在配線形成的空閒中，進行裝置之維修。 Further, the wiring forming apparatus 1 is sprayed and applied from the nozzle 3 by using the paste material atomized by the atomizing device 2 under the control of the control device, thereby forming a paste on the substrate W. The coating of the material is formed and a wiring pattern is formed. On the other hand, in the wiring forming apparatus 1, it is possible to perform maintenance of the apparatus between the formation of the wiring pattern and the formation of the next wiring pattern, that is, in the idle state in which the wiring is formed.
更具體而言，本發明之第1實施形態之配線形成裝置1，係能夠藉由控制裝置來控制自動閥51~57之閥開度，而對於第1氣體供給部61處之第1維修氣體之供給和吸引部63之吸引以及第2氣體供給部65處之第2維修氣體之供給分別作控制。其結果，配線形成裝置1，係能夠在配線形成之空閒中，作為維修，而進行第1氣體供給部61處之第1維修氣體之供給。又，配線形成裝置1，係能夠使附著在通連管4內之包含有糊狀材料之霧的揮發成分揮發並減少附著物之量。 More specifically, in the wiring forming apparatus 1 according to the first embodiment of the present invention, the valve opening degree of the automatic valves 51 to 57 can be controlled by the control device, and the first service gas at the first gas supply unit 61 can be controlled. The supply and suction of the suction unit 63 and the supply of the second maintenance gas at the second gas supply unit 65 are controlled separately. As a result, the wiring forming apparatus 1 can supply the first maintenance gas at the first gas supply unit 61 as a maintenance during the idle formation of the wiring. Further, in the wiring forming apparatus 1, the volatile component of the mist containing the paste material adhering to the communication tube 4 can be volatilized and the amount of the deposit can be reduced.
又，配線形成裝置1，係能夠在配線形成之空閒中，作為維修，而一同進行吸引部63處之吸引和第2氣體供給部65處之第2維修氣體之供給。又，配線形成裝置1，係能夠利用第2維修氣體的流動來使通連管4內之結露移動，並從通連管4而以高效率來將結露排出。 In the wiring forming apparatus 1, the suction of the suction unit 63 and the supply of the second maintenance gas at the second gas supply unit 65 can be performed together for maintenance while the wiring is being formed. Further, in the wiring forming apparatus 1, the condensation in the communication tube 4 can be moved by the flow of the second maintenance gas, and the condensation can be discharged from the communication tube 4 with high efficiency.
之後，配線形成裝置1，係能夠在作為維修而進行之第1氣體供給部61處之第1維修氣體之供給之後，為了使霧化了的糊狀材料之塗布安定化，而進行與配 線形成相獨立之安定化塗布。亦即是，係能夠在第1維修氣體之供給後，進行使用有藉由霧化裝置2而作了霧化的糊狀材料之安定化塗布，而使由從噴嘴3而來之噴射所致的塗布安定化，接著，進行實際之配線形成。 After that, the wiring forming apparatus 1 can perform the stabilization of the application of the atomized paste material after the supply of the first maintenance gas at the first gas supply unit 61 which is performed as a maintenance. The lines form independent stabilization coatings. In other words, after the supply of the first maintenance gas, it is possible to perform the stabilization coating using the paste material atomized by the atomizing device 2, thereby causing the ejection from the nozzle 3. The coating is stabilized, and then, actual wiring formation is performed.
又，配線形成裝置1，係能夠在作為維修而進行之第2氣體供給部65處之第2維修氣體之供給和在吸引部63處之吸引之後，為了使霧化了的糊狀材料之塗布安定化，而進行與配線形成相獨立之安定化塗布。亦即是，係能夠在吸引和第2維修氣體之供給後，進行使用有藉由霧化裝置2而作了霧化的糊狀材料之安定化塗布，而使由從噴嘴3而來之噴射所致的塗布安定化。接著，例如係能夠進行由在第1氣體供給部61處之第1維修氣體之供給等的其他方法所致之維修。 Moreover, the wiring forming apparatus 1 is capable of coating the atomized paste material after the supply of the second maintenance gas at the second gas supply unit 65 and the suction at the suction portion 63, which are performed as maintenance. The stabilization is carried out, and the stabilization coating is performed independently of the wiring formation. In other words, after the supply of the suction and the second maintenance gas, the stabilization coating of the paste material atomized by the atomizing device 2 can be performed, and the ejection from the nozzle 3 can be performed. The resulting coating is stabilized. Next, for example, maintenance by another method such as supply of the first maintenance gas at the first gas supply unit 61 can be performed.
進而，本發明之第1實施形態之配線形成裝置1，係能夠藉由控制裝置之控制，來對於在配線形成之空閒中所進行的上述之維修之方法和頻度任意作設定。亦即是，配線形成裝置1，係能夠藉由控制裝置之控制，來在配線形成之空閒中，選擇要進行由在第1氣體供給部61處之第1維修氣體之供給所致的維修以及由在吸引部63之吸引和在第2氣體供給部65處之第2維修氣體之供給所致的維修之中的何者，其結果，係能夠對於該些維修之各別的頻度作設定。 Further, in the wiring forming apparatus 1 according to the first embodiment of the present invention, it is possible to arbitrarily set the method and frequency of the above-described maintenance performed during the idle formation of the wiring by the control of the control device. In other words, the wiring forming apparatus 1 can select the maintenance to be performed by the supply of the first maintenance gas at the first gas supply unit 61 during the idle formation of the wiring by the control of the control device. The maintenance by the suction of the suction unit 63 and the supply of the second maintenance gas at the second gas supply unit 65 results in the setting of the respective frequencies of the maintenance.
亦即是，本發明之第1實施形態之配線形成裝置1，係能夠將在配線形成之空閒中所進行的由在第1 氣體供給部61處之第1維修氣體之供給所致的維修以及由在吸引部63之吸引和在第2氣體供給部65處之第2維修氣體之供給所致的維修任意作組合並實施之。其結果，本實施形態之配線形成裝置1，在配線形成中，係能夠安定地形成配線圖案。 In other words, the wiring forming apparatus 1 according to the first embodiment of the present invention can perform the first in the idle formation of the wiring. The maintenance by the supply of the first maintenance gas in the gas supply unit 61 and the maintenance by the suction of the suction unit 63 and the supply of the second maintenance gas at the second gas supply unit 65 are arbitrarily combined and implemented. . As a result, in the wiring forming apparatus 1 of the present embodiment, the wiring pattern can be stably formed in the wiring formation.
接著，針對使用本發明之第1實施形態的配線形成裝置1所進行之本發明之實施形態的配線形成方法作說明。 Next, a wiring forming method according to an embodiment of the present invention performed by the wiring forming apparatus 1 according to the first embodiment of the present invention will be described.
本發明之實施形態之配線形成方法，係使用上述之本發明之第1實施形態的配線形成裝置1而進行配線形成。又，本發明之實施形態之配線形成方法，係藉由使用配線形成裝置1，而能夠包含有在配線圖案形成和下一個配線圖案形成之間，亦即是在配線形成的空閒中，對於配線形成裝置1進行維修之維修方法。 In the wiring forming method according to the embodiment of the present invention, the wiring forming apparatus 1 according to the first embodiment of the present invention described above is used for wiring formation. Further, in the wiring forming method according to the embodiment of the present invention, by using the wiring forming apparatus 1, it is possible to include between the wiring pattern formation and the formation of the next wiring pattern, that is, in the idle formation of the wiring, and the wiring. A maintenance method for forming the device 1 for maintenance is formed.
亦即是，本發明之實施形態之配線形成方法，係包含有對於所使用之配線形成裝置1進行維修之維修方法，而構成之。具體而言，本實施形態之配線形成方法，係在反覆進行之配線形成的空閒中，作為維修，而進行在配線形成裝置1之第1氣體供給部61處的第1維修氣體之供給。亦即是，本發明之實施形態之配線形成方法，係作為維修，而設置有對於通連管4內而供給第1維修氣體之第1氣體供給工程。以下，將藉由此第1氣體供給工程所實現的配線形成裝置1之維修，稱作第1維修。又，在本實施形態之配線形成方法中，係藉由此第1維 修，而使配線形成裝置1之附著在通連管4內的包含有糊狀材料之霧的揮發成分揮發，並使附著物之量減少，而能夠進行安定之配線圖案之形成。 In other words, the wiring forming method according to the embodiment of the present invention includes a maintenance method for repairing the wiring forming apparatus 1 to be used. Specifically, in the wiring forming method of the present embodiment, the supply of the first maintenance gas in the first gas supply unit 61 of the wiring forming apparatus 1 is performed as a maintenance in the idle formation of the wiring which is repeatedly performed. In other words, the wiring forming method according to the embodiment of the present invention is provided with a first gas supply process for supplying the first maintenance gas to the inside of the communication pipe 4 as a maintenance. Hereinafter, the maintenance of the wiring forming apparatus 1 realized by the first gas supply project is referred to as a first maintenance. Further, in the wiring forming method of the present embodiment, the first dimension is thereby In the wiring forming apparatus 1, the volatile component of the mist containing the paste material adhering to the inside of the connecting pipe 4 is volatilized, and the amount of the deposit is reduced, whereby the stable wiring pattern can be formed.
又，本實施形態之配線形成方法，係在反覆進行之配線形成的空閒中，作為其他的維修，而將配線形成裝置1之在吸引部63處之吸引與在第2氣體供給部65處的第2維修氣體之供給一同進行。亦即是，本發明之實施形態之配線形成方法，係作為維修，而設置有與通連管4內之吸引一同地而對於通連管4內而供給第2維修氣體之第2氣體供給工程。以下，將藉由通連管4內之吸引和第2氣體供給工程所實現的配線形成裝置1之維修，稱作第2維修。又，在本實施形態之配線形成方法中，係能夠利用此第2維修中之第2維修氣體的流動，而使配線形成裝置1之通連管4內之結露移動，並從通連管4而以高效率來將結露排出。 Further, in the wiring forming method of the present embodiment, the suction of the wiring forming device 1 at the suction portion 63 and the second gas supply portion 65 are performed as the other maintenance in the idle formation of the wiring which is repeatedly performed. The supply of the second maintenance gas is performed together. In other words, the wiring forming method according to the embodiment of the present invention is provided with a second gas supply project for supplying the second maintenance gas to the inside of the communication pipe 4 together with the suction in the communication pipe 4 as a maintenance. . Hereinafter, the maintenance of the wiring forming apparatus 1 by the suction in the communication pipe 4 and the second gas supply project is referred to as a second maintenance. Further, in the wiring forming method of the present embodiment, the condensation of the inside of the connecting tube 4 of the wiring forming apparatus 1 can be moved by the flow of the second maintenance gas in the second maintenance, and the communication tube 4 can be moved from the communication tube 4 The condensation is discharged with high efficiency.
又，本實施形態之配線形成方法，係將在配線形成之空閒中所進行之上述第1維修以及第2維修之2種類的維修，以成為各自之既定之頻度的方式而組合並含有，而能夠進行配線形成和配線形成裝置1之維修。 Further, in the wiring forming method of the present embodiment, the maintenance of the two types of the first maintenance and the second maintenance performed in the idle state of the wiring formation is combined and contained so as to have a predetermined frequency. It is possible to perform wiring formation and maintenance of the wiring forming apparatus 1.
例如，當反覆進行配線形成而進行數日間之實施的情況時，第1維修係能夠以24小時1次之程度的頻度來進行。又，第2維修，係能夠以成為其之1/5的程度之頻度的例如120小時1次之程度的頻度來進行。 For example, when the wiring is formed repeatedly and the implementation is performed for several days, the first maintenance system can be performed at a frequency of about 24 hours. In addition, the second maintenance can be performed at a frequency of, for example, 120 hours once the frequency of 1/5.
亦即是，對於本發明之第1實施形態之配線 形成裝置1進行維修的維修方法，係將上述之第1維修以及第2維修之2種類的維修，分別以既定之頻度而作組合，而能夠於在配線形成方法中而反覆進行之配線形成的空閒中實施。 That is, the wiring of the first embodiment of the present invention The maintenance method for the maintenance of the apparatus 1 is a combination of the above-described maintenance of the first type and the second type of maintenance, which are combined with each other at a predetermined frequency, and can be formed by wiring which is repeatedly performed in the wiring forming method. Implemented in idle time.
更具體而言，於在本實施形態之配線形成方法中所進行的配線形成之空閒中，係能夠將由在第1氣體供給部61處之第1維修氣體之供給所致的維修以及由在吸引部63之吸引和在第2氣體供給部65處之第2維修氣體之供給所致的維修，以任意之頻度來作組合而實施之。 More specifically, in the idleness of the wiring formation performed in the wiring forming method of the present embodiment, the maintenance and the suction by the supply of the first maintenance gas at the first gas supply unit 61 can be performed. The maintenance by the suction of the portion 63 and the supply of the second maintenance gas at the second gas supply unit 65 is performed in combination at an arbitrary frequency.
其結果，本發明之實施形態之配線形成方法，係能夠在使用本發明之第1實施形態之配線形成裝置1來進行配線形成的同時，於該配線形成之空閒中，實施本發明之實施形態之維修方法，而進行配線形成裝置1之維修，以安定地形成配線圖案。此時，本發明之實施形態之維修方法，係將上述之第1維修以及第2維修之2種類的維修分別以既定之頻度來作組合而構成之。 As a result, in the wiring forming method according to the embodiment of the present invention, the wiring forming apparatus 1 according to the first embodiment of the present invention can be used to form the wiring, and the embodiment of the present invention can be implemented while the wiring is formed free. In the maintenance method, the wiring forming apparatus 1 is repaired to form a wiring pattern in a stable manner. In this case, in the maintenance method according to the embodiment of the present invention, the two types of maintenance of the first maintenance and the second maintenance described above are combined at a predetermined frequency.
又，本發明之實施形態之配線形成方法，係能夠在進行了上述之第1維修之後，於進行配線形成之前，如同上述一般，設置用以使霧化了的糊狀材料之塗布安定化之安定化工程，而進行安定化塗布。同樣的，在上述之第2維修之後，係可例如在進行第1維修之前，如同上述一般，設置用以使霧化了的糊狀材料之塗布安定化之安定化工程，而進行安定化塗布。 Further, in the wiring forming method according to the embodiment of the present invention, it is possible to stabilize the application of the atomized paste material as described above before the wiring is formed after the first maintenance described above. Stabilize the project and carry out the stabilization coating. Similarly, after the second maintenance described above, for example, before the first maintenance, the stabilization process for setting the application of the atomized paste material may be performed as described above, and the stabilization coating may be performed. .
本發明之實施形態之配線形成方法，係藉由 在第1維修以及第2維修之後，設置安定化工程，並進行用以使霧化了的糊狀材料之塗布安定化之塗布，而能夠在配線形成中安定地形成配線圖案。 The wiring forming method of the embodiment of the present invention is After the first maintenance and the second maintenance, the stabilization process is performed, and the application for ensuring the application of the atomized paste material is stabilized, and the wiring pattern can be stably formed in the wiring formation.
以下，一面適宜參考圖1，一面針對本發明之實施形態的配線形成方法作說明。另外，本發明之實施形態之配線形成方法的說明，係針對身為其之重要部分的本實施形態之維修方法和接續於其後之配線形成，來使用流程圖而作說明。 Hereinafter, a wiring forming method according to an embodiment of the present invention will be described with reference to Fig. 1 as appropriate. In addition, the description of the wiring forming method according to the embodiment of the present invention will be described using a flowchart for the maintenance method of the present embodiment, which is an important part thereof, and the subsequent wiring formation.
圖3，係為對於本發明之第2實施形態的配線形成方法之第1例作展示之流程圖。 Fig. 3 is a flow chart showing a first example of the wiring forming method according to the second embodiment of the present invention.
在圖3所示之本發明之第2實施形態的配線形成方法之第1例中，係在反覆進行之配線形成的空閒中，進行上述之第1維修。亦即是，在第2實施形態之配線形成方法的第1例中，係於配線形成之後，作為維修，而進行在配線形成裝置1之第1氣體供給部61處的第1維修氣體之供給。又，在本實施形態之配線形成方法的第1例中，係使配線形成裝置1之附著在通連管4內的包含有糊狀材料之霧的揮發成分揮發，並使附著物之量減少，而能夠進行安定之配線圖案之形成。 In the first example of the wiring forming method according to the second embodiment of the present invention shown in FIG. 3, the above-described first maintenance is performed in the idle state in which the wiring is repeatedly formed. In the first example of the wiring forming method of the second embodiment, after the wiring is formed, the first maintenance gas supply to the first gas supply unit 61 of the wiring forming apparatus 1 is performed as a maintenance. . In the first example of the wiring forming method of the present embodiment, the volatile component of the mist containing the paste material adhering to the connecting tube 4 in the wiring forming device 1 is volatilized, and the amount of the attached matter is reduced. The formation of a stable wiring pattern can be performed.
如圖3中所示一般，首先，係在圖1之霧化裝置2中，進行超音波之停止(步驟1)。具體而言，係進行霧化裝置2之霧化部11的超音波產生裝置16之停止。另外，超音波停止前之配線形成裝置1，係為可進行配線形成之狀態。亦即是，被配線形成裝置1之控制裝置 所控制，自動閥51、52、53、54係為ON狀態而為開狀態，自動閥55、56、57係為OFF狀態而為閉狀態。 As shown generally in Fig. 3, first, in the atomizing device 2 of Fig. 1, the ultrasonic wave is stopped (step 1). Specifically, the ultrasonic generating device 16 of the atomizing unit 11 of the atomizing device 2 is stopped. In addition, the wiring forming apparatus 1 before the stop of the ultrasonic wave is in a state in which wiring can be formed. That is, the control device of the wiring forming device 1 The automatic valves 51, 52, 53, 54 are controlled to be in an ON state and are in an ON state, and the automatic valves 55, 56, and 57 are in an OFF state and are in a closed state.
接著，係為了進行由第1氣體供給部61所致之第1維修氣體之供給，而進行自動閥操作(步驟2)。此自動閥動作，係為了對於通連管4內供給第1維修氣體，而藉由控制裝置之控制，來將自動閥51、53、55、56設為OFF狀態而成為閉狀態，並將自動閥52、54、57設為ON狀態而成為開狀態。其結果，載體氣體之供給係被停止，霧化了的糊狀材料之霧流的供給亦被停止。另一方面，係成為能夠進行從第1氣體供給部61所對於通連管4之第1維修氣體之供給。 Next, in order to supply the first maintenance gas by the first gas supply unit 61, an automatic valve operation is performed (step 2). In order to supply the first maintenance gas to the communication pipe 4, the automatic valve operation is controlled by the control device, and the automatic valves 51, 53, 55, and 56 are turned OFF, and are automatically closed. The valves 52, 54, and 57 are in an ON state and are in an open state. As a result, the supply of the carrier gas is stopped, and the supply of the mist flow of the atomized paste material is also stopped. On the other hand, it is possible to supply the first maintenance gas from the first gas supply unit 61 to the communication pipe 4.
接著，對於通連管4，而進行第1維修氣體之供給(步驟3)。第1維修氣體，係以使用氮氣、氬氣以及氦氣等之惰性氣體為理想，又以使用易於獲取之氮氣為特別理想。 Next, the supply of the first maintenance gas is performed to the communication pipe 4 (step 3). The first maintenance gas is preferably an inert gas such as nitrogen, argon or helium, and it is particularly preferable to use nitrogen which is easily available.
在從第1氣體供給部61而來之第1維修氣體的供給中之流量，係以設為每分鐘1ml~100ml為理想，為了以短時間而有效率地進行充分之維修，係以每分鐘5ml~20ml為更理想。又，第1維修氣體之供給時間，係以設為2分鐘~60分鐘為理想，為了以短時間而有效率地進行充分之維修，係以設為10分鐘~30分鐘為更理想。 The flow rate in the supply of the first maintenance gas from the first gas supply unit 61 is preferably 1 ml to 100 ml per minute, and is preferably performed in a minute to efficiently perform sufficient maintenance. 5ml~20ml is more ideal. In addition, the supply time of the first maintenance gas is preferably 2 minutes to 60 minutes, and it is more preferably 10 minutes to 30 minutes in order to perform sufficient maintenance in a short time.
從第1氣體供給部61所供給之第1維修氣體，係從噴嘴3之噴嘴部33而被排出。 The first service gas supplied from the first gas supply unit 61 is discharged from the nozzle unit 33 of the nozzle 3.
藉由進行此種由第1氣體供給部61所致之第1維修氣體之供給，係能夠使附著在通連管4內之包含有糊狀材料之霧的揮發成分揮發並減少附著物之量。 By supplying the first maintenance gas by the first gas supply unit 61, it is possible to volatilize the volatile component of the mist containing the paste material adhering to the communication tube 4 and reduce the amount of the deposit. .
接著，停止第1維修氣體之供給，並於進行配線形成之前，設置用以使霧化了的糊狀材料之塗布安定化之安定化工程，而進行為了進行安定之配線形成所需的準備。亦即是，藉由控制裝置之控制，而進行自動閥操作(步驟4)，自動閥51、52、53、54係被設為ON狀態而成為開狀態，自動閥55、56、57係被設為OFF狀態而成為閉狀態。此狀態，係如同上述一般，為與配線形成之狀態相同的狀態，載體氣體之供給係成為可能，霧化了的糊狀材料之霧流的供給亦成為可能。另一方面，從第1氣體供給部61所對於通連管4之第1維修氣體之供給係被停止。 Then, the supply of the first maintenance gas is stopped, and before the wiring is formed, a stabilization process for setting the application of the atomized paste material is provided, and preparation for wiring formation for stabilization is performed. That is, the automatic valve operation (step 4) is performed by the control of the control device, and the automatic valves 51, 52, 53, 54 are set to the ON state to be in the open state, and the automatic valves 55, 56, and 57 are It is in the OFF state and is in the closed state. In this state, as in the above-described state, the supply of the carrier gas is possible in the same state as the state in which the wiring is formed, and the supply of the mist flow of the atomized paste material is also possible. On the other hand, the supply of the first maintenance gas from the first gas supply unit 61 to the communication pipe 4 is stopped.
接著，在霧化裝置2中，進行超音波之產生(步驟5)。具體而言，霧化裝置2之霧化部11的超音波產生裝置16係被啟動，並開始超音波之產生。其結果，糊狀材料之霧化係開始，並進行對於通連管4以及噴嘴3之霧化了的糊狀材料之霧流的供給。 Next, in the atomizing device 2, the generation of ultrasonic waves is performed (step 5). Specifically, the ultrasonic generating device 16 of the atomizing unit 11 of the atomizing device 2 is activated, and generation of ultrasonic waves is started. As a result, the atomization of the paste material is started, and the supply of the mist flow of the atomized material of the atomizing tube 4 and the nozzle 3 is performed.
之後，為了使霧化了的糊狀材料之從噴嘴3所進行的噴射安定化並使霧化了的糊狀材料之塗布安定化，係在既定之時間中而維持塗布狀態，並進行塗布(安定化塗布)(步驟6)。為了達成安定化之塗布的時間，係以設為5分鐘~60分鐘為理想，為了以短時間而有效 率地實現充分之安定化，係以設為10分鐘~30分鐘為更理想。 Thereafter, in order to stabilize the spray of the atomized paste material from the nozzle 3 and stabilize the application of the atomized paste material, the coating state is maintained for a predetermined period of time, and coating is performed ( Stabilization coating) (Step 6). In order to achieve a stable coating time, it is ideal for 5 minutes to 60 minutes, and is effective for a short period of time. To achieve full stability, it is more desirable to set it to 10 minutes to 30 minutes.
接著，係進行對於由從噴嘴3而來之噴射所致的霧化了的糊狀材料之塗布的狀態之確認(步驟7)，並判斷是否能夠進行配線形成(步驟8)。當判斷為並無法進行配線形成的情況時，係回到步驟6，並再度進行用以達成安定化之塗布。 Next, confirmation of the state of application of the atomized paste material by the ejection from the nozzle 3 is performed (step 7), and it is determined whether or not wiring formation is possible (step 8). When it is judged that the wiring formation is not possible, the process returns to step 6, and the coating for achieving stabilization is performed again.
另一方面，當在步驟8中而判斷為能夠進行配線形成的情況時，係前進至步驟9，並進行配線之形成。此時，自動閥51~57之狀態，係如同上述一般，藉由控制裝置而被做控制，自動閥51、52、53、54係被設為ON狀態而成為開狀態，自動閥55、56、57係被設為OFF狀態而成為閉狀態。 On the other hand, when it is determined in step 8 that wiring formation is possible, the process proceeds to step 9 and wiring is formed. At this time, the state of the automatic valves 51 to 57 is controlled by the control device as described above, and the automatic valves 51, 52, 53, 54 are turned ON, and the automatic valves 55, 56 are opened. The 57 system is in the OFF state and is in the closed state.
如此這般，在本實施形態之配線形成方法的第1例中，係能夠藉由在步驟3中對於通連管4內供給第1維修氣體，來使配線形成裝置1之附著在通連管4內的包含有糊狀材料之霧的揮發成分揮發，並使附著物之量減少，之後，係能夠進行安定之配線圖案之形成。 In the first example of the wiring forming method of the present embodiment, the first maintenance gas can be supplied to the communication tube 4 in step 3, and the wiring forming apparatus 1 can be attached to the communication tube. The volatile component of the mist containing the paste material in 4 is volatilized, and the amount of the deposit is reduced, and thereafter, the formation of a stable wiring pattern can be performed.
如同以上一般，在圖3所示之本發明之第2實施形態的配線形成方法之第1例中，係在反覆進行之配線形成的空閒中，實施本發明之實施形態的維修方法之第1維修。在本實施形態之配線形成方法的第1例中，步驟1~步驟8，係相當於本發明之實施形態之維修方法的第1維修。而，本實施形態之配線形成方法之第1例，係進行 配線形成裝置1之維修，而使安定之配線圖案之形成成為可能。 In the first example of the wiring forming method according to the second embodiment of the present invention shown in FIG. 3, the first maintenance method according to the embodiment of the present invention is performed in the idle state in which the wiring is repeatedly formed. service. In the first example of the wiring forming method of the present embodiment, steps 1 to 8 correspond to the first maintenance of the maintenance method according to the embodiment of the present invention. Further, the first example of the wiring forming method of the present embodiment is performed. The maintenance of the wiring forming device 1 makes it possible to form a stable wiring pattern.
接著，針對本發明之第2實施形態的配線形成方法之身為另外一例的第2例作說明。 Next, a second example of the wiring forming method according to the second embodiment of the present invention will be described.
在本發明之第2實施形態的配線形成方法之第2例中，係在反覆進行之配線形成的空閒中，進行上述之第2維修。在第2維修中，係能夠利用第2維修氣體的流動，而使配線形成裝置1之通連管4內之結露移動，並從通連管4而以高效率來將結露排出。 In the second example of the wiring forming method according to the second embodiment of the present invention, the second maintenance described above is performed in the idle state in which the wiring is repeatedly formed. In the second maintenance, the condensation of the inside of the communication tube 4 of the wiring forming apparatus 1 can be performed by the flow of the second maintenance gas, and the condensation can be discharged from the communication tube 4 with high efficiency.
又，較理想，在第2維修之後，係於進行配線形成之前，進行上述之第1維修。亦即是，較理想，係對於通連管4內，而進行第1維修氣體之供給。藉由如此這般地在第2維修之後進行第1維修，於本發明之第2實施形態之配線形成方法中，係於將在吸引部63處之吸引與在第2氣體供給部65處之第2維修氣體之供給一同進行之後，成為能夠進行霧化了的糊狀材料之安定的塗布，而成為能夠進行霧化了的糊狀材料之安定的塗布。 Further, preferably, after the second maintenance, the first maintenance described above is performed before the wiring is formed. That is, it is preferable to supply the first maintenance gas to the inside of the communication pipe 4. In the wiring forming method according to the second embodiment of the present invention, the drawing is performed at the suction portion 63 and the second gas supply portion 65. After the supply of the second maintenance gas is performed together, the coating of the atomized material that can be atomized can be applied, and the coating of the atomized material can be stabilized.
圖4，係為對於本發明之第2實施形態的配線形成方法之第2例作展示之流程圖。 Fig. 4 is a flow chart showing a second example of the wiring forming method according to the second embodiment of the present invention.
在圖4所示之本發明之第2實施形態的配線形成方法之第2例中，係在反覆進行之配線形成的空閒中，進行上述之第2維修。亦即是，在第2實施形態之配線形成方法的第2例中，係於配線形成之後，作為維修，而進行配線形成裝置1之在吸引部63處之吸引和在第2 氣體供給部65處的第2維修氣體之供給。在本實施形態之配線形成方法中，係能夠利用此第2維修中之第2維修氣體的流動，而使配線形成裝置1之通連管4內之結露移動，並從通連管4而以高效率來將結露排出。 In the second example of the wiring forming method according to the second embodiment of the present invention shown in FIG. 4, the second maintenance described above is performed in the idle state in which the wiring is repeatedly formed. In the second example of the wiring forming method of the second embodiment, after the wiring is formed, the suction of the wiring forming apparatus 1 at the suction portion 63 is performed as a maintenance, and the second example is performed. The supply of the second maintenance gas at the gas supply unit 65. In the wiring forming method of the present embodiment, the condensation of the inside of the communication tube 4 of the wiring forming apparatus 1 can be moved by the flow of the second maintenance gas in the second maintenance, and the connection tube 4 can be used. High efficiency to discharge condensation.
接著，本發明之第2實施形態之配線形成方法之第2例，係在第2維修之後，於配線形成之前，被組合有第1維修地而實施之。其結果，本發明之第2實施形態之配線形成方法之第2例，係能夠進行安定之配線圖案之形成。 Next, the second example of the wiring forming method according to the second embodiment of the present invention is implemented after the second maintenance is performed, and the first maintenance place is combined before the wiring is formed. As a result, in the second example of the wiring forming method according to the second embodiment of the present invention, it is possible to form a stable wiring pattern.
在本發明之第2實施形態之配線形成方法之第2例中，如圖4中所示一般，首先，係在圖1之霧化裝置2中，進行超音波之停止(步驟1)。具體而言，係進行霧化裝置2之霧化部11的超音波產生裝置16之停止。另外，超音波停止前之配線形成裝置1，係為可進行配線形成之狀態。亦即是，被配線形成裝置1之控制裝置所控制，自動閥51、52、53、54係為ON狀態而為開狀態，自動閥55、56、57係為OFF狀態而為閉狀態。 In the second example of the wiring forming method according to the second embodiment of the present invention, as shown in Fig. 4, first, in the atomizing device 2 of Fig. 1, the ultrasonic wave is stopped (step 1). Specifically, the ultrasonic generating device 16 of the atomizing unit 11 of the atomizing device 2 is stopped. In addition, the wiring forming apparatus 1 before the stop of the ultrasonic wave is in a state in which wiring can be formed. That is, the control devices of the wiring forming apparatus 1 are controlled, and the automatic valves 51, 52, 53, 54 are in an ON state and are in an ON state, and the automatic valves 55, 56, and 57 are in an OFF state and are in a closed state.
接著，係為了進行由吸引部63所致之吸引和由第2氣體供給部65所致之第2維修氣體之供給，而進行自動閥操作(步驟2)。此自動閥動作，係為了對於通連管4內進行吸引並供給第2維修氣體，而藉由控制裝置之控制，來將自動閥51、52、53、54、57設為OFF狀態而成為閉狀態，並將自動閥55、56設為ON狀態而成為開狀態。其結果，載體氣體之供給係被停止，霧化了的糊 狀材料之霧流的供給亦被停止。又，噴嘴3之對於霧流轉換裝置32的鞘套氣體之供給係被停止。另一方面，係成為能夠進行由吸引部63所致之通連管4內之吸引、和從第2氣體供給部65而來之第2維修氣體之供給。 Next, in order to perform suction by the suction unit 63 and supply of the second maintenance gas by the second gas supply unit 65, an automatic valve operation is performed (step 2). This automatic valve operates to control the inside of the communication pipe 4 and supply the second maintenance gas, and the automatic valves 51, 52, 53, 54, and 57 are turned OFF by the control of the control device. In the state, the automatic valves 55 and 56 are turned on and turned on. As a result, the supply of the carrier gas is stopped, and the atomized paste is stopped. The supply of the mist flow of the material is also stopped. Further, the supply of the jacket gas to the mist flow conversion device 32 of the nozzle 3 is stopped. On the other hand, the suction in the communication pipe 4 by the suction unit 63 and the supply of the second maintenance gas from the second gas supply unit 65 can be performed.
接著，係進行通連管4內之吸引和第2維修氣體之供給(步驟3)。步驟3之通連管4內之吸引和第2維修氣體之供給，較理想，係進行10秒~5分鐘，又，為了實現高效率之結露的排出，更理想，係進行30秒~2分鐘。 Next, the suction in the communication pipe 4 and the supply of the second maintenance gas are performed (step 3). In the step 3, the suction in the connecting pipe 4 and the supply of the second maintenance gas are preferably carried out for 10 seconds to 5 minutes, and in order to achieve high-efficiency dew discharge, it is more desirable to perform 30 seconds to 2 minutes. .
第2維修氣體，除了氮氣、氬氣以及氦氣等之惰性氣體以外，亦可使用空氣。又，較理想，係利用容易獲取並且能夠簡單的準備而能夠以低成本來作利用之空氣，更理想，係利用能夠對於水份之附著在通連管4內的情況作抑制之乾燥空氣(dry air)。第2維修氣體之流量供給時間，係以設為每分鐘1公升(1)~10公升(1)為理想，為了實現高效率之結露的排出，係以設為每分鐘2公升(1)~6公升(1)為更理想。 The second maintenance gas may be air other than an inert gas such as nitrogen, argon or helium. Further, it is preferable to use air which can be easily utilized and can be easily used for low cost, and it is more preferable to use dry air which can suppress the adhesion of moisture to the inside of the communication pipe 4 ( Dry air). The flow rate of the second maintenance gas is preferably 1 liter (1) to 10 liters per minute (1). In order to achieve high-efficiency condensation, it is set to 2 liters per minute (1)~ 6 liters (1) is more ideal.
如此這般，在本發明之第2實施形態之配線形成方法的第2例中，係能夠利用吸引和第2維修氣體的供給，來在通連管4內形成第2維修氣體之流動，並能夠利用第2維修氣體之流動，而使配線形成裝置1之通連管4內之結露移動，並從通連管4而以高效率來將結露排出。 In the second example of the wiring forming method according to the second embodiment of the present invention, the flow of the second maintenance gas can be formed in the communication pipe 4 by the suction and the supply of the second maintenance gas. By the flow of the second maintenance gas, the condensation in the communication tube 4 of the wiring forming device 1 can be moved, and the condensation can be discharged from the communication tube 4 with high efficiency.
接著，在本發明之第2實施形態之配線形成 方法之第2例中，係為了成為能夠進行安定之配線形成，而進行有第1維修。然而，較理想，於此之前，係設置有用以使霧化了的糊狀材料之塗布安定化之安定化工程，而進行與上述之第2實施形態之配線形成方法的第1例相同之用以使塗布狀態安定化的塗布(安定化塗布)。 Next, wiring formation in the second embodiment of the present invention In the second example of the method, the first maintenance is performed in order to form a wiring that can be stabilized. However, it is preferable to use the same stability as the first example of the wiring forming method of the second embodiment described above, in order to stabilize the application of the application of the atomized paste material. Coating (stabilized coating) in which the coating state is stabilized.
亦即是，藉由控制裝置之控制，而進行自動閥操作(步驟4)，自動閥51、52、53、54係被設為ON狀態而成為開狀態，自動閥55、56、57係被設為OFF狀態而成為閉狀態。此狀態，係如同上述一般，為與配線形成之狀態相同的狀態，載體氣體之供給係成為可能，霧化了的糊狀材料之霧流的供給亦成為可能。另一方面，在吸引部63處之吸引和從第2氣體供給部65所對於通連管4之第2維修氣體之供給係被停止。 That is, the automatic valve operation (step 4) is performed by the control of the control device, and the automatic valves 51, 52, 53, 54 are set to the ON state to be in the open state, and the automatic valves 55, 56, and 57 are It is in the OFF state and is in the closed state. In this state, as in the above-described state, the supply of the carrier gas is possible in the same state as the state in which the wiring is formed, and the supply of the mist flow of the atomized paste material is also possible. On the other hand, the suction at the suction portion 63 and the supply of the second maintenance gas from the second gas supply portion 65 to the communication pipe 4 are stopped.
接著，在霧化裝置2中，進行超音波之產生(步驟5)。具體而言，霧化裝置2之霧化部11的超音波產生裝置16係被啟動，並開始超音波之產生。其結果，糊狀材料之霧化係開始，並進行對於通連管4以及噴嘴3之霧化了的糊狀材料之霧流的供給，而成為進行從噴嘴3之噴嘴部33而來的噴射。 Next, in the atomizing device 2, the generation of ultrasonic waves is performed (step 5). Specifically, the ultrasonic generating device 16 of the atomizing unit 11 of the atomizing device 2 is activated, and generation of ultrasonic waves is started. As a result, the atomization of the paste material is started, and the supply of the mist flow of the atomized material of the nozzles 4 and the nozzles 3 is performed, and the injection from the nozzle portion 33 of the nozzle 3 is performed. .
接著，藉由控制裝置之控制，而進行自動閥51、52之操作，載體氣體之流量和鞘套氣體之流量係被調整(步驟6)。此時，載體氣體之流量和鞘套氣體之流量，係為了迅速地實現塗布狀態之安定化，而以設為相較於配線形成時之各流量而為更大的流量為理想。例如，更 理想，係相較於進行配線形成時，而分別設定有更增大了10%~40%之流量。 Next, the operation of the automatic valves 51, 52 is performed by the control of the control means, and the flow rate of the carrier gas and the flow rate of the sheath gas are adjusted (step 6). In this case, the flow rate of the carrier gas and the flow rate of the sheath gas are preferably set to be larger than the respective flow rates at the time of wiring formation in order to rapidly stabilize the application state. For example, more Ideally, the flow rate is increased by 10% to 40%, respectively, when the wiring is formed.
之後，為了使霧化了的糊狀材料之從噴嘴3而來的噴射安定化，並使霧化了的糊狀材料之塗布安定化，係在既定之時間中而維持塗布狀態，並進行塗布(步驟7)。為了達成安定化之塗布的時間，係以設為5分鐘~60分鐘為理想，為了以短時間而有效率地實現充分之安定化，係以設為10分鐘~30分鐘為更理想。 After that, in order to stabilize the ejection of the atomized paste material from the nozzle 3, and to stabilize the application of the atomized paste material, the coating state is maintained for a predetermined period of time, and coating is performed. (Step 7). In order to achieve a stable coating time, it is preferably 5 minutes to 60 minutes, and it is more preferably 10 minutes to 30 minutes in order to achieve sufficient stabilization in a short time.
接著，在本實施形態之配線形成方法之第2例中，係進行有對於進行第1維修一事之準備。 Next, in the second example of the wiring forming method of the present embodiment, preparation for performing the first maintenance is performed.
亦即是，在圖1之霧化裝置2中，進行超音波之停止(步驟8)。具體而言，係進行霧化裝置2之霧化部11的超音波產生裝置16之停止。此時，配線形成裝置1，係為可進行配線形成之狀態。亦即是，被配線形成裝置1之控制裝置所控制，自動閥51、52、53、54係為ON狀態而為開狀態，自動閥55、56、57係為OFF狀態而為閉狀態。 That is, in the atomizing device 2 of Fig. 1, the ultrasonic wave is stopped (step 8). Specifically, the ultrasonic generating device 16 of the atomizing unit 11 of the atomizing device 2 is stopped. At this time, the wiring forming apparatus 1 is in a state in which wiring can be formed. That is, the control devices of the wiring forming apparatus 1 are controlled, and the automatic valves 51, 52, 53, 54 are in an ON state and are in an ON state, and the automatic valves 55, 56, and 57 are in an OFF state and are in a closed state.
接著，係為了進行由第1氣體供給部61所致之第1維修氣體之供給，而進行自動閥操作(步驟9)。此自動閥動作，係為了對於通連管4內供給第1維修氣體，而藉由控制裝置之控制，來將自動閥51、53、55、56設為OFF狀態而成為閉狀態，並將自動閥52、54、57設為ON狀態而成為開狀態。其結果，載體氣體之供給係被停止，霧化了的糊狀材料之霧流的供給亦被停止。另一 方面，係成為能夠進行從第1氣體供給部61所對於通連管4之第1維修氣體之供給。 Next, in order to supply the first maintenance gas by the first gas supply unit 61, an automatic valve operation is performed (step 9). In order to supply the first maintenance gas to the communication pipe 4, the automatic valve operation is controlled by the control device, and the automatic valves 51, 53, 55, and 56 are turned OFF, and are automatically closed. The valves 52, 54, and 57 are in an ON state and are in an open state. As a result, the supply of the carrier gas is stopped, and the supply of the mist flow of the atomized paste material is also stopped. another In other words, the supply of the first maintenance gas to the communication pipe 4 from the first gas supply unit 61 can be performed.
接著，對於通連管4，而進行第1維修氣體之供給(步驟10)。第1維修氣體，係以使用氮氣、氬氣以及氦氣等之惰性氣體為理想，又以使用易於獲取之氮氣為特別理想。 Next, the supply of the first maintenance gas is performed to the communication pipe 4 (step 10). The first maintenance gas is preferably an inert gas such as nitrogen, argon or helium, and it is particularly preferable to use nitrogen which is easily available.
在從第1氣體供給部61而來之第1維修氣體的供給中之流量，係以設為每分鐘1ml~100ml為理想，為了以短時間而有效率地進行充分之維修，係以每分鐘5ml~20ml為更理想。又，第1維修氣體之供給時間，係以設為2分鐘~60分鐘為理想，為了以短時間而有效率地進行充分之維修，係以設為10分鐘~30分鐘為更理想。 The flow rate in the supply of the first maintenance gas from the first gas supply unit 61 is preferably 1 ml to 100 ml per minute, and is preferably performed in a minute to efficiently perform sufficient maintenance. 5ml~20ml is more ideal. In addition, the supply time of the first maintenance gas is preferably 2 minutes to 60 minutes, and it is more preferably 10 minutes to 30 minutes in order to perform sufficient maintenance in a short time.
從第1氣體供給部61所供給之第1維修氣體，係從噴嘴3之噴嘴部33而被排出。 The first service gas supplied from the first gas supply unit 61 is discharged from the nozzle unit 33 of the nozzle 3.
藉由進行此種由第1氣體供給部61所致之第1維修氣體之供給，係能夠使附著在通連管4內之包含有糊狀材料之霧的揮發成分揮發並減少附著物之量。 By supplying the first maintenance gas by the first gas supply unit 61, it is possible to volatilize the volatile component of the mist containing the paste material adhering to the communication tube 4 and reduce the amount of the deposit. .
接著，停止第1維修氣體之供給，並於進行配線形成之前，設置用以使霧化了的糊狀材料之塗布安定化之安定化工程，而進行為了實現安定之配線形成所需的準備。亦即是，藉由控制裝置之控制，而進行自動閥操作(步驟11)，自動閥51、52、53、54係被設為ON狀態而成為開狀態，自動閥55、56、57係被設為OFF狀態而 成為閉狀態。此狀態，係如同上述一般，為與配線形成時相同的狀態，載體氣體之供給係成為可能，霧化了的糊狀材料之霧流的供給亦成為可能。另一方面，從第1氣體供給部61所對於通連管4之第1維修氣體之供給係被停止。 Then, the supply of the first maintenance gas is stopped, and before the wiring is formed, a stabilization process for setting the application of the atomized paste material is provided, and preparation for wiring formation for stabilization is performed. That is, the automatic valve operation is performed by the control of the control device (step 11), and the automatic valves 51, 52, 53, 54 are set to the ON state to be in the open state, and the automatic valves 55, 56, 57 are Set to the OFF state Become closed. In this state, as in the above, in the same state as when the wiring is formed, the supply of the carrier gas is possible, and the supply of the mist flow of the atomized paste material is also possible. On the other hand, the supply of the first maintenance gas from the first gas supply unit 61 to the communication pipe 4 is stopped.
接著，藉由控制裝置之控制，而進行自動閥51、52之操作，載體氣體之流量和鞘套氣體之流量係被調整(步驟12)。此時，載體氣體之流量和鞘套氣體之流量，係被設定為與進行配線形成時之各流量相等的流量。 Next, the operation of the automatic valves 51, 52 is performed by the control of the control means, and the flow rate of the carrier gas and the flow rate of the sheath gas are adjusted (step 12). At this time, the flow rate of the carrier gas and the flow rate of the sheath gas are set to a flow rate equal to the respective flow rates at the time of wiring formation.
接著，在霧化裝置2中，進行超音波之產生(步驟13)。具體而言，霧化裝置2之霧化部11的超音波產生裝置16係被啟動，並開始超音波之產生。其結果，糊狀材料之霧化係開始，並進行對於通連管4以及噴嘴3之霧化了的糊狀材料之霧流的供給。 Next, in the atomizing device 2, the generation of ultrasonic waves is performed (step 13). Specifically, the ultrasonic generating device 16 of the atomizing unit 11 of the atomizing device 2 is activated, and generation of ultrasonic waves is started. As a result, the atomization of the paste material is started, and the supply of the mist flow of the atomized material of the atomizing tube 4 and the nozzle 3 is performed.
之後，為了使霧化了的糊狀材料之從噴嘴3而來的噴射安定化，並使霧化了的糊狀材料之塗布安定化，係在既定之時間中而維持塗布狀態，並進行塗布(步驟14)。為了達成安定化之塗布的時間，係以設為5分鐘~60分鐘為理想。於此情況，為了以短時間而有效率地實現充分之安定化，係以設為較步驟7或上述之圖3的本實施形態之配線形成方法之第1例的步驟6而更常的時間為理想，例如，係以設為20分鐘~40分鐘為理想。 After that, in order to stabilize the ejection of the atomized paste material from the nozzle 3, and to stabilize the application of the atomized paste material, the coating state is maintained for a predetermined period of time, and coating is performed. (Step 14). In order to achieve a stable coating time, it is preferably set to 5 minutes to 60 minutes. In this case, in order to achieve sufficient stabilization in a short period of time, it is more common time than step 6 of the first example of the wiring forming method of the present embodiment in the step 7 or the above-described FIG. Ideally, for example, it is ideal to set it as 20 minutes to 40 minutes.
接著，係進行對於由從噴嘴3而來之噴射所 致的霧化了的糊狀材料之塗布的狀態之確認(步驟15)，並判斷是否能夠進行配線形成(步驟16)。當判斷為並無法進行配線形成的情況時，係回到步驟10，並再度進行第1維修和用以達成安定化之塗布。 Next, it is performed on the jetting machine from the nozzle 3 The state of application of the atomized paste material is confirmed (step 15), and it is judged whether or not wiring formation is possible (step 16). When it is judged that the wiring formation cannot be performed, the process returns to step 10, and the first maintenance and the coating for achieving stabilization are performed again.
另一方面，當在步驟16中而判斷為能夠進行配線形成的情況時，係前進至步驟17，並進行配線形成。此時，自動閥51~57之狀態，係如同上述一般，藉由控制裝置而被作控制，自動閥51、52、53、54係被設為ON狀態而成為開狀態，自動閥55、56、57係被設為OFF狀態而成為閉狀態。 On the other hand, when it is determined in step 16 that wiring formation is possible, the process proceeds to step 17 and wiring formation is performed. At this time, the state of the automatic valves 51 to 57 is controlled by the control device as described above, and the automatic valves 51, 52, 53, 54 are turned ON, and the automatic valves 55, 56 are opened. The 57 system is in the OFF state and is in the closed state.
如此這般，在本實施形態之配線形成方法之第2例中，藉由在步驟3中而進行通連管4內之吸引和第2維修氣體之供給，係能夠利用第2維修氣體的流動，而使配線形成裝置1之通連管4內之結露移動，並從通連管4而以高效率來將結露排出。進而，之後，係能夠藉由在步驟10中對於通連管4內供給第1維修氣體，來使配線形成裝置1之附著在通連管4內的包含有糊狀材料之霧的揮發成分揮發，並使附著物之量減少，之後，係能夠進行安定之配線圖案之形成。 In the second example of the wiring forming method of the present embodiment, the flow of the second maintenance gas can be utilized by performing the suction in the communication pipe 4 and the supply of the second maintenance gas in the step 3. The condensation in the communication tube 4 of the wiring forming device 1 is moved, and the condensation is discharged from the communication tube 4 with high efficiency. Further, after the first maintenance gas is supplied to the communication tube 4 in step 10, the volatile component of the mist containing the paste material adhering to the communication tube 1 in the wiring forming device 1 can be volatilized. And the amount of the attached matter is reduced, and thereafter, the formation of a stable wiring pattern can be performed.
如同以上一般，在圖4所示之本發明之第2實施形態的配線形成方法之第2例中，係在反覆進行之配線形成的空閒中，實施本發明之實施形態的維修方法之第2維修，並接著實施第1維修。在本實施形態之配線形成方法的第2例中，步驟1~步驟7，係相當於本發明之實 施形態之維修方法的第2維修。又，步驟8~步驟16，係相當於本發明之實施形態之維修方法的第1維修，該些係被作組合而包含之。其結果，第2實施形態之配線形成方法之第2例，係進行配線形成裝置1之維修，而使安定之配線圖案之形成成為可能。 In the second example of the wiring forming method according to the second embodiment of the present invention shown in FIG. 4, the second maintenance method according to the embodiment of the present invention is implemented in the idle state in which the wiring is repeatedly formed. Repair, and then implement the first repair. In the second example of the wiring forming method of the present embodiment, steps 1 to 7 correspond to the present invention. The second maintenance of the maintenance method of the form. Further, steps 8 to 16 correspond to the first maintenance of the maintenance method according to the embodiment of the present invention, and these are included in combination. As a result, in the second example of the wiring forming method of the second embodiment, maintenance of the wiring forming apparatus 1 is performed, and formation of a stable wiring pattern is possible.
另外，係將在本發明之第2實施形態之配線形成方法中，於實行配線形成處理之步驟、供給第1維修氣體之步驟、吸引和供給第2維修氣體之步驟、以及進行安定化塗布之步驟的各步驟時，所設定之自動閥51~57的開閉狀態，於圖5中作了整理。 Further, in the wiring forming method according to the second embodiment of the present invention, the step of performing the wiring forming process, the step of supplying the first maintenance gas, the step of sucking and supplying the second maintenance gas, and the stabilization coating are performed. In the respective steps of the step, the open and closed states of the set automatic valves 51 to 57 are arranged in Fig. 5 .
圖5，係為對於本發明之第2實施形態的配線形成方法之主要的步驟中之自動閥的開閉狀態作了整理之表。 Fig. 5 is a table in which the opening and closing states of the automatic valves in the main steps of the wiring forming method according to the second embodiment of the present invention are arranged.
在圖5中，於自動閥51~57之欄中所記載的「開」之標記，係代表各自動閥51~57被設定為開啟之狀態，「閉」之標記，係代表各自動閥51~57被設定為關閉之狀態。 In Fig. 5, the "open" mark in the column of the automatic valves 51 to 57 indicates that each of the automatic valves 51 to 57 is set to be in an open state, and the "closed" mark indicates that each of the automatic valves 51 is present. ~57 is set to the off state.
在身為本發明之實施形態的配線形成裝置中，將霧化裝置和噴嘴作連接的通連管之構造，係並不被限定於圖1中所示之第1實施形態之配線形成裝置1的通連管4之構造。只要是能夠進行通連管內之吸引和第2維修氣體之供給，而能夠利用第2維修氣體的流動，來使配線形成裝置 之通連管內之結露移動，並從通連管而以高效率來將結露排出，則係亦可採用其他的構造。 In the wiring forming apparatus according to the embodiment of the present invention, the structure of the communication tube that connects the atomizing device and the nozzle is not limited to the wiring forming device 1 of the first embodiment shown in FIG. The construction of the communication tube 4. The wiring forming device can be used by the flow of the second maintenance gas as long as the suction in the communication pipe and the supply of the second maintenance gas can be performed. It is also possible to adopt other configurations in the case where the condensation in the tube is moved and the condensation is discharged from the communication tube with high efficiency.
例如，亦可構成為：在與霧化裝置之間的連接部側處，具備有對於通連管內而供給第1維修氣體之第1氣體供給部，並且在與噴嘴之間的連接部側處，具備有用以對於通連管內進行吸引之吸引部，且在與霧化裝置之間的連接部側處，具備有用以對於通連管內供給第2維修氣體之第2氣體供給部。 For example, the first gas supply unit that supplies the first maintenance gas to the inside of the communication tube may be provided on the side of the connection portion with the atomization device, and the connection portion between the nozzle and the nozzle may be provided. There is provided a suction portion for attracting the inside of the communication pipe, and a second gas supply portion for supplying the second maintenance gas to the communication pipe is provided on the side of the connection portion with the atomization device.
圖6，係為對於本發明之第3實施形態的配線形成裝置作展示之圖。 Fig. 6 is a view showing a wiring forming apparatus according to a third embodiment of the present invention.
另外，在圖6所示之本發明之第3實施形態之配線形成裝置100中，針對與本發明之第1實施形態之配線形成裝置1共通的構成要素，係附加相同之元件符號，並省略重複之說明。 In the wiring forming apparatus 100 according to the third embodiment of the present invention shown in FIG. 6, the same components as those of the wiring forming apparatus 1 according to the first embodiment of the present invention are denoted by the same reference numerals, and are omitted. Repeat the instructions.
如圖6中所示一般，本發明之第3實施形態的配線形成裝置100，係由霧化裝置2、和噴嘴3、以及將霧化裝置2和噴嘴3作連接之通連管104，而構成之。並且，配線形成裝置100，係與本發明之第1實施形態之配線形成裝置1相同的，使用藉由霧化裝置2而霧化了的糊狀材料，來從噴嘴3來進行噴射，並例如在基板W上形成糊狀材料之塗膜，而能夠進行配線圖案之形成。 As shown in FIG. 6, the wiring forming apparatus 100 according to the third embodiment of the present invention is an atomizing device 2, a nozzle 3, and a communication pipe 104 for connecting the atomizing device 2 and the nozzle 3, and Constituting it. Further, the wiring forming apparatus 100 is the same as the wiring forming apparatus 1 of the first embodiment of the present invention, and uses the paste material atomized by the atomizing device 2 to eject the nozzle 3, for example. A coating film of a paste material is formed on the substrate W, and formation of a wiring pattern can be performed.
又，本發明之第3實施形態之配線形成裝置100，係在與霧化裝置2之間的連接部側處，具備有對於通連管104內而供給第1維修氣體之第1氣體供給部 61，並在與噴嘴3之間的連接部側處，具備有用以對於通連管104內進行吸引之吸引部63，且在與霧化裝置2之間的連接部側處，具備有用以對於通連管104內供給第2維修氣體之第2氣體供給部65。 In the wiring forming apparatus 100 according to the third embodiment of the present invention, the first gas supply unit that supplies the first maintenance gas to the inside of the communication pipe 104 is provided on the side of the connection portion with the atomization device 2. 61. At the side of the connection portion with the nozzle 3, a suction portion 63 for sucking the inside of the communication tube 104 is provided, and at the side of the connection portion with the atomization device 2, it is useful for The second gas supply unit 65 that supplies the second maintenance gas is connected to the communication pipe 104.
在本實施形態之配線形成裝置100中，通連管104之第1氣體供給部61，係與圖1中所示之第1實施形態之配線形成裝置1相同的，具備有以對於通連管104內而供給第1維修氣體的方式來與第1維修氣體源67作連接之第1氣體供給管62、和自動閥57。 In the wiring forming apparatus 100 of the present embodiment, the first gas supply unit 61 of the communication tube 104 is the same as the wiring forming apparatus 1 of the first embodiment shown in FIG. The first gas supply pipe 62 and the automatic valve 57 connected to the first maintenance gas source 67 are supplied to the first maintenance gas in the 104.
在本實施形態之配線形成裝置100中，通連管104之第2氣體供給部65，係與圖1中所示之第1實施形態之配線形成裝置1相同的，具備有以對於通連管104內而供給第2維修氣體的方式來與第2維修氣體源69作連接之第2氣體供給管66、和自動閥55。 In the wiring forming apparatus 100 of the present embodiment, the second gas supply unit 65 of the communication tube 104 is the same as the wiring forming apparatus 1 of the first embodiment shown in FIG. The second gas supply pipe 66 connected to the second maintenance gas source 69 and the automatic valve 55 are provided in the mode in which the second maintenance gas is supplied.
在本實施形態之配線形成裝置100中，通連管104之吸引部63，係與圖1中所示之第1實施形態之配線形成裝置1相同的，以對於通連管104內進行吸引的方式，而例如具備有和由吸引幫浦等所成之吸引裝置68作連接的吸引管64、和能夠對於由吸引裝置68所致之吸引效果進行控制的自動閥56。 In the wiring forming apparatus 100 of the present embodiment, the suction portion 63 of the communication tube 104 is the same as the wiring forming device 1 of the first embodiment shown in FIG. 1, and is attracted to the inside of the communication tube 104. For example, the suction pipe 64 connected to the suction device 68 formed by the suction pump or the like and the automatic valve 56 capable of controlling the suction effect by the suction device 68 are provided.
具備有以上的構成之本發明之第3實施形態之配線形成裝置100，係能夠對於會有糊狀材料之霧附著並成為結露而在噴嘴3中流動的擔憂之通連管104，而供給由第1維修氣體之供給所進行的維修。 In the wiring forming apparatus 100 according to the third embodiment of the present invention having the above-described configuration, it is possible to supply the communication tube 104 in which the mist of the paste material adheres and becomes dew condensation and flows through the nozzle 3. Maintenance of the supply of the first maintenance gas.
又，配線形成裝置100，係進而能夠進行第2之維修氣體的供給以及吸引，而進行以相異之方法所致之通連管104之維修。亦即是，本發明之第3實施形態之配線形成裝置100，係與圖1中所示之第1實施形態之配線形成裝置1相同的，成為能夠進行使用有第1氣體供給部61、吸引部63以及第2氣體供給部65之維修，而成為能夠安定地形成配線圖案。 Moreover, the wiring forming apparatus 100 can further perform the supply and the suction of the second maintenance gas, and perform maintenance of the communication pipe 104 by a different method. In other words, the wiring forming apparatus 100 according to the third embodiment of the present invention is similar to the wiring forming apparatus 1 of the first embodiment shown in FIG. 1, and the first gas supply unit 61 can be used and attracted. The maintenance of the portion 63 and the second gas supply unit 65 makes it possible to form the wiring pattern in a stable manner.
又，本發明之第3實施形態之配線形成裝置100，係能夠對於上述之本發明之第2實施形態之配線形成方法，而與圖1中所示之第1實施形態之配線形成裝置1同樣的來作適用。 In the wiring forming apparatus 100 according to the third embodiment of the present invention, the wiring forming method according to the second embodiment of the present invention described above can be the same as the wiring forming apparatus 1 of the first embodiment shown in FIG. The application is applicable.
另外，本發明係並不被限定於上述之各實施形態，在不脫離本發明之趣旨的範圍內，係能夠作各種之變形而實施之。 The present invention is not limited to the embodiments described above, and various modifications can be made without departing from the spirit and scope of the invention.
例如，係並不僅限於使用利用有金屬奈米糊之糊狀材料的配線形成裝置以及配線形成方法，而可對於各種之噴霧系統來適用本發明。 For example, the present invention is not limited to the use of a wiring forming apparatus and a wiring forming method using a paste material having a metal nano paste, but the present invention can be applied to various spray systems.
又，在配線形成裝置中，霧化裝置之霧化部以及溶媒補給裝置之構成，係可適用各種之構成，而可使用所有的既存之裝置。 Further, in the wiring forming apparatus, the atomizing unit of the atomizing device and the solvent replenishing device can be configured in various configurations, and all existing devices can be used.
1‧‧‧配線形成裝置 1‧‧‧Wiring forming device
2‧‧‧霧化裝置 2‧‧‧Atomizing device
3‧‧‧噴嘴 3‧‧‧ nozzle
4、24、41‧‧‧通連管 4, 24, 41‧‧‧Connected
11‧‧‧霧化部 11‧‧‧Atomization Department
12‧‧‧恆溫用液體 12‧‧‧Constant liquid
13‧‧‧恆溫槽 13‧‧‧ thermostat
14‧‧‧混合物 14‧‧‧Mixture
15‧‧‧材料收容容器 15‧‧‧Material storage container
16‧‧‧超音波產生裝置 16‧‧‧Ultrasonic generating device
17‧‧‧蓋體 17‧‧‧ Cover
18‧‧‧流體導入口 18‧‧‧ fluid inlet
19‧‧‧流體導出口 19‧‧‧ Fluid outlet
20‧‧‧內部管 20‧‧‧Internal pipe
21‧‧‧溶媒補給裝置 21‧‧‧Solvent replenishing device
22‧‧‧溶媒補給部 22‧‧‧Solvent Replenishment Department
23‧‧‧溫度控制部 23‧‧‧ Temperature Control Department
25‧‧‧溶媒 25‧‧‧Solvent
26‧‧‧載體氣體源 26‧‧‧ Carrier gas source
32‧‧‧霧流轉換裝置 32‧‧‧Mist stream conversion device
33‧‧‧噴嘴部 33‧‧‧Nozzle Department
34‧‧‧鞘套氣體供給管 34‧‧‧sheath gas supply pipe
42‧‧‧放出開口 42‧‧‧ release opening
51、52、53、54、55、56、57‧‧‧自動閥 51, 52, 53, 54, 55, 56, 57‧‧‧ automatic valves
61‧‧‧第1氣體供給部 61‧‧‧1st gas supply department
62‧‧‧第1氣體供給管 62‧‧‧1st gas supply pipe
63‧‧‧吸引部 63‧‧‧Attraction
64‧‧‧吸引管 64‧‧‧ suction tube
65‧‧‧第2氣體供給部 65‧‧‧2nd gas supply department
66‧‧‧第2氣體供給管 66‧‧‧2nd gas supply pipe
67‧‧‧第1維修氣體源 67‧‧‧1st maintenance gas source
68‧‧‧吸引裝置 68‧‧‧Attraction device
69‧‧‧第2維修氣體源 69‧‧‧2nd maintenance gas source
70‧‧‧鞘套氣體源 70‧‧‧sheath gas source
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| WO2018011854A1 (en) * | 2016-07-11 | 2018-01-18 | 東芝三菱電機産業システム株式会社 | Mist-coating film formation apparatus and mist-coating film formation method |
| CN110035832B (en) * | 2019-03-08 | 2021-04-02 | 璞真生活有限公司 | Atomizing nozzle and atomizing device |
| JP7408985B2 (en) | 2019-10-07 | 2024-01-09 | Ｔｏｐｐａｎホールディングス株式会社 | Printing method, printing device and printed matter |
| JP6994694B2 (en) * | 2020-02-27 | 2022-01-14 | 信越化学工業株式会社 | Atomization device for film formation and film formation device using this |
| CN111330767A (en) * | 2020-03-16 | 2020-06-26 | Tcl华星光电技术有限公司 | Coater control method, coater control device and storage medium |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61242663A (en) * | 1985-04-20 | 1986-10-28 | Toyota Motor Corp | Process for recovering waste heat from painting booth |
| KR20020060353A (en) * | 2001-01-10 | 2002-07-18 | 박종섭 | device for preventing dewfall of adhesion promoter in coater for fabricating semiconductor device |
| JP3739287B2 (en) | 2001-02-14 | 2006-01-25 | 東京エレクトロン株式会社 | Vacuum drying method and coating film forming apparatus |
| JP4759916B2 (en) * | 2002-12-13 | 2011-08-31 | 東京エレクトロン株式会社 | Processing equipment |
| JP4607474B2 (en) * | 2004-02-12 | 2011-01-05 | 東京エレクトロン株式会社 | Deposition equipment |
| JP4150356B2 (en) * | 2004-05-13 | 2008-09-17 | 東京エレクトロン株式会社 | Film forming apparatus and film forming method |
| JP2007038202A (en) * | 2005-02-25 | 2007-02-15 | Ntn Corp | Method and device for correcting pattern |
| JP4759760B2 (en) * | 2005-07-22 | 2011-08-31 | 本多電子株式会社 | Fine atomization particle cleaning equipment |
| JP5190465B2 (en) | 2007-11-29 | 2013-04-24 | 株式会社日本マイクロニクス | Atomization device, atomization method, wiring forming device and wiring forming method |
| JP5338100B2 (en) * | 2008-03-25 | 2013-11-13 | 株式会社Ｉｈｉ | Method and apparatus for controlling spray amount of coating apparatus |
| CN101314154A (en) * | 2008-07-01 | 2008-12-03 | 攀钢集团研究院有限公司 | Method for removing obstruction of atomizer |
| JP2011251231A (en) * | 2010-06-01 | 2011-12-15 | Panasonic Corp | Ink jet head and ink jet device mounting the same |
| JP5693104B2 (en) * | 2010-08-31 | 2015-04-01 | キヤノン株式会社 | Inkjet recording device |
| JP5608874B2 (en) * | 2010-11-19 | 2014-10-15 | 本多電子株式会社 | Ultrasonic treatment equipment to prevent alteration by carbon dioxide gas |
| JP5599701B2 (en) * | 2010-12-16 | 2014-10-01 | 株式会社日本マイクロニクス | Wiring forming device |
-
2012
- 2012-12-27 JP JP2012284324A patent/JP6049067B2/en active Active
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2013
- 2013-10-17 TW TW102137486A patent/TWI525311B/en active
- 2013-10-28 KR KR20130128460A patent/KR101492735B1/en active IP Right Grant
- 2013-12-27 CN CN201310742866.5A patent/CN103906367B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN103906367B (en) | 2017-01-04 |
| JP2014127619A (en) | 2014-07-07 |
| KR20140085294A (en) | 2014-07-07 |
| TW201428258A (en) | 2014-07-16 |
| KR101492735B1 (en) | 2015-02-11 |
| JP6049067B2 (en) | 2016-12-21 |
| CN103906367A (en) | 2014-07-02 |
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