WO2009069210A1 - Atomizer, method of atomization, apparatus for wiring formation, and method of wiring formation - Google Patents

Atomizer, method of atomization, apparatus for wiring formation, and method of wiring formation Download PDF

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Publication number
WO2009069210A1
WO2009069210A1 PCT/JP2007/073048 JP2007073048W WO2009069210A1 WO 2009069210 A1 WO2009069210 A1 WO 2009069210A1 JP 2007073048 W JP2007073048 W JP 2007073048W WO 2009069210 A1 WO2009069210 A1 WO 2009069210A1
Authority
WO
WIPO (PCT)
Prior art keywords
solvent
atomizer
wiring formation
atomization
carrier gas
Prior art date
Application number
PCT/JP2007/073048
Other languages
French (fr)
Japanese (ja)
Inventor
Katsumi Tanaka
Kenichi Shinozaki
Kentaro Nakamura
Takao Narumi
Tetsuya Okumura
Original Assignee
Kabushiki Kaisha Nihon Micronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Nihon Micronics filed Critical Kabushiki Kaisha Nihon Micronics
Priority to PCT/JP2007/073048 priority Critical patent/WO2009069210A1/en
Priority to JP2009543614A priority patent/JP5190465B2/en
Publication of WO2009069210A1 publication Critical patent/WO2009069210A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/086—Using an inert gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1344—Spraying small metal particles or droplets of molten metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1366—Spraying coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

Abstract

An atomizer in which the intervals of the replenishment of a solvent for material dissolution can be prolonged. The atomizer includes an atomizing part in which a material is dissolved in a solvent and the material and solvent are atomized to form a mist. The mist is discharged outward with a carrier gas introduced. The atomizer is characterized by having a solvent-replenishing part which supplies to the atomizing part a gas mixture of the carrier gas and a solvent in a vaporized state. The solvent-replenishing part has a space in which a liquid solvent is vaporized, and a carrier gas introduced from the outside is mixed with the solvent vaporized.
PCT/JP2007/073048 2007-11-29 2007-11-29 Atomizer, method of atomization, apparatus for wiring formation, and method of wiring formation WO2009069210A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2007/073048 WO2009069210A1 (en) 2007-11-29 2007-11-29 Atomizer, method of atomization, apparatus for wiring formation, and method of wiring formation
JP2009543614A JP5190465B2 (en) 2007-11-29 2007-11-29 Atomization device, atomization method, wiring forming device and wiring forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/073048 WO2009069210A1 (en) 2007-11-29 2007-11-29 Atomizer, method of atomization, apparatus for wiring formation, and method of wiring formation

Publications (1)

Publication Number Publication Date
WO2009069210A1 true WO2009069210A1 (en) 2009-06-04

Family

ID=40678126

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/073048 WO2009069210A1 (en) 2007-11-29 2007-11-29 Atomizer, method of atomization, apparatus for wiring formation, and method of wiring formation

Country Status (2)

Country Link
JP (1) JP5190465B2 (en)
WO (1) WO2009069210A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012129413A (en) * 2010-12-16 2012-07-05 Micronics Japan Co Ltd Wiring formation device
KR101492735B1 (en) 2012-12-27 2015-02-11 가부시키가이샤 니혼 마이크로닉스 Apparatus and method for forming wiring and maintenance method
JP2020049440A (en) * 2018-09-27 2020-04-02 凸版印刷株式会社 Thin film forming method, thin film forming device, and functional thin film

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0219478A (en) * 1988-07-05 1990-01-23 Mitsubishi Heavy Ind Ltd High-speed film formation
JPH0685605U (en) * 1993-05-26 1994-12-13 昇 加藤 Humidifier for beauty salon
JP2003051499A (en) * 2001-08-07 2003-02-21 Matsushita Electric Ind Co Ltd Method and device for thin film formation

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH076263U (en) * 1993-06-26 1995-01-27 太陽誘電株式会社 Thin film forming equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0219478A (en) * 1988-07-05 1990-01-23 Mitsubishi Heavy Ind Ltd High-speed film formation
JPH0685605U (en) * 1993-05-26 1994-12-13 昇 加藤 Humidifier for beauty salon
JP2003051499A (en) * 2001-08-07 2003-02-21 Matsushita Electric Ind Co Ltd Method and device for thin film formation

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012129413A (en) * 2010-12-16 2012-07-05 Micronics Japan Co Ltd Wiring formation device
CN102573311A (en) * 2010-12-16 2012-07-11 日本麦可罗尼克斯股份有限公司 Wire forming device
US8468685B2 (en) 2010-12-16 2013-06-25 Kabushiki Kaisha Nihon Micronics Wire forming device
KR101284538B1 (en) * 2010-12-16 2013-07-11 가부시키가이샤 니혼 마이크로닉스 Wire Forming Device
TWI457059B (en) * 2010-12-16 2014-10-11 Nihon Micronics Kk Wire forming device
KR101492735B1 (en) 2012-12-27 2015-02-11 가부시키가이샤 니혼 마이크로닉스 Apparatus and method for forming wiring and maintenance method
JP2020049440A (en) * 2018-09-27 2020-04-02 凸版印刷株式会社 Thin film forming method, thin film forming device, and functional thin film
JP7434705B2 (en) 2018-09-27 2024-02-21 Ｔｏｐｐａｎホールディングス株式会社 Thin film forming method, thin film forming apparatus, and functional thin film

Also Published As

Publication number Publication date
JP5190465B2 (en) 2013-04-24
JPWO2009069210A1 (en) 2011-04-07

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