JP7434705B2 - Thin film forming method, thin film forming apparatus, and functional thin film - Google Patents

Description

The present invention relates to a method of forming a thin film by turning raw materials into mist.

With the expansion of networks and the diversification of lifestyles in recent years, functional devices are required to have added values such as flexibility and large area that are difficult to achieve with conventional Si semiconductors. Devices are attracting attention. In order to improve the performance of various functional devices, it is important to form layers of materials with different functions. Dry processes such as vacuum evaporation, and wet processes such as spin coating are generally known as methods for producing thin films.

The dry process can deposit uniform thin films with a constant thickness, but it cannot be applied to thermally unstable materials such as organic materials because it applies high energy to the material being deposited. First, the base material is limited to heat-resistant materials such as glass, so there are restrictions on the materials and base materials. In addition, since most of the processes are vacuum processes, there is a problem of low productivity.

In the wet process, a film can be easily formed on a flexible substrate such as a film, so it is much superior to the dry process in terms of productivity and increasing the area. In addition, in the wet process, patterns can be formed using various printing methods, but it is necessary to adjust the viscoelastic properties during the process, so additives are added to the paints and inks used to adjust the fluidity during the process. do. This mixture may be mixed into the functional pattern formed on the base material through the process, resulting in a problem of lowering the purity of the functional material within the pattern and reducing the functionality required of the pattern. A wet coating method that does not require any additives in the raw material is the mist coating method, in which the material is made into minute droplets and transferred to the substrate to form a film.

Mist coating does not require mixing materials that affect flow, and it is possible to form films of highly pure materials, which is advantageous when forming thin films of functional materials or forming thin film patterns.
In addition, it is easy to adjust to reduce the solvent component from the droplets when transporting the mist droplets to the substrate, and by making adjustments and optimizing the solvent content, it is possible to coat without damaging the underlying layer during lamination. It is also possible to stack thin films using a wet process. To obtain a thin film pattern using the above-mentioned mist coating, a method is used in which a patterned film is formed by mist coating through a mask plate having a pattern of through holes. In addition, in the misting method of Patent Document 1, a pattern consisting of hydrophilic and water-repellent materials is formed on the base material in advance, and the mist material is conveyed to determine the degree of adhesion of the mist droplets to the base material without using a mask plate. A method for forming patterns has been proposed. However, when forming fine patterns using mist coating, the size of mist droplets becomes the limit of pattern resolution.

In the ultrasonic mist method, the diameter of the generated mist is generally determined by Lang's formula, but the solvent is not added during the process of transporting the mist droplets generated by the ultrasonic vibrator to the substrate. By transpiring, it is possible to reduce the mist diameter before deposition. For example, by heating the mist transport path to a temperature higher than the evaporation temperature of the solvent, it is possible to evaporate the solvent from the mist droplets being transported. In addition, in the electrospray method, by increasing the spray distance and allowing the droplets to self-split due to Coulomb force, it is theoretically possible to reduce the diameter to the size of the dispersed material (micrometers, nanometers).

International Publication No. 2015/064438

When forming a thin film or patterning a thin film, it is necessary to miniaturize the mist droplets and arrange them on the base material. It is possible to make the mist droplets smaller when placing the substrate by splitting the mist droplets and making them smaller by evaporating the solvent from the mist droplets, but the viscosity of the droplets increases. This causes the particles to be deposited on the substrate while maintaining their particle shape, resulting in defects such as voids in the film. In addition, when it is desired to form a thin film pattern from mist droplets onto a base material, by reducing the diameter of the mist droplets and transporting them to the base material, it is possible to form a pattern with the droplet size as the resolution limit. There was a problem that the droplet viscosity increased and the fluidity decreased, resulting in a decrease in leveling properties, causing defects in the formed pattern, and decreasing the continuity of the pattern.

Sputtering and printing methods also exist as methods for forming a thin film, but sputtering forms a film by applying high energy to a substance to be deposited. For this reason, polymer compounds such as resins are highly likely to be decomposed and denatured by the energy of sputtering, making them unsuitable for film formation using sputtering.

In addition, in the printing method, it is necessary to use ink as the object to be film-formed, and in order to prevent clogging and ensure fluidity, additives (mixtures) other than the object to be film-formed (e.g., polymeric materials) are used. Mixing is required, making it difficult to increase the purity (concentration) of the film-forming target, and additives and the like during ink production (ink production) also cause defects in the produced thin film.

In view of these problems, the present invention provides a thin film forming method, a thin film forming apparatus, and a functional thin film that have few defects and do not impair functionality even when droplets containing thin film raw materials are miniaturized. The purpose is to provide.

One aspect of the present invention for solving the above problems is a method for forming a thin film on a substrate, in which a solvent for dispersing raw materials for the thin film is supplied to a solvent supply unit using vibrations driven at 2.4 MHz. The process involves turning a vibrator into mist droplets by driving a vibrator with a voltage of 24V , and in the raw material supply section , the raw material liquid obtained by dissolving or dispersing the thin film raw material in a solvent is driven with a 2.4MHz vibrator at a voltage of 24V. In this process, the mist droplets of the solvent are conveyed from the solvent supply part to the raw material liquid supply part by air of 0.8 kg/cm2 ^so as not to pass through the raw material liquid supply part, and the mist droplets of the raw material liquid are converted into the raw material liquid. A step of conveying from the liquid supply section with air of 0.8 kg/cm2 ^so as not to go through the solvent supply section, and merging and mixing the mist droplets of the solvent and the mist droplets of the raw material liquid during the conveyance; The solvent is ethanol, the raw material for the thin film is PEDOT /PSS , and the raw material liquid is: This is a thin film forming method in which a mixture of PEDOT/PSS, which is a raw material, is diluted four times by weight with ethanol, which is a solvent .

According to the present invention, it is possible to provide a thin film forming method, a thin film forming apparatus, and a functional thin film that have few defects and do not impair functionality even when droplets containing thin film raw materials are miniaturized. This thin film forming method enables pattern formation with high material purity based on mist coating technology, and enables functional pattern formation.

Process diagram of a thin film forming method according to an embodiment of the present invention Schematic diagram of a thin film forming apparatus according to an embodiment of the present invention Schematic diagram of a thin film forming apparatus according to a modified example FIG. 3 is a diagram of a latent image forming method using the present thin film forming method. SEM observation images of thin films created in Examples and Comparative Examples

(Thin film formation method)
A method for forming a thin film according to an embodiment of the present invention is a method for forming a thin film on a base material, and includes a step of supplying a solvent onto the base material for dissolving or dispersing raw materials for the thin film, and The method includes a step of transporting and depositing droplets of a raw material liquid obtained by dissolving or dispersing raw materials in the solvent onto a base material.

Further, as a modification of the above-described thin film forming method, the thin film may not be formed directly on the base material, but may be formed on an intermediate transfer body, and this thin film may be transferred from the intermediate transfer body to the base material. Specifically, a solvent for dissolving or dispersing the raw material of the thin film is supplied onto the intermediate transfer body, droplets of the raw material liquid are transported and deposited on the intermediate transfer body, and then the droplets of the raw material liquid are conveyed and deposited on the intermediate transfer body. It can be formed by transferring the contained solvent and raw material liquid to a base material.

Examples of solvents that can be used in the present invention include water, organic solvents, and ionic liquids. The solvent may contain an acid, an alkali, or the like. Furthermore, compatible solvents such as water and ethanol may be mixed.

Examples of thin film raw materials (film-forming substances) that can be used in the present invention include polymer compounds (resins), inorganic substances, and natural polymers such as cellulose. As the raw material for the thin film, those that can be dissolved and dispersed in the above-mentioned solvents can be used.

A thin film forming method according to an embodiment of the present invention will be explained using FIG. The left side of FIG. 1 shows a process diagram of a thin film forming method (method 1) according to one embodiment, and the right side of FIG. 1 shows a process diagram of a thin film forming method (method 2) according to a modification using an intermediate transfer body. A process diagram is shown. In the thin film forming method according to an embodiment of the present invention, a raw material liquid in which a raw material is dissolved or dispersed in a solvent is physically formed into fine droplets, and the droplets are deposited on a target base material 2 to form a thin film. It is based on the method of forming.

In method 1, the solvent 4 is first supplied onto the substrate 2 using the solvent supply device 1 . Next, using the mist supply device 5, fine droplets 6 of a raw material liquid obtained by dissolving or dispersing the raw material for the thin film in the solvent 4 are transported and deposited on the base material 2. As shown in FIG. 1, in method 2, the intermediate transfer body 3 is the object to which the solvent 4 and droplets 6 are supplied and deposited in these steps.

The mist supply device 5 in FIG. 1 is a device that divides the raw material liquid into droplets and conveys the finely divided droplets. For example, an apparatus for forming fine droplets may employ a method of applying ultrasonic waves to the raw material liquid to generate fine droplets 6 from the raw material liquid using the capillary principle, and transporting the fine droplets 6 to the base material 2 or intermediate transfer body 3. Can be done. As another method, the raw material liquid is ejected from a nozzle, a high voltage is applied between the nozzle and the base material 2 or the intermediate transfer member 3, and the droplets 6 ejected from the nozzle are charged by the voltage application, and the repulsive force of Coulomb force is applied. An electrospray (ESC) method can be used in which the droplets 6 are divided into small pieces and deposited on the base material 2 or the intermediate transfer body 3.

As shown in FIG. 1, when the droplets 6 land on the base material 2 or the intermediate transfer body 3, the solvent 4 is supplied in advance from a separate solvent supply device 1 to the surface of the base material 2 or the intermediate transfer body 3. There is. Therefore, the solvent 4 is supplied to the landed droplet 6, and the attached droplet 6 becomes in a solvent-rich state.

Further, during the process in which the droplet 6 moves from the nozzle of the mist supply device 5 to the base material 2 or the intermediate transfer member 3, the solvent 4 in the droplet 6 evaporates and escapes. For this reason, the droplet 6 has a high ratio of solids in the thin film raw material, and when it lands on the base material 2 or the intermediate transfer body 3, it often loses its fluidity. The surface of the film (thin film) formed by the droplets 6 that have lost their fluidity after landing on the base material 2 often has unevenness, and if the droplets 6 are deposited in this state, the uneven shape will occur. A thin film with a rough surface remains, and it may be difficult to obtain the desired surface shape and functionality. To solve this problem, after a certain amount of droplets 6 have been deposited, only the solvent 4 may be further sprayed onto the surface of the film (thin film) formed by the droplets 6 deposited on the base material.

As the droplets 6 deposited in this manner receive replenishment (supply) of the solvent 4, their fluidity increases, and the film (thin film) formed by the deposited droplets 6 flows and is leveled, resulting in a smooth thin film. 8 can be formed. Once the thin film 8 is formed on the intermediate transfer body 3, by transferring the thin film 8 contained in the intermediate transfer body 3 to the base material 2, the thin film 8 made of the target material is formed on the base material 2. Become.

Finally, excess solvent is evaporated from the thin film 8 by heating and drying, thereby forming a thin film 8 with high material purity. The material used for the intermediate transfer body 3 is not particularly limited as long as it can absorb and release the solvent 4 of the raw material liquid, but an example is polydimethylsiloxane (PDMS) of silicone rubber, and the material has a porous structure. A material can be used.

According to the thin film forming method explained above, it is only necessary to use a solvent and a liquid (raw material liquid) in which the raw material for the thin film is dissolved or dispersed in the solvent, and additives etc. that are necessary when forming into ink are required. becomes unnecessary. Therefore, with the present invention, it is possible to form a film of a substance that could not be formed using the sputtering method, and a film with high purity (concentration) of the target substance that could not be formed using the printing method. It becomes possible to obtain film properties that were previously unavailable.

(Thin film forming device)
2 and 3 are schematic diagrams of thin film forming apparatuses 100 and 200 that can implement a thin film forming method according to an embodiment of the present invention. The thin film forming apparatus includes a raw material liquid supply section that can spray droplets 6 of the raw material liquid onto the substrate 2, and after the raw material liquid supply section sprays the droplets 6 of the raw material liquid onto the substrate 2, Alternatively, the solvent 4 can be sprayed onto the base material 2 at the same time as the droplets 6 of the raw material liquid are sprayed. Further, the thin film forming apparatus may further include a solvent supply unit capable of spraying the solvent 4 onto the base material 2. In the following description, the substrate 2 is exemplified as an object to be sprayed with the droplets 6 and the solvent 4, but it may be configured so that the intermediate transfer body 3 is sprayed.

In the thin film forming apparatus 100 shown in FIG. 2, two electrospray nozzles are prepared as a raw material liquid supply section and a solvent supply section, one nozzle 11 is used to discharge (spray) a liquid 6 of the raw material liquid, and the other is The nozzle 12 is used to discharge (spray) the solvent of the raw material liquid. A mist 13 consisting of droplets 6 of the raw material liquid and a mist 14 consisting of the solvent 4 are discharged onto the base material 2 from the nozzles 11 and 12, respectively. A counter electrode 10 that can apply a voltage between the nozzles 11 and 12 and the substrate 2 is provided below the base material 2 . The thin film forming apparatus 100 can adjust the distance between the nozzle 11 and the base material 2. When this distance is close, the diameter of the droplet 6 is large, and when the distance is increased, the diameter of the droplet 6 is increased. Small and adjustable. By ejecting the solvent from the nozzles 11 and 12 simultaneously or by ejecting the solvent in advance, an appropriate amount of the solvent 6 can be supplied onto the base material 2, so that when the mist 13 lands on the base material 2, the droplets 6 are Solvent 4 is supplied. As a result, the viscosity of the thin film formed on the surface of the base material 2 is reduced and leveled, and a uniform thin film 8 is formed. The relative positions of the base material 2 and the nozzles 11 and 12 in the horizontal plane may be moved as appropriate.

In the thin film forming apparatus 200 shown in FIG. 3, an ultrasonic mist method is used to generate the mist 13 and the mist 14. The thin film forming apparatus 200 sets the raw material liquid in the ultrasonic chamber 21 and the solvent 4 in the ultrasonic chamber 22, and then uses the ultrasonic vibrators installed in each chamber 21 and 22 to remove the raw material liquid and the solvent 4 in the chambers. Converts into mist droplets. Thereafter, by sending conveyance air into the respective chambers 21 and 22, the respective mist 13 and 14 can be conveyed (sprayed) onto the base material 2 from the raw material supply head 23 and the solvent supply head 24. In FIG. 3, the thin film forming apparatus is shown conveying the mist 13 and 14 individually on the base material 2, but the mist 13 and 14 coming out from each chamber 21 and 22 are combined to form one A mixed aerosol of the raw material liquid and the solvent may be supplied onto the base material 2 using the head.

Also in the case of the thin film forming apparatus 200, the droplets 6 in the mist 13 that landed on the base material 2 absorb the separately supplied solvent 4, and the viscosity decreases, forming a leveled thin film 8. Become. A drying device may be introduced into the supply path of the mist 13 to adjust the amount of solvent in the droplets 6.

FIG. 4 is a diagram illustrating a method of forming a latent image by patterning the intermediate transfer member 3 with the solvent 4 using the above-described thin film forming method.

FIG. 4A shows a method of patterning the intermediate transfer body 3 using a pattern mask 40. In FIG. In the masked portions, the supply of the solvent 4 is blocked, and the solvent 4 is supplied only to the opening portions, and the solvent 4 is contained in the form of a latent image 43 based on a predetermined pattern. The solvent spray 41 is not limited as long as it is a coating method that supplies the solvent 4 in the form of a mist, and may be supplied by, for example, an ultrasonic mist method or an electrospray method.

FIG. 4B shows a method of supplying the solvent 4 in a predetermined pattern using an inkjet (IJ) head 42. The solvent 4 is supplied from the inkjet head 42 to form a latent image 43 on the intermediate transfer body 3 based on a predetermined pattern contained in the solvent 4.

After the process shown in FIG. 4(a) or (b), although not shown, droplets 6 are applied under gravity to the intermediate transfer member 3 on which the latent image 43 has been formed. When sprayed, the fine droplets 6 bounce off as an elastic body and do not adhere to areas where the solvent 4 is not contained (that is, areas where the latent image 43 is not formed). On the other hand, in the portion containing the solvent 4, the solvent 4 is supplied to the droplet 6 at the time of landing and is adsorbed as it is, and the viscosity decreases, leveling occurs and a pattern along the latent image 43 is formed.

As described above, according to the present invention, the raw material liquid in which the raw materials are dissolved or dispersed is made into mist droplets, and when the solvent ratio is lowered during the process to make fine droplets and the droplets land on the base material 2, the solvent 4 is made into droplets. By supplying the same, the viscosity is lowered and leveling is made possible, and a uniform thin film 8 and thin film patterning are made possible.

(Example 1)
A thin film was formed using an ultrasonic mist coater equipped with two mist generators. A PEDOT/PSS mixture (SV-3, Heraeus), which is a coating material (thin film raw material), is mixed with ethanol in a weight ratio so that the raw material liquid is supplied from the first mist generating part (raw material liquid supply part). A raw material solution diluted four times with water was filled. The second mist generation section (solvent supply section) was filled with 100% ethanol (solvent) so that the solvent was supplied.

The ultrasonic vibrators of the first and second mist generating sections were driven at a voltage of 24 V using 2.4 MHz driven vibrators (HM-2412, manufactured by Honda Electronics Co., Ltd.). The mist droplets generated in the first and second mist generating parts are transported by air of 0.8 kg/cm ² and merged in the middle of the transport route, and are placed on a 0.7 mm thick glass substrate (EGLE-XG, Corning Mist droplets were deposited for 3 minutes to obtain a PEDOT/PSS film with a thickness of 300 nm. PEDOT is an abbreviation for poly (3,4-ethylenedioxythiophene) and PSS is an abbreviation for poly (4-styrenesulfonate).

(Example 2)
In an electrospray mist coating device that has two nozzles that generate mist, the same mist raw material as in the example is supplied from the first nozzle (raw material liquid supply section), and the ethanol solvent is supplied from the second nozzle (solvent supply section). 100% supply was ensured. In the first and second mist generating parts, the nozzle diameter was 100 μm, the liquid was fed to the nozzle at 0.1 cc/min, the voltage between the nozzle and the substrate was 14 kV, and the distance between the first nozzle and the substrate was 70 mm. The distance between the second nozzle and the base material was 30 mm. A 0.7 mm thick glass substrate (EGLE-XG, Corning Inc.) was scanned with the second nozzle and then the first nozzle at a speed of 50 mm/sec to obtain a PEDOT/PSS film with a thickness of 300 nm. .

(Example 3)
Using the second mist generating part of Example 1, the intermediate transfer body (polydimethylsiloxane; PDMS) was allowed to contain solvent mist for 3 minutes, and the same mist raw material as the first mist generating part of Example 1 was used. After depositing the mist raw material on the intermediate transfer body for 3 minutes under mist generation conditions, the thin film formed on the intermediate transfer body was transferred to a glass substrate to obtain a PEDOT/PSS film with a thickness of 300 nm.

(Comparative example 1)
Using the same coating material as in Example 1, spin coating at 2000 RPM and drying at 80° C. for 10 minutes was repeated four times to obtain a PEDOT/PSS film with a thickness of 300 nm.

(Comparative example 2)
In Example 2, a PEDOT/PSS film with a thickness of 300 μm was obtained on a glass substrate using the same materials and steps as in Example 2, except that the solvent was not discharged from the second nozzle.

(Comparative example 3)
In Example 3, an attempt was made to form a film on a glass substrate using the same materials and steps as in Example 3, except that the step of pre-containing a solvent in the intermediate transfer body was omitted, but no film was formed.

FIG. 5 shows images of the surface states of the PEDOT/PSS films obtained in Examples 1 to 3 and Comparative Examples 1 and 2 observed using a scanning electron microscope (Hitachi S4800). In addition, the surface resistance of each film was measured using a four-probe resistance measuring device (MCP-T610, Mitsubishi Chemical). Table 1 shows the surface resistance values, and ○ indicates that the surface resistance value is low and almost no particulate matter is observed in SEM observation, △ indicates that there is some contamination, and △ indicates that the surface resistance value is high and that the particulate matter is mixed all over the surface. The film formability results are shown with x as x.

From the above results, it can be seen that in the comparative example, the surface properties of the film were poor and the surface resistance value was also high. On the other hand, in the examples of the present invention, thin films with good film formability were obtained, and thin films with low surface resistance and good characteristics were obtained.

(Example 4)
When the substrate was coated in the same manner as in Example 3 except that the solvent was coated using the second mist generating part through the pattern mask, a pattern with a film thickness of 300 nm was formed according to the pattern mask. .

(Example 5)
When a substrate was coated in the same manner as in Example 3 except that pattern coating was performed using an inkjet head, a pattern with a film thickness of 300 nm was formed in accordance with the pattern formed by inkjet.

The present invention can be used to manufacture functional thin films.

1 Solvent supply device 2 Base material 3 Intermediate transfer body 4 Supply solvent 5 Mist supply device 6 Mist droplets 8 Material thin film 10 Counter electrode 11 ESC nozzle 1
12 ESC nozzle 2
13 Raw material mist 14 Solvent mist 21 Ultrasonic chamber 1
22 Ultrasonic chamber 2
23 Raw material mist supply head 24 Solvent mist supply head 30 Max latent image formation 31 IJ latent image formation 40 Pattern mask 41 Solvent spray 42 Solvent IJ head 43 Solvent-containing latent image 100, 200 Thin film forming device

Claims (4)

A method of forming a thin film on a substrate, the method comprising:
A step of converting the solvent for dispersing the raw material of the thin film into mist droplets by driving a 2.4 MHz-driven vibrator at a voltage of 24 V in a solvent liquid supply section;
A step of converting a raw material liquid obtained by dissolving or dispersing the raw material of the thin film into the solvent into mist droplets by driving a 2.4 MHz-driven vibrator at a voltage of 24 V in a raw material supply section;
The mist droplets of the solvent are conveyed from the solvent supply section by air of 0.8 kg/cm2 ^so as not to pass through the raw material liquid supply section, and the mist droplets of the raw material liquid are transported from the raw material liquid supply section to the solvent. A step of conveying with air of 0.8 kg/cm ² so as not to go through a supply part, and merging and mixing the mist droplets of the solvent and the mist droplets of the raw material liquid during conveyance;
a step of supplying mixed mist droplets of the solvent and mist droplets of the raw material liquid onto the base material,
the solvent is ethanol ;
The raw material of the thin film is PEDOT/PSS ,
The raw material liquid is obtained by diluting the raw material PEDOT/PSS mixture by 4 times by weight with the solvent ethanol.
Thin film formation method. A method of forming a thin film on a substrate, the method comprising:
A step of converting the solvent for dispersing the raw material of the thin film into mist droplets by driving a 2.4 MHz-driven vibrator at a voltage of 24 V in a solvent liquid supply section;
A step of converting a raw material liquid obtained by dissolving or dispersing the raw material of the thin film into the solvent into mist droplets by driving a 2.4 MHz-driven vibrator at a voltage of 24 V in a raw material supply section;
The mist droplets of the solvent are conveyed from the solvent supply section by air of 0.8 kg/cm2 ^so as not to pass through the raw material liquid supply section, and the mist droplets of the raw material liquid are transported from the raw material liquid supply section to the solvent. A step of conveying with air of 0.8 kg/cm ² so as not to go through a supply part, and merging and mixing the mist droplets of the solvent and the mist droplets of the raw material liquid during conveyance;
a step of transporting and depositing the mixed mist droplets of the solvent and the mist droplets of the raw material liquid onto an intermediate transfer body;
a step of transferring the solvent and the raw material liquid contained in the intermediate transfer body to the base material,
the solvent is ethanol ;
The raw material of the thin film is PEDOT/PSS ,
The raw material liquid is obtained by diluting the raw material PEDOT/PSS mixture by 4 times by weight with the solvent ethanol.
Thin film formation method. A thin film forming apparatus that forms a thin film on a base material,
A raw material liquid obtained by diluting a mixture of PEDOT/PSS as a raw material by 4 times by weight with ethanol as a solvent , and turning it into mist droplets by driving a 2.4 MHz driven vibrator at a voltage of 24 V. a supply section ;
a solvent supply unit that converts the solvent for dispersing the raw material of the thin film into mist droplets by driving a 2.4 MHz driven vibrator at a voltage of 24 V ,
Mist droplets of the raw material liquid transported by air of 0.8 kg/cm ^{2 so as not to go through the solvent supply part from the raw material liquid supply part, and mist droplets of the raw material liquid conveyed by air of 0.8 kg/cm 2} so as not to go through the raw material liquid supply part from the solvent supply part. and 0.8 kg/cm ² of air- borne mist droplets of the solvent, and spraying onto the substrate.
Thin film forming equipment. A thin film forming apparatus that forms a thin film on a base material,
A raw material liquid obtained by diluting a mixture of PEDOT/PSS as a raw material by 4 times by weight with ethanol as a solvent , and turning it into mist droplets by driving a 2.4 MHz driven vibrator at a voltage of 24 V. a supply section;
a solvent supply unit that converts the solvent for dispersing the raw material into mist droplets by driving a 2.4 MHz-driven vibrator at a voltage of 24 V ;
Mist droplets of the raw material liquid transported by air of 0.8 kg/cm ^{2 so as not to go through the solvent supply part from the raw material liquid supply part, and mist droplets of the raw material liquid conveyed by air of 0.8 kg/cm 2} so as not to go through the raw material liquid supply part from the solvent supply part. is mixed with mist droplets of the solvent carried by air at 0.8 kg/cm ² and sprayed onto the intermediate transfer body, and the raw material liquid and the solvent contained in the intermediate transfer body are transferred to the base material. can be transferred onto,
Thin film forming equipment.