TWI522496B - Substrate holder and plating device - Google Patents
Substrate holder and plating device Download PDFInfo
- Publication number
- TWI522496B TWI522496B TW102100423A TW102100423A TWI522496B TW I522496 B TWI522496 B TW I522496B TW 102100423 A TW102100423 A TW 102100423A TW 102100423 A TW102100423 A TW 102100423A TW I522496 B TWI522496 B TW I522496B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- holding member
- holder
- substrate holder
- movable base
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 522
- 238000007747 plating Methods 0.000 title claims description 80
- 238000007789 sealing Methods 0.000 claims description 95
- 230000006835 compression Effects 0.000 claims description 60
- 238000007906 compression Methods 0.000 claims description 60
- 230000002093 peripheral effect Effects 0.000 claims description 35
- 230000007246 mechanism Effects 0.000 claims description 34
- 230000008859 change Effects 0.000 claims description 13
- 238000005381 potential energy Methods 0.000 claims description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 1
- 238000003860 storage Methods 0.000 description 19
- 238000005406 washing Methods 0.000 description 12
- 230000032258 transport Effects 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000011282 treatment Methods 0.000 description 7
- 238000007664 blowing Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012016167A JP5643239B2 (ja) | 2012-01-30 | 2012-01-30 | 基板ホルダ及びめっき装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201331425A TW201331425A (zh) | 2013-08-01 |
| TWI522496B true TWI522496B (zh) | 2016-02-21 |
Family
ID=48835732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102100423A TWI522496B (zh) | 2012-01-30 | 2013-01-07 | Substrate holder and plating device |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9175416B2 (https=) |
| JP (1) | JP5643239B2 (https=) |
| KR (1) | KR101489051B1 (https=) |
| CN (1) | CN103225099B (https=) |
| TW (1) | TWI522496B (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI699460B (zh) * | 2018-03-20 | 2020-07-21 | 日商東芝記憶體股份有限公司 | 電解鍍敷裝置及電解鍍敷方法 |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6508935B2 (ja) * | 2014-02-28 | 2019-05-08 | 株式会社荏原製作所 | 基板ホルダ、めっき装置及びめっき方法 |
| CN106471162B (zh) * | 2014-06-26 | 2018-09-25 | 株式会社村田制作所 | 电镀用夹具 |
| KR102250050B1 (ko) * | 2015-02-06 | 2021-05-11 | 삼성디스플레이 주식회사 | 전기도금용 지그 및 이를 이용한 도금물 제조 방법 |
| JP6659467B2 (ja) * | 2016-06-03 | 2020-03-04 | 株式会社荏原製作所 | めっき装置、基板ホルダ、めっき装置の制御方法、及び、めっき装置の制御方法をコンピュータに実行させるためのプログラムを格納した記憶媒体 |
| JP6799395B2 (ja) | 2016-06-30 | 2020-12-16 | 株式会社荏原製作所 | 基板ホルダ、電子デバイス製造装置において基板を搬送する搬送システム、および電子デバイス製造装置 |
| JP6713863B2 (ja) * | 2016-07-13 | 2020-06-24 | 株式会社荏原製作所 | 基板ホルダ及びこれを用いためっき装置 |
| TWI738855B (zh) * | 2016-09-08 | 2021-09-11 | 日商荏原製作所股份有限公司 | 基板固持器、鍍覆裝置、基板固持器之製造方法、以及基板保持方法 |
| JP6713916B2 (ja) * | 2016-12-01 | 2020-06-24 | 株式会社荏原製作所 | 基板ホルダ、めっき装置、及び基板ホルダの製造方法 |
| JP6727117B2 (ja) * | 2016-12-22 | 2020-07-22 | 株式会社荏原製作所 | 基板着脱装置、めっき装置、基板着脱装置の制御装置、基板着脱装置の制御方法をコンピュータに実行させるためのプログラムを格納した記憶媒体 |
| JP7003005B2 (ja) * | 2018-06-25 | 2022-01-20 | 株式会社荏原製作所 | 基板ホルダ及びめっき装置 |
| JP7122235B2 (ja) * | 2018-11-26 | 2022-08-19 | 上村工業株式会社 | 保持治具 |
| JP7256728B2 (ja) * | 2019-10-04 | 2023-04-12 | 株式会社荏原製作所 | 基板ホルダ及び基板処理装置 |
| JP7244408B2 (ja) * | 2019-12-13 | 2023-03-22 | 株式会社荏原製作所 | 基板ホルダ |
| US11353497B2 (en) * | 2020-03-27 | 2022-06-07 | Yamaichi Electronics Co., Ltd. | Test socket |
| JP7483578B2 (ja) * | 2020-09-29 | 2024-05-15 | 株式会社荏原製作所 | 接点構造、基板ホルダ、めっき装置、及び基板に給電する方法 |
| CN115142104B (zh) * | 2022-07-28 | 2024-04-26 | 福州一策仪器有限公司 | 电镀装置、多通道电镀装置组和电镀反应系统 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5891516A (ja) | 1981-11-25 | 1983-05-31 | Matsushita Electric Ind Co Ltd | 薄膜磁気ヘッドの製造装置 |
| JPS5931882A (ja) | 1982-08-12 | 1984-02-21 | Sonitsukusu:Kk | 浴中表面処理方法及びその装置 |
| JP3130144B2 (ja) | 1992-10-01 | 2001-01-31 | オムロン株式会社 | 媒体処理システム及び媒体処理装置 |
| JPH076268U (ja) * | 1993-06-29 | 1995-01-27 | 富士電気化学株式会社 | 片面メッキ用治具 |
| JP3402168B2 (ja) * | 1997-12-25 | 2003-04-28 | 株式会社デンソー | 表面加工装置 |
| DE19962170A1 (de) | 1999-12-22 | 2001-07-12 | Steag Micro Tech Gmbh | Substrahthalter |
| JP3876663B2 (ja) * | 2001-08-07 | 2007-02-07 | 株式会社デンソー | 表面処理装置及び表面処理方法 |
| TWI316097B (en) * | 2002-06-21 | 2009-10-21 | Ebara Corp | Substrate holder and plating apparatus |
| JP4162440B2 (ja) | 2002-07-22 | 2008-10-08 | 株式会社荏原製作所 | 基板ホルダ及びめっき装置 |
| JP4124327B2 (ja) * | 2002-06-21 | 2008-07-23 | 株式会社荏原製作所 | 基板ホルダ及びめっき装置 |
| JP3778282B2 (ja) | 2002-07-15 | 2006-05-24 | 株式会社荏原製作所 | 基板ホルダ及びめっき装置 |
| US7735451B2 (en) * | 2002-11-15 | 2010-06-15 | Ebara Corporation | Substrate processing method and apparatus |
| JP4892326B2 (ja) * | 2006-11-29 | 2012-03-07 | 株式会社フジクラ | メッキ治具 |
| JP5435355B2 (ja) * | 2009-09-04 | 2014-03-05 | 日立金属株式会社 | メッキ装置 |
| JP5766048B2 (ja) * | 2010-08-19 | 2015-08-19 | 株式会社荏原製作所 | 基板ホルダ及びめっき装置 |
-
2012
- 2012-01-30 JP JP2012016167A patent/JP5643239B2/ja active Active
-
2013
- 2013-01-07 TW TW102100423A patent/TWI522496B/zh active
- 2013-01-24 KR KR20130007746A patent/KR101489051B1/ko active Active
- 2013-01-29 US US13/752,460 patent/US9175416B2/en active Active
- 2013-01-29 CN CN201310034182.XA patent/CN103225099B/zh active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI699460B (zh) * | 2018-03-20 | 2020-07-21 | 日商東芝記憶體股份有限公司 | 電解鍍敷裝置及電解鍍敷方法 |
| US10985006B2 (en) | 2018-03-20 | 2021-04-20 | Toshiba Memory Corporation | Electrolytic plating apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| US9175416B2 (en) | 2015-11-03 |
| JP5643239B2 (ja) | 2014-12-17 |
| KR101489051B1 (ko) | 2015-02-02 |
| JP2013155405A (ja) | 2013-08-15 |
| KR20130088062A (ko) | 2013-08-07 |
| CN103225099A (zh) | 2013-07-31 |
| US20130192983A1 (en) | 2013-08-01 |
| TW201331425A (zh) | 2013-08-01 |
| CN103225099B (zh) | 2016-01-06 |
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