JP5643239B2 - 基板ホルダ及びめっき装置 - Google Patents

基板ホルダ及びめっき装置 Download PDF

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Publication number
JP5643239B2
JP5643239B2 JP2012016167A JP2012016167A JP5643239B2 JP 5643239 B2 JP5643239 B2 JP 5643239B2 JP 2012016167 A JP2012016167 A JP 2012016167A JP 2012016167 A JP2012016167 A JP 2012016167A JP 5643239 B2 JP5643239 B2 JP 5643239B2
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Japan
Prior art keywords
substrate
holding member
substrate holder
holder
support base
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JP2012016167A
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English (en)
Japanese (ja)
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JP2013155405A (ja
JP2013155405A5 (https=
Inventor
淳平 藤方
淳平 藤方
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2012016167A priority Critical patent/JP5643239B2/ja
Priority to TW102100423A priority patent/TWI522496B/zh
Priority to KR20130007746A priority patent/KR101489051B1/ko
Priority to CN201310034182.XA priority patent/CN103225099B/zh
Priority to US13/752,460 priority patent/US9175416B2/en
Publication of JP2013155405A publication Critical patent/JP2013155405A/ja
Publication of JP2013155405A5 publication Critical patent/JP2013155405A5/ja
Application granted granted Critical
Publication of JP5643239B2 publication Critical patent/JP5643239B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2012016167A 2012-01-30 2012-01-30 基板ホルダ及びめっき装置 Active JP5643239B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012016167A JP5643239B2 (ja) 2012-01-30 2012-01-30 基板ホルダ及びめっき装置
TW102100423A TWI522496B (zh) 2012-01-30 2013-01-07 Substrate holder and plating device
KR20130007746A KR101489051B1 (ko) 2012-01-30 2013-01-24 기판 홀더 및 도금 장치
CN201310034182.XA CN103225099B (zh) 2012-01-30 2013-01-29 基板架以及电镀装置
US13/752,460 US9175416B2 (en) 2012-01-30 2013-01-29 Substrate holder and plating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012016167A JP5643239B2 (ja) 2012-01-30 2012-01-30 基板ホルダ及びめっき装置

Publications (3)

Publication Number Publication Date
JP2013155405A JP2013155405A (ja) 2013-08-15
JP2013155405A5 JP2013155405A5 (https=) 2014-01-09
JP5643239B2 true JP5643239B2 (ja) 2014-12-17

Family

ID=48835732

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012016167A Active JP5643239B2 (ja) 2012-01-30 2012-01-30 基板ホルダ及びめっき装置

Country Status (5)

Country Link
US (1) US9175416B2 (https=)
JP (1) JP5643239B2 (https=)
KR (1) KR101489051B1 (https=)
CN (1) CN103225099B (https=)
TW (1) TWI522496B (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6508935B2 (ja) * 2014-02-28 2019-05-08 株式会社荏原製作所 基板ホルダ、めっき装置及びめっき方法
CN106471162B (zh) * 2014-06-26 2018-09-25 株式会社村田制作所 电镀用夹具
KR102250050B1 (ko) * 2015-02-06 2021-05-11 삼성디스플레이 주식회사 전기도금용 지그 및 이를 이용한 도금물 제조 방법
JP6659467B2 (ja) * 2016-06-03 2020-03-04 株式会社荏原製作所 めっき装置、基板ホルダ、めっき装置の制御方法、及び、めっき装置の制御方法をコンピュータに実行させるためのプログラムを格納した記憶媒体
JP6799395B2 (ja) 2016-06-30 2020-12-16 株式会社荏原製作所 基板ホルダ、電子デバイス製造装置において基板を搬送する搬送システム、および電子デバイス製造装置
JP6713863B2 (ja) * 2016-07-13 2020-06-24 株式会社荏原製作所 基板ホルダ及びこれを用いためっき装置
TWI738855B (zh) * 2016-09-08 2021-09-11 日商荏原製作所股份有限公司 基板固持器、鍍覆裝置、基板固持器之製造方法、以及基板保持方法
JP6713916B2 (ja) * 2016-12-01 2020-06-24 株式会社荏原製作所 基板ホルダ、めっき装置、及び基板ホルダの製造方法
JP6727117B2 (ja) * 2016-12-22 2020-07-22 株式会社荏原製作所 基板着脱装置、めっき装置、基板着脱装置の制御装置、基板着脱装置の制御方法をコンピュータに実行させるためのプログラムを格納した記憶媒体
JP6963524B2 (ja) * 2018-03-20 2021-11-10 キオクシア株式会社 電解メッキ装置
JP7003005B2 (ja) * 2018-06-25 2022-01-20 株式会社荏原製作所 基板ホルダ及びめっき装置
JP7122235B2 (ja) * 2018-11-26 2022-08-19 上村工業株式会社 保持治具
JP7256728B2 (ja) * 2019-10-04 2023-04-12 株式会社荏原製作所 基板ホルダ及び基板処理装置
JP7244408B2 (ja) * 2019-12-13 2023-03-22 株式会社荏原製作所 基板ホルダ
US11353497B2 (en) * 2020-03-27 2022-06-07 Yamaichi Electronics Co., Ltd. Test socket
JP7483578B2 (ja) * 2020-09-29 2024-05-15 株式会社荏原製作所 接点構造、基板ホルダ、めっき装置、及び基板に給電する方法
CN115142104B (zh) * 2022-07-28 2024-04-26 福州一策仪器有限公司 电镀装置、多通道电镀装置组和电镀反应系统

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5891516A (ja) 1981-11-25 1983-05-31 Matsushita Electric Ind Co Ltd 薄膜磁気ヘッドの製造装置
JPS5931882A (ja) 1982-08-12 1984-02-21 Sonitsukusu:Kk 浴中表面処理方法及びその装置
JP3130144B2 (ja) 1992-10-01 2001-01-31 オムロン株式会社 媒体処理システム及び媒体処理装置
JPH076268U (ja) * 1993-06-29 1995-01-27 富士電気化学株式会社 片面メッキ用治具
JP3402168B2 (ja) * 1997-12-25 2003-04-28 株式会社デンソー 表面加工装置
DE19962170A1 (de) 1999-12-22 2001-07-12 Steag Micro Tech Gmbh Substrahthalter
JP3876663B2 (ja) * 2001-08-07 2007-02-07 株式会社デンソー 表面処理装置及び表面処理方法
TWI316097B (en) * 2002-06-21 2009-10-21 Ebara Corp Substrate holder and plating apparatus
JP4162440B2 (ja) 2002-07-22 2008-10-08 株式会社荏原製作所 基板ホルダ及びめっき装置
JP4124327B2 (ja) * 2002-06-21 2008-07-23 株式会社荏原製作所 基板ホルダ及びめっき装置
JP3778282B2 (ja) 2002-07-15 2006-05-24 株式会社荏原製作所 基板ホルダ及びめっき装置
US7735451B2 (en) * 2002-11-15 2010-06-15 Ebara Corporation Substrate processing method and apparatus
JP4892326B2 (ja) * 2006-11-29 2012-03-07 株式会社フジクラ メッキ治具
JP5435355B2 (ja) * 2009-09-04 2014-03-05 日立金属株式会社 メッキ装置
JP5766048B2 (ja) * 2010-08-19 2015-08-19 株式会社荏原製作所 基板ホルダ及びめっき装置

Also Published As

Publication number Publication date
US9175416B2 (en) 2015-11-03
KR101489051B1 (ko) 2015-02-02
JP2013155405A (ja) 2013-08-15
TWI522496B (zh) 2016-02-21
KR20130088062A (ko) 2013-08-07
CN103225099A (zh) 2013-07-31
US20130192983A1 (en) 2013-08-01
TW201331425A (zh) 2013-08-01
CN103225099B (zh) 2016-01-06

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