TWI518154B - A thermosetting type conductive coating composition, an optical film, and a protective film - Google Patents

A thermosetting type conductive coating composition, an optical film, and a protective film Download PDF

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TWI518154B
TWI518154B TW100137819A TW100137819A TWI518154B TW I518154 B TWI518154 B TW I518154B TW 100137819 A TW100137819 A TW 100137819A TW 100137819 A TW100137819 A TW 100137819A TW I518154 B TWI518154 B TW I518154B
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melamine resin
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TW201219514A (en
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Yasuo Chikusa
Norihiro Nakamura
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Nagase Chemtex Corp
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Description

熱硬化型導電性塗佈用組成物、光學膜及保護膜Thermosetting conductive coating composition, optical film and protective film

本發明係關於一種熱硬化型導電性塗佈用組成物、使用該熱硬化型導電性塗佈用組成物而獲得之光學膜及保護膜。The present invention relates to a thermosetting conductive coating composition and an optical film and a protective film obtained by using the thermosetting conductive coating composition.

於構成液晶電視或電漿電視、電致發光顯示器、太陽電池等之平板的光學膜,有時為了消除靜電損害等故障而設置具有抗靜電功能之塗層(抗靜電層)。In an optical film constituting a flat panel of a liquid crystal television, a plasma television, an electroluminescence display, or a solar cell, a coating (antistatic layer) having an antistatic function may be provided in order to eliminate malfunction such as electrostatic damage.

例如於平板顯示器之製造步驟或運送步驟中,為了防止面板表面受損、附著污垢或灰塵,而於其表面貼合作為一種光學膜之保護膜。該保護膜係於PET等樹脂基材之單面具有黏著層,並將黏著層側貼合於顯示器而使用者,為了防止由剝離膜時引起之靜電而損壞電氣製品,樹脂基材之與黏著層側相反側之面形成有抗靜電層。For example, in the manufacturing step or the transporting step of the flat panel display, in order to prevent damage to the surface of the panel, adhesion of dirt or dust, the surface is bonded to form a protective film of an optical film. The protective film has an adhesive layer on one side of a resin substrate such as PET, and the user adheres the adhesive layer side to the display, and the user protects the resin from damage due to static electricity caused by peeling off the film. An antistatic layer is formed on the surface on the opposite side of the layer side.

先前,對於此抗靜電層,除要求抗靜電功能以外,亦要求用於防止受損之耐刮痕性、用於防止剪裁時之黏著劑之附著的防污性、拭去所附著之黏著劑時所需之耐溶劑性,但近年來除該等特性以外,為了在保護膜上印刷批號(lot number)等,亦要求油性墨水之印刷密合性之類的特性。進而,對於降低成本之要求亦提高,要求以1層塗層形成同時滿足上述特性之被膜。In the past, in addition to the antistatic function, the antistatic layer is required to prevent scratch resistance due to damage, antifouling property for preventing adhesion of the adhesive at the time of cutting, and wiping off the adhered adhesive. In recent years, in addition to these characteristics, in order to print a lot number or the like on a protective film, characteristics such as printing adhesion of an oil-based ink are also required. Further, the demand for cost reduction is also increased, and it is required to form a film which satisfies the above characteristics with one coat layer.

形成此種抗靜電層之材料,使用含導電性聚合物之導電性塗佈材料。As the material for forming such an antistatic layer, a conductive coating material containing a conductive polymer is used.

專利文獻1揭示有一種用於形成抗靜電層之導電性聚合物組成物。該導電性聚合物組成物係含聚噻吩系導電性聚合物與聚酯黏合劑之組成物,可藉由100℃ 1分鐘左右之乾燥而於樹脂基材上形成密合性優異之抗靜電層。然而,由於其為溶劑乾燥型之組成物,故而所形成之抗靜電層於耐刮痕性及耐溶劑性方面不充分,為了確保該等特性,需要於抗靜電層上積層外塗層,以1層塗層無法滿足上述所有性能。Patent Document 1 discloses a conductive polymer composition for forming an antistatic layer. The conductive polymer composition contains a composition of a polythiophene-based conductive polymer and a polyester binder, and can form an antistatic layer excellent in adhesion on a resin substrate by drying at 100 ° C for about 1 minute. . However, since it is a solvent-drying type composition, the formed antistatic layer is insufficient in scratch resistance and solvent resistance, and in order to secure these characteristics, it is necessary to laminate an overcoat layer on the antistatic layer to One layer of coating does not meet all of the above properties.

專利文獻2揭示有一種含導電性聚合物與水溶性聚醚改質聚矽氧之組成物,並且揭示藉由添加側鏈經聚醚改質之聚矽氧,可形成潤滑性優異之被膜,但並未提及耐刮痕性及印刷性,含有側鏈經聚醚改質之聚矽氧之導電性組成物無法同時滿足耐刮痕性及印刷性。Patent Document 2 discloses a composition comprising a conductive polymer and a water-soluble polyether modified polyfluorene oxide, and discloses that a film having excellent lubricity can be formed by adding a polyfluorene modified by a polyether having a side chain. However, there is no mention of scratch resistance and printability, and a conductive composition containing a polyether modified by a polyether having a side chain cannot satisfy scratch resistance and printability at the same time.

專利文獻3揭示可利用由具有活性氫之樹脂與含有聚矽氧烷之聚胺酯樹脂(polyurethane resin)、聚異氰酸酯、抗靜電劑所構成之組成物,可以1層塗層形成具有表面電阻率、耐溶劑性、耐刮痕性、印刷性之抗靜電層,但該組成物於印刷密合性方面不充分,又,形成抗靜電層時需要於40℃老化(ageing)48小時,因此生產性較低,不適合大量生產。Patent Document 3 discloses that a composition composed of a resin having active hydrogen and a polyurethane resin, a polyisocyanate, and an antistatic agent containing polyoxyalkylene can be used to form a surface resistivity and a resistance by one coating layer. Solvent-based, scratch-resistant, and printable antistatic layer, but this composition is insufficient in terms of printing adhesion, and when it is formed into an antistatic layer, it needs to be aged at 40 ° C for 48 hours, so productivity is better. Low, not suitable for mass production.

專利文獻4揭示有一種含有於末端具有羥基等反應性官能基之有機矽氧烷的組成物,並且揭示使用該組成物形成之被膜同時實現防污性(較高之對水之接觸角)與特定墨水之印刷密合性。然而,該組成物之硬化需要於140℃ 2分鐘之條件下,因而生產性較低,不適合大量生產。Patent Document 4 discloses a composition containing an organosiloxane having a reactive functional group such as a hydroxyl group at the terminal, and discloses a film formed using the composition while achieving antifouling property (higher contact angle with water) and Printing adhesion of specific inks. However, the hardening of the composition requires a condition of 140 ° C for 2 minutes, so that the productivity is low and it is not suitable for mass production.

專利文獻5揭示有一種含導電性聚合物、三聚氰胺樹脂衍生物及酸觸媒之組成物,並且揭示藉由使用此組成物,可以100℃之1分鐘左右之低溫短時間形成具有抗靜電功能、耐刮痕性、耐溶劑性、防污性之被膜。然而,使用該組成物形成之被膜無法同時實現印刷性及印刷密合性、與耐刮痕性。Patent Document 5 discloses a composition containing a conductive polymer, a melamine resin derivative, and an acid catalyst, and discloses that by using the composition, an antistatic function can be formed at a low temperature of about 1 minute at 100 ° C. A film that is resistant to scratches, solvents, and stains. However, the film formed using the composition cannot simultaneously achieve printability, print adhesion, and scratch resistance.

[專利文獻1]日本特開2002-060736號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2002-060736

[專利文獻2]日本特開2007-308549號公報[Patent Document 2] Japanese Patent Laid-Open Publication No. 2007-308549

[專利文獻3]日本特開2006-178424號公報[Patent Document 3] Japanese Laid-Open Patent Publication No. 2006-178424

[專利文獻4]日本特開2009-107329號公報[Patent Document 4] Japanese Patent Laid-Open Publication No. 2009-107329

[專利文獻5]日本特開2009-138042號公報[Patent Document 5] Japanese Patent Laid-Open Publication No. 2009-138042

如上所示,對於先前提出之導電性組成物,於以1層塗層形成導電性被膜之情形時,無法於低溫短時間之硬化條件下形成耐刮痕性、耐溶劑性、印刷性及印刷密合性優異之導電性被膜。As described above, in the case where the conductive coating is formed of a single layer coating on the conductive composition previously proposed, scratch resistance, solvent resistance, printability, and printing cannot be formed under low-temperature curing conditions for a short period of time. A conductive film excellent in adhesion.

尤其是耐刮痕性與印刷性及印刷密合性通常存在取捨之關係,難以同時滿足兩者。In particular, scratch resistance, printability, and print adhesion generally have a trade-off relationship, and it is difficult to satisfy both of them at the same time.

本發明人等為解決上述課題而潛心研究,結果發現:含有導電性聚合物(a)、三聚氰胺樹脂衍生物(b)、磺酸硬化觸媒(c)、兩末端聚醚改質聚矽氧(d)、導電性提升劑(e)、及溶劑或分散介質(f)之導電性組成物藉由於低溫短時間之熱硬化,可形成耐刮痕性、耐溶劑性、印刷性及印刷密合性優異之導電性被膜,從而完成本發明。The present inventors have diligently studied to solve the above problems, and as a result, found that the conductive polymer (a), the melamine resin derivative (b), the sulfonic acid hardening catalyst (c), and the two-end polyether modified polyoxyl (d) The conductive enhancer (e), and the conductive composition of the solvent or dispersion medium (f) can form scratch resistance, solvent resistance, printability, and print density by thermal hardening at a low temperature for a short period of time. The conductive film excellent in compatibility is completed to complete the present invention.

即,本發明之熱硬化型導電性塗佈用組成物,含有:That is, the thermosetting conductive coating composition of the present invention contains:

(a)導電性聚合物、(a) a conductive polymer,

(b)三聚氰胺樹脂衍生物、(b) a melamine resin derivative,

(c)磺酸硬化觸媒、(c) sulfonic acid hardening catalyst,

(d)兩末端聚醚改質聚矽氧、(d) Two-end polyether modified polyfluorene,

(e)導電性提升劑、及(e) a conductivity enhancer, and

(f)溶劑或分散介質。(f) solvent or dispersion medium.

又,於本發明之熱硬化型導電性塗佈用組成物中,較理想為上述導電性聚合物(a)係具有下述式(I)之重複結構之聚(3,4-二烷氧基噻吩)或聚(3,4-伸烷二氧基噻吩)與摻雜物(dopant)之複合體,Further, in the thermosetting conductive coating composition of the present invention, it is preferred that the conductive polymer (a) is a poly(3,4-dialkoxy group) having a repeating structure of the following formula (I). a complex of a thiophene) or a poly(3,4-alkylenedioxythiophene) with a dopant,

(式中,R1及R2相互獨立表示氫原子或C1-4之烷基,或一併表示可經取代之C1-4之伸烷基)。(Wherein, R 1 is and R 2 each independently represents a hydrogen atom or a C 1-4 alkyl group, or together represent may be substituted with the C 1-4 alkylene group).

又,於上述熱硬化型導電性塗佈用組成物中,較理想為上述三聚氰胺樹脂衍生物(b)之含量相對於導電性聚合物100重量份為150~750重量份。Moreover, in the thermosetting conductive coating composition, the content of the melamine resin derivative (b) is preferably 150 to 750 parts by weight based on 100 parts by weight of the conductive polymer.

又,於上述熱硬化型導電性塗佈用組成物中,較理想為上述磺酸硬化觸媒(c)為芳香族磺酸,其含量相對於三聚氰胺樹脂衍生物100重量份為8~40重量份。Further, in the thermosetting conductive coating composition, the sulfonic acid curing catalyst (c) is preferably an aromatic sulfonic acid, and the content thereof is 8 to 40 by weight based on 100 parts by weight of the melamine resin derivative. Share.

又,於上述熱硬化型導電性塗佈用組成物中,較理想為上述兩末端聚醚改質聚矽氧(d)之含量相對於三聚氰胺樹脂衍生物100重量份為10~60重量份。Further, in the thermosetting conductive coating composition, the content of the both-end polyether modified polyfluorene (d) is preferably 10 to 60 parts by weight based on 100 parts by weight of the melamine resin derivative.

又,於上述熱硬化型導電性塗佈用組成物中,較理想為上述導電性提升劑(e)係具有醯胺基、磺基及羥基中之至少1種取代基的化合物。Moreover, in the thermosetting conductive coating composition, the conductive enhancer (e) preferably has at least one substituent selected from the group consisting of a mercapto group, a sulfo group and a hydroxyl group.

較理想為上述熱硬化型導電性塗佈用組成物進而含有(g)水溶性抗氧化劑,上述水溶性抗氧化劑(g)較理想為抗壞血酸或異抗壞血酸。It is preferable that the thermosetting conductive coating composition further contains (g) a water-soluble antioxidant, and the water-soluble antioxidant (g) is preferably ascorbic acid or isoascorbic acid.

較理想為上述熱硬化型導電性塗佈用組成物進而含有(h)濡濕性提升劑。It is preferable that the thermosetting conductive coating composition further contains (h) a wetness improving agent.

較理想為上述熱硬化型導電性塗佈用組成物進而含有(i)消泡劑,上述消泡劑(i)較理想為聚矽氧乳化液。It is preferable that the thermosetting conductive coating composition further contains (i) an antifoaming agent, and the antifoaming agent (i) is preferably a polyoxymethylene emulsion.

本發明之光學膜係由基材與積層於上述基材上之導電性被膜構成,其特徵在於:上述導電性被膜係使用本發明之熱硬化型導電性塗佈用組成物而形成。The optical film of the present invention is composed of a substrate and a conductive film laminated on the substrate, and the conductive film is formed using the thermosetting conductive coating composition of the present invention.

於上述光學膜中,較理想為上述導電性被膜係藉由將上述熱硬化型導電性塗佈用組成物塗佈於上述基材,並於130℃以下之溫度使其乾燥、熱硬化而形成。又,較理想為上述導電性被膜之計算膜厚未達45nm。In the above-mentioned optical film, it is preferable that the conductive film is applied to the substrate by applying the thermosetting conductive coating composition, and dried and thermally cured at a temperature of 130 ° C or lower. . Further, it is preferable that the calculated film thickness of the conductive film is less than 45 nm.

本發明之保護膜係由本發明之光學膜構成。The protective film of the present invention is composed of the optical film of the present invention.

根據本發明之熱硬化型導電性塗佈用組成物,可藉由低溫短時間之加熱處理(乾燥、熱硬化)而形成同時滿足耐刮痕性、耐溶劑性、印刷性及印刷密合性之導電性被膜。According to the thermosetting conductive coating composition of the present invention, it can be formed by heat treatment (drying or thermal curing) at a low temperature for a short period of time while satisfying scratch resistance, solvent resistance, printability, and printing adhesion. Conductive film.

又,藉由使用上述熱硬化型導電性塗佈用組成物,可形成同時滿足優異之耐刮痕性、與優異之印刷性及印刷密合性之導電性被膜。Moreover, by using the above-mentioned thermosetting conductive coating composition, it is possible to form a conductive film which satisfies both excellent scratch resistance and excellent printability and printing adhesion.

又,本發明之光學膜具備導電性被膜,該導電性被膜係將本發明之熱硬化型導電性塗佈用組成物塗佈於基材上並硬化而成者,因此具有優異之導電性,並且耐刮痕性、耐溶劑性、印刷性及印刷密合性優異。Moreover, the optical film of the present invention is provided with a conductive film which is obtained by applying the thermosetting conductive coating composition of the present invention to a substrate and curing it, thereby having excellent conductivity. Moreover, it is excellent in scratch resistance, solvent resistance, printability, and printing adhesiveness.

又,本發明之光學膜極適合用作保護膜,由上述光學膜構成之保護膜亦為本發明之一。Further, the optical film of the present invention is extremely suitable as a protective film, and the protective film composed of the above optical film is also one of the inventions.

首先,對本發明之熱硬化型導電性塗佈用組成物進行說明。First, the thermosetting conductive coating composition of the present invention will be described.

本發明之熱硬化型導電性塗佈用組成物(以下亦簡稱為「導電性組成物」)含有(a)導電性聚合物、(b)三聚氰胺樹脂衍生物、(c)磺酸硬化觸媒、(d)兩末端聚醚改質聚矽氧、(e)導電性提升劑、及(f)溶劑或分散介質。The thermosetting conductive coating composition of the present invention (hereinafter also referred to simply as "conductive composition") contains (a) a conductive polymer, (b) a melamine resin derivative, and (c) a sulfonic acid hardening catalyst. And (d) a polyether modified polyfluorene at both ends, (e) a conductivity enhancer, and (f) a solvent or a dispersion medium.

以下,依序對各調配物進行說明。Hereinafter, each formulation will be described in order.

1.導電性聚合物(a)1. Conductive polymer (a)

上述導電性聚合物(a)係用於對形成之導電性被膜(塗層)賦予導電性之調配物。The conductive polymer (a) is a formulation for imparting conductivity to the formed conductive film (coating).

上述導電性聚合物,可列舉:聚噻吩、聚吡咯、聚苯胺、聚乙炔、聚苯乙炔、聚萘、該等之衍生物、及該等與摻雜物之複合體等。Examples of the conductive polymer include polythiophene, polypyrrole, polyaniline, polyacetylene, polyphenylacetylene, polynaphthalene, derivatives thereof, and the like, and a composite thereof.

該等之中,較佳為由聚噻吩與摻雜物之複合體構成之聚噻吩系導電性聚合物,作為聚噻吩系導電性聚合物,更佳為聚(3,4-二烷氧基噻吩)或聚(3,4-伸烷二氧基噻吩)與摻雜物之複合體。Among these, a polythiophene-based conductive polymer composed of a composite of polythiophene and a dopant is preferable, and a polythiophene-based conductive polymer is more preferably a poly(3,4-dialkoxy group). A complex of thiophene) or poly(3,4-alkylenedioxythiophene) with a dopant.

上述聚(3,4-二烷氧基噻吩)或聚(3,4-伸烷二氧基噻吩),較佳為由以下之式(I)所表示之重複結構單位構成之陽離子形態之聚噻吩,The above poly(3,4-dialkoxythiophene) or poly(3,4-alkylenedioxythiophene) is preferably a cationic form composed of repeating structural units represented by the following formula (I). Thiophene,

此處,R1及R2相互獨立表示氫原子或C1-4之烷基,或一併表示可經取代之C1-4之伸烷基。Here, R 1 and R 2 each independently represents a hydrogen atom or a C 1-4 alkyl group, or together represent may be substituted with the C 1-4 alkylene group.

上述C1-4之烷基,例如可列舉:甲基、乙基、丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基等。Examples of the alkyl group of the above C 1-4 include a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a second butyl group, and a third butyl group.

又,R1及R2一併形成之可經取代之C1-4之伸烷基,例如可列舉:亞甲基、1,2-伸乙基、1,3-伸丙基、1,4-伸丁基、1-甲基-1,2-伸乙基、1-乙基-1,2-伸乙基、1-甲基-1,3-伸丙基、2-甲基-1,3-伸丙基等。較佳為,亞甲基、1,2-伸乙基、1,3-伸丙基,尤佳為1,2-伸乙基。具有上述伸烷基之聚噻吩,尤佳為聚(3,4-乙烯二氧噻吩)。Further, R 1 and R 2 may be substituted by a C 1-4 alkylene group which may be substituted, and examples thereof include a methylene group, a 1,2-extended ethyl group, a 1,3-propanyl group, and 1, 4-tert-butyl, 1-methyl-1,2-extended ethyl, 1-ethyl-1,2-extended ethyl, 1-methyl-1,3-propanyl, 2-methyl- 1,3-propyl group and the like. Preferably, a methylene group, a 1,2-extended ethyl group, a 1,3-propanyl group, and more preferably a 1,2-extended ethyl group. The polythiophene having an alkylene group as described above is particularly preferably poly(3,4-ethylenedioxythiophene).

由聚(3,4-乙烯二氧噻吩)與摻雜物構成之複合體除導電性或透明性極為優異之外,化學穩定性亦極為優異,使用該複合物作為導電性聚合物而形成之導電性被膜具有不依賴於濕度之極為穩定之導電性與極高之透明性。The composite composed of poly(3,4-ethylenedioxythiophene) and a dopant is extremely excellent in electrical conductivity and transparency, and is also excellent in chemical stability, and is formed using the composite as a conductive polymer. The conductive film has extremely stable conductivity independent of humidity and extremely high transparency.

進而,含有該複合體作為導電性聚合物之導電性組成物由於可於低溫短時間形成被膜,故而亦具有極為適合謀求大量生產之保護膜等光學膜之製作的生產性。Further, since the conductive composition containing the composite as a conductive polymer can form a film at a low temperature for a short period of time, it is also highly productive for producing an optical film such as a protective film which is mass-produced.

構成上述聚噻吩系導電性聚合物之摻雜物係藉由與上述聚噻吩形成離子對而形成複合體,並可使聚噻吩穩定地分散於水中之陰離子形態之聚合物。The dopant constituting the polythiophene-based conductive polymer is a polymer having an anionic form by forming an ion pair with the polythiophene to form a complex and stably dispersing the polythiophene in water.

此種摻雜物,可列舉:羧酸聚合物類(例如,聚丙烯酸、聚順丁烯二酸、聚甲基丙烯酸等)、磺酸聚合物類(例如,聚苯乙烯磺酸、聚乙烯磺酸、聚異戊二烯磺酸等)等。該等羧酸聚合物類及磺酸聚合物類,又,亦可為乙烯羧酸類及乙烯磺酸類與其他可聚合之單體類,例如丙烯酸酯類、苯乙烯、乙烯萘等芳香族乙烯化合物之共聚物。其中,尤佳為聚苯乙烯磺酸。Examples of such a dopant include carboxylic acid polymers (for example, polyacrylic acid, polymaleic acid, polymethacrylic acid, etc.), and sulfonic acid polymers (for example, polystyrenesulfonic acid, polyethylene). Sulfonic acid, polyisoprene sulfonic acid, etc.). The carboxylic acid polymers and sulfonic acid polymers may also be ethylene carboxylic acids and vinyl sulfonic acids and other polymerizable monomers, such as aromatic vinyl compounds such as acrylates, styrenes, and vinyl naphthalenes. Copolymer. Among them, polystyrenesulfonic acid is particularly preferred.

上述聚苯乙烯磺酸較佳為重量平均分子量大於20000、且為500000以下。更佳為40000~200000。若使用分子量為此範圍外之聚苯乙烯磺酸,則存在聚噻吩系導電性聚合物對於水之分散穩定性下降之情形。再者,上述聚合物之重量平均分子量係利用凝膠滲透層析法(GPC)測定之值。測定時使用Waters公司製造之ultrahydroge 1500管柱。The polystyrenesulfonic acid preferably has a weight average molecular weight of more than 20,000 and not more than 500,000. More preferably, it is 40,000 to 200,000. When polystyrenesulfonic acid having a molecular weight outside this range is used, there is a case where the dispersion stability of the polythiophene-based conductive polymer with respect to water is lowered. Further, the weight average molecular weight of the above polymer is a value measured by gel permeation chromatography (GPC). An ultrahydroge 1500 column manufactured by Waters Corporation was used for the measurement.

上述導電性聚合物之含量較佳為相對於全部導電性組成物作為固形分為0.01~1.2重量%。更佳為0.03~0.5重量%。若少於0.01重量%則不易表現導電性,若多於1.2重量%則存在藉由與其他成分之混合而產生沈澱之情形。The content of the conductive polymer is preferably from 0.01 to 1.2% by weight based on the total of the conductive composition. More preferably, it is 0.03 to 0.5% by weight. If it is less than 0.01% by weight, it is difficult to express conductivity, and if it is more than 1.2% by weight, precipitation may occur by mixing with other components.

2.三聚氰胺樹脂衍生物(b)2. Melamine resin derivative (b)

上述三聚氰胺樹脂衍生物(b)係可對導電性組成物賦予低溫之熱硬化性,且可形成被膜外觀、導電性(例如,表面電阻率,以下記作SR)、透明性(例如,總透光率,以下記作Tt,及霧度值,以下記作Haze)、對基材之密合性、耐溶劑性優異之導電性被膜。The melamine resin derivative (b) can impart a low-temperature thermosetting property to the conductive composition, and can form a film appearance, conductivity (for example, surface resistivity, hereinafter referred to as SR), and transparency (for example, total permeability). The light transmittance is hereinafter referred to as Tt and haze value, and is referred to as Haze), a conductive film excellent in adhesion to a substrate, and solvent resistance.

上述三聚氰胺樹脂衍生物係例如以下之式(II)所表示,The above melamine resin derivative is represented, for example, by the following formula (II).

(式中,R3~R8表示H或CH2OR9,R9表示H或C1-4之烷基)。取代基R3~R8均為氫原子之三聚氰胺樹脂衍生物為亞胺基型三聚氰胺樹脂衍生物;取代基R3~R8均為CH2OH之三聚氰胺樹脂衍生物為羥甲基型三聚氰胺樹脂衍生物;取代基R3~R8均為CH2OR9,且R9為經C1-4之烷基取代的結構之三聚氰胺樹脂衍生物為全醚型三聚氰胺樹脂衍生物。(wherein R 3 to R 8 represent H or CH 2 OR 9 , and R 9 represents H or a C 1-4 alkyl group). The melamine resin derivative in which the substituents R 3 to R 8 are each a hydrogen atom is an imide-based melamine resin derivative; the melamine resin derivative in which the substituents R 3 to R 8 are both CH 2 OH is a hydroxymethyl type melamine resin The derivative; the melamine resin derivative in which the substituents R 3 to R 8 are both CH 2 OR 9 and R 9 is a C 1-4 alkyl group is a perether type melamine resin derivative.

又,上述3個取代基中2個混在於1分子中之結構之三聚氰胺樹脂衍生物分類為亞胺基羥甲基型、羥甲基醚型及亞胺基醚型,全部混在之三聚氰胺樹脂衍生物為亞胺基羥甲基醚型。Further, a melamine resin derivative in which two of the above three substituents are mixed in one molecule is classified into an imidomethylol type, a methylol ether type, and an imino ether type, all of which are mixed with a melamine resin. The substance is an imidohydroxymethyl ether type.

於上述R3~R8表示CH2OR9、且R9為C1-4之烷基之情形時,C1-4之烷基存在甲基、乙基、丙基、丁基等,若考慮低溫硬化性則較佳為甲基。上述三聚氰胺樹脂衍生物亦可為以式(II)為基本骨架並自我縮合之寡聚物。In the case where R 3 to R 8 represent CH 2 OR 9 and R 9 is a C 1-4 alkyl group, a C 1-4 alkyl group may have a methyl group, an ethyl group, a propyl group, a butyl group or the like. A methyl group is preferred in view of low temperature hardenability. The above melamine resin derivative may also be an oligomer having a basic skeleton of the formula (II) and self-condensing.

該等三聚氰胺樹脂衍生物可單獨地使用,亦可併用2種以上。These melamine resin derivatives may be used singly or in combination of two or more.

上述結構之三聚氰胺樹脂衍生物中,就導電性組成物之穩定性及低溫之硬化性之觀點而言,更佳為全醚型三聚氰胺,尤佳為R9為甲基之全醚型三聚氰胺。又,於三聚氰胺樹脂衍生物為寡聚物之情形時,若考慮導電性組成物之適用期(pot life),則較佳為其平均聚合度較低,尤佳為超過1.0未達1.8。Among the melamine resin derivatives having the above-described structure, from the viewpoint of stability of the conductive composition and curability at low temperature, it is more preferably a perether type melamine, and particularly preferably a total ether type melamine in which R 9 is a methyl group. Further, when the melamine resin derivative is an oligomer, considering the pot life of the conductive composition, the average degree of polymerization is preferably low, and more preferably more than 1.0 is less than 1.8.

再者,於本說明書中,所謂導電性組成物之適用期係表示:導電性組成物(塗佈液)之外觀(沈澱之有無)、形成之導電性被膜之外觀、透明性、導電性、對基材之密合性、耐刮痕性、耐溶劑性、印刷性、印刷密合性等諸多性能於製備導電性組成物(塗佈液)後可充分維持之時間。In the present specification, the application period of the conductive composition means the appearance of the conductive composition (coating liquid) (presence of precipitation), the appearance of the formed conductive film, transparency, conductivity, and Many properties such as adhesion to the substrate, scratch resistance, solvent resistance, printability, and printing adhesion can be sufficiently maintained after the preparation of the conductive composition (coating liquid).

為了使於低溫硬化之導電性被膜具有被膜外觀、導電性、透明性、對基材之密合性、耐溶劑性之三聚氰胺樹脂衍生物(b)的含量較佳為相對於導電性聚合物(a)之固形分100重量份為150~750重量份。更佳為250~450重量份。The content of the melamine resin derivative (b) having a film appearance, conductivity, transparency, adhesion to a substrate, and solvent resistance in the conductive film which is cured at a low temperature is preferably relative to the conductive polymer ( The solid content of a) is 150 to 750 parts by weight in 100 parts by weight. More preferably, it is 250 to 450 parts by weight.

若含量超過750重量份,則存在被膜之導電性下降,或被膜白化而透明性下降之情形。相反地,於少於150重量份之情形時,不易對被膜賦予充分之耐溶劑性。When the content exceeds 750 parts by weight, the conductivity of the film may be lowered, or the film may be whitened to lower the transparency. On the contrary, in the case of less than 150 parts by weight, it is difficult to impart sufficient solvent resistance to the film.

3.磺酸硬化觸媒(c)3. Sulfonic acid hardening catalyst (c)

上述磺酸硬化觸媒(c)具有於乾燥、硬化時於基材上促進三聚氰胺樹脂衍生物(b)之交聯的作用。磺酸由於在導電性組成物中顯示酸性,故而促進導電性組成物中之三聚氰胺樹脂衍生物之交聯,塗佈液之適用期縮短。The sulfonic acid hardening catalyst (c) has a function of promoting crosslinking of the melamine resin derivative (b) on the substrate during drying and hardening. Since the sulfonic acid exhibits acidity in the conductive composition, crosslinking of the melamine resin derivative in the conductive composition is promoted, and the pot life of the coating liquid is shortened.

又,磺酸硬化觸媒亦具有提高導電性組成物於基材之調平(leveling)性之作用。Further, the sulfonic acid hardening catalyst also has an effect of improving the leveling property of the conductive composition on the substrate.

因此,上述磺酸硬化觸媒較理想為於基材上促進硬化,且可維持導電性組成物於基材之調平性及導電性組成物之適用期的結構。Therefore, the sulfonic acid hardening catalyst is preferably a structure which promotes hardening on a substrate and maintains the leveling property of the conductive composition on the substrate and the pot life of the conductive composition.

作為該種磺酸硬化觸媒可列舉脂肪族或芳香族之磺酸。As such a sulfonic acid hardening catalyst, an aliphatic or aromatic sulfonic acid can be mentioned.

上述脂肪族磺酸,例如可列舉:甲磺酸、三氟甲磺酸、異戊二烯磺酸、樟腦磺酸、己磺酸、辛磺酸、壬磺酸、癸磺酸、十六烷基磺酸等。又,上述芳香族磺酸,例如可列舉:苯磺酸、對甲苯磺酸、異丙苯磺酸、十二烷基苯磺酸、萘磺酸、壬基萘磺酸等。Examples of the aliphatic sulfonic acid include methanesulfonic acid, trifluoromethanesulfonic acid, isoprenesulfonic acid, camphorsulfonic acid, hexanesulfonic acid, octanesulfonic acid, sulfonic acid, sulfonic acid, and hexadecane. Sulfonic acid and the like. Further, examples of the aromatic sulfonic acid include benzenesulfonic acid, p-toluenesulfonic acid, cumenesulfonic acid, dodecylbenzenesulfonic acid, naphthalenesulfonic acid, and decylnaphthalenesulfonic acid.

該等之中,就塗佈液之適用期及於低溫之硬化性之觀點而言,較佳為芳香族磺酸,尤佳為十二烷基苯磺酸。Among these, from the viewpoint of the pot life of the coating liquid and the curability at low temperature, an aromatic sulfonic acid is preferred, and a dodecyl benzene sulfonic acid is preferred.

上述磺酸硬化觸媒之含量較理想為其上限相對於三聚氰胺樹脂衍生物100重量份為40重量份,更理想為33重量份。又,其下限較理想為相對於三聚氰胺樹脂衍生物100重量份為8重量份。其原因在於:若為此範圍,則可使三聚氰胺樹脂衍生物於低溫短時間內硬化,且可充分維持塗佈液之適用期。The content of the sulfonic acid hardening catalyst is preferably 40 parts by weight, more preferably 33 parts by weight, based on 100 parts by weight of the melamine resin derivative. Further, the lower limit thereof is preferably 8 parts by weight based on 100 parts by weight of the melamine resin derivative. The reason for this is that if it is in this range, the melamine resin derivative can be hardened at a low temperature for a short period of time, and the pot life of the coating liquid can be sufficiently maintained.

相對於此,若上述含量超過40重量份,則容易變得無法維持塗佈液之適用期,另一方面,未達8重量份則存在導電性組成物之成膜性惡化而形成之被膜中可見收縮(cissing)之情形,或存在被膜之耐溶劑性下降之情形。On the other hand, when the content is more than 40 parts by weight, the application period of the coating liquid may not be maintained. On the other hand, if it is less than 8 parts by weight, the film formation property of the conductive composition may be deteriorated. The case of cissing is visible, or there is a case where the solvent resistance of the film is lowered.

4.兩末端聚醚改質聚矽氧(d)4. Two-end polyether modified polyoxane (d)

上述兩末端聚醚改質聚矽氧(d)具有對導電性被膜賦予耐刮痕性、耐溶劑性、印刷性、印刷密合性之作用。The both-end polyether modified polyfluorene (d) has an effect of imparting scratch resistance, solvent resistance, printability, and printing adhesion to the conductive film.

尤其是,由於本發明之熱硬化型導電性塗佈用組成物中將兩末端聚醚改質聚矽氧與其他成分併用,故而可同時對形成之導電性被膜賦予耐刮痕性與印刷性及印刷密合性。In particular, in the thermosetting conductive coating composition of the present invention, the both-end polyether modified polyfluorene oxide and other components are used in combination, so that the formed conductive film can be simultaneously provided with scratch resistance and printability. And printing adhesion.

聚醚改質聚矽氧存在側鏈改質型、兩末端改質型,但該等之中,僅使用兩末端聚醚改質聚矽氧之情形可特異性地對形成之導電性被膜同時賦予耐刮痕性與印刷性及印刷密合性,即便使用側鏈聚醚改質聚矽氧亦無法享受該種效果。而且,該種見解係本案發明人等新發現之見解。The polyether modified polyfluorene has a side chain modification type and a two-end modification type. However, in the case where only the two-end polyether is modified to form a polyfluorene oxide, the conductive film formed can be specifically formed simultaneously. Scratch resistance, printability, and printing adhesion are imparted, and this effect cannot be obtained even if a side chain polyether is used to modify polyfluorene. Moreover, this kind of insight is the newly discovered insight of the inventor of the present case.

又,關於藉由使用兩末端聚醚改質聚矽氧可享受上述效果的理由,可認為:(1)由於聚醚改質聚矽氧於導電性被膜表面之定向性提高、表現優異之光滑性,結果提高耐刮痕性,(2)藉由兩末端之聚醚鏈而提高墨水之密合性,亦可較高程度地賦予印刷性及印刷密合性。Further, the reason why the above effects can be obtained by using the polyether modified polyether at the both ends is considered to be: (1) the directionality of the polyether modified polyfluorene on the surface of the conductive film is improved, and the performance is excellent. The result is that the scratch resistance is improved, and (2) the adhesion of the ink is improved by the polyether chains at both ends, and the printability and the printing adhesion can be imparted to a high degree.

又,於使用兩末端聚醚改質聚矽氧之情形時亦維持耐溶劑性。可認為其原因在於:由於兩末端聚醚改質聚矽氧於表面均勻地定向,故而不阻礙三聚氰胺樹脂衍生物之交聯,因此被膜之交聯密度不下降。Further, the solvent resistance is also maintained in the case where the polyether is modified by the two-end polyether. The reason for this is considered to be that since the two-end polyether modified polyfluorene is uniformly oriented on the surface, the crosslinking of the melamine resin derivative is not inhibited, so that the crosslinking density of the film does not decrease.

上述兩末端聚醚改質聚矽氧,例如可列舉以下之式(III)所表示者,Examples of the above-mentioned two-terminal polyether-modified polyfluorene oxide include those represented by the following formula (III).

(式中,R10為聚醚基,表示由氧化乙烯構成之R11(C2H4O)aR12、由氧化丙烯構成之R11(C3H6O)bR12、或該等混合而成之R11(C2H4O)a(C3H6O)bR12。聚醚基中之R11及R12分別獨立表示烷基或伸烷基)。又,上述式(III)之兩末端之聚醚基R10分別可相同或不同。(wherein R 10 is a polyether group, and R 11 (C 2 H 4 O) a R 12 composed of ethylene oxide, R 11 (C 3 H 6 O) b R 12 composed of propylene oxide, or the like R 11 (C 2 H 4 O) a (C 3 H 6 O) b R 12 is mixed, and R 11 and R 12 in the polyether group each independently represent an alkyl group or an alkylene group). Further, the polyether groups R 10 at both ends of the above formula (III) may be the same or different.

又,聚矽氧烷之聚合度(n)較理想為380以下,較佳為45~230。藉由調配上述聚合度之聚矽氧烷,可對形成之導電性被膜賦予更優異之耐刮痕性。Further, the degree of polymerization (n) of the polyoxyalkylene is preferably 380 or less, preferably 45 to 230. By forming the polyoxyalkylene having the above polymerization degree, it is possible to impart more excellent scratch resistance to the formed conductive film.

又,於上述導電性組成物中,只要維持上述兩末端聚醚改質聚矽氧之溶解性、且表現要求之特性,則R10所含之聚醚基之聚合度(a及b)並無特別限制。Further, in the above-mentioned conductive composition, the degree of polymerization (a and b) of the polyether group contained in R 10 is maintained as long as the solubility of the both-end polyether-modified polyfluorene is maintained and the properties required are exhibited. There are no special restrictions.

上述聚醚基之骨架存在氧化乙烯、氧化丙烯、或氧化乙烯與氧化丙烯之共聚物。該等之中,就水溶性之觀點而言,較佳為氧化乙烯,若考慮印刷性及印刷密合性,則較佳為氧化丙烯或氧化乙烯與氧化丙烯之共聚物。The skeleton of the above polyether group is represented by ethylene oxide, propylene oxide, or a copolymer of ethylene oxide and propylene oxide. Among these, from the viewpoint of water solubility, ethylene oxide is preferred, and in view of printability and printing adhesion, propylene oxide or a copolymer of ethylene oxide and propylene oxide is preferred.

如上所述,藉由選擇最適結構之聚醚改質聚矽氧,可於形成之導電性被膜中確實地使耐刮痕性與印刷性及印刷密合性並存。As described above, by selecting a polyether-modified polyfluorene having an optimum structure, scratch resistance can be surely made to coexist with printability and print adhesion in the formed conductive film.

上述導電性組成物所含之兩末端聚醚改質聚矽氧係可形成不失去耐溶劑性而賦予耐刮痕性、且印刷性、印刷密合性優異之導電性被膜者,較佳為上述式(III)所表示之結構之兩末端聚醚改質聚矽氧。上述式(III)所表示之兩末端聚醚改質聚矽氧可單獨地使用1種,亦可併用分子量不同之2種以上之兩末端聚醚改質聚矽氧。The both-end polyether modified polyfluorene-based oxygen contained in the conductive composition can be formed into a conductive film which is excellent in printability and print adhesion without imparting solvent resistance and imparting scratch resistance. The polyether at the two ends of the structure represented by the above formula (III) is modified to form polyfluorene. The two-end polyether modified polyfluorene represented by the above formula (III) may be used singly or in combination of two or more kinds of terminal polyethers having different molecular weights.

上述兩末端聚醚改質聚矽氧之含量較佳為其上限相對於三聚氰胺樹脂衍生物100重量份為60重量份,更佳為33重量份。又,其下限較佳為相對於三聚氰胺樹脂衍生物100重量份為10重量份。The content of the above-mentioned two-end polyether modified polyfluorene is preferably such that the upper limit thereof is 60 parts by weight, more preferably 33 parts by weight, per 100 parts by weight of the melamine resin derivative. Further, the lower limit thereof is preferably 10 parts by weight based on 100 parts by weight of the melamine resin derivative.

其原因在於:若為該範圍,則可對形成之被膜同時賦予耐刮痕性與印刷性及印刷密合性。The reason for this is that when it is in this range, scratch resistance, printability, and printing adhesion can be simultaneously provided to the formed film.

相對於此,若兩末端聚醚改質聚矽氧之含量超過60重量份,則存在形成之被膜之耐溶劑性惡化之情形。On the other hand, when the content of the polyether modified polyfluorene at both ends is more than 60 parts by weight, the solvent resistance of the formed film may be deteriorated.

5.導電性提升劑(e)5. Conductivity enhancer (e)

上述導電性組成物所含之導電性提升劑(e)可提高形成之導電性被膜之導電性。The conductivity enhancer (e) contained in the conductive composition can improve the conductivity of the formed conductive film.

上述導電性提升劑(e),例如可列舉:N-甲基甲醯胺、N,N-二甲基甲醯胺、γ-丁內酯、N-甲基吡咯啶酮等醯胺化合物;乙二醇、二乙二醇、丙二醇、1,3-丙二醇(trimethylene glycol)、1,4-丁二醇、1,5-戊二醇、1,6-己二醇、新戊二醇、鄰苯二酚、環己二醇、環己烷二甲醇、甘油、二乙二醇單乙基醚、丙二醇單甲基醚等含羥基化合物;異佛酮、碳酸丙二酯、環己酮、乙醯丙酮、乙酸乙酯、乙醯乙酸乙酯、原乙酸甲酯(methylorthoacetate)、原甲酸乙酯(ethyl orthoformate)等含羰基化合物;二甲基亞碸等具有磺基之化合物等。Examples of the conductive enhancer (e) include decylamine compounds such as N-methylformamide, N,N-dimethylformamide, γ-butyrolactone, and N-methylpyrrolidone; Ethylene glycol, diethylene glycol, propylene glycol, trimethylene glycol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, neopentyl glycol, Hydroxy-containing compounds such as catechol, cyclohexanediol, cyclohexanedimethanol, glycerin, diethylene glycol monoethyl ether, propylene glycol monomethyl ether; isophorone, propylene carbonate, cyclohexanone, A carbonyl group-containing compound such as acetone, ethyl acetate, ethyl acetate, methylorthoacetate or ethyl orthoformate; a compound having a sulfo group such as dimethylhydrazine.

該等之中,就塗佈液之適用期或於低溫之硬化性、形成之導電性被膜之透明性、耐刮痕性、耐溶劑性等觀點而言,較佳為醯胺化合物、含羥基化合物、含磺基化合物,尤佳為N-甲基吡咯啶酮、二甲基亞碸、乙二醇。Among these, a guanamine compound and a hydroxyl group are preferable from the viewpoints of the pot life of the coating liquid, the curability at low temperature, the transparency of the formed conductive film, the scratch resistance, the solvent resistance, and the like. A compound or a sulfo group-containing compound, particularly preferably N-methylpyrrolidone, dimethyl azine or ethylene glycol.

又,上述導電性提升劑之含量並無特別限制,但通常較佳為以導電性組成物中0.1~60重量%之量含有。Further, the content of the conductive enhancer is not particularly limited, but it is usually preferably contained in an amount of 0.1 to 60% by weight based on the conductive composition.

6.溶劑或分散介質(f)6. Solvent or dispersion medium (f)

作為上述溶劑或分散介質(f),只要為使導電性組成物中所含之各成分溶解或分散者則並無特別限制,例如可列舉:水、有機溶劑、該等之混合物等。The solvent or the dispersion medium (f) is not particularly limited as long as it dissolves or disperses each component contained in the conductive composition, and examples thereof include water, an organic solvent, and the like.

再者,於本發明中,導電性組成物所含之溶劑或分散介質以外之各成分發生溶解之情形時稱為溶劑,構成組成物之至少1種成分均勻地分散之情形時稱為分散介質。In the present invention, when a solvent or a component other than the solvent contained in the conductive composition is dissolved, it is called a solvent, and when at least one component constituting the composition is uniformly dispersed, it is called a dispersion medium. .

於上述導電性組成物中,存在上述三聚氰胺樹脂衍生物不溶於水之情形。於該情形時,溶劑或分散介質可使用水與有機溶劑之混合物。進而,於使用水與有機溶劑之混合物之情形時,有機溶劑,較佳為含有至少1種與水混合之有機溶劑,只要含有與水混合之有機溶劑,則亦可進而含有不與水混合(疏水性)之有機溶劑。藉由使用沸點較低之醇系有機溶劑與水之混合物作為溶劑或分散介質,存在揮發性提高並於乾燥、熱硬化時變得有利之情形。又,於使用樹脂基材之情形時,醇系有機溶劑可有助於提高調平性。In the above conductive composition, the above melamine resin derivative is insoluble in water. In this case, a solvent or a dispersion medium may be a mixture of water and an organic solvent. Further, when a mixture of water and an organic solvent is used, the organic solvent preferably contains at least one organic solvent mixed with water, and may further contain no water mixed with water as long as it contains an organic solvent mixed with water ( Hydrophobic) organic solvent. By using a mixture of an alcohol-based organic solvent having a relatively low boiling point and water as a solvent or a dispersion medium, there is a case where the volatility is improved and it is advantageous in drying and heat curing. Further, in the case of using a resin substrate, an alcohol-based organic solvent can contribute to an improvement in leveling property.

再者,於本案說明書中,所謂水系熱硬化型導電性塗佈用組成物,係溶劑或分散介質僅為水或為水與跟水混合之有機溶劑之混合物的熱硬化型導電性塗佈用組成物:所謂溶劑系熱硬化型導電性塗佈用組成物,係溶劑或分散介質含非水溶性有機溶劑之熱硬化型導電性塗佈用組成物。In the present specification, the water-based thermosetting conductive coating composition is a thermosetting conductive coating for a solvent or a dispersion medium which is only water or a mixture of water and an organic solvent mixed with water. Composition: The solvent-based thermosetting conductive coating composition is a thermosetting conductive coating composition containing a solvent or a dispersion medium containing a water-insoluble organic solvent.

6-1.有機溶劑6-1. Organic solvents

上述有機溶劑,可列舉可使不易溶解於水中之三聚氰胺樹脂衍生物等成分均勻地溶解或分散者。Examples of the organic solvent include those in which a component such as a melamine resin derivative which is not easily dissolved in water is uniformly dissolved or dispersed.

作為與水混合之有機溶劑,例如可列舉:甲醇、乙醇、2-丙醇、1-丙醇等醇類;乙二醇、二乙二醇、三乙二醇、四乙二醇等乙二醇類;乙二醇單甲基醚、二乙二醇單甲基醚、乙二醇二乙基醚、二乙二醇二甲基醚等二醇醚類;乙二醇單乙基醚乙酸酯、二乙二醇單乙基醚乙酸酯、二乙二醇單丁基醚乙酸酯等二醇醚乙酸酯類;丙二醇、二丙二醇、三丙二醇等丙二醇類;丙二醇單甲基醚、丙二醇單乙基醚、二丙二醇單甲基醚、二丙二醇單乙基醚、丙二醇二甲基醚、二丙二醇二甲基醚、丙二醇二乙基醚、二丙二醇二乙基醚等丙二醇醚類;丙二醇單甲基醚乙酸酯、丙二醇單乙基醚乙酸酯、二丙二醇單甲基醚乙酸酯、二丙二醇單乙基醚乙酸酯等丙二醇醚乙酸酯類;四氫呋喃、丙酮、乙腈、及該等之混合物等。Examples of the organic solvent to be mixed with water include alcohols such as methanol, ethanol, 2-propanol and 1-propanol; and ethylene glycol, diethylene glycol, triethylene glycol, and tetraethylene glycol. Alcohols; glycol ethers such as ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether; ethylene glycol monoethyl ether Glycol ether acetates such as acid esters, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate; propylene glycols such as propylene glycol, dipropylene glycol, and tripropylene glycol; propylene glycol monomethyl ether , propylene glycol monoethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, propylene glycol dimethyl ether, dipropylene glycol dimethyl ether, propylene glycol diethyl ether, dipropylene glycol diethyl ether and other propylene glycol ethers Propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, dipropylene glycol monomethyl ether acetate, dipropylene glycol monoethyl ether acetate, etc.; propylene glycol ether acetate; tetrahydrofuran, acetone, acetonitrile And mixtures of such and the like.

又,作為疏水性有機溶劑,例如可列舉:乙酸乙酯、乙酸丁酯、乳酸乙酯等酯類;二異丙基醚、二異丁基醚等醚類;甲基乙基酮、甲基二異丁基酮等酮類;己烷、辛烷、石油醚等脂肪族烴類;甲苯、二甲苯等芳香族烴類;及該等之混合物等。Further, examples of the hydrophobic organic solvent include esters such as ethyl acetate, butyl acetate, and ethyl lactate; and ethers such as diisopropyl ether and diisobutyl ether; methyl ethyl ketone and methyl group; Ketones such as diisobutyl ketone; aliphatic hydrocarbons such as hexane, octane and petroleum ether; aromatic hydrocarbons such as toluene and xylene; and mixtures thereof.

該等有機溶劑可單獨使用,亦可併用2種以上。These organic solvents may be used singly or in combination of two or more.

於上述導電性組成物為水系導電性組成物之情形時,上述有機溶劑之含量較佳為相對於水100重量份為20重量份以上。若未達20重量份,則存在三聚氰胺樹脂衍生物等成分溶解或分散不均勻而成膜性惡化並無法表現性能之情形。再者,於上述導電性組成物為溶劑系導電性組成物之情形時,上述溶劑之含量並無限制。In the case where the conductive composition is a water-based conductive composition, the content of the organic solvent is preferably 20 parts by weight or more based on 100 parts by weight of water. When the amount is less than 20 parts by weight, the components such as the melamine resin derivative may be dissolved or dispersed unevenly, and the film forming property may be deteriorated, and the performance may not be exhibited. In the case where the conductive composition is a solvent-based conductive composition, the content of the solvent is not limited.

6-2.水6-2. Water

水系導電性組成物中使用之水,例如可列舉:蒸餾水、離子交換水及離子交換蒸餾水等。又,上述水亦包含導電性聚合物之水分散體及其他成分所含之水分。Examples of the water used in the water-based conductive composition include distilled water, ion-exchanged water, and ion-exchange distilled water. Further, the water also contains water in an aqueous dispersion of a conductive polymer and other components.

上述水之含量較佳為相對於全部導電性組成物為1重量%以上。The content of the water is preferably 1% by weight or more based on the total of the conductive composition.

於上述導電性組成物為水系導電性組成物之情形時,導電性組成物之pH值較佳為1~14之範圍,若考慮低溫之硬化性,則更佳為1~7,尤佳為1.5~3。導電性組成物之pH值藉由鹼等pH值調整劑進行調整即可。In the case where the conductive composition is a water-based conductive composition, the pH of the conductive composition is preferably in the range of 1 to 14, and more preferably 1 to 7 in consideration of low-temperature hardenability, and particularly preferably 1.5 to 3. The pH of the conductive composition may be adjusted by a pH adjuster such as a base.

上述pH值調整劑,例如可列舉:氨、乙醇胺、異丙醇胺等烷醇胺類等。Examples of the pH adjuster include alkanolamines such as ammonia, ethanolamine, and isopropanolamine.

此處,考慮到:有時鹼形成酸與鹽而降低三聚氰胺樹脂衍生物之硬化促進效果,另一方面,存在導電性組成物之pH值越高低溫之硬化性越下降,但由於抑制於三聚氰胺樹脂衍生物之溶液中之自我交聯故而溶液之穩定性或適用期變好之情形,pH值調整劑之添加量適宜決定即可。再者,上述pH值調整劑為上述導電性組成物中之任意成分。Here, it is considered that the alkali forms an acid and a salt to lower the hardening promoting effect of the melamine resin derivative. On the other hand, the higher the pH of the conductive composition, the lower the hardenability of the low temperature, but the melamine is inhibited by the melamine. In the case of self-crosslinking in the solution of the resin derivative, the stability or the pot life of the solution may be improved, and the amount of the pH adjusting agent may be appropriately determined. Further, the pH adjuster is an optional component of the conductive composition.

又,含有如以上說明般之(a)~(f)成分之導電性組成物於如下情形時導電性組成物之適用期顯著提高方面尤佳:相對於導電性聚合物之固形分100重量份含有150~750重量份之全醚型三聚氰胺樹脂衍生物(b),相對於三聚氰胺樹脂衍生物100重量份含有8~40重量份芳香族磺酸作為磺酸硬化觸媒(c),相對於三聚氰胺樹脂衍生物100重量份含有10~60重量份兩末端聚醚改質聚矽氧(d),含有具有醯胺基、羥基、磺基中一個以上之化合物作為導電性提升劑(e)。Further, the conductive composition containing the components (a) to (f) as described above is particularly preferable in that the pot life of the conductive composition is remarkably improved as follows: 100 parts by weight relative to the solid content of the conductive polymer 150 to 750 parts by weight of the perether type melamine resin derivative (b), which contains 8 to 40 parts by weight of aromatic sulfonic acid as a sulfonic acid hardening catalyst (c) relative to 100 parts by weight of the melamine resin derivative, relative to melamine 100 parts by weight of the resin derivative contains 10 to 60 parts by weight of the terminal polyether modified polyfluorene oxide (d), and contains one or more compounds having a mercapto group, a hydroxyl group or a sulfo group as the conductivity enhancer (e).

以上說明之(a)~(f)成分係本發明之熱硬化型導電性塗佈用組成物中之必需成分。The components (a) to (f) described above are essential components in the thermosetting conductive coating composition of the present invention.

而且,本發明之熱硬化型導電性塗佈用組成物亦可視需要而含有水溶性抗氧化劑(g)、濡濕性提升劑(h)、消泡劑(i)等。Further, the thermosetting conductive coating composition of the present invention may contain a water-soluble antioxidant (g), a wettability enhancer (h), an antifoaming agent (i), or the like as needed.

7.水溶性抗氧化劑(g)7. Water-soluble antioxidants (g)

上述導電性組成物亦可含有水溶性抗氧化劑(g)。上述水溶性抗氧化劑(g)發揮如下功能:於形成導電性被膜時,對於該被膜中之導電性聚合物而均勻地存在,並有效地抑制由暴露於空氣而引起之電阻升高。The above conductive composition may also contain a water-soluble antioxidant (g). The water-soluble antioxidant (g) has a function of uniformly forming a conductive polymer in the film when the conductive film is formed, and effectively suppressing an increase in electric resistance caused by exposure to air.

再者,脂溶性抗氧化劑無法均勻地存在於被膜中,無法有效地抑制由暴露於空氣而引起之電阻升高。Further, the fat-soluble antioxidant cannot be uniformly present in the film, and the increase in electric resistance caused by exposure to air cannot be effectively suppressed.

上述水溶性抗氧化劑可列舉還原性或非還原性水溶性抗氧化劑。The water-soluble antioxidant may be a reducing or non-reducing water-soluble antioxidant.

上述具有還原性之水溶性抗氧化劑,例如可列舉:L-抗壞血酸、L-抗壞血酸鈉、L-抗壞血酸鉀、異抗壞血酸、異抗壞血酸鈉、異抗壞血酸鉀等具有經2個羥基取代之內酯環之化合物;麥芽糖、乳糖、纖維雙糖、木糖、阿拉伯糖、葡萄糖、果糖、半乳糖、甘露糖等單糖類或二糖類;兒茶素、芸香苷、楊梅黃酮、槲皮素、堪非黃酮醇(kaempferol)等類黃酮;薑黃素、迷迭香酸、漂木酸、對苯二酚、3,4,5-三羥基苯甲酸等具有2個以上酚性羥基之化合物;半胱胺酸、麩胱甘肽、新戊四醇四(3-巰基丁酸酯)等具有硫醇基之化合物等。Examples of the water-soluble antioxidant having a reducing property include L-ascorbic acid, sodium L-ascorbate, potassium L-ascorbate, erythorbic acid, sodium erythorbate, and potassium erythorbate having a lactone ring substituted by two hydroxyl groups. a compound; a monosaccharide or a disaccharide such as maltose, lactose, cellobiose, xylose, arabinose, glucose, fructose, galactose, mannose; catechin, rutin, myricetin, quercetin, non-flavonol Flavonoids such as (kaempferol); compounds having more than two phenolic hydroxyl groups such as curcumin, rosmarinic acid, drifting acid, hydroquinone, 3,4,5-trihydroxybenzoic acid; cysteine, A compound having a thiol group such as glutathione or neopentyltetrakis(3-mercaptobutyrate).

上述非還原性水溶性抗氧化劑,例如可列舉:苯基咪唑磺酸、苯基三唑磺酸、2-羥基嘧啶、水楊酸苯酯、2-羥基-4-甲氧基二苯甲酮-5-磺酸鈉等吸收成為氧化劣化之原因之紫外線的化合物。該等可單獨使用,亦可併用2種以上。Examples of the non-reducing water-soluble antioxidant include phenylimidazoliumsulfonic acid, phenyltriazolesulfonic acid, 2-hydroxypyrimidine, phenyl salicylate, and 2-hydroxy-4-methoxybenzophenone. A compound such as sodium 5-sulfonate which absorbs ultraviolet rays which is a cause of oxidative degradation. These may be used alone or in combination of two or more.

該等水溶性抗氧化劑中,較理想為抗壞血酸及異抗壞血酸,更理想為抗壞血酸。Among these water-soluble antioxidants, ascorbic acid and isoascorbic acid are preferred, and ascorbic acid is more preferred.

其原因在於:明顯實現抑制由暴露於空氣而引起之電阻升高之效果,及使形成之導電性被膜透明性優異之效果。This is because the effect of suppressing the increase in electric resistance caused by exposure to air and the effect of making the formed conductive film transparent are excellent.

上述水溶性抗氧化劑之含量並無特別限定,但其上限較佳為相對於三聚氰胺樹脂衍生物100重量份為60重量份,更佳為40重量份。另一方面,其下限較佳為9重量份,更佳為20重量份。The content of the water-soluble antioxidant is not particularly limited, but the upper limit thereof is preferably 60 parts by weight, more preferably 40 parts by weight, per 100 parts by weight of the melamine resin derivative. On the other hand, the lower limit thereof is preferably 9 parts by weight, more preferably 20 parts by weight.

若上述含量超過60重量份,則存在形成之導電性被膜之耐溶劑性下降之情形,相反地,若少於9重量份,則有時由暴露於空氣而引起SR上升率增高。When the content is more than 60 parts by weight, the solvent resistance of the formed conductive film may be lowered. Conversely, if it is less than 9 parts by weight, the SR increase rate may be increased by exposure to air.

8.濡濕性提升劑(h)8. Hygroscopic enhancer (h)

上述導電性組成物亦可含有濡濕性提升劑(h)。上述濡濕性提升劑(h)可提高對導電性組成物之基材之濡濕性,且可提高形成之導電性被膜之均勻性。The above conductive composition may also contain a wetting enhancer (h). The moisture-reducing agent (h) can improve the wettability of the substrate of the conductive composition and can improve the uniformity of the formed conductive film.

上述濡濕性提升劑,例如可列舉:丙烯酸系共聚物或聚氧乙烯脂肪酸酯系化合物等。Examples of the above-mentioned wetness improving agent include an acrylic copolymer or a polyoxyethylene fatty acid ester compound.

該等之中較佳為丙烯酸系共聚物。其原因在於導電性被膜之透明性、耐刮痕性、耐溶劑性優異。Among these, an acrylic copolymer is preferred. The reason for this is that the conductive film is excellent in transparency, scratch resistance, and solvent resistance.

上述濡濕性提升劑之固形分之含量並無特別限制,但其上限較佳為相對於三聚氰胺樹脂衍生物100重量份為70重量份,更佳為40重量份。另一方面,其下限較佳為相對於三聚氰胺樹脂衍生物100重量份為4重量份。The content of the solid content of the above-mentioned moisture-reducing agent is not particularly limited, but the upper limit thereof is preferably 70 parts by weight, more preferably 40 parts by weight, per 100 parts by weight of the melamine resin derivative. On the other hand, the lower limit thereof is preferably 4 parts by weight based on 100 parts by weight of the melamine resin derivative.

若上述含量超過70重量份,則存在三聚氰胺樹脂衍生物之交聯密度下降而耐溶劑性惡化之情形,若未達4重量份,則存在成膜性不提高而被膜變得不均勻之情形。When the content is more than 70 parts by weight, the crosslinking density of the melamine resin derivative is lowered and the solvent resistance is deteriorated. When the amount is less than 4 parts by weight, the film formability is not improved and the film is not uniform.

9.消泡劑(i)9. Defoamer (i)

上述導電性組成物亦可含有消泡劑(i)。藉由調配上述消泡劑(i),可有效地消泡並抑制導電性組成物起泡。The above conductive composition may also contain an antifoaming agent (i). By disposing the above antifoaming agent (i), it is possible to effectively defoam and suppress foaming of the conductive composition.

上述消泡劑,例如可列舉:聚乙炔二醇(polyacetylene glycol)等二醇系化合物、有機改質聚矽氧烷等矽氧烷系化合物、使聚二甲基矽氧烷藉由乳化劑而分散於水之乳化物等。Examples of the antifoaming agent include a diol-based compound such as polyacetylene glycol, a siloxane-based compound such as an organically modified polyoxyalkylene oxide, and a polydimethyl methoxy olefin by an emulsifier. An emulsion or the like dispersed in water.

該等之中,就消泡性優異方面而言,較佳為聚二甲基矽氧烷之乳化物。Among these, an emulsion of polydimethyl methoxyoxane is preferred in terms of excellent defoaming property.

上述消泡劑之含量並無特別限制,但較佳為相對於兩末端聚醚改質聚矽氧100重量份為1~30重量份。若超過30重量份,則存在三聚氰胺樹脂衍生物之交聯密度下降而耐溶劑性惡化之情形,若未達1重量份,則存在消泡性不提高而泡沫長時間殘留之情形。The content of the antifoaming agent is not particularly limited, but is preferably from 1 to 30 parts by weight based on 100 parts by weight of the polyether modified polyfluorene at both ends. When the amount is more than 30 parts by weight, the crosslinking density of the melamine resin derivative is lowered and the solvent resistance is deteriorated. When the amount is less than 1 part by weight, the defoaming property is not improved and the foam remains for a long period of time.

本發明之熱硬化型導電性塗佈用組成物除上述成分以外,亦可視需要而含有其他成分。The thermosetting conductive coating composition of the present invention may contain other components as needed in addition to the above components.

10.其他成分10. Other ingredients

10-1.黏合劑樹脂10-1. Adhesive resin

為了提高形成之導電性被膜之成膜性或印刷性,上述導電性組成物亦可含有黏合劑樹脂。In order to improve the film formability or printability of the formed conductive film, the conductive composition may contain a binder resin.

於本發明之導電性組成物中,三聚氰胺樹脂衍生物之自我交聯膜具有黏合劑功能,但藉由添加黏合劑樹脂,存在進一步提高成膜性、被膜之可撓性及密合性、進而印刷性及印刷密合性之情形。In the conductive composition of the present invention, the self-crosslinking film of the melamine resin derivative has a binder function, but by adding a binder resin, the film formability, the flexibility and adhesion of the film are further improved, and further The situation of printability and print adhesion.

上述黏合劑樹脂,例如可列舉:聚酯、聚(甲基)丙烯酸酯、聚胺酯、聚乙酸乙烯酯、聚偏二氯乙烯、聚醯胺、聚醯亞胺、聚乙烯醇、聚丙烯酸多元醇、聚酯多元醇等均聚物;以選自由苯乙烯、偏二氯乙烯、氯乙烯及(甲基)丙烯酸烷基酯構成之群之化合物為共聚成分之共聚物等。Examples of the binder resin include polyester, poly(meth)acrylate, polyurethane, polyvinyl acetate, polyvinylidene chloride, polyamine, polyimine, polyvinyl alcohol, and polyacryl polyol. a homopolymer such as a polyester polyol; a copolymer selected from the group consisting of styrene, vinylidene chloride, vinyl chloride, and alkyl (meth)acrylate as a copolymerization component.

上述黏合劑樹脂之含量並無特別限定,但較佳為相對於三聚氰胺樹脂衍生物100重量份為200重量份以下,更佳為40重量份以下。若上述黏合劑樹脂之量超過200重量份,則存在三聚氰胺樹脂衍生物之交聯密度下降而形成之導電性被膜之耐溶劑性惡化之情形。The content of the binder resin is not particularly limited, but is preferably 200 parts by weight or less, more preferably 40 parts by weight or less based on 100 parts by weight of the melamine resin derivative. When the amount of the binder resin exceeds 200 parts by weight, the crosslinking property of the melamine resin derivative may decrease, and the solvent resistance of the conductive film formed may be deteriorated.

本發明之導電性組成物中之三聚氰胺樹脂衍生物之熱硬化較佳為三聚氰胺樹脂衍生物之自我交聯反應。其原因在於形成之導電性被膜之耐刮痕性或耐溶劑性優異。可認為三聚氰胺樹脂衍生物之自我交聯而形成之被膜之耐刮痕性或耐溶劑性優異之理由在於其交聯密度較高。The thermal hardening of the melamine resin derivative in the conductive composition of the present invention is preferably a self-crosslinking reaction of the melamine resin derivative. This is because the formed conductive film is excellent in scratch resistance or solvent resistance. The reason why the film formed by self-crosslinking of the melamine resin derivative is excellent in scratch resistance or solvent resistance is that the crosslinking density is high.

另一方面,三聚氰胺樹脂衍生物由於可與黏合劑樹脂所含之羰基或羥基等官能基進行反應,故而亦作為黏合劑樹脂之交聯劑而發揮功能,但三聚氰胺樹脂衍生物作為黏合劑樹脂之交聯劑發揮功能而形成之被膜,存在其耐刮痕性或耐溶劑性與三聚氰胺樹脂衍生物之自我交聯被膜相比較低之傾向。On the other hand, since the melamine resin derivative can react with a functional group such as a carbonyl group or a hydroxyl group contained in the binder resin, it also functions as a crosslinking agent of the binder resin, but the melamine resin derivative is used as a binder resin. The film formed by the function of the crosslinking agent tends to have lower scratch resistance or solvent resistance than the self-crosslinking film of the melamine resin derivative.

10-2.界面活性劑10-2. Surfactant

為了提高調平性,上述導電性組成物亦可含有界面活性劑。In order to improve the leveling property, the above conductive composition may also contain a surfactant.

上述界面活性劑,例如可列舉:全氟烷基羧酸、全氟烷基聚氧乙烯乙醇等氟系界面活性劑;聚氧乙烯烷基苯醚、氧化丙烯聚合物、氧化乙烯聚合物等聚醚系化合物;椰子油脂肪酸胺鹽、松脂膠等羧酸;蓖麻油硫酸酯類、磷酸酯、烷基醚硫酸鹽、山梨醇酐脂肪酸酯、磺酸酯、琥珀酸酯等酯系化合物;烷基芳基磺酸胺鹽、磺基琥珀酸二辛酯鈉等磺酸鹽化合物;月桂基磷酸鈉等磷酸鹽化合物;椰子油脂肪酸乙醇醯胺等醯胺化合物;陰離子性界面活性劑、陽離子性界面活性劑、非離子界面活性劑、矽改質丙烯酸化合物等。Examples of the surfactant include fluorine-based surfactants such as perfluoroalkylcarboxylic acid and perfluoroalkylpolyoxyethyleneethanol; and polyoxyethylene alkylphenyl ether, propylene oxide polymer, and ethylene oxide polymer. An ether compound; a carboxylic acid such as a coconut oil fatty acid amine salt or a rosin gum; an ester compound such as a castor oil sulfate, a phosphate ester, an alkyl ether sulfate, a sorbitan fatty acid ester, a sulfonate or a succinic acid ester; a sulfonate compound such as an alkylarylsulfonate amine salt or a sodium dioctyl sulfosuccinate; a phosphate compound such as sodium lauryl phosphate; a guanamine compound such as coconut oil fatty acid ethanolamine; an anionic surfactant; A surfactant, a nonionic surfactant, a hydrazine-modified acrylic compound, or the like.

上述界面活性劑之含量並無特別限定,但較佳為相對於三聚氰胺樹脂衍生物100重量份為100重量份以下。若超過100重量份,則存在三聚氰胺樹脂衍生物之交聯密度下降而形成之導電性被膜之耐溶劑性惡化之情形。The content of the surfactant is not particularly limited, but is preferably 100 parts by weight or less based on 100 parts by weight of the melamine resin derivative. When the amount is more than 100 parts by weight, the crosslinking property of the melamine resin derivative may be deteriorated, and the solvent resistance of the conductive film formed may be deteriorated.

10-3.矽烷偶合劑10-3. Decane coupling agent

為了提高導電性被膜之耐溶劑性、印刷性、印刷密合性,上述導電性組成物亦可含有矽烷偶合劑。The conductive composition may contain a decane coupling agent in order to improve solvent resistance, printability, and printing adhesion of the conductive film.

上述矽烷偶合劑,可列舉:3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基甲基二甲氧基矽烷、2-(3,4-環氧基環己基)乙基三甲氧基矽烷、3-巰基三甲氧基矽烷等。The above decane coupling agent may, for example, be 3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropylmethyldimethoxydecane or 2-(3,4-epoxy ring). Hexyl)ethyltrimethoxydecane, 3-mercaptotrimethoxydecane, and the like.

上述矽烷偶合劑之含量並無特別限定,但較佳為相對於三聚氰胺樹脂衍生物100重量份為100重量份以下。若多於100重量份,則存在三聚氰胺樹脂衍生物之交聯密度下降而形成之導電性被膜之耐溶劑性惡化之情形。The content of the decane coupling agent is not particularly limited, but is preferably 100 parts by weight or less based on 100 parts by weight of the melamine resin derivative. When it is more than 100 parts by weight, the solvent resistance of the conductive film formed by the decrease in the crosslinking density of the melamine resin derivative may be deteriorated.

10-4.增黏劑10-4. Tackifier

為了提高上述導電性組成物之黏度,上述導電性組成物亦可含有增黏劑。In order to increase the viscosity of the above conductive composition, the conductive composition may further contain a tackifier.

上述增黏劑,例如可列舉:海藻酸之鹽及衍生物、三仙膠衍生物、鹿角菜膠或纖維素等糖類化合物等水溶性高分子等。Examples of the tackifier include water-soluble polymers such as salts and derivatives of alginic acid, santillac derivatives, carrageenan or cellulose, and the like.

上述增黏劑之含量並無特別限定,但較佳為相對於三聚氰胺樹脂衍生物100重量份為100重量份以下。若多於100重量份,則存在三聚氰胺樹脂衍生物之交聯密度下降而形成之導電性被膜之耐溶劑性惡化之情形。The content of the tackifier is not particularly limited, but is preferably 100 parts by weight or less based on 100 parts by weight of the melamine resin derivative. When it is more than 100 parts by weight, the solvent resistance of the conductive film formed by the decrease in the crosslinking density of the melamine resin derivative may be deteriorated.

10-5.微粒子材料10-5. Microparticle material

為了提高導電性被膜之光滑性或印刷性、印刷密合性,上述導電性組成物中亦可含有膠體二氧化矽或中空二氧化矽、氟樹脂微粒子、二氧化鈦等金屬微粒子等微粒子材料。In order to improve the smoothness, printability, and printing adhesion of the conductive film, the conductive composition may contain fine particles such as colloidal cerium oxide, hollow cerium oxide, fluororesin fine particles, or metal fine particles such as titanium dioxide.

上述微粒子材料之含量並無特別限定,但較佳為相對於三聚氰胺樹脂衍生物100重量份為100重量份以下。若多於100重量份,則存在三聚氰胺樹脂衍生物之交聯密度下降而形成之導電性被膜之耐溶劑性惡化之情形。The content of the fine particle material is not particularly limited, but is preferably 100 parts by weight or less based on 100 parts by weight of the melamine resin derivative. When it is more than 100 parts by weight, the solvent resistance of the conductive film formed by the decrease in the crosslinking density of the melamine resin derivative may be deteriorated.

10-6.有機羧酸化合物10-6. Organic carboxylic acid compounds

為了提高導電性被膜之印刷性、印刷密合性,上述導電性組成物亦可含有具有羧基之有機羧酸。In order to improve the printability and print adhesion of the conductive film, the conductive composition may contain an organic carboxylic acid having a carboxyl group.

有機羧酸存在脂肪族及芳香族之1價、多價羧酸,亦可於分子內含有羥基或乙烯基等官能基。上述脂肪族羧酸,例如可列舉:乙酸、丁酸、己烷羧酸、辛烷羧酸、乙醯乙酸、丙二酸、琥珀酸、戊二酸、己二酸、反丁烯二酸、順丁烯二酸、蘋果酸、酒石酸、檸檬酸等。又,上述芳香族羧酸,例如可列舉:苯甲酸、水楊酸、沒食子酸、桂皮酸、鄰苯二甲酸、偏苯三甲酸、均苯四甲酸等。The organic carboxylic acid may be an aliphatic or aromatic monovalent or polyvalent carboxylic acid, and may have a functional group such as a hydroxyl group or a vinyl group in the molecule. Examples of the aliphatic carboxylic acid include acetic acid, butyric acid, hexanecarboxylic acid, octanecarboxylic acid, acetoacetic acid, malonic acid, succinic acid, glutaric acid, adipic acid, and fumaric acid. Maleic acid, malic acid, tartaric acid, citric acid, and the like. Further, examples of the aromatic carboxylic acid include benzoic acid, salicylic acid, gallic acid, cinnamic acid, phthalic acid, trimellitic acid, and pyromellitic acid.

接著,對本發明之光學膜進行說明。Next, the optical film of the present invention will be described.

本發明之光學膜係由基材及積層於上述基材上之導電性被膜構成者,且其特徵在於:上述導電性被膜係使用本發明之熱硬化型導電性塗佈用組成物而形成者。The optical film of the present invention is composed of a substrate and a conductive film laminated on the substrate, and the conductive film is formed by using the thermosetting conductive coating composition of the present invention. .

上述光學膜係由基材及積層於上述基材上之導電性被膜構成。The optical film is composed of a substrate and a conductive film laminated on the substrate.

上述基材,例如可列舉:樹脂基材、玻璃基材等。Examples of the substrate include a resin substrate and a glass substrate.

上述樹脂基材之材料樹脂,例如可列舉:聚乙烯、聚丙烯、乙烯-乙酸乙烯酯共聚物、乙烯-丙烯酸酯共聚物、離子聚合物共聚物、環烯烴系樹脂等聚烯烴樹脂;聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚碳酸酯、聚氧乙烯、改質聚苯、聚苯硫醚等聚酯樹脂;尼龍6、尼龍6,6、尼龍9、半芳香族聚醯胺6T6、半芳香族聚醯胺6T66、半芳香族聚醯胺9T等聚醯胺樹脂;丙烯酸樹脂、聚苯乙烯、丙烯腈-苯乙烯共聚物、丙烯腈-丁二烯-苯乙烯共聚物、氯乙烯樹脂、三乙醯纖維素等。Examples of the material resin of the resin substrate include polyolefin resins such as polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-acrylate copolymer, ionic polymer copolymer, and cycloolefin resin; Polyethylene phthalate, polybutylene terephthalate, polycarbonate, polyoxyethylene, modified polyphenylene, polyphenylene sulfide and other polyester resins; nylon 6, nylon 6,6, nylon 9, half Aramid resin such as aromatic polyamine 6T6, semi-aromatic polyamide 6T66, semi-aromatic polyamine 9T; acrylic resin, polystyrene, acrylonitrile-styrene copolymer, acrylonitrile-butadiene- Styrene copolymer, vinyl chloride resin, triacetyl cellulose, and the like.

又,上述基材較理想為透明(具有較高之透光率)。Further, the above substrate is preferably transparent (having a high light transmittance).

又,該等之中,於用作保護膜之光學膜之情形時,就加工性及功能性之觀點而言,較佳為使用聚對苯二甲酸乙二酯或三乙醯纖維素。Moreover, in the case of using as an optical film of a protective film, it is preferable to use polyethylene terephthalate or triacetium cellulose from a viewpoint of processability and functionality.

上述基材之形狀並無特別限定,根據光學膜之形狀而適宜選擇即可,可列舉膜狀、板狀、其他所需之形狀。因此,上述基材,可使用膜、片、板、成形物等各種基材。The shape of the substrate is not particularly limited, and may be appropriately selected depending on the shape of the optical film, and examples thereof include a film shape, a plate shape, and other desired shapes. Therefore, various substrates such as a film, a sheet, a sheet, and a molded article can be used as the substrate.

又,亦可對上述基材之表面施加電暈處理、火焰處理、電漿處理等物理處理。藉由施加該等處理可提高導電性組成物之塗佈性。Further, physical treatment such as corona treatment, flame treatment, or plasma treatment may be applied to the surface of the substrate. The coating property of the conductive composition can be improved by applying such treatment.

上述導電性被膜係使用本發明之導電性組成物而形成者,藉由將上述導電性組成物塗佈於基材並使其乾燥、熱硬化而形成。The conductive film is formed by using the conductive composition of the present invention, and is formed by applying the conductive composition to a substrate, drying it, and thermally curing the conductive composition.

將上述導電性組成物塗佈於上述基材之方法並無特別限定,可自該領域中通用之方法中適宜選擇,例如可列舉:旋塗、凹版印刷塗佈、棒塗、浸漬塗佈、淋幕式塗佈、模塗、噴塗等塗佈方法。The method of applying the conductive composition to the substrate is not particularly limited, and may be appropriately selected from methods common in the field, and examples thereof include spin coating, gravure coating, bar coating, and dip coating. Coating methods such as curtain coating, die coating, and spray coating.

又,亦可採用網版印刷、噴印、噴墨印刷、凸版印刷、凹版印刷、平版印刷等印刷法來塗佈上述導電性組成物。Further, the conductive composition may be applied by a printing method such as screen printing, jet printing, inkjet printing, letterpress printing, gravure printing, or lithography.

又,塗佈上述導電性組成物時,亦可製備將上述導電性組成物預先以醇等稀釋之塗佈液,再塗佈該塗佈液。Further, when the conductive composition is applied, a coating liquid in which the conductive composition is previously diluted with an alcohol or the like may be prepared, and the coating liquid may be applied.

上述導電性被膜之厚度並無特別限定,可根據目的而適宜選擇。The thickness of the conductive film is not particularly limited and may be appropriately selected depending on the purpose.

就塗佈成本之觀點而言,較佳為加熱乾燥後之計算膜厚為45nm以下,更佳為10~20nm。From the viewpoint of coating cost, the calculated film thickness after heat drying is preferably 45 nm or less, more preferably 10 to 20 nm.

再者,若使塗佈液之比重與乾燥後之被膜之比重可近似於1,則上述計算膜厚可根據以下之計算式而算出。In addition, when the specific gravity of the coating liquid and the specific gravity of the film after drying can be approximated to 1, the calculated film thickness can be calculated according to the following calculation formula.

「膜厚=塗佈液之濃度(%)÷100×線棒之理論塗佈量(μm)」"Thickness = concentration of coating solution (%) ÷ 100 × theoretical coating amount of wire rod (μm)"

通常,由於線棒之塗佈量少於理論值,故而實際之膜厚薄於計算值。Usually, since the coating amount of the wire bar is less than the theoretical value, the actual film thickness is thinner than the calculated value.

上述導電性被膜由於含有導電性聚合物故而具有導電性,其表面電阻率較佳為104~1011Ω/□。其原因在於:若具有該範圍之表面電阻率,則充分滿足作為抗靜電層之要求特性。The conductive film has conductivity because it contains a conductive polymer, and its surface resistivity is preferably from 10 4 to 10 11 Ω/□. The reason for this is that if the surface resistivity in this range is present, the required characteristics as an antistatic layer are sufficiently satisfied.

上述導電性被膜係藉由對塗佈於基材之導電性組成物加熱,並蒸發溶劑或分散介質同時使其熱硬化(乾燥、熱硬化)而形成。The conductive film is formed by heating a conductive composition applied to a substrate, and evaporating the solvent or the dispersion medium while thermally hardening (drying, heat curing).

此處,加熱條件較佳為於130℃以下(80℃~130℃)之溫度加熱1分鐘左右(30~90秒)之條件。其原因在於:本發明之導電性組成物可於上述條件下充分地形成導電性被膜,且上述條件於本件技術領域中為低溫短時間之條件,因此生產性亦優異。Here, the heating condition is preferably a condition of heating at a temperature of 130 ° C or lower (80 ° C to 130 ° C) for about 1 minute (30 to 90 seconds). The reason for this is that the conductive composition of the present invention can sufficiently form a conductive film under the above-described conditions, and the above conditions are in a low-temperature condition for a short period of time in the technical field of the present invention, and therefore, productivity is also excellent.

再者,於該條件下硬化不充分之情形時,於輥塗後以捲筒膜之狀態於25℃~60℃之乾燥機或保管庫後固化1小時~數週。Further, in the case where the curing is insufficient under the above conditions, the film is cured in a state of a roll film at 25 ° C to 60 ° C in a state of a roll film and post-cured for 1 hour to several weeks.

為了蒸發溶劑或分散介質之乾燥及熱硬化使用通常之通風乾燥機、熱風乾燥機、紅外線乾燥機等乾燥機等。為了同時進行乾燥及加熱,必須使用具有加熱手段之乾燥機(熱風乾燥機、紅外線乾燥機等)。又,作為加熱手段,除上述乾燥機之外,亦可使用具備加熱功能之加熱加壓輥、加壓機等。A drying machine such as a general air dryer, a hot air dryer, or an infrared dryer is used for drying and heat curing of the solvent or the dispersion medium. In order to perform drying and heating at the same time, it is necessary to use a dryer (hot air dryer, infrared dryer, etc.) having a heating means. Further, as the heating means, in addition to the above-described dryer, a heating and pressing roller having a heating function, a pressurizing machine, or the like may be used.

如上所述,本發明之導電性組成物含有導電性聚合物、三聚氰胺樹脂衍生物、磺酸硬化觸媒、兩末端聚醚改質聚矽氧、導電性提升劑、及溶劑或分散介質作為必需成分,並進而視需要含有水溶性抗氧化劑、濡濕性提升劑、消泡劑、黏合劑樹脂、界面活性劑、矽烷偶合劑、增黏劑、微粒子材料等。As described above, the conductive composition of the present invention contains a conductive polymer, a melamine resin derivative, a sulfonic acid hardening catalyst, a two-terminal polyether modified polyfluorene oxide, a conductivity improving agent, and a solvent or a dispersion medium as essential The component further contains a water-soluble antioxidant, a moisturizing enhancer, an antifoaming agent, a binder resin, a surfactant, a decane coupling agent, a tackifier, a microparticle material, and the like as needed.

由該種構成所構成之組成物通常為了防止於三聚氰胺樹脂衍生物之溶液中之自我交聯,而以三聚氰胺樹脂衍生物與酸性成分分離之狀態而供給(此處,作為顯示酸性之成分可列舉導電性聚合物或磺酸硬化觸媒等)。In order to prevent self-crosslinking in the solution of the melamine resin derivative, the composition of the composition of the melamine resin derivative is usually supplied in a state in which the melamine resin derivative is separated from the acidic component (here, as a component showing acidity) Conductive polymer or sulfonic acid hardening catalyst, etc.).

而且,將上述各成分於使用前以一定之比例混合,並以所有成分混合之狀態而使用。再者,於以鹼等中和酸性成分之情形時,即便將所有成分以混合之狀態而供給亦可維持保存穩定性。Further, each of the above components is mixed in a predetermined ratio before use, and used in a state in which all the components are mixed. Further, when the acidic component is neutralized with an alkali or the like, the storage stability can be maintained even if all the components are supplied in a mixed state.

通常,考慮組成物之適用期及保存穩定性,用於製備上述導電性組成物之塗佈液係以三聚氰胺樹脂衍生物與酸性成分分離之2~3液之狀態而供給。就成本之觀點而言,該等塗佈液之成分亦可充分濃縮。In general, in consideration of the pot life and storage stability of the composition, the coating liquid for preparing the above-mentioned conductive composition is supplied in a state in which two or three liquids of the melamine resin derivative and the acidic component are separated. The components of the coating liquids may also be sufficiently concentrated from the viewpoint of cost.

上述導電性組成物(塗佈液)之製備方法並無特別限制,將各成分以機械攪拌機或磁力攪拌機等攪拌機一面攪拌一面混合而製備。此處,上述攪拌較佳為持續約1~60分鐘。The method for preparing the conductive composition (coating liquid) is not particularly limited, and each component is prepared by mixing with a stirrer such as a mechanical stirrer or a magnetic stirrer while stirring. Here, the agitation is preferably continued for about 1 to 60 minutes.

再者,攪拌時,為了避免導電性聚合物或磺酸硬化觸媒、進而三聚氰胺樹脂衍生物以高濃度混合,故而希望預先添加醇等稀釋劑。Further, in the case of stirring, in order to avoid the conductive polymer or the sulfonic acid hardening catalyst, and further the melamine resin derivative is mixed at a high concentration, it is desirable to previously add a diluent such as an alcohol.

尤其是,若使含水溶性導電性聚合物之溶液與含醇等有機溶劑之溶液以高濃度混合,則存在分散穩定性下降而凝聚、且適用期減少之情形。In particular, when a solution containing a water-soluble conductive polymer and a solution containing an organic solvent such as an alcohol are mixed at a high concentration, the dispersion stability is lowered to cause aggregation, and the pot life is reduced.

又,於直接混合三聚氰胺樹脂衍生物與酸性成分之情形時,由於三聚氰胺之自我交聯容易於溶液中進行,故而存在導電性組成物之適用期縮短之情形。Further, in the case where the melamine resin derivative and the acidic component are directly mixed, since the self-crosslinking of melamine is easily carried out in the solution, the application period of the conductive composition is shortened.

又,導電性組成物之適用期由於亦依賴於組成物之溫度,故而較佳為使液溫保持低於30℃而製備。更佳之液溫為-5℃~10℃。Further, since the pot life of the conductive composition is also dependent on the temperature of the composition, it is preferably prepared by keeping the liquid temperature below 30 °C. A more preferable liquid temperature is -5 ° C to 10 ° C.

上述導電性組成物於25℃左右之常溫中穩定,但於含有酸性成分之情形時,有時三聚氰胺樹脂衍生物之自我交聯於溶液中進行而適用期惡化。The conductive composition is stable at a normal temperature of about 25 ° C. However, when an acidic component is contained, the melamine resin derivative may be self-crosslinked in a solution and the pot life may be deteriorated.

由於適用期依賴於塗佈液之溫度,故而藉由將溫度維持於-20℃~20℃進行塗佈,可提高適用期。可尤佳地維持於-5℃~10℃之溫度塗佈於基材。Since the pot life depends on the temperature of the coating liquid, the application period can be improved by coating the temperature at -20 ° C to 20 ° C. It can be preferably applied to the substrate at a temperature of from -5 ° C to 10 ° C.

將溫度保持越低適用期越提高,於水系導電性組成物之情形時,低於-20℃之溫度組成物有可能結冰。上述導電性組成物較佳為自製備時起將溫度保持低於30℃而製備,更佳為維持於-5℃~10℃之溫度。The lower the temperature is, the higher the pot life is. In the case of the water-based conductive composition, the temperature of the composition below -20 ° C may freeze. The above conductive composition is preferably prepared by keeping the temperature below 30 ° C from the time of preparation, and more preferably at a temperature of -5 ° C to 10 ° C.

由該種構成所構成之光學膜作為用於液晶顯示器、偏光板、電致發光顯示器、電漿顯示器、電子呈色顯示器、太陽電池等之具備抗靜電層之光學膜較佳。The optical film composed of such a composition is preferably used as an optical film having an antistatic layer for a liquid crystal display, a polarizing plate, an electroluminescence display, a plasma display, an electronic color display, a solar cell or the like.

又,上述光學膜作為保護膜尤佳,且由本發明之光學膜構成之保護膜亦為本發明之一。Further, the above optical film is particularly preferable as a protective film, and the protective film composed of the optical film of the present invention is also one of the inventions.

再者,於保護膜之情形時,就加工性及硬度或透明性等觀點而言,其基材較佳為聚對苯二甲酸乙二酯。Further, in the case of a protective film, the substrate is preferably polyethylene terephthalate in terms of workability, hardness, transparency, and the like.

[實施例][Examples]

以下,列舉實施例對本發明進行說明,但本發明不限定於該等實施例。Hereinafter, the present invention will be described by way of examples, but the present invention is not limited to the examples.

(實施例1~27及比較例1~9)(Examples 1 to 27 and Comparative Examples 1 to 9)

將表1中所示之各成分(使用原料)一面攪拌一面逐一添加於溶劑或分散介質中。確認添加之成分溶解或均勻地分散後再添加下一成分,添加所有成分後進而攪拌5分鐘,製備溶液或分散液狀態之熱硬化型導電性塗佈用組成物。此後,將本組成物以80%乙醇稀釋至6倍(1:5,重量比)而製備塗佈液。Each component (the raw material used) shown in Table 1 was added to the solvent or dispersion medium one by one while stirring. After confirming that the added components were dissolved or uniformly dispersed, the next component was added, and after all the components were added, the mixture was further stirred for 5 minutes to prepare a thermosetting conductive coating composition in a solution or dispersion state. Thereafter, the composition was diluted to 80 times (1:5, by weight) with 80% ethanol to prepare a coating liquid.

製備該塗佈液後,立即以No.4之線棒(濕膜厚9μm)塗佈於由聚對苯二甲酸乙二酯膜(Toray公司製造之Lumirror T-60(商品名))構成之基材上,並利用熱風乾燥機於130℃使其乾燥、熱硬化1分鐘,形成導電性被膜。Immediately after the preparation of the coating liquid, a wire rod (wet film thickness: 9 μm) of No. 4 was applied to a polyethylene terephthalate film (Lumirror T-60 (trade name) manufactured by Toray Co., Ltd.). The substrate was dried by a hot air dryer at 130 ° C and thermally cured for 1 minute to form a conductive film.

又,適用期之評價,製備熱硬化型導電性塗佈用組成物後經過24小時,以相同之方式製作導電性被膜。Further, in the evaluation of the pot life, a conductive film was produced in the same manner after 24 hours from the preparation of the thermosetting conductive coating composition.

(實施例28)(Embodiment 28)

與實施例1~27相同地,將表2中所示之各成分(使用原料)逐一一面攪拌一面添加,製備熱硬化型導電性塗佈用組成物。此後,將本組成物以80%乙醇稀釋至4倍(1:3,重量比)而製備塗佈液。In the same manner as in the examples 1 to 27, each component (the raw material used) shown in Table 2 was added while stirring, and a thermosetting conductive coating composition was prepared. Thereafter, the composition was diluted to 80 times (1:3, by weight) with 80% ethanol to prepare a coating liquid.

製備該塗佈液後,立即以No.4之線棒(濕膜厚9μm)塗佈於由聚對苯二甲酸乙二酯膜(Toray公司製造之Lumirror T-60(商品名))構成之基材上,並利用熱風乾燥機於130℃使其乾燥、熱硬化1分鐘,形成導電性被膜。Immediately after the preparation of the coating liquid, a wire rod (wet film thickness: 9 μm) of No. 4 was applied to a polyethylene terephthalate film (Lumirror T-60 (trade name) manufactured by Toray Co., Ltd.). The substrate was dried by a hot air dryer at 130 ° C and thermally cured for 1 minute to form a conductive film.

又,適用期之評價,製備熱硬化型導電性塗佈用組成物後經過24小時,以相同之方式製作導電性被膜。Further, in the evaluation of the pot life, a conductive film was produced in the same manner after 24 hours from the preparation of the thermosetting conductive coating composition.

進而,切割製成之導電性被膜並進行TEM觀察。將結果示於圖1。Further, the produced conductive film was cut and subjected to TEM observation. The results are shown in Fig. 1.

圖1係將實施例28中製作之導電性被膜以10萬倍之倍率拍攝之TEM觀察影像。圖1中,1為導電性被膜,2為PET膜,圖中右下角出示長度115nm之比例尺。Fig. 1 is a TEM observation image obtained by taking the conductive film produced in Example 28 at a magnification of 100,000 times. In Fig. 1, 1 is a conductive film, 2 is a PET film, and a scale of 115 nm in length is shown in the lower right corner of the figure.

I.使用原料I. Use of raw materials

I.1導電性聚合物(a)I.1 Conductive polymer (a)

含有導電性材料之水分散液,使用由聚(3,4-乙烯二氧噻吩)與聚苯乙烯磺酸之複合體構成之導電性聚合物之水分散液即H. C. Starck公司製造之Clevios P(商品名)(1.3重量%聚(3,4-乙烯二氧噻吩)/聚苯乙烯磺酸(重量平均分子量=150000)之複合體分散水溶液,水98.7重量%)。An aqueous dispersion containing a conductive material, which is an aqueous dispersion of a conductive polymer composed of a composite of poly(3,4-ethylenedioxythiophene) and polystyrenesulfonic acid, Clevios P manufactured by HC Starck Co., Ltd. Trade name) (1.3% by weight of a poly(3,4-ethylenedioxythiophene)/polystyrenesulfonic acid (weight average molecular weight = 1,500,000) composite dispersion aqueous solution, water 98.7% by weight).

I.2三聚氰胺樹脂衍生物(b)I.2 melamine resin derivative (b)

三聚氰胺樹脂衍生物,使用NIPPON CARBIDE工業公司製造之NIKALAC MW-390(全醚型,式(II)中之R9為甲基,聚合度:1.00)、NIKALAC MS-11(羥甲基型,60重量%製品,式(II)中之R9為氫原子,聚合度:1.80)及Nippon Sytecs Industry Nihon Cytec Industries公司製造之Cymel 300(全醚型,式(II)中之R9為甲基,聚合度:1.35)、Cymel 301(全醚型,式(II)中之R9為甲基,聚合度:1.40)(上述名稱均為商品名)。A melamine resin derivative using NIKALAC MW-390 manufactured by NIPPON CARBIDE Industrial Co., Ltd. (per ether type, R 9 in the formula (II) is a methyl group, a polymerization degree: 1.00), NIKALAC MS-11 (hydroxymethyl type, 60 % by weight of the product, R 9 in the formula (II) is a hydrogen atom, degree of polymerization: 1.80) and Cymel 300 manufactured by Nippon Sytecs Industry Nihon Cytec Industries, Inc. (all ether type, R 9 in the formula (II) is a methyl group, Degree of polymerization: 1.35), Cymel 301 (per ether type, R 9 in the formula (II) is a methyl group, degree of polymerization: 1.40) (the above names are all trade names).

I.3磺酸硬化觸媒(c)I.3 sulfonic acid hardening catalyst (c)

磺酸硬化觸媒,使用Tayca公司製造之Taycatox T-500(商品名)(分子量187.2;化合物名:異丙苯磺酸;以下記作QS)、花王公司製造之NEOPELEX GS(商品名)(分子量326.8;化合物名:十二烷基苯磺酸;以下記作DBS)。又,比較例之一部分中,作為酸觸媒亦使用將和光純藥工業公司製造之硝酸(分子量63.01;60重量%製品)稀釋至2重量%者。Sulfonic acid hardening catalyst, Taycatox T-500 (trade name) manufactured by Tayca Co., Ltd. (molecular weight: 187.2; compound name: cumenesulfonic acid; hereinafter referred to as QS), NEOPELEX GS (trade name) manufactured by Kao Corporation (molecular weight) 326.8; Compound name: dodecylbenzenesulfonic acid; hereinafter referred to as DBS). Further, in one of the comparative examples, nitric acid (molecular weight 63.01; 60% by weight of a product) manufactured by Wako Pure Chemical Industries, Ltd. was diluted to 2% by weight as an acid catalyst.

I.4聚醚改質聚矽氧(d)I.4 polyether modified polyoxane (d)

兩末端聚醚改質聚矽氧,使用Toray‧Dow Corning公司製造之8029 additive(商品名)、共榮社化學工業公司製造之Polyflow KL-402(商品名)、或BYK公司製造之BYK-378(商品名)。The two-end polyether modified polyfluorene oxygen, using 8029 additive (trade name) manufactured by Toray‧Dow Corning Co., Ltd., Polyflow KL-402 (trade name) manufactured by Kyoeisha Chemical Industry Co., Ltd., or BYK-378 manufactured by BYK Corporation (Product name).

比較例之一部分,作為側鏈聚醚改質聚矽氧,亦使用信越化學工業公司製造之KF-355A(商品名)、BYK公司製造之BYK-348(商品名)及BYK-307(商品名)、或Momentive Performance Materials公司製造之YF-3842(商品名)。In one part of the comparative example, KF-355A (trade name) manufactured by Shin-Etsu Chemical Co., Ltd., BYK-348 (trade name) manufactured by BYK Corporation, and BYK-307 (trade name) are also used as the side chain polyether modified polyfluorene oxygen. ), or YF-3842 (trade name) manufactured by Momentive Performance Materials.

I.5水溶性抗氧化劑(g)I.5 Water Soluble Antioxidant (g)

水溶性抗氧化劑,使用和光純藥工業公司製造之抗壞血酸或異抗壞血酸。As the water-soluble antioxidant, ascorbic acid or erythorbic acid manufactured by Wako Pure Chemical Industries, Ltd. is used.

有機溶劑可溶型之抗氧化劑,亦使用Riken Vitamin公司製造之DRY MIX FS-20(商品名)(主成分:維生素E)。As an organic solvent-soluble antioxidant, DRY MIX FS-20 (trade name) (main component: vitamin E) manufactured by Riken Vitamin Co., Ltd. was also used.

I.6導電性提升劑(e)I.6 conductivity enhancer (e)

導電性提升劑,使用和光純藥工業公司製造之N-甲基吡咯啶酮(以下記作NMP)、二甲基亞碸(以下記作DMSO)、或乙二醇(以下記作EG)、N-甲基甲醯胺(以下記作NMF)。For the conductivity-increasing agent, N-methylpyrrolidone (hereinafter referred to as NMP), dimethyl hydrazine (hereinafter referred to as DMSO), or ethylene glycol (hereinafter referred to as EG) manufactured by Wako Pure Chemical Industries, Ltd., N-methylformamide (hereinafter referred to as NMF).

I.7有機溶劑(f)I.7 organic solvent (f)

有機溶劑,使用和光純藥工業公司製造之1級乙醇。For the organic solvent, the first grade ethanol manufactured by Wako Pure Chemical Industries, Ltd. was used.

I.8水(f)I.8 water (f)

水之大半係導電性聚合物之水分散體Clevios P所含之水,新添加之水係使用經離子交換處理之純水。Most of the water is water contained in the aqueous dispersion of conductive polymer Clevios P, and the newly added water is pure water treated by ion exchange.

表1、2中記載之水係新添加之水。The newly added water in the water system described in Tables 1 and 2.

I.9濡濕性提升劑(h)I.9 wetness enhancer (h)

濡濕性提升劑,使用BYK公司製造之BYK-380N(商品名)(化合物名:丙烯酸系共聚物)。For the wetness improving agent, BYK-380N (trade name) (Compound name: acrylic copolymer) manufactured by BYK Corporation was used.

I.10消泡劑(i)I.10 defoamer (i)

消泡劑,使用Toray‧Dow Corning公司製造之ANTIFOAM 013A(商品名)(化合物名:聚二甲基矽氧烷之乳化物,以下記作013A)。As the antifoaming agent, ANTIFOAM 013A (trade name) manufactured by Toray‧Dow Corning Co., Ltd. (compound name: emulsion of polydimethyl methoxy oxane, hereinafter referred to as 013A) was used.

I.11其他添加劑I.11 other additives

其他添加劑,使用作為矽烷偶合劑之Momentive‧Performance‧Materials公司製造之SIRQUEST A-189(商品名)(化合物名:3-巰基丙基三乙氧基矽烷)、微粒子材料之日產化學公司製造之Snowtex OXS(商品名)(化合物名:膠體二氧化矽之水分散體)、有機羧酸之三菱瓦斯化學公司製造之Trimellitic Acid(商品名)。Other additives, SIRQUEST A-189 (trade name) (Compound name: 3-mercaptopropyl triethoxy decane) manufactured by Momentive ‧ Performance Productions, a decane coupling agent, and Snowtex manufactured by Nissan Chemical Co., Ltd. OXS (trade name) (compound name: aqueous dispersion of colloidal cerium oxide), Trimellitic Acid (trade name) manufactured by Mitsubishi Gas Chemical Co., Ltd. of organic carboxylic acid.

II.評價II. Evaluation

針對實施例1~28及比較例1~9中製備之塗佈液之液體外觀、使用其而獲得之導電性被膜之被膜外觀、耐刮痕性、耐溶劑性、印刷性、印刷密合性,以下述3等級進行評價。又,測定SR、Tt、Haze之值。對基材之密合性係依據JIS K 5400進行評價。適用期係評價自溶液製備時起經過24小時之塗佈液及使用該塗佈液而形成之被膜。塗佈液之適用期考慮到塗佈液之外觀、被膜之外觀、密合性、耐刮痕性、耐溶劑性、印刷性、印刷密合性,與初期值相同地進行評價。另一方面,以下述3等級評價被膜之SR、Tt、Haze之測定值自初期值之變動。再者,關於初期評價即便有1個「×」評價之實施例及比較例亦未對適用期作評價。The appearance of the liquid of the coating liquid prepared in Examples 1 to 28 and Comparative Examples 1 to 9, the appearance of the coating film of the conductive film obtained using the film, the scratch resistance, the solvent resistance, the printability, and the printing adhesion The evaluation was performed in the following three grades. Further, the values of SR, Tt, and Haze were measured. The adhesion to the substrate was evaluated in accordance with JIS K 5400. The pot life is a coating liquid which is subjected to 24 hours from the preparation of the solution and a film formed using the coating liquid. The application period of the coating liquid was evaluated in the same manner as the initial value in consideration of the appearance of the coating liquid, the appearance of the coating film, the adhesion, the scratch resistance, the solvent resistance, the printability, and the printing adhesion. On the other hand, the fluctuations of the measured values of SR, Tt, and Haze of the film from the initial values were evaluated in the following three levels. In addition, in the initial evaluation, even if there is one "X" evaluation example and comparative example, the evaluation period is not evaluated.

評價結果示於下述表3及4。The evaluation results are shown in Tables 3 and 4 below.

II.1導電性塗佈用組成物之外觀II.1 Appearance of Conductive Coating Composition

藉由目視以3等級評價製備組成物後之溶液外觀。亦相同地對適用期進行評價。The appearance of the solution after the preparation of the composition was evaluated by visual evaluation on a grade of 3. The applicability period is also evaluated in the same manner.

◎:無沈澱物產生◎: no sediment production

○:產生少量沈澱物○: a small amount of precipitate is produced

×:凝膠化×: gelation

II.2被膜外觀II.2 Appearance of the film

藉由目視以如下之3等級評價塗佈後之導電性被膜之外觀(均勻性)。亦相同地對適用期進行評價。The appearance (uniformity) of the coated conductive film was evaluated by visual observation in the following three grades. The applicability period is also evaluated in the same manner.

◎:被膜均勻地塗佈,未見塗佈不均◎: The film was uniformly coated, and no uneven coating was observed.

○:有少許塗佈不均○: There is a little uneven coating

×:由於收縮而未形成被膜×: no film was formed due to shrinkage

II.3表面電阻率/SR(Ω/□)II.3 Surface resistivity / SR (Ω / □)

表面電阻率係依據JIS K 7194,使用三菱化學公司製造之Hiresta UP(MCP-HT450型,商品名)之UA探針並於100 V之外加電壓測定,並對測定值進行評價。以如下之3等級評價適用期相對於初期值之上升倍率。The surface resistivity was measured in accordance with JIS K 7194 using a UA probe of Hiresta UP (MCP-HT450 type, trade name) manufactured by Mitsubishi Chemical Corporation, and a voltage was measured at 100 V, and the measured value was evaluated. The increase rate of the pot life relative to the initial value was evaluated in the following three grades.

◎:10倍以下◎: 10 times or less

○:超過10倍未達100倍○: more than 10 times less than 100 times

×:100倍以上×: 100 times or more

II.4總透光率(Tt:%)II.4 total light transmittance (Tt:%)

總透光率係依據JIS K 7150使用Suga Test Instruments公司製造之Haze Computer HGM-2B(商品名)進行測定,並對測定值進行評價。以如下之3等級評價適用期相對於初期值之變化量。The total light transmittance was measured in accordance with JIS K 7150 using Haze Computer HGM-2B (trade name) manufactured by Suga Test Instruments, Inc., and the measured values were evaluated. The amount of change in the pot life relative to the initial value was evaluated in the following three grades.

◎:大於-0.5,未達+0.5◎: greater than -0.5, not up to +0.5

○:-1.0~-0.5或+0.5~+1.0○: -1.0 to -0.5 or +0.5 to +1.0

×:未達-1.0或大於+1.0 ×: not up to -1.0 or greater than +1.0

II.5 Haze(%)II.5 Haze (%)

Haze係依據JIS K 7150使用Suga Test Instruments公司製造之Haze Computer HGM-2B(商品名)進行測定,並對測定值進行評價。以如下之3等級評價適用期相對於初期值之變化量。Haze was measured in accordance with JIS K 7150 using Haze Computer HGM-2B (trade name) manufactured by Suga Test Instruments, Inc., and the measured values were evaluated. The amount of change in the pot life relative to the initial value was evaluated in the following three grades.

◎:大於-0.5、未達+0.5◎: greater than -0.5, not up to +0.5

○:-1.0~-0.5或+0.5~+1.0○: -1.0 to -0.5 or +0.5 to +1.0

×:未達-1.0或大於+1.0 ×: not up to -1.0 or greater than +1.0

II.6對基材之密合性II.6 Adhesion to the substrate

導電性被膜對基材之密合性係依據JIS K 5400之柵格剝離測試進行評價,藉由一定之分數進行評價。以如下之3等級評價適用期。The adhesion of the conductive film to the substrate was evaluated in accordance with the grid peeling test of JIS K 5400, and evaluated by a certain score. The pot life is evaluated at the following 3 levels.

◎:自初期值未變動◎: No change since the initial value

○:自初期值以未達2分之範圍下降○: Decrease from the initial value by less than 2 points

×:自初期值以2分以上之範圍下降×: Decrease from the initial value by 2 or more

II.7耐刮痕性測試II.7 scratch resistance test

對形成於基材上之導電性被膜,利用爪以約200 g之負荷摩擦10cm之長度,以如下之3等級評價傷痕之形成及粉之產生。亦相同地對適用期進行評價。The conductive film formed on the substrate was rubbed with a claw by a load of about 200 g for a length of 10 cm, and the formation of the flaw and the generation of the powder were evaluated in the following three grades. The applicability period is also evaluated in the same manner.

◎:未形成傷痕◎: no scars were formed

○:可見較輕之摩擦痕跡,但無粉產生○: Lighter friction marks are visible, but no powder is produced.

×:傷痕形成,產生粉×: scar formation, powder production

II.8耐溶劑性測試II.8 Solvent resistance test

對形成於基材上之導電性被膜,進行乙醇擦拭測試、乙酸乙酯擦拭測試、甲基乙基酮(以下記作MEK)擦拭測試、己烷擦拭測試。具體而言,利用滲透有各溶劑之無塵紙(BEMCOT)以約200g之負荷摩擦10cm之長度15次,以如下之3等級評價測試後之被膜外觀。亦相同地對適用期進行評價。The conductive film formed on the substrate was subjected to an ethanol wiping test, an ethyl acetate wiping test, a methyl ethyl ketone (hereinafter referred to as MEK) wiping test, and a hexane wiping test. Specifically, the appearance of the film after the test was evaluated by the following three grades using a dust-free paper (BEMCOT) infiltrated with each solvent with a load of about 200 g for 15 times. The applicability period is also evaluated in the same manner.

◎:被膜無變化◎: no change in the film

○:可見微小之摩擦痕跡○: visible traces of friction

×:被膜剝落×: peeling off the film

II.9印刷性測試II.9 printability test

印刷性測試係使用三菱鉛筆公司製造之油性標記油墨(Pi:S、細字),以如下之3等級評價印刷於導電性被膜之表面時之收縮情況。In the printing test, the oily marking ink (Pi: S, fine type) manufactured by Mitsubishi Pencil Co., Ltd. was used, and the shrinkage at the time of printing on the surface of the conductive film was evaluated in the following three grades.

◎:所印之字完全未收縮◎: The printed words are not shrinking at all.

○:所印之字稍有收縮而不均勻○: The printed words are slightly shrunk and uneven

×:收縮較大,無法印刷×: The shrinkage is large and cannot be printed.

II.10印刷密合性測試II.10 Printing adhesion test

印刷密合性測試係將三菱鉛筆公司製造之油性標記油墨(Pi:S、細字)印刷於導電性被膜之表面,1分鐘後使用kimwipe以約500g之負荷進行摩擦,藉由目視以如下之3等級評價此時之印刷狀態。The printing adhesion test was performed by printing an oil-based marking ink (Pi:S, fine type) manufactured by Mitsubishi Pencil Co., Ltd. on the surface of a conductive film, and rubbing with a kimwipe at a load of about 500 g after 1 minute, by visual observation as follows. The rating evaluates the printing status at this time.

◎:無印刷之剝落◎: no peeling of printing

○:印刷留有摩擦之痕跡○: There is trace of friction in printing

×:印刷完全剝落×: Printing is completely peeled off

II.11耐空氣暴露測試II.11 Air resistance test

空氣暴露測試係將導電性被膜貼附於壁,以如下3等級評價1週後之SR。亦相同地對適用期進行評價。In the air exposure test, the conductive film was attached to the wall, and the SR after one week was evaluated in the following three levels. The applicability period is also evaluated in the same manner.

◎:低於1×1010Ω/□◎: less than 1 × 10 10 Ω / □

○:1×1010Ω/□以上、低於1×1011Ω/□○: 1 × 10 10 Ω / □ or more, less than 1 × 10 11 Ω / □

×:1×1011Ω/□以上×: 1 × 10 11 Ω / □ or more

II.12消泡測試II.12 defoaming test

消泡測試係將塗佈液振盪5次,以如下之4等級評價直至產生之較大泡沫全部消失為止之時間。亦相同地對適用期進行評價。In the defoaming test, the coating liquid was shaken 5 times, and evaluated in the following four grades until the time when the larger foam produced disappeared. The applicability period is also evaluated in the same manner.

◎:於20秒以內消泡◎: Defoaming within 20 seconds

○:超過20秒、於20分鐘以內消泡○: Defoaming within 20 minutes in less than 20 seconds

△:超過20分鐘、於1小時以內消泡△: Defoaming within 1 hour for more than 20 minutes

×:即便經過1小時以上亦未消泡×: No defoaming even after more than 1 hour

根據比較例1~4及實施例1~3,很明顯,若即便缺少三聚氰胺樹脂衍生物、磺酸硬化觸媒、兩末端聚醚改質聚矽氧、導電性提升劑中之一者,則被膜外觀、導電性、總透光率、Haze、對基材之密合性、耐刮痕性、耐溶劑性、印刷性、印刷密合性無法全部同時滿足。若無導電性聚合物及導電性提升劑,則不表現SR,若無三聚氰胺樹脂衍生物及磺酸硬化觸媒則被膜不硬化。兩末端聚醚改質聚矽氧係用於使耐刮痕性與印刷性、印刷密合性並存之必需成分。According to Comparative Examples 1 to 4 and Examples 1 to 3, it is apparent that even if one of the melamine resin derivative, the sulfonic acid hardening catalyst, the two-end polyether modified polyoxane, and the conductivity improving agent is absent, The film appearance, conductivity, total light transmittance, Haze, adhesion to the substrate, scratch resistance, solvent resistance, printability, and printing adhesion cannot all be satisfied at the same time. If there is no conductive polymer or conductivity enhancer, SR is not exhibited, and the film is not cured without the melamine resin derivative and the sulfonic acid hardening catalyst. The two-end polyether modified polyfluorene is an essential component for imparting scratch resistance, printability, and printing adhesion.

根據實施例1及4~6,很明顯,三聚氰胺樹脂衍生物為全醚型者塗佈液之穩定性優異,且24小時後之塗膜之物性亦不下降。According to Examples 1 and 4 to 6, it is apparent that the melamine resin derivative is excellent in the stability of the coating liquid of the all-ether type, and the physical properties of the coating film after 24 hours are not lowered.

根據實施例1及7~10,很明顯,存在若三聚氰胺樹脂衍生物之含量增多則適用期惡化之傾向,若相對於導電性聚合物固形分100重量份少於150重量份,則自初期起耐溶劑性較低。According to Examples 1 and 7 to 10, it is apparent that if the content of the melamine resin derivative is increased, the pot life tends to be deteriorated, and if it is less than 150 parts by weight based on 100 parts by weight of the conductive polymer solid content, from the beginning Low solvent resistance.

根據比較例5及實施例8,很明顯硬化觸媒較佳為磺酸,進而根據實施例11,很明顯,由於使用QS時塗佈液之適用期少許惡化,24小時後存在特性下降之部分,故而作為硬化觸媒尤佳為DBS。According to Comparative Example 5 and Example 8, it is apparent that the hardening catalyst is preferably a sulfonic acid, and further, according to Example 11, it is apparent that the application period of the coating liquid is slightly deteriorated due to the use of QS, and there is a characteristic deterioration after 24 hours. Therefore, as a hardening catalyst, it is especially good for DBS.

進而,根據實施例1及12~15,很明顯,其含量相對於三聚氰胺樹脂衍生物100重量份為40重量份以下之情況於適用期之維持方面較佳。Further, according to Examples 1 and 12 to 15, it is apparent that the content is preferably 40 parts by weight or less based on 100 parts by weight of the melamine resin derivative, which is preferable in terms of maintenance of the pot life.

根據實施例1及16~18,很明顯,為了同時滿足耐刮痕性與印刷性及印刷密合性必須使用兩末端聚醚改質聚矽氧,即便如比較例6~9般使用側鏈聚醚改質聚矽氧,亦無法同時滿足耐刮痕性與印刷性及印刷密合性。According to Examples 1 and 16 to 18, it is apparent that in order to simultaneously satisfy the scratch resistance, the printability, and the printing adhesion, it is necessary to use a two-end polyether modified polyfluorene, even if the side chains are used as in Comparative Examples 6 to 9. Polyether modified polyfluorene, also can not meet the scratch resistance and printability and printing adhesion.

進而,實施例1及比較例9使用之聚醚改質聚矽氧係均與聚二甲基矽氧烷之分子量大致相同程度、改質部位不同結構者。而且,實施例1為兩末端聚醚改質聚矽氧,可同時滿足耐刮痕性、耐溶劑性、印刷性及印刷密合性,相對於此,比較例9之側鏈聚醚改質聚矽氧則無法同時滿足。根據該結果,很明顯,藉由使用兩末端聚醚改質聚矽氧作為聚醚改質聚矽氧,特異性地實現本發明之效果。Further, in the first embodiment and the comparative example 9, the polyether modified polyfluorene oxygen system is substantially the same as the molecular weight of the polydimethyl siloxane, and the modified portion has a different structure. Further, Example 1 is a polyether modified polyfluorene at both ends, which satisfies both scratch resistance, solvent resistance, printability, and printing adhesion. On the other hand, the side chain polyether of Comparative Example 9 is modified. Polyoxyl cannot be satisfied at the same time. From the results, it is apparent that the effects of the present invention are specifically achieved by using a two-terminal polyether modified polyfluorene as a polyether modified polyfluorene oxygen.

又,根據實施例1及19~21,很明顯,兩末端聚醚改質聚矽氧之含量相對於三聚氰胺樹脂衍生物100重量份為60重量份以下之情況於耐溶劑方面性較佳。Further, according to Examples 1 and 19 to 21, it is apparent that the content of the polyether modified polyfluorene at both ends is preferably 60 parts by weight or less based on 100 parts by weight of the melamine resin derivative.

根據實施例1及22~24,很明顯,藉由使用具有醯胺基、羥基、磺基之化合物作為導電性提升劑,進一步提高導電性被膜之導電性。According to Examples 1 and 22 to 24, it is apparent that the conductivity of the conductive film is further improved by using a compound having a mercapto group, a hydroxyl group or a sulfo group as a conductivity improving agent.

若將實施例1、25與實施例2進行比較,則很明顯,藉由添加水溶性抗氧化劑之抗壞血酸或異抗壞血酸,可抑制暴露於空氣之SR上升。又,如實施例26般之油溶性抗氧化劑未見該種效果。Comparing Examples 1 and 25 with Example 2, it is apparent that the addition of ascorbic acid or isoascorbic acid of a water-soluble antioxidant can suppress the SR rise of exposure to air. Further, such an effect was not observed in the oil-soluble antioxidant as in Example 26.

又,實施例3中確認少許之收縮,若與其他實施例進行比較,則很明顯,含有濡濕性提升劑者之成膜性優異,進而,根據實施例27,很明顯,藉由添加消泡劑,可有效地對產生之泡沫進行消泡。Further, in Example 3, a slight shrinkage was confirmed, and when compared with other examples, it was apparent that the film forming property of the moisture-containing enhancer was excellent, and further, according to Example 27, it was apparent that defoaming was added by adding The agent can effectively defoam the foam produced.

又,根據實施例28及圖1,很明顯,將以計算膜厚計約30nm之被膜以TEM進行分析,結果實際測量約為12nm。已知,於本條件下成膜之組成物之膜厚遠遠薄於計算值。Further, according to Example 28 and Fig. 1, it is apparent that the film having a film thickness of about 30 nm was analyzed by TEM, and as a result, the actual measurement was about 12 nm. It is known that the film thickness of the film formed under the present conditions is much thinner than the calculated value.

本發明之導電性組成物由於可於低溫短時間內形成同時滿足耐刮痕性、耐溶劑性、印刷性及印刷密合性之導電性被覆,故而可較佳地用於形成例如構成保護膜等各種光學膜等之導電性被膜(抗靜電層)等。The conductive composition of the present invention can be preferably used for forming, for example, a protective film because it can form a conductive coating which satisfies scratch resistance, solvent resistance, printability, and printing adhesion at a low temperature for a short period of time. A conductive film (antistatic layer) or the like of various optical films.

1...導電性被膜1. . . Conductive film

2...PET膜2. . . PET film

圖1係以10萬倍之倍率拍攝實施例28中製作之導電性被膜之TEM觀察影像。Fig. 1 is a TEM observation image of the conductive film produced in Example 28 taken at a magnification of 100,000 times.

Claims (14)

一種熱硬化型導電性塗佈用組成物,含有:(a)導電性聚合物、(b)三聚氰胺樹脂衍生物、(c)磺酸硬化觸媒、(d)兩末端聚醚改質聚矽氧、(e)導電性提升劑、及(f)溶劑或分散介質;且兩末端聚醚改質聚矽氧(d)之含量相對於三聚氰胺樹脂衍生物100重量份為10~60重量份。 A thermosetting conductive coating composition comprising: (a) a conductive polymer, (b) a melamine resin derivative, (c) a sulfonic acid hardening catalyst, and (d) a two-end polyether modified polyfluorene Oxygen, (e) a conductivity enhancer, and (f) a solvent or a dispersion medium; and the content of the polyether modified polyoxane (d) at both ends is 10 to 60 parts by weight based on 100 parts by weight of the melamine resin derivative. 如申請專利範圍第1項之熱硬化型導電性塗佈用組成物,其中,導電性聚合物(a)為具有下述式(I)之重複結構之聚(3,4-二烷氧基噻吩)或聚(3,4-伸烷二氧基噻吩)與摻雜物之複合體, (式中,R1及R2相互獨立表示氫原子或C1-4之烷基,或一併表示可經取代之C1-4之伸烷基)。 The thermosetting conductive coating composition according to the first aspect of the invention, wherein the conductive polymer (a) is a poly(3,4-dialkoxy group) having a repeating structure of the following formula (I). a complex of thiophene) or poly(3,4-alkylenedioxythiophene) with a dopant, (Wherein, R 1 is and R 2 each independently represents a hydrogen atom or a C 1-4 alkyl group, or together represent may be substituted with the C 1-4 alkylene group). 如申請專利範圍第1項或第2項之熱硬化型導電性塗佈用組成物,其中,三聚氰胺樹脂衍生物(b)之含量相對於導電性聚合物100重量份為150~750重量份。 The thermosetting conductive coating composition according to the first or second aspect of the invention, wherein the content of the melamine resin derivative (b) is from 150 to 750 parts by weight based on 100 parts by weight of the conductive polymer. 如申請專利範圍第1項或第2項之熱硬化型導電性塗 佈用組成物,其中,磺酸硬化觸媒(c)為芳香族磺酸,其含量相對於三聚氰胺樹脂衍生物100重量份為8~40重量份。 For example, the thermosetting conductive coating of claim 1 or 2 A composition for a cloth, wherein the sulfonic acid hardening catalyst (c) is an aromatic sulfonic acid, and the content thereof is 8 to 40 parts by weight based on 100 parts by weight of the melamine resin derivative. 如申請專利範圍第1項或第2項之熱硬化型導電性塗佈用組成物,其中,導電性提升劑(e)為具有醯胺基、磺基及羥基中之至少1種取代基的化合物。 The thermosetting conductive coating composition according to the first or second aspect of the invention, wherein the conductivity improving agent (e) has at least one substituent selected from the group consisting of a mercapto group, a sulfo group and a hydroxyl group. Compound. 如申請專利範圍第1項或第2項之熱硬化型導電性塗佈用組成物,進而含有(g)水溶性抗氧化劑。 The composition for thermosetting conductive coating of the first or second aspect of the patent application further contains (g) a water-soluble antioxidant. 如申請專利範圍第6項之熱硬化型導電性塗佈用組成物,其中,水溶性抗氧化劑(g)為抗壞血酸或異抗壞血酸。 The thermosetting conductive coating composition according to claim 6, wherein the water-soluble antioxidant (g) is ascorbic acid or isoascorbic acid. 如申請專利範圍第1項或第2項之熱硬化型導電性塗佈用組成物,進而含有(h)濡濕性提升劑。 The composition for thermosetting conductive coating of the first or second aspect of the patent application further contains (h) a wetness improving agent. 如申請專利範圍第1項或第2項之熱硬化型導電性塗佈用組成物,進而含有(i)消泡劑。 The thermosetting conductive coating composition according to the first or second aspect of the patent application, further comprising (i) an antifoaming agent. 如申請專利範圍第9項之熱硬化型導電性塗佈用組成物,其中,消泡劑(i)為聚矽氧乳化液。 The thermosetting conductive coating composition according to claim 9, wherein the antifoaming agent (i) is a polyoxymethylene emulsion. 一種光學膜,係由基材與積層於該基材上之導電性被膜構成,其特徵在於:該導電性被膜係使用申請專利範圍第1項至第10項中任一項之熱硬化型導電性塗佈用組成物而形成。 An optical film comprising a substrate and a conductive film laminated on the substrate, wherein the conductive film is made of a thermosetting conductive material according to any one of claims 1 to 10. It is formed by the composition for coating. 如申請專利範圍第11項之光學膜,其中,該導電性被膜係藉由將該熱硬化型導電性塗佈用組成物塗佈於該基材,並於130℃以下之溫度使其乾燥、熱硬化而形成。 The optical film according to claim 11, wherein the conductive film is applied to the substrate by applying the composition for thermosetting conductive coating, and dried at a temperature of 130 ° C or lower. Formed by heat hardening. 如申請專利範圍第11項或第12項之光學膜,其中,該導電性被膜之計算膜厚未達45nm。 The optical film of claim 11 or 12, wherein the conductive film has a calculated film thickness of less than 45 nm. 一種保護膜,係由申請專利範圍第11項至第13項中任一項之光學膜構成。 A protective film comprising the optical film of any one of the items 11 to 13.
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