TW201219514A - Composition for heat-curable conductive coatings, optical film and protective film - Google Patents

Composition for heat-curable conductive coatings, optical film and protective film Download PDF

Info

Publication number
TW201219514A
TW201219514A TW100137819A TW100137819A TW201219514A TW 201219514 A TW201219514 A TW 201219514A TW 100137819 A TW100137819 A TW 100137819A TW 100137819 A TW100137819 A TW 100137819A TW 201219514 A TW201219514 A TW 201219514A
Authority
TW
Taiwan
Prior art keywords
film
composition
conductive
acid
conductive coating
Prior art date
Application number
TW100137819A
Other languages
Chinese (zh)
Other versions
TWI518154B (en
Inventor
Yasuo Chikusa
Norihiro Nakamura
Original Assignee
Nagase Chemtex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagase Chemtex Corp filed Critical Nagase Chemtex Corp
Publication of TW201219514A publication Critical patent/TW201219514A/en
Application granted granted Critical
Publication of TWI518154B publication Critical patent/TWI518154B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24Electrically-conducting paints

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Paints Or Removers (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Conductive Materials (AREA)

Abstract

The purpose of the invention is to provide a composition for heat-curable conductive coatings that is able to form, at low temperature and in short times, conductive films that are simultaneously scratch resistant, solvent resistant, and printable and that adhere tightly to printed characters. This composition for heat-curable conductive coatings is characterized in comprising (a) a conductive polymer, (b) a melamine resin derivative, (c) a sulfonic acid curing catalyst, (d) a silicone with both ends modified with a polyether, (e) a conductivity-improving agent, and (f) a solvent or dispersion medium.

Description

201219514 六、發明說明: 【發明所屬之技術領域】 本發明係關於-種熱硬化型導電性塗佈用組成物、使 用該熱硬化型導電性塗佈用組成物而獲得之光學膜及保護 膜0 【先前技術】 於構成液晶電視或電漿電視、電致發光顯示器、太陽 電池等之平板的光學膜,有時為了消除靜電損害等故障而 設置具有抗靜電功能之塗層(抗靜電層)。 例如於平板顯示器之製造步驟或運送步驟中,為了防 土面板表面受損、附著污垢或灰塵,而於其表面貼合作為 -種先學膜之保護膜。該保護膜係於ρΕτ等樹脂基材之單 面具有黏著層’並將黏著層側貼合於顯示器而使用者,為 了防止由剝離膜時引起之靜雷 夕盥*… …之靜電而知壞電氣製品,樹脂基材 ―、黏:層側相反側之面形成有抗靜電層。 夕”對於此抗靜電層,除要求抗靜電功能以外,亦 之附受損之耐到痕性、用於防止剪裁時之黏著劑 性,作近牟:性、拭去所附著之黏著劑時所需之耐溶劑 λΐ b _#特&外,為了在保護膜上印刷批號 性。進而"4,亦要求油性墨水之印刷密合性之類的特 :成本之要求亦提高,要求以1層塗層 凡丨J岈滿足上述特性之被膜。 形成此種抗靜電層之材料 電性塗佈材料。 制含導電性聚合物之導 3 5 201219514[Technical Field] The present invention relates to a thermosetting conductive coating composition, an optical film and a protective film obtained by using the thermosetting conductive coating composition. 0 [Prior Art] An optical film constituting a flat panel of a liquid crystal television, a plasma television, an electroluminescence display, a solar cell, or the like may be provided with an antistatic function coating (antistatic layer) in order to eliminate malfunction such as electrostatic damage. . For example, in the manufacturing step or the transporting step of the flat panel display, in order to prevent damage to the surface of the earthproof panel, adhesion of dirt or dust, the surface of the flat panel is bonded to a protective film of the film. The protective film is provided with an adhesive layer on one side of a resin substrate such as ρΕτ, and the adhesive layer is attached to the display, and the user is prevented from being damaged by static electricity caused by peeling off the film. Electrical product, resin substrate -, adhesive: an antistatic layer is formed on the opposite side of the layer side. For the antistatic layer, in addition to the antistatic function, it is also resistant to scratches, and it is used to prevent adhesiveness during tailoring. When it is used, it is used to wipe off the adhered adhesive. The required solvent resistance λΐ b _# special & in order to print the batch number on the protective film. Further, "4, also requires the printing adhesiveness of the oily ink, etc.: the cost requirement is also improved, A coating of a coating that satisfies the above characteristics. A material coating material that forms such an antistatic layer. A conductive polymer-containing conductor 3 5 201219514

^ j % |不5¾寻付性,需 1層塗層無法滿足上述所 專利文獻1揭示有一種用於形成抗靜電層之導電性聚 合物組成物。該導電性聚合物組成物係含聚噻吩系導電性 聚合物與聚酯黏合劑之組成物,可藉由10(rc i分鐘左右之 乾燥而於樹脂基材上形成密合性倦s々4士 μ雨a 由於其為溶劑乾燥型之組成物, 耐刮痕性及耐溶劑性方面不充分 要於抗靜電層上積層外塗層,以 有性能。 專利文獻2揭示有一種含導電性聚合物與水溶性聚醚 改質拿矽氧之組成物,並且揭示藉由添加側鏈經聚醚改質 之聚矽氧,可形成潤滑性優異之被膜,但並未提及耐到痕 性及印刷性,含有側鏈經聚醚改質之聚矽氧之導電性組成^ j % | not 53⁄4 sufficiency, one layer of coating is not required to satisfy the above. Patent Document 1 discloses a conductive polymer composition for forming an antistatic layer. The conductive polymer composition contains a composition of a polythiophene-based conductive polymer and a polyester binder, and can form an adhesive fatigue s々4 on a resin substrate by drying at about 10 minutes (r i minutes).士雨雨 a Because it is a solvent-drying type composition, scratch resistance and solvent resistance are insufficient, and an overcoat layer is laminated on the antistatic layer to have properties. Patent Document 2 discloses a conductive polymerization. And the water-soluble polyether is modified to take the composition of the oxygen, and it is revealed that the film having excellent lubricity can be formed by adding the polyether modified by the polyether in the side chain, but the scratch resistance and the resistance are not mentioned. Printability, conductive composition of polyfluorene modified with polyether modified by side chains

專利文獻3揭示可利用由具有活性氫之樹脂與含有聚 石夕氧燒之聚胺酯樹脂(p〇lyUrethane resin)、聚異氰酸醋、 抗靜電劑所構成之組成物,可以丨層塗層形成具有表面電 阻率、耐溶劑性、耐刮痕性 '印刷性之抗靜電層,但該組 成物於印刷密合性方面不充分,又,形成抗靜電層時需要 於4(TC老化(ageing) 48小時,因此生產性較低,不適合 大量生產。 專利文獻4揭示有一種含有於末端具有羥基等反應性 B能基之有機矽氧烷的組成物,並且揭示使用該組成物形 成之被膜同時實現防污性(較高之對水之接觸角)與特定 墨水之印刷密合性。然而,該組成物之硬化需要於14〇<t 2 201219514 分鐘之條件下,因而生產性較低,不適合大量生產。 專利文獻1揭示有一種含導電性聚合物、三聚氰胺樹 脂何生物及酸觸媒之組成物,並且揭示藉由使用此組成 物’可以1〇〇。(:之1分鐘左右之低溫短時間形成具有抗靜電 功能、耐刮痕性、耐溶劑性、防污性之被膜。然而,使用 δ玄組成物形成之被媒無法同時實現印刷性及印刷密合性、 與耐刮痕性。 [專利文獻1]日本特開2〇〇2_ 〇6〇736號公報 [專利文獻2]日本特開2〇〇7_ 3〇8549號公報 [專利文獻3]日本特開2〇〇6 _ 178424號公報 [專利文獻4]日本特開2009— 107329號公報 [專利文獻5]日本特開2009 — 138042號公報 【發明内容】 如上所示,對於先前提出之導電性組成物,於以丨層 塗層形成導電性被膜之情形時,無法於低溫短時間之硬化 條件下形成时刮痕性 '耐溶劑性、印刷性及印刷密合性優 異之導電性被膜。 尤其是耐刮痕性與印刷性及印刷密合性通常存在取捨 之關係,難以同時滿足兩者。 本發明人專為解決上诚4® as -r- ,-jr 上通課蟪而潛心研究,結果發現: 含有導電性聚合物(a )、r: ¥羞松姓+ , —\虱胺樹脂衍生物(b)、磺酸硬 化觸媒(C)、兩末端聚喊改質聚 負^夕乳(d)、導電性提升劑(e)、 及溶劑或分散介質(f)之 之熱硬化,可形成耐刮痕 導電性組成物藉由於低溫短時間 性、耐溶劑性、印刷性及印刷密 5 1 201219514 合性優異之導電性被膜,從而完成本發明。 即,本發明之熱硬化型導電性塗佈用組成物,含有: (a )導電性聚合物、 (b )二聚氰胺樹脂衍生物、 (c )磺酸硬化觸媒、 (d)兩末端聚醚改質聚矽氧、 (e )導電性提升劑、及 (f)溶劑或分散介質。 又’於本發明之熱硬化形暮蕾从、各〜 ^導電I·生塗佈用組成物中,較理想 為上述導電性聚合物(a)係具有下述式⑴之重複結構之 聚二院氧基嘆吩)或聚(3,4—伸烧二氧基嚷吩)與摻雜 物(dopant )之複合體,Patent Document 3 discloses that a composition composed of a resin having active hydrogen and a polyfluorene resin containing polyphosphoric acid, polyisocyanuric acid, and an antistatic agent can be used to form a coating layer. An antistatic layer having surface resistivity, solvent resistance, and scratch resistance 'printability. However, this composition is insufficient in terms of printing adhesion, and it is required to form an antistatic layer at 4 (TC ageing). 48 hours, the productivity is low, and it is not suitable for mass production. Patent Document 4 discloses a composition containing an organic siloxane having a reactive B group such as a hydroxyl group at the terminal, and reveals that a film formed using the composition is simultaneously realized. The antifouling property (higher contact angle to water) is compatible with the printing of a specific ink. However, the hardening of the composition needs to be 14 〇 <t 2 201219514 minutes, so the productivity is low, and it is not suitable. Mass production. Patent Document 1 discloses a composition containing a conductive polymer, a melamine resin, and an acid catalyst, and discloses that it can be used by using this composition. The film having an antistatic function, scratch resistance, solvent resistance, and antifouling property is formed at a low temperature of about 1 minute. However, the medium formed by using the δ metamaterial cannot simultaneously achieve printability and print adhesion. [Patent Document 1] Japanese Laid-Open Patent Publication No. JP-A No. Hei. [Patent Document 4] JP-A-2009-107804 [Patent Document 5] JP-A-2009- 138042 SUMMARY OF THE INVENTION As described above, the conductive composition previously proposed When a conductive film is formed by a ruthenium layer coating, it is not possible to form a conductive film having excellent scratch resistance, solvent resistance, printability, and print adhesion when formed under a low-temperature curing condition for a short period of time. Scratch, printing, and printing adhesion usually have a trade-off relationship, and it is difficult to satisfy both of them at the same time. The present inventors have devoted themselves to solving the problems of Shangcheng 4® as-r- and -jr, and found that they have been studied. : Contains conductive polymer (a), r: ¥羞松姓+ , —\虱amine resin derivative (b), sulfonic acid hardening catalyst (C), both ends of the poly-shocking modified poly-negative emulsion (d), conductivity enhancer (e), and Thermally hardening the solvent or the dispersion medium (f) to form a scratch-resistant conductive composition by a conductive film which is excellent in low-temperature properties, solvent resistance, printability, and printing density, and is excellent in printability. In the present invention, the thermosetting conductive coating composition of the present invention comprises: (a) a conductive polymer, (b) a melamine resin derivative, and (c) a sulfonic acid hardening catalyst, ( d) a two-end polyether modified polyfluorene oxide, (e) a conductivity enhancer, and (f) a solvent or dispersion medium. Further, in the heat-curable bud-forming composition of the present invention, it is preferable that the conductive polymer (a) has a repeating structure of the following formula (1). a compound of a polyoxynene or a poly (3,4-external dioxy porphin) and a dopant (dopant),

(式中,R1及R2相互獨立表示氫原子或CM之烷基, 或一併表示可經取代之C〗_4之伸烷基)。 又,於上述熱硬化型導電性塗佈用組成物中,較理想 為上述二聚氰胺樹脂衍生物(b )之含量相對於導電性聚合 物100重量份為150〜750重量份。 又,於上述熱硬化型導電性塗佈用組成物中,較理想 為上述磺酸硬化觸媒(c )為芳香族磺酸,其含量相對於三 聚氰胺樹脂衍生物1〇〇重量份為8〜40重量份。 6 201219514 又’於上述熱硬化型導電性塗佈用組成物中,較理想 為上述兩末端聚醚改質聚矽氧(d)之含量相對於三聚氰胺 樹脂衍生物100重量份為10〜60重量份。 又,於上述熱硬化型導電性塗佈用組成物中,較理想 為上述導電性提升劑(e;)係具有醯胺基、磺基及羥基中之 至少1種取代基的化合物。 較理想為上述熱硬化型導電性塗佈用組成物進而含有 (g )水溶性抗氧化劑,上述水溶性抗氧化劑(g )較理想 為抗壞血酸或異抗壞血酸。 較理想為上述熱硬化型導電性塗佈用組成物進而含有 (h )霜濕性提升劑。 較理想為上述熱硬化型導電性塗佈用組成物進而含有 (1 )消泡劑,上述消泡劑(i )較理想為聚矽氧乳化液。 本發明之光學膜係由基材與積層於上述基材上之導電 性被膜構成,其特徵在於: 上述導電性被膜係使用本發明之熱硬化型導電性塗佈 用組成物而形成。 於上述光學膜中,較理想為上述導電性被膜係藉由將 上述熱硬化型導電性塗佈用組成物塗佈於上述基材,並於 1 3 0 C以下之溫度使其乾燥、熱硬化而形成。又,較理想為 上述導電性被膜之計算膜厚未達45nm。 本發明之保護臈係由本發明之光學膜構成。 根據本發明之熱硬化型導電性塗佈用組成物,可藉由 低溫短時間之加熱處理(乾燥、熱硬化)而形成同時滿足(wherein R1 and R2 independently of each other represent a hydrogen atom or an alkyl group of CM, or a substituted alkyl group of C _4 which may be substituted). Further, in the thermosetting conductive coating composition, the content of the melamine resin derivative (b) is preferably 150 to 750 parts by weight based on 100 parts by weight of the conductive polymer. Further, in the thermosetting conductive coating composition, it is preferred that the sulfonic acid curing catalyst (c) is an aromatic sulfonic acid, and the content thereof is 8 to 1 part by weight based on 1 part by weight of the melamine resin derivative. 40 parts by weight. 6 201219514 Further, in the thermosetting conductive coating composition, it is preferred that the content of the two-end polyether modified polyfluorene (d) is 10 to 60 parts by weight based on 100 parts by weight of the melamine resin derivative. Share. Further, in the above-mentioned thermosetting conductive coating composition, the conductive reinforcing agent (e;) is preferably a compound having at least one substituent selected from the group consisting of a mercapto group, a sulfo group and a hydroxyl group. It is preferable that the thermosetting conductive coating composition further contains (g) a water-soluble antioxidant, and the water-soluble antioxidant (g) is preferably ascorbic acid or erythorbic acid. It is preferable that the thermosetting conductive coating composition further contains (h) a frost wetness improving agent. It is preferable that the thermosetting conductive coating composition further contains (1) an antifoaming agent, and the antifoaming agent (i) is preferably a polyoxymethylene emulsion. The optical film of the present invention is composed of a substrate and a conductive film laminated on the substrate, and the conductive film is formed using the thermosetting conductive coating composition of the present invention. In the above-mentioned optical film, it is preferable that the conductive film is applied to the substrate by the thermosetting conductive coating composition, and dried and thermally cured at a temperature of 130 ° C or lower. And formed. Further, it is preferable that the calculated film thickness of the conductive film is less than 45 nm. The protective oxime of the present invention is composed of the optical film of the present invention. According to the thermosetting conductive coating composition of the present invention, it can be formed by heat treatment (drying, heat curing) at a low temperature for a short period of time.

S 7 201219514 对到痕性、耐溶劑性'印刷性及印刷密合性之導電性被膜。 又’藉由使用上述熱硬化型導電性塗佈用組成物,可 形成同時滿足優異之耐到痕性、與優異之印刷性及印刷密 合性之導電性被膜。 又’本發明之光學膜具備導電性被膜,該導電性被膜 係將本發明之熱硬化型導電性塗佈用組成物塗佈於基材上 並硬化而成者,因此具有優異之導電性,並且耐刮痕性、 耐溶劑性、印刷性及印刷密合性優異。 又,本發明之光學膜極適合用作保護膜,由上述光學 膜構成之保護膜亦為本發明之一。 【實施方式】 首先,對本發明之熱硬化型導電性塗佈用組成物進行 說明。 本發明之熱硬化型導電性塗佈用組成物(以下亦簡稱 為導電性組成物」)含有(a )導電性聚合物、(b )三聚氰 胺樹脂衍生物、(c)磺酸硬化觸媒、(d)兩末端聚醚改質聚 矽氧、(e )導電性提升劑、及(f)溶劑或分散介質。 以下,依序對各調配物進行說明。 1.導電性聚合物(a ) 上述導電性聚合物(a )係用於對形成之導電性被膜(塗 層)賦予導電性之調配物。 上述導電性聚合物,可列舉:聚雀吩、聚料、聚笨 胺、聚乙炔、聚笨乙快、聚萘'該等之衍生物、及該等與 摻雜物之複合體等。 8 201219514 該等之中,車交#為由聚嚷吩與#雜物<複合體構成之 聚噻吩系導電性聚合物’作為聚噻吩系導電性聚合物,更 佳為聚(3,4-二烧氧基嘆吩)或聚(3,4—伸院二氧基嚷吩)與 摻雜物之複合體。 上述聚(3,4 -二烷氧基噻吩)或聚(3,4 —伸烷二氧基噻 吩)’較佳為由以下之戎Λ 4 + W Λ卜心式Q)所表不之重複結構單位構成之 陽離子形態之聚嗟吩,S 7 201219514 Conductive film for printing and printing adhesion to trace and solvent resistance. In addition, by using the above-mentioned thermosetting conductive coating composition, it is possible to form a conductive film which satisfies both excellent scratch resistance and excellent printability and printing adhesion. Further, the optical film of the present invention is provided with a conductive film which is obtained by applying the thermosetting conductive coating composition of the present invention to a substrate and curing the conductive film, thereby having excellent conductivity. Moreover, it is excellent in scratch resistance, solvent resistance, printability, and printing adhesiveness. Further, the optical film of the present invention is extremely suitable as a protective film, and the protective film composed of the above optical film is also one of the inventions. [Embodiment] First, the thermosetting conductive coating composition of the present invention will be described. The thermosetting conductive coating composition (hereinafter also referred to simply as a conductive composition) of the present invention contains (a) a conductive polymer, (b) a melamine resin derivative, and (c) a sulfonic acid hardening catalyst. (d) a polyether modified polyfluorene at both ends, (e) a conductivity enhancer, and (f) a solvent or dispersion medium. Hereinafter, each formulation will be described in order. 1. Conductive polymer (a) The conductive polymer (a) is a formulation for imparting conductivity to a formed conductive film (coating layer). The conductive polymer may, for example, be a polystyrene, a polymer, a polyamine, a polyacetylene, a polystyrene, a polynaphthalene or the like, and a composite of the above and the like. 8 201219514 Among these, the car exchange # is a polythiophene-based conductive polymer composed of a polyphenol and a #hybrid < complex, as a polythiophene-based conductive polymer, more preferably poly (3, 4) a complex of a di-oxo-oxysole or a poly(3,4-extension dioxy porphin) and a dopant. The above poly(3,4-disalkoxythiophene) or poly(3,4-desanedioxythiophene)' is preferably a repeat represented by the following 戎Λ 4 + W Λ 心 式 Q) a cationic form of polythiophene composed of structural units,

(I 〇 此處,R1及R2相互猶古矣+与js 7丄 镯立表不虱原子或C丨-4之烷基, 或一併表示可經取代之C1_4之伸烷基。 上述4之烷基,例如可列舉:甲基、乙基、丙基、 異丙基、正丁基、異丁基、第二丁基、第三丁基等。 又,R1及R2 -併形成之可經取代之Ci 4之伸燒基, 例如可列舉:亞甲基…一伸乙基、…伸丙基、m—伸 丁基、1 —甲基一1,2 —伸乙其、1 r «· 田甘 1甲乙基1-乙基~ 1,2-伸乙基、i -甲基叫,3—伸丙基、2—甲基—13_伸丙基等。較佳為, =基、…伸乙基、…伸丙基’尤佳為…伸乙基。 -有上迷伸烧基之㈣吩’尤佳為聚(3,4—乙稀二氧嚷吩)。 =聚(3,4-乙埽二氧。塞吩)與摻雜物構成之複合體除導 或透明性極為優異之外,化學穩定性亦極為優異,使 201219514 用該複合物作為導電性聚合物而形成之導電性被膜具有不 依賴於濕度之極為穩定之導電性與極高之透明性。八 進而,含有該複合體作為導電性聚合物之導電性龟成 物由於可於低温短時間形成被膜,故而亦具有極為適合謀 求大量生產之保護膜等光學膜之製作的生產性。 構成上述聚售吩系導電性聚合物之捧雜物係藉由盘上 逃聚嘆吩形成離子對而形成複合體,並可使聚嗟吩穩定地 分散於水中之陰離子形態之聚合物。 此種摻雜物,可列舉:羧酸聚合物 切賴c例如’聚丙烯 聚順丁稀二酸、聚甲基丙稀酸等)、續酸聚合物類(例 如m料酸、聚乙烯賴、聚異戊二料酸等)等。 該等竣酸聚合物類及磺酸聚合物類, Q 頰又,亦可為乙烯羧酸 員及乙輪類與其他可聚合之單體類,例如丙稀酸酿 :員、苯乙焊、乙烯萘等芳香族乙埽化合物之共聚物。其中, 尤佳為聚苯乙烯磺酸。 上述聚苯乙烯磺酸較佳為重 、且為5_〇以下。更佳為4〇〇〇〇千句刀子^大於 、 又住马400〇〇〜200000。若使用 為此範圍外之聚笨乙稀續酸,則存在聚嗟吩系導電 合物:於水之分散穩定性下降之情形。再者,上述聚 σ之重里平均分子量係利用凝膠滲3 ϋγ ^ . 夕蚀 喂〜边層析法(GPC )測定 柱。。測定時使用Waters公司製造之此灿咖^ 15〇〇管 上述導電性聚合物之含量較佳. ^ 权佳為相對於全部導電性組 為固形分為〇.01〜h2重量%。更佳為0.03〜0.5重量 10 201219514(I 〇 , R R R R R R R R R R R 与 与 与 与 与 与 与 R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R R Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a n-butyl group, an isobutyl group, a second butyl group, a third butyl group, etc. Further, R1 and R2 are formed by The substituted alkyl group of Ci 4 may, for example, be a methylene group, an ethyl group, a propyl group, a m-butylene group, a methyl group, a methyl group, a methyl group, a 1 Gan 1-methylethyl 1-ethyl ~ 1,2-extended ethyl, i-methyl, 3-propyl, 2-methyl-13-propyl, etc. Preferably, = base, ... Ethyl, ... extended propyl 'is especially good for ... extended ethyl. - There is a sufficiency of the base (four) pheno- especially good for poly (3,4-ethylene dioxy porphin). = poly (3,4 - The composite composed of acetyl dioxane and phenanthrene is excellent in addition to conductivity and transparency, and is excellent in chemical stability, and makes conductivity of 201219514 using the composite as a conductive polymer. The film has extremely stable conductivity independent of humidity and is extremely high Transparency. In addition, since the conductive tortoise containing the composite as a conductive polymer can form a film at a low temperature for a short period of time, it is also highly productive for producing an optical film such as a protective film which is mass-produced. The dopant constituting the above-mentioned polyphenylene-based conductive polymer is a polymer which forms a complex by escaping an epitaxial ion on a disk to form an ion, and which can stably disperse the polyphenanthrene in water. Examples of the dopant include a carboxylic acid polymer, such as 'polypropylene polybutadiac diacid, polymethyl methic acid, etc., and a continuous acid polymer (for example, m acid, polyethylene, Polyisoprene, etc.). The phthalic acid polymers and sulfonic acid polymers, Q cheeks, may also be ethylene carboxylic acid members and ethylene wheels and other polymerizable monomers, such as acrylic acid styrene, styrene, ethylene A copolymer of an aromatic acetyl compound such as naphthalene. Among them, polystyrenesulfonic acid is especially preferred. The above polystyrene sulfonic acid is preferably heavy and is 5 Å or less. More preferably, 4 〇〇〇〇 thousand knives ^ greater than, and live in the horse 400 〇〇 ~ 200000. If polystyrene is used outside this range, there is a polyporphyrin-based conductive compound: the dispersion stability in water is lowered. Further, the average molecular weight of the above poly σ is measured by gel permeation 3 ϋ γ ^ 蚀 喂 〜 ~ edge chromatography (GPC). . The content of the above conductive polymer is preferably used in the measurement. The weight of the conductive polymer is preferably 〇.01 to h2% by weight relative to the total conductivity group. More preferably 0.03~0.5 weight 10 201219514

2.三聚氰胺樹脂衍生物(b)2. Melamine resin derivative (b)

上述二聚氰胺樹脂衍生物係例如以下之式(I〗)所表示 〇3 r.4The above melamine resin derivative is represented by, for example, the following formula (I): 〇3 r.4

(式中,R3〜R8表示H或CH2〇r9,r9表示H或 之烧基)。取代基R3〜R8均為氫原子之三聚氰胺樹脂衍生物 為亞胺基型二聚氰胺樹脂衍生物;取代基R3〜rS均為 CH2OH之三聚氰胺樹脂衍生物為經甲基型三聚氰胺樹脂衍 生物,取代基R〜R8均為CH2〇R9,且R9為經Cl — 4之烷基 取代的、°構之一聚氰胺樹脂衍生物為全趟型三聚氰胺樹脂 衍生物。 又’上述3個取代基中2個混在於〗分子中之結構之 201219514 三聚氰胺樹脂衍生物分類為亞胺基羥甲基型、羥甲基醚型 及亞胺基醚型,全部混在之三聚氰胺樹脂衍生物為亞胺基 羥甲基醚型。 於上述R3〜R8表示CH2〇R9、且R9為Ci_4之烷基之情 形時’Ci-4之烷基存在曱基、乙基、丙基、丁基等,若考 慮低溫硬化性則較佳為甲基。上述三聚氰胺樹脂衍生物亦 可為以式(II)為基本骨架並自我縮合之募聚物。 該等三聚氰胺樹脂衍生物可單獨地使用,亦可併用2 種以上。 上述結構之三聚氰胺樹脂衍生物中,就導電性組成物 之穩定性及低溫之硬化性之觀點而言,更佳為全醚型三聚 亂胺’尤佳為R9為甲基之全喊型三聚氰胺。又,於三聚氮 胺樹脂衍生物為寡聚物之情料,若考慮導電性組成物之 適用期(pot Hfe)’則較佳為其平均聚合度較低,尤佳為超 過1 ·〇未達1.8。 _再者’於本說明書中’所謂導電性組成物之適用期係 表丁 4電I·生組成物(塗佈液)之外觀(沈殿之有無)、形 成之導電I*生被膜之外觀、透明性、導電性、對基材之密合 f到痕|±而才/合劑性、印刷性 '印刷密合性等諸多性 能於製備導電性組成物(塗佈液)後可充分維持之時間。 為了使於低溫硬化之導電性被膜具有被膜外觀、導電 Μ透月f子基材之密合性、耐溶劑性之三聚氰胺樹脂 物(b )的3里較佳為相對於導電性聚合物(a )之固形 重量份為150〜75〇重量份。更佳為25〇〜45〇重量 12 201219514 份0 若含量超過750重量份,則存在被膜之導電性下降, 或被膜白化而透明性下降之情形。相反地,於少於Μ。重 量份之情形時,不易對被膜賦予充分之財溶劑性。 3 .磺酸硬化觸媒(^ ) 上述績酸硬化觸媒⑺具有於乾燥、硬化時於基材上 促進三聚氰胺樹脂衍生物(b)之交聯的作用。續酸由於在 導電性組成物中顯示酸性,故而促進導電性組成物中之三 聚亂胺樹脂衍生物之交聯,塗佈液之適用期縮短。 又,石黃酸硬化觸媒亦且古坦 咽踩τ具有k向導電性組成物於基材之 調平(leveling)性之作用。 因此’上述續酸硬化觸媒較理想為於基材上促進硬 2,且可維持導電性組成物於基材之調平性及導電性組成 物之適用期的結構。 作為該種磺酸硬化觸媒可列舉腊肪族或芳香族之磺 亡=肪族續酸,例如可列舉:f續酸、三銳甲續酸、 異戊—烯嶒酸、樟腦續 κ馱己嶒馱、辛磺酸、壬磺醆、癸 只酉夂、十六烷基磺酸等。又, # 又上述方香族磺酸,例如可列 ^本增酸、對甲苯㈣ '異丙苯㈣、十:絲苯績酸、 奈%酸、壬基萘磺酸等。 點而H㈣液之適用期及於低溫之硬化性之觀 點而^較佳為芳㈣韻,尤料十:職苯續酸。 上述續酸硬化觸媒之含量較理想為其上限相對於三聚(wherein R3 to R8 represent H or CH2?r9, and r9 represents H or a burnt group). The melamine resin derivative in which the substituents R3 to R8 are each a hydrogen atom is an imide type melamine resin derivative; the melamine resin derivative in which the substituents R3 to rS are both CH2OH is a methyl type melamine resin derivative. The substituents R to R8 are all CH2〇R9, and R9 is a C1-alkyl substituted one, and one of the melamine resin derivatives is a fluorene-type melamine resin derivative. In addition, the two of the above three substituents are mixed in the structure of the molecule. 201219514 The melamine resin derivative is classified into an imidomethylol type, a methylol ether type and an imino ether type, all of which are mixed with the melamine resin. The derivative is an imidohydroxymethyl ether type. In the case where R3 to R8 represent CH2〇R9 and R9 is an alkyl group of Ci_4, the alkyl group of Ci-4 has a mercapto group, an ethyl group, a propyl group, a butyl group or the like, and in view of low-temperature curability, it is preferably methyl. The above melamine resin derivative may also be a polymer having a basic skeleton of the formula (II) and self-condensing. These melamine resin derivatives may be used singly or in combination of two or more. Among the melamine resin derivatives having the above structure, from the viewpoint of the stability of the conductive composition and the curability at low temperature, it is more preferably a perether-type trimeric oleylamine, and particularly preferably a sulphonic melamine in which R9 is a methyl group. . Further, in the case where the triazamine resin derivative is an oligomer, it is preferable to consider the pot life of the conductive composition (pot Hfe) to have a lower average degree of polymerization, and more preferably more than 1 · Not up to 1.8. _ Further, in the present specification, the application period of the so-called conductive composition is the appearance of the electrode 4, the appearance of the composition (coating solution), the appearance of the formed conductive I* film, Transparency, electrical conductivity, adhesion to the substrate f to the mark|±, only/mixture property, printability, printability, and the like can be sufficiently maintained after the preparation of the conductive composition (coating liquid) . In order to make the conductive film which is cured at a low temperature, the melamine resin (b) having the appearance of the film, the adhesion of the conductive permeable sub-substrate, and the solvent resistance is preferably 3 to the conductive polymer (a) The solid part by weight is 150 to 75 parts by weight. More preferably, it is 25 〇 to 45 〇 weight 12 201219514 parts 0 When the content exceeds 750 parts by weight, the conductivity of the film may be lowered, or the film may be whitened and the transparency may be lowered. Conversely, less than Μ. In the case of a weight fraction, it is difficult to impart sufficient solvent property to the film. 3. Sulfonic acid hardening catalyst (^) The above-mentioned acid-hardening catalyst (7) has a function of promoting crosslinking of the melamine resin derivative (b) on a substrate upon drying and hardening. Since the acid continued to exhibit acidity in the conductive composition, crosslinking of the trimeric amine resin derivative in the conductive composition is promoted, and the pot life of the coating liquid is shortened. Further, the rhein hardening catalyst also has a function of leveling the k-conductive composition on the substrate. Therefore, the above-mentioned acid-hardening catalyst is preferably a structure which promotes hard 2 on the substrate and maintains the leveling property of the conductive composition on the substrate and the pot life of the conductive composition. Examples of such a sulfonic acid hardening catalyst include sulphide or aromatic sulphonic acid = aliphatic acid, and examples thereof include: f acid, trimethyl benzoic acid, isovalerone acid, camphor 驮 驮Benzene, octanesulfonic acid, sulfonium sulfonate, hydrazine, hexadecyl sulfonic acid, and the like. Further, # Further, the above-mentioned aromatic sulfonic acid may, for example, be an acid-increasing, p-toluene (tetra)-isopropylbenzene (tetra), ten: silk phthalic acid, naphthonic acid, decylnaphthalenesulfonic acid or the like. Point and the application period of H (four) liquid and the view of the hardening property of low temperature and ^ is preferably the fang (four) rhyme, especially the ten: benzene continued acid. The content of the above-mentioned acid-hardening catalyst is preferably an upper limit relative to the trimerization

S 13 201219514 :胺樹脂何生4勿100重量份為4〇重量份,更理想為33重 里=又,其下限較理想為相對於三聚氰胺樹脂衍生物100 重置伤為 8重量份。盆m . 卜 伪具原因在於:若為此範圍,則可使三 聚氧胺樹脂衍生物於'很n't B日 曰1王初於低,服短時間内硬化,且可充分維持塗 佈液之適用期。 相對於此,右上述含量超過40重量份,則容易變得無 法維持塗佈液之適用期’另一方面,未達8重量份則存: 導電性組成物之成臈性惡化而形成之被膜中可見收縮 之情形’或存在被膜之耐溶劑性下降之情形。 4·兩末端聚驗改質聚妙氧(d) 上述兩末端聚醚改質聚矽氧(d)具有對導電性被膜賦 予财刮痕性、财溶劑性、印刷性、印刷密合性之作用。 尤其是’由於本發明之熱硬化型導電性塗佈用組成物 中將兩末端聚醚改質聚矽氧與其他成分併用,&而可同時 對形成之導電性被膜賦予耐刮痕性與印刷性及印刷密合 性。 α * · π Κ 貝 ϊί,但 該等之中’僅使用末端聚_改f聚碎氧之情形可特異性 地對形成之導電性被膜同時賦予㈣痕性與印難及; 密合性’即便使用側鏈聚趟改質聚石夕氧亦無法享受該種效 果。而且’該種見解係本案發明人等新發現之見解^ > 又,關於藉由使用兩末端聚醚改質聚矽氧可享為上 效果的理由’可認為:(1)由於聚越改質聚石夕氧於“: 被膜表面之定向性提高、表現優異之光滑性,結果提高耐 14 201219514 到痕性,(2 )藉由兩末端之聚醚鏈而提高墨水之密合性, 亦可較高程度地賦予印刷性及印刷密合性。 又,於使用兩末端聚醚改質聚矽氧之情形時亦維持耐 溶劑性。可認為其原因在於:由於兩末端聚醚改質聚石夕氧 於表面均勻地定向,故而不阻礙三聚氰胺樹脂衍生物之交 聯’因此被膜之交聯密度不下降。 上述兩末端聚醚改質聚矽氧,例如可列舉以下之式 (III)所表示者, R_ CH3 'Si—ΟΙ ch3 CHg · Si一〇-in3 „ ch3 -Si—R10I ch3 (ID) (式中,R1G為聚蝴基,表示由氧化乙烯構成之 R (C2H4〇)aR12、由氧化丙烯構成之R11(C3H6⑺bRl2、或該 等混合而成之RM(C2H40)a(C3H60)bRi2。聚醚基中之R"及 R 2分別獨立表示烷基或伸烷基)。又,上述式(ΠΙ )之兩 末端之聚醚基R10分別可相同或不同。 又’聚矽氧烷之聚合度(η )較理想為38〇以下,較佳 為45〜23卜藉由調配上述聚合度之聚矽氧烷,可對形成之 導電性被膜賦予更優異之耐刮痕性。 又,於上述導電性組成物中’只要維持上述兩末端聚 醚改質聚矽氧之溶解性、且表現要求之特性,則r1〇所含之 裝醚基之聚合度(a及b )並無特別限制。 15 201219514 上述聚驗基之骨架存在氧化乙稀、氧化丙烯、或氧化 乙烯與氧化丙烯之共聚物。該等之中,就水溶性之觀點而 呂,較佳為氧化乙烯,若考慮印刷性及印刷密合性,則較 佳為氧化丙稀或氧化乙烯與氧化丙烯之共聚物。 如上所述,藉由選擇最適結構之聚醚改質聚矽氧,可 於形成之導電性被膜中確實地使耐到痕性與印刷性及 密合性並存。 ,上述導電性組成物所含之兩末端聚醚改質聚矽氧係可 $成不失去耐溶劑性而賦予耐到痕性、且印刷生、印刷密 ^性優異之導電性被膜者’較佳為上述式(叫所表示之 :構之兩末端聚驗改質聚錢。上述式(ιπ)戶斤表示之兩 端聚鍵改質聚石夕氧可單獨地使用1#,亦可併用分子量 同之2種以上之兩末端聚醚改質聚矽氧。 於一 3兩末端聚趟改質聚石夕氧之含量較佳為其上限相對 重::氛胺樹脂衍生物100重量份為重量份,更佳為33 重!二又,其下限較佳為相對於三聚氰胺樹脂衍生物⑽ 里里份為1 〇重量份。 其原因在於:若為該範圚, 予耐刮痕性與印刷性及印刷密合性:,形成之被膜同時賦 量份相若兩末端聚趟改質聚妙氧之含量超過6。重 伤則存在形成之被膜之耐溶劑性惡化之情形。 5 ·導電性提升劑(e ) 上述導電性組成物所含之 ^ ^ ^ ^ ^ ^ 成之導電性被膜之導電性。 k升劑(〇可提高形 16 201219514 上述導電性提升劑(e),例如可列舉:N—甲基甲酿胺、 N,N—二甲基甲醯胺、r _丁内酯、n—甲基吼咯啶酮等酿 胺化合物,乙二醇、-乙— 醉一乙一醇、丙二醇、1,3—丙二醇 (mmethylene glycol)、M_ 丁二醇、15 _ 戊二醇、16—己 二酵、新戊二醇、鄰苯二酚、環己二醇、m己烷二甲醇、 甘油、二乙二醇單乙基驗、内二醇單甲基㈣含經基化合 物;異佛酮、碳酸丙二醋、環己酮、乙醯丙鲷、乙酸乙酉旨、 乙醯乙酸乙酉旨、原乙酸甲醋(methyl〇nh〇acetate)、原甲酸 乙醋(ethyi 〇nh〇f〇rmate)等含幾基化合物;二甲基亞硬等 具有續基之化合物等。 «亥等之中,就塗佈液之適用期或於低溫之硬化性、形 成之導電性被膜之透㈣、❹^痕性、❹劑性等觀點而 言,較佳為酿胺化合物、含經基化合物、含續基化合物, 尤佳為N—甲基吡咯啶酮、二甲基亞碾、乙二醇。 又,上述導電性提升劑之含量並無特別限制,但通常 較佳為以導電性組成物中〇.丨〜6〇重量%之量含有。 6.溶劑或分散介質(f) 作為上述溶劑或分散介f(f),只要為使導電性組成物 中所含之各成分溶解或分散者則並無特別限制,例如可列 舉.水、有機溶劑、該等之混合物等。 再者,於本發明中,導電性組成物所含之溶劑或分散 介質以外之各成分發生溶解之情形時稱為溶劑,構成組成 物之至少1種成分均勻地分散之情形時稱為分散介質。 於上述導電性組成物中,存在上述三聚氰胺樹脂衍生S 13 201219514 : The amine resin 4 is not 100 parts by weight of 4 parts by weight, more preferably 33 parts by weight. Further, the lower limit is preferably 8 parts by weight relative to the melamine resin derivative 100. The reason for the pot m is that if it is for this range, the melamine resin derivative can be hardened in a short period of time, and can be sufficiently maintained. The pot life of the cloth. On the other hand, when the content is more than 40 parts by weight on the right side, the application period of the coating liquid is likely to be maintained. On the other hand, if it is less than 8 parts by weight, the film formed by the deterioration of the conductivity of the conductive composition may be formed. The case of shrinkage can be seen in the case where there is a decrease in the solvent resistance of the film. 4. Both ends of the poly-modified poly (oxygen) (d) The two-end polyether modified polyfluorene (d) has a scratch resistance, a solvent, a printability, and a printing adhesion to the conductive film. effect. In particular, in the thermosetting conductive coating composition of the present invention, the both-end polyether modified polyfluorene oxide and other components are used in combination, and the conductive film formed can be simultaneously provided with scratch resistance and Printability and print adhesion. α * · π Κ ϊ ϊ , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , This effect cannot be enjoyed even with the use of side chain polyfluorene modified polychlorite. Moreover, 'this kind of insight is the newly discovered opinion of the inventor of the present case^> Further, the reason for using the two-end polyether to modify polyfluorene can enjoy the effect of the effect> can be considered as: (1) due to the change质聚石夕氧": The orientation of the surface of the film is improved, and the smoothness is excellent. As a result, the resistance is improved to 14 201219514, and (2) the adhesion of the ink is improved by the polyether chain at both ends. The printing property and the printing adhesion can be imparted to a high degree. Further, the solvent resistance is maintained even when the polyether is modified by the two-end polyether. The reason is considered to be that the polyether is modified by the two ends. Since the oxygen is uniformly oriented on the surface, the cross-linking of the melamine resin derivative is not hindered, so that the crosslinking density of the film is not lowered. The above-mentioned two-end polyether-modified polyfluorene oxide can be, for example, the following formula (III). Representation, R_CH3 'Si-ΟΙ ch3 CHg · Si-〇-in3 „ ch3 -Si—R10I ch3 (ID) (wherein R1G is a poly-base, which represents R (C2H4〇) aR12 composed of ethylene oxide, R11 (C3H6(7)bRl2 consisting of propylene oxide or such a mixture RM(C2H40)a(C3H60)bRi2. R" and R 2 in the polyether group independently represent an alkyl group or an alkylene group. Further, the polyether groups R10 at both ends of the above formula (ΠΙ) may be the same Further, the degree of polymerization (η) of the polyoxyalkylene is preferably 38 Å or less, preferably 45 to 23 Å. By formulating the polyoxy siloxane having the above polymerization degree, the formed conductive film can be imparted more. Further, in the above-mentioned conductive composition, the polymerization of the ether group contained in the r1〇 is maintained as long as the solubility of the both-end polyether-modified polyfluorene is maintained and the performance is required. The degree (a and b) is not particularly limited. 15 201219514 The skeleton of the above-mentioned polymerization group is oxidized ethylene oxide, propylene oxide, or a copolymer of ethylene oxide and propylene oxide. Among these, from the viewpoint of water solubility, Preferably, it is ethylene oxide, and in view of printability and printing adhesion, it is preferably propylene oxide or a copolymer of ethylene oxide and propylene oxide. As described above, polyether modified polyoxane is selected by selecting an optimum structure. , can reliably make the resistance to traces in the formed conductive film Both the printing property and the adhesiveness are coexisting. The two-end polyether modified polyfluorene-based oxygen contained in the conductive composition can provide scratch resistance and print and print density without losing solvent resistance. The excellent conductive film is preferably the above formula (called the one shown: the two ends of the structure are combined with the modified money. The above formula (ιπ) is expressed by the two ends of the poly-bonded polysulfide oxide alone. The use of 1#, can also be used together with two or more kinds of two ends of the polyether modified polyfluorene. The content of the polyphosphonium at the end of the 3rd and 2nd polycondensate is preferably the upper limit of the relative weight: 100 parts by weight of the amine resin derivative is parts by weight, more preferably 33 parts by weight! Further, the lower limit is preferably 1 part by weight relative to the melamine resin derivative (10). The reason for this is that, in the case of the film, scratch resistance, printability, and printing adhesion are obtained: the film formed at the same time has a content of more than 6 at the end of the polycondensation. In the case of serious injury, the solvent resistance of the formed film deteriorates. (5) Conductivity enhancer (e) The conductivity of the conductive film formed by the ^ ^ ^ ^ ^ ^ contained in the above conductive composition. K liter agent (〇 can improve shape 16 201219514 The above conductivity enhancer (e), for example, N-methyl amide, N, N-dimethylformamide, r-butyrolactone, n- Alkalamine compounds such as methyl oxabromone, ethylene glycol, -ethyl-d-glycol, propylene glycol, 1,3-ethylene glycol, M-butanediol, 15 pentylene glycol, 16-hexane Yeast, neopentyl glycol, catechol, cyclohexanediol, m-hexane dimethanol, glycerol, diethylene glycol monoethyl, internal glycol monomethyl (tetra) containing trans-based compounds; isophorone, Propylene carbonate, cyclohexanone, acetophenone, acetic acid, ethyl acetate, methyl 〇nh〇acetate, ethyi 〇nh〇f〇rmate, etc. a compound containing a group of compounds, a compound having a thiol group such as dimethyl sulfene, etc., etc., in the case of Hai et al., the pot life of the coating liquid or the hardening property at a low temperature, and the formation of a conductive film (four), ❹ From the viewpoints of properties, oxime, etc., it is preferably a stilbene compound, a thiol-containing compound, a thiol-containing compound, and more preferably N-methylpyrrolidone, dimethyl Further, the content of the above-mentioned conductivity improving agent is not particularly limited, but it is usually preferably contained in an amount of 〇.丨6〇% by weight in the conductive composition. 6. Solvent or dispersion The medium (f) is not particularly limited as long as it dissolves or disperses each component contained in the conductive composition, and examples thereof include water, an organic solvent, and the like. In the present invention, when a solvent or a component other than the solvent contained in the conductive composition is dissolved, it is called a solvent, and when at least one component constituting the composition is uniformly dispersed, it is called Is a dispersion medium. In the above conductive composition, the above melamine resin is derived

S 17 201219514 物不溶於水之愔形 ^ 月形。於該情形時,溶劑或 水與有機溶劑之$ At — 77放介質可使用 合物之情形時,右m κ與有機溶劑之混 ^ f有機溶劑,較佳為含有至少】 之有機溶劑,只要含 人 1種與水混合 含有不盘水混人/ 之有機溶劑,則亦可進而 ’ ua合(疏水性)之有 低之醇糸古她w & 错由使用沸點較 低之醇系有機溶劑與水之混合物 在揮發性提高並於齡檢w次刀政介質,存 门卫於乾屌、熱硬化時變得有利 於使用樹脂基材之情年 ^ 又 平性。 ^時1^有機溶劑可有助於提高調 明㈣’所謂水系熱硬化型導電性塗 佈用組成物,係溶劑或分散介f 之右Μ 刀狀"質僅為水或為水與跟水混合 劑之混合物的熱硬化型導電性塗佈用組成物;所 二丨系熱硬化型導電性塗佈用組成物,係溶劑或分散介 質3非水溶性有機溶劑之熱硬化型導電性塗佈用組成物。 6 — 1 ·有機溶劑 上述有機溶劑,可列舉可使容解於水中之三聚氰 胺樹脂衍生物等成分均勻地溶解或分散者。 作為與水混合之有機溶劑,例如可列舉:甲醇、乙醇、 2-丙醇、卜丙醇等醇類;乙二醇 四乙二醇等乙二醇類;乙-醇單甲^ 和 知 〇 一師早甲基醚、二乙二醇單甲基 醚二二醇二乙基醚、二乙二醇二甲基醚等二醇醚類;乙 二醇單乙基趟乙酸自旨、〔乙二醇單乙基峻乙酸S旨、二乙二 醇單丁基醚乙酸酯等二醇醚乙酸酯類;丙二醇、二丙二醇、 三丙二醇等丙二醇類;$二醇單甲基㈣、丙二醇單乙基醚、 201219514 一丙一醇”基越、二丙二醇單乙基趟、丙二醇二 一丙一酵二f基醚、丙二醇二乙基醚、二丙土 等丙二醇醚類;丙二醇單甲美 一知一乙基醚 乙酸酯、二丙-醇口口, 丙二醇單乙基趟 —丙一%早尹基醚乙酸酯、二丙二 酸醋等丙二_乙駿醋類,w丙d 等之混合物等。 乙腈、及該 =作為疏水性有機溶劑,例如可列舉:乙醆乙醋、 乙馱丁自曰、乳酸乙酯等酯類,·二 ; fAr 呉丙基醚、二異丁基醚等 心類,T基乙基纲、甲基二異丁基酮等網 石油越等脂肪族煙類; 疋辛虎、 等之混合物等。 * -甲本專方香族煙類;及該 該等有機溶劑可單獨使用,亦可併用2種以上。 =料電性組絲為水系導電性組絲 上述有機溶劑之含量較佳為 办号 份以…… 較佳為相對於水⑽重量份為20重量 上。右未達20重量份,目丨丨户+一甘 成分溶解戋分散不灼4 在二聚氰胺樹脂衍生物等 形。再膜性惡化並無法表現性能之情 (Jf^04 ^電性組成物為溶劑系導電性組成物之 清形時,上述溶劑之含量並無限制。 之 6 — 2.水 水系導電性組成物中传用 離早4 之水’例如可列舉:蒸餾水、 父換水及離子交換蒸餾水等。又, Ψ ^ AL· X 上述水亦包含導電 I物之水分散體及其他成分所含之水分。 上述水之含量較佳為相對於全部導電 里%以上。 $S 17 201219514 The shape of water insoluble in water ^ shape. In this case, when the solvent or water and the organic solvent are used in the case where the medium can be used, the mixture of the right m κ and the organic solvent, preferably an organic solvent containing at least the organic solvent, as long as Containing one kind of organic solvent containing water mixed with water, it can also be a mixture of low-hydrogen alcohols, and it is also used by alcohols with lower boiling points. The mixture of the solvent and the water is improved in volatility and is used for the inspection of the medium in the age of inspection, and it is advantageous to use the resin substrate in the case of dryness and heat hardening. ^11 organic solvent can help to improve the conditioning (4) 'so-called water-based thermosetting conductive coating composition, the solvent or dispersion of the right Μ knife-like" quality is only water or water and with A thermosetting conductive coating composition for a mixture of water mixtures; a thermosetting conductive coating composition for a bismuth-based thermosetting conductive coating, a thermosetting conductive coating for a solvent or a dispersion medium 3, a water-insoluble organic solvent The composition of the cloth. 6 - 1 · Organic solvent The organic solvent may be one which dissolves or disperses a component such as a melamine resin derivative which is dissolved in water. Examples of the organic solvent to be mixed with water include alcohols such as methanol, ethanol, 2-propanol and propanol; ethylene glycols such as ethylene glycol tetraethylene glycol; and ethyl alcohol monomethyl and hydrazine; a division of early methyl ether, diethylene glycol monomethyl ether diethylene glycol diethyl ether, diethylene glycol dimethyl ether and other glycol ethers; ethylene glycol monoethyl phthalic acid from the purpose, [B Glycol ether acetate such as diol monoethyl succinic acid S, diethylene glycol monobutyl ether acetate; propylene glycol such as propylene glycol, dipropylene glycol, tripropylene glycol; diol monomethyl (tetra), propylene glycol Ethyl ether, 201219514 monopropanol, ketone, dipropylene glycol monoethyl hydrazine, propylene glycol, dipropylene glycol, di-f-butyl ether, propylene glycol diethyl ether, dipropylene and other propylene glycol ethers; propylene glycol monomethyl methacrylate Known monoethyl ether acetate, dipropanol mouth, propylene glycol monoethyl hydrazine - propyl methacrylate, dipropylene glycol vinegar, etc. Mixtures, etc. acetonitrile, and the = as a hydrophobic organic solvent, for example, ethyl acetate, acetaminophen, ethyl lactate and the like, 2; fAr propyl propyl ether, diisobutyl ether and other cores, T-ethyl ethyl, methyl diisobutyl ketone and other oils such as aliphatic cigarettes; a mixture of 疋辛虎, etc. * - A special-purpose aromatic tobacco; and the organic solvent may be used singly or in combination of two or more. = The electrical component of the wire is a water-based conductive wire. The content of the organic solvent is preferably a portion. Preferably, it is 20 parts by weight with respect to water (10) parts by weight. The right side is less than 20 parts by weight, and the target household + one sugar component is dissolved and 戋 is not smeared in the form of a melamine resin derivative. When the film property is deteriorated and the performance is not exhibited (Jf^04), when the electrical composition is a solvent-based conductive composition, the content of the solvent is not limited. 6 - 2. Water-based conductive composition For example, distilled water, parent water exchange, and ion exchange distilled water can be used. Further, Ψ ^ AL· X The water also contains water contained in the water dispersion of the conductive material I and other components. The content is preferably greater than or equal to the total conductivity.

S 19 201219514 於上述導電性組成物Λ # 馮水系導電性組成物之情形時, 導電性組成物之ΡΗ值較佳為】〜 /L , 14之範圍,若考慮低溫之 硬化性,則更佳為〗〜7,尤 u#丄 佳為1.5〜3。導電性組成物之 PH值错由鹼等阳值調整劑進行調整即可。 上述PH值調整劑,例如可列舉:氨、 胺等烷醇胺類等。 此處,考慮到:有時驗形成酸與鹽而降低三聚氛胺樹 脂衍生物之硬化促進效果, _ 力 方面’存在導電性組成物 之pH值越高低溫之硬化性抵 注越下降,但由於抑制於三聚氰胺 ㈣衍生物之溶液中之自我交聯故而溶液之穩定性或適用 期變好之情形,pH值調整劑之添加量適宜決定即可。再者, 上述PH值調整劑為上述導電性組成物中之任意成分。 、又,含有如以上說明般之(a)〜⑺成分之導電性組 成物於如下情形時導電性組成物之適用期顯著提高方面尤 佳^目對於導電性聚合物之固形分刚重量份含有15〇〜75〇 重置份之全醚型三聚氰胺樹脂衍生物 胺㈣衍生物丨。。重量份含有…量份芳二= 為%酸硬化觸媒(c),相對於三聚氰胺樹脂衍生物ι〇〇重量 份含有10〜60重量份兩末端聚醚改質聚矽氧(d),含有具 有醯胺基、經基、確基中一個以上之化合物作為導電性提 升劑(e )。 以上說明之(a )〜(f)成分係本發明之熱硬化型導電 性塗佈用組成物中之必需成分。 而且’本發明之熱硬化型導電性塗佈用組成物亦可視 20 201219514 需要而含有水溶性抗氧化劑 泡劑(i )等。 (g )、濡濕性提升劑(h )、消 7·水溶性抗氧化劑(g) 上迹導電性組成物亦可合右 』3有水溶性抗氧化劑(g )。j 述水溶性抗氧化劑(g )發揎 發揮如下功能:於形成導電性被港 時,對於該被膜中之導雷性咿人 电性鬈CT物而均勻地存在,並有矣 地抑制由暴露於空氣而引起之電阻升高。 再者’脂溶性抗氧化劑無法均句地存在於被膜中,無 法有效地抑制由暴露於空氣而引起之電阻升高。 上述水溶性抗氧化劑可列舉還原性或非還原性水溶性 抗氧化劑。 上述具有還原性之水溶性抗氧化劑,例如可列舉:L — 柷裒血I、L柷壞血酸鈉、L 一抗壞血酸鉀、異抗壞血酸、 ^抗壞血酸納、異抗壞灰酸鉀等具有經2個羥基取代之内 酉曰%之化合物;麥芽糖、乳糖、纖維雙糖、木糖 '阿拉伯 糖、葡萄#、果糖、半乳糖、甘露糖等單糖類或二糖類; 兒茶素、芸香苷、楊梅黃酮、槲皮素、堪非黃酮醇 (kaempferol)等類黃酮;薑黃素、迷迭香酸、漂木酸、對 笨二酚、3,4,5—三羥基苯曱酸等具有2個以上酚性羥基之 化合物;半胱胺酸、麩胱甘肽、新戊四醇四(3_巯基丁酸酯) 等具有硫醇基之化合物等。 上述非還原性水溶性抗氧化劑,例如可列舉:苯基咪 °坐~酸、笨基二嗤續酸、2 —經基响咬、水揚酸苯酯、2 — 致基 4 一曱氧基二笨甲酮—5—續酸納等吸收成為氧化劣S 19 201219514 In the case of the above-mentioned conductive composition Λ# feng water-based conductive composition, the enthalpy of the conductive composition is preferably in the range of 〜 /L , 14 , and is preferably considered in consideration of low-temperature hardenability. For 〗 〖7, Yuu #丄佳 is 1.5~3. The pH value of the conductive composition may be adjusted by a positive value adjusting agent such as alkali. The pH adjusting agent may, for example, be an alkanolamine such as ammonia or an amine. Here, it is considered that the acid and salt are sometimes formed to reduce the hardening promoting effect of the trimeric amine resin derivative, and the higher the pH of the conductive composition is, the lower the hardening resistance of the low temperature is. However, since the stability or the pot life of the solution is improved by the self-crosslinking in the solution of the melamine (tetra) derivative, the addition amount of the pH adjuster may be appropriately determined. Further, the pH adjusting agent is an optional component of the conductive composition. Further, the conductive composition containing the components (a) to (7) as described above is particularly preferably used in the case where the pot life of the conductive composition is remarkably improved in the following cases. 15〇~75〇Replacement of the full ether type melamine resin derivative amine (IV) derivative 丨. . The parts by weight contain a part of aryl 2 = a % acid hardening catalyst (c), and 10 to 60 parts by weight of the melamine resin derivative ι 〇〇 contains 10 to 60 parts by weight of the two-end polyether modified polyfluorene (d), containing One or more compounds having a mercapto group, a trans group, and a confirming group are used as the conductivity enhancer (e). The components (a) to (f) described above are essential components in the thermosetting conductive coating composition of the present invention. Further, the thermosetting conductive coating composition of the present invention may contain a water-soluble antioxidant foaming agent (i) or the like as required by 20 201219514. (g), moisturizing enhancer (h), elimination 7. Water-soluble antioxidant (g) The conductive composition of the upper trace may also be combined with the right water-soluble antioxidant (g). j The water-soluble antioxidant (g) has a function of uniformly exhibiting a conductive property in the film when the conductive port is formed, and suppressing the exposure by exposure. The resistance caused by air rises. Further, the fat-soluble antioxidant cannot be uniformly present in the film, and the increase in electric resistance caused by exposure to air cannot be effectively suppressed. The water-soluble antioxidant may, for example, be a reducing or non-reducing water-soluble antioxidant. Examples of the above-mentioned water-soluble antioxidant having a reducing property include L-sputum I, sodium L-ascorbate, L-ascorbate, erythorbic acid, sodium ascorbate, and potassium gluconate. a compound in which hydroxy group is substituted with 酉曰%; monosaccharide or disaccharide such as maltose, lactose, cellobiose, xylose 'arabinose, grape#, fructose, galactose, mannose; catechin, rutin, arbutus Flavonoids, quercetin, flavonoids such as kaempferol; curcumin, rosmarinic acid, bleaching acid, 2,4,5-trihydroxybenzoic acid, etc. A compound having a phenolic hydroxyl group; a compound having a thiol group such as cysteine, glutathione, or pentaerythritol tetrakis(3-mercaptobutyrate). Examples of the non-reducing water-soluble antioxidant include a phenyl group, an acid, a streptozoic acid, a 2-basic biting, a phenyl salicylate, and a 2-hydroxy group. Dimethyl ketone -5 - continuous sodium sulphate absorption becomes oxidative

S 21 201219514 化之原因之紫外線的化合物 ^ ^ . J #可早獨使用,亦可併用2 種以上。 «玄等水冷性抗氧化劑中,較理想為抗壞血酸及異抗壞 血酸’更理想為抗壞血酸。 /、原因在於.明顯實現抑制由暴露於空氣而引起之電 I"升问之效果,及使形成之導電性被膜透明性優異之效果。 上述水溶性抗氧化劑之含量並無特別限定,但其上限 較佳為相對於三聚氰胺樹脂衍生^⑼重量份為6〇重量 份’更佳為40重量份。另—方面,其下限較佳為9重量份, 更佳為2 0重量份。 若上述含量超過60重量份’則存在形成之導電性被膜 之耐溶劑性下降之情形,相反地,若少於9重量份,則有 時由暴露於空氣而引起SR上升率增高。 8 ·霜濕性提升劑(h ) 上述導電性組成物亦可含有儒濕性提升劑⑴。上述 潘濕性提升劑(h)可提高對導電性組成物之基材之潘濕 性,且可提高形成之導電性被膜之均勻性。 "上述濡濕性提升劑,例如可列舉:丙烯酸系共聚物或 聚氧乙烯脂肪酸酯系化合物等。 該等之中較佳為丙烯酸系共聚物。其原因在於導電性 被膜之透明性、耐刮痕性、耐溶劑性優異。 上述濡濕性提升劑之固形分之含量並無特別限制,但 其上限較佳為相對於三聚氰胺樹脂衍生物100重量份為70 重里伤’更佳為40重量份。另一方面,其下限較佳為相對 22 201219514 於二:鼠胺樹脂衍生物刚重量份為4重量份。 右上述含量超過70重量 物之交聯密声 在二聚氰胺樹脂衍生 又下降而耐溶劑性惡化之情形,若未 刀,則存在成膜性不提高 (υ 〒皮職仔不均句之情形。 上述導電性組成物亦可含有消泡劑 消泡杳丨「、 -Τ· 猎由調配上迷 包:(:),可有效地消泡並抑制導電性组成物起泡。 上述消泡劑,例如可列舉. g—υ 等 m… 醇(p°lyaeetylene 合物有機改質聚石夕氧燒等石夕氧烧系化 :物使聚二甲㈣院藉由乳化劑而分散於水之乳化物 甲基 該等之中,就消泡性優異方面 矽氧烷之乳化物。 衩佳為聚. 末端肖泡劑之含量並無特別限制,但較佳為相對於兩 質聚石夕氧⑽重量份為卜30重量份。若超過 η,則存在三聚氰胺樹脂衍生物之交聯密度下降而 =劑性惡化之情形’若未彡i重量份,則存在消泡性不 捉向而泡沫長時間殘留之情形。 本發明之熱硬化型導電性塗佈用組成物除上述成分以 外’亦可視需要而含有其他成分。 10 ·其他成分 — 1 ·黏合劑樹脂 為了提高形成之導電性被膜之成膜性或印刷性,上述 導電性組成物亦可含有黏合劑樹脂。 23 5 201219514 於本發明之導電性組成物中,三聚氰胺樹脂衍生物之 自我交聯膜具有黏合劑功能,但藉由添加黏合劑樹脂,存 在進-步提高成膜性、被膜之可撓性及密合性、進而印刷 性及印刷密合性之情形。 上述黏合劑樹脂,例如可列舉:聚醋、聚(甲基)丙稀酸 s曰聚胺酉曰、聚乙酸乙稀g旨、聚偏二氣乙稀、聚酿胺、聚 醯亞胺、聚乙烯醇、聚丙婦酸多元醇、聚酉旨多元醇等均聚 物;以選自由苯乙烯'偏二氯乙烯、氯乙婦及(甲基)丙婦酸 烷基酯構成之群之化合物為共聚成分之共聚物等。 上,黏合劑樹脂之含量並無特別限定,但較佳為相對 於三聚氰胺樹脂衍生物100重量份為2〇〇重量份以下,更 佳為40重量份以下。若上述黏合劑樹脂之量超過2〇〇重量 份,則存在三聚氰胺樹脂衍生物之交聯密度下降而形成之 導電性被膜之耐溶劑性惡化之情形。 本發明之導電性組成物中之三聚氰胺樹脂衍生物之熱 硬化較佳為三聚氰胺樹脂衍生物之自我交聯反應。其原因 在於形成之導電性被膜之耐刮痕性或耐溶劑性優異。可認 為三聚氰胺樹脂衍生物之自我交聯而形成之被膜之耐刮痕 性或耐溶劑性優異之理由在於其交聯密度較高。 另一方面,三聚氰胺樹脂衍生物由於可與黏合劑樹脂 所含之減或㈣等官能基進行反應,故而亦作為黏合= 樹脂之交聯劑而發揮功能,但三聚氰胺樹脂衍生物作為黏 合劑樹脂之交聯劑發揮功能而形成之被膜,存在其耐到痕 性或耐/谷劑性與二聚氰胺樹脂衍生物之自我交聯被臈相比 24 201219514 較低之傾向。 上述導電性組成物亦可含有界面活 1 〇 ~ 2.界面活性劑 為了提高調平性, 性劑。 上述界面活性劑,例如可 j列舉.全齓烷基羧酸、全氟 炫•基聚氧乙娣乙醇蓉螽糸βι、, 寺齓糸界面活性劑;聚氧乙烯烷基苯 趟、氧化丙烯聚合物、氧化^秘取人1w 孔1匕乙烯聚合物等聚醚系化合物; 椰子油脂肪酸胺鹽、松脂膠等㈣;t麻油硫動旨類、碟 酸醋、院基醚硫酸鹽、&梨醇肝脂肪酸g|、續酸醋、破雜 酸醋等I系化合物;烷基芳基磺酸胺鹽、磺基琥拍酸二辛 醋鈉等磺酸鹽化合物;月桂基磷酸鈉等磷酸鹽化合物;椰 子油脂肪酸乙醇醯胺等醯胺化合物;陰離子性界面活性 劑、陽離子性界面活性劑、非離子界面活性劑、矽改質丙 烯酸化合物等。 上述界面活性劑之含量並無特別限定,但較佳為相對 於二聚氰胺樹脂衍生物1 〇〇重量份為丨〇〇重量份以下。若 超過100重量份,則存在三聚氰胺樹脂衍生物之交聯密度 下降而形成之導電性被膜之耐溶劑性惡化之情形。 又 !〇 — 3.矽烷偶合劑 為了提高導電性被膜之耐溶劑性、印刷性、印刷密人 性,上述導電性組成物亦可含有矽烷偶合劑。 上述矽烷偶合劑,可列舉:3 ~環氧丙氧基丙基三甲氧 基矽烷、3—環氧丙氧基丙基曱基二甲氧基矽烷、2__ (3,4〜 氧基環己基)乙基三甲氧基矽烷、3_巯基三曱氧基石夕^S 21 201219514 The ultraviolet compound of the reason ^ ^ . J # can be used alone or in combination of two or more. Among the water-cooling antioxidants such as Xuan, it is preferable that ascorbic acid and erythorbic acid are more preferably ascorbic acid. The reason is that the effect of suppressing the electric power caused by exposure to air and the transparency of the formed conductive film are excellent. The content of the above water-soluble antioxidant is not particularly limited, but the upper limit thereof is preferably 6 parts by weight', more preferably 40 parts by weight, based on the melamine resin-derived (9) parts by weight. On the other hand, the lower limit is preferably 9 parts by weight, more preferably 20 parts by weight. When the content exceeds 60 parts by weight, the solvent resistance of the formed conductive film is lowered. Conversely, if it is less than 9 parts by weight, the SR rise rate is sometimes increased by exposure to air. 8·Frost Humidity Enhancer (h) The above conductive composition may also contain a Confucian enhancer (1). The above-mentioned pan wetness improving agent (h) can improve the pan wetness of the substrate of the conductive composition and can improve the uniformity of the formed conductive film. " The above-mentioned wetness improving agent may, for example, be an acrylic copolymer or a polyoxyethylene fatty acid ester compound. Among these, an acrylic copolymer is preferred. The reason for this is that the conductive film is excellent in transparency, scratch resistance, and solvent resistance. The content of the solid content of the above-mentioned moisture-reducing agent is not particularly limited, but the upper limit thereof is preferably 70% by weight and more preferably 40 parts by weight based on 100 parts by weight of the melamine resin derivative. On the other hand, the lower limit thereof is preferably relative to 22 201219514 on the second: the amount of the murine amine resin derivative is 4 parts by weight. The above-mentioned cross-linked dense sound having a content of more than 70% by weight on the right side is degraded in the case where the melamine resin is degraded and the solvent resistance is deteriorated. If the knife is not knives, the film formability is not improved (υ 〒 职 职 不 不 不The above conductive composition may also contain an antifoaming agent for defoaming 杳丨 ", - Τ · hunting by the package: (:), which can effectively defoam and inhibit the blistering of the conductive composition. Examples of the agent include g. υ, etc. m... alcohol (p°lyaeetylene organically modified poly-stone oxy-oxygenation, etc.): the polydimethylene (four) house is dispersed in water by an emulsifier Among the emulsion methyl groups, the emulsion of the oxime is excellent in the defoaming property. The content of the terminal foaming agent is not particularly limited, but is preferably relative to the two masses. Oxygen (10) parts by weight is 30 parts by weight. When it exceeds η, the crosslinking density of the melamine resin derivative decreases and the agent property deteriorates. If it is not part by weight, the defoaming property is not caught and the foam is present. The case of the thermosetting conductive coating composition of the present invention, in addition to the above Other components may be contained as needed. 10 Other components - 1 - Adhesive resin The conductive composition may contain a binder resin in order to improve the film formability or printability of the formed conductive film. 201219514 In the conductive composition of the present invention, the self-crosslinking film of the melamine resin derivative has a binder function, but by adding a binder resin, there is a stepwise improvement in film formability, flexibility and adhesion of the film. In the case of the above-mentioned adhesive resin, for example, polyacetal, poly(methyl)acrylic acid s曰 polyamine oxime, polyacetic acid ethoxylate, and polypyrenequinone a homopolymer of ethylene ethoxide, polyamine, polyimine, polyvinyl alcohol, polyglycolic acid polyol, polyhydric alcohol, etc.; selected from styrene's vinylidene chloride, chloroethene and (a) The compound of the group consisting of alkyl acetophenate is a copolymer of a copolymerization component, etc. The content of the binder resin is not particularly limited, but is preferably 2 parts by weight based on 100 parts by weight of the melamine resin derivative. Weight by weight More preferably, it is 40 parts by weight or less. When the amount of the binder resin exceeds 2 parts by weight, the solvent resistance of the conductive film formed by the decrease in the crosslinking density of the melamine resin derivative may be deteriorated. The thermal hardening of the melamine resin derivative in the conductive composition is preferably a self-crosslinking reaction of the melamine resin derivative, because the conductive film formed is excellent in scratch resistance or solvent resistance, and the melamine resin is considered to be considered. The reason why the film formed by self-crosslinking of the derivative is excellent in scratch resistance or solvent resistance is that the crosslinking density is high. On the other hand, the melamine resin derivative may be reduced by the binder resin or (4) When the functional group reacts, it functions as a crosslinking agent for the binder = resin, but the melamine resin derivative functions as a crosslinking agent for the binder resin, and the film is resistant to scratch or resistance/valley. The self-crosslinking of the agent with the melamine resin derivative is lower than that of the 2012 20121414. The above conductive composition may also contain an interface activity 1 2. ~ 2. Surfactant In order to improve the leveling property, the agent. The above surfactants may, for example, be exemplified by a fluorenyl carboxylic acid, a perfluoroxanyl ethoxylated oxime oxime, a cerium surfactant, a polyoxyethylene alkyl benzoquinone, or a propylene oxide. Polyether compound such as 1w hole 1 匕 ethylene polymer; coconut oil fatty acid amine salt, rosin gum, etc. (4); t sesame oil sulfur type, dish vinegar, hospital ether sulfate, &; linoleic fatty acid g|, continuous acid vinegar, broken acid vinegar and other I compounds; alkyl aryl sulfonate amine salt, sulfosyl sulfonate sodium octanoate sodium sulfonate compounds; sodium lauryl phosphate, etc. Phosphate compound; decylamine compound such as coconut oil fatty acid ethanol decylamine; anionic surfactant, cationic surfactant, nonionic surfactant, hydrazine modified acrylic compound, and the like. The content of the surfactant is not particularly limited, but is preferably 1 part by weight or less based on 1 part by weight of the melamine resin derivative. When the amount is more than 100 parts by weight, the crosslinking property of the melamine resin derivative is lowered to deteriorate the solvent resistance of the conductive film formed. Further, 〇 - 3. decane coupling agent The conductive composition may contain a decane coupling agent in order to improve solvent resistance, printability, and printability of the conductive film. Examples of the above decane coupling agent include 3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropylmercaptodimethoxydecane, and 2__(3,4-oxycyclohexyl). Ethyltrimethoxydecane, 3_mercaptotrimethoxysilane

25 S 201219514 等。 3里亚黑特別限定,但較 於三聚氰胺樹脂衍生物〖〇〇重量 多於1〇〇重量份,則存在一 ^為〇〇重量份以下。若 , 子在一聚鼠胺樹脂衍生物之交聯密产 下降而形成之導電性祐腺夕+ w 又 守电!·生被膜之耐溶劑性惡化之情形。 1 0 — 4 ·增黏劑 為了提高上述導電性組成物之黏度,上 物亦可含有增黏劑β 电丨生組成 上述增黏劑,例如可列皇. j幻舉.海藻酸之鹽及衍生物、一 =生物、鹿角菜膠或纖維素等糖類化合物等水溶性: 上述增黏劑之含量並無特別限定,但較佳 象氰胺樹脂衍生物100重量份. 、— 里里伤為100重量份以下。 1 〇〇重量份,則存在三聚氛胺樹 ; 日何生物之交聯密度下降而 形成之導電性被膜之耐溶劑性惡化之情形。 降而 1 〇 — 5.微粒子材料 為了提高導電性被膜之光滑性或印刷性、印刷密人 ,上述導電性組成物中亦可含有膠體二氧切 一口 氧化矽、氟樹脂微粒子、二t芥岛松A 工一 材料。 氧化鈦荨金屬微粒子等微粒子 粒子材料之含量並無特別限定,但較佳 於二聚氰胺樹脂衍生物丨〇 〇重 $如為1〇〇重量份以下。婪 =⑽重量份,則存在三聚氛胺樹脂衍生物之 二 下降而形成之導電性被膜之耐溶劑性惡化之情形。- 26 201219514 1 〇 — 6.有機羧酸化合物 為了提高導電性被膜之印刷性、印刷密合性,上 電性組成物亦可含有具有羧基之有機羧酸。 Κ 有機羧酸存在脂肪族及芳香族之〗價、多價羧醆,亦 可於分子内含有羥基或乙烯基等官能基。上述脂肪族 酸’例如可列舉:乙酸、丁酸、己烧缓酸、辛院幾醆、乙 醯乙酸、丙二酸、琥酸、戊二酸、己二酸、反丁埽二酸、 順丁稀二酸、蘋果酸、酒石酸、檸檬酸等。又,上述/香 族叛酸’例如可列舉:苯甲酸、水揚酸、沒食子酸: 酸、鄰苯二甲冑、偏苯三甲酸、均笨四甲酸等。 接著’對本發明之光學膜進行說明。 本發明之光學膜係由基材及積層於上述基材上之 性被膜構成者, 且其特徵在於:上述導電性被膜係使用本發明之熱硬 化型導電性塗佈用組成物而形成者。 上述光學膜係由基材及積層於上述基材上之導電性被 膜構成。 上述基材,例如可列舉:樹脂基材、玻璃基材等。 上述祕脂基材之材料樹脂,例如可列舉:聚乙烯、聚 丙烯乙烯—乙酸乙烯酯共聚物、乙烯一丙烯酸酯共聚物、 離子聚σ物共聚物、環烯烴系樹脂等聚烯烴樹脂;聚對苯 曱駄乙—酯、聚對苯二曱酸丁二酯、聚碳酸酯、聚氧乙 烯、改質聚笨、聚苯硫趟等聚g旨樹脂;尼龍6、尼龍6,6、25 S 201219514 and so on. 3 rye black is particularly limited, but if it is more than 1 〇〇 by weight based on the melamine resin derivative, there is one 〇〇 by weight or less. If the sub-linkage of the poly-moleamine resin derivative is reduced, the conductivity is formed by the conductive adenine + w and the electricity is kept! - The case where the solvent resistance of the green film deteriorates. 1 0 — 4 · Tackifier In order to increase the viscosity of the above-mentioned conductive composition, the top material may also contain a tackifier β electro-xistence to form the above-mentioned tackifier, for example, can be listed as a salt of alginic acid. Water-soluble: a saccharide such as a derivative, a bacterium, a carrageenan or a cellulose; the content of the above-mentioned tackifier is not particularly limited, but is preferably 100 parts by weight of a cyanoamine resin derivative. 100 parts by weight or less. In the case of 1 part by weight, a trimeric amine tree is present; the cross-linking density of the Japanese organism is lowered, and the solvent resistance of the conductive film formed is deteriorated. 1) - 5. Fine particle material In order to improve the smoothness or printability of the conductive film and to print the dense film, the conductive composition may also contain colloidal bismuth oxide, fluororesin fine particles, and two t mustard. Song A work a material. The content of the fine particle material such as the titanium oxide cerium fine metal particles is not particularly limited, but it is preferably 10,000 parts by weight or less based on the weight of the melamine resin derivative. When 婪 = (10) parts by weight, the solvent resistance of the conductive film formed by the decrease of the trimeric amine resin derivative may be deteriorated. - 26 201219514 1 6. 6. Organic carboxylic acid compound The electroconductive composition may contain an organic carboxylic acid having a carboxyl group in order to improve printability and print adhesion of the conductive film. Κ Organic carboxylic acids contain aliphatic and aromatic valences, polyvalent carboxy hydrazines, and functional groups such as hydroxyl groups or vinyl groups in the molecule. Examples of the above aliphatic acid include acetic acid, butyric acid, hexasic acid, simazine, acetoacetic acid, malonic acid, succinic acid, glutaric acid, adipic acid, butyl succinic acid, and cis. Butyric acid, malic acid, tartaric acid, citric acid, and the like. Further, examples of the above-mentioned "fragrance acid" include benzoic acid, salicylic acid, gallic acid: acid, phthalic acid, trimellitic acid, and tetrabenzoic acid. Next, the optical film of the present invention will be described. The optical film of the present invention is composed of a substrate and a film which is laminated on the substrate, and the conductive film is formed by using the composition for a thermosetting conductive coating of the present invention. The optical film is composed of a substrate and a conductive film laminated on the substrate. Examples of the substrate include a resin substrate and a glass substrate. Examples of the material resin of the above-mentioned secret fat base material include polyolefin resins such as polyethylene, polypropylene ethylene-vinyl acetate copolymer, ethylene monoacrylate copolymer, ion poly-sigma copolymer, and cycloolefin resin; Phenyl phthalate, polybutylene terephthalate, polycarbonate, polyoxyethylene, modified polystyrene, polyphenylene sulfide, etc.; nylon 6, nylon 6,6,

At ^、 . 务 ”芳香族聚醯胺0T6、半芳香族聚醯胺6T66、半芳At ^, . 务 "Aromatic polyamine 0T6, semi-aromatic polyamine 6T66, semi-aromatic

S 27 201219514 香族聚醯胺9T等聚醯胺樹脂;丙烯酸樹脂、聚苯乙烯、丙 稀腈笨乙稀共聚物、丙烯腈一 丁二稀—笨乙稀共聚物、 氣乙烯樹脂、三乙醯纖維素等。 又,上述基材較理想為透明(具有較高之透光率)。 又,該等之中,於用作保護膜之光學膜之情形時,就 加工f生及功此性之觀點而言,較佳為使用聚對苯二甲酸乙 二S旨或三乙醯纖維素。 上述基材之形狀並無特別限定,根據光學膜之形狀而 適且選擇即可’可列舉膜狀、板狀、其他所需之形狀。因 此,上述基材’可使用膜、[板、成形物等各種基材。 又亦可對上述基材之表面施加電暈處理、火焰處理、 電水處理等物理處理。冑由施加該等處理可提高導電性組 成物之塗佈性。 上述導電性被膜係使用本發明之導電性組成物而形成 者,藉由將上述導電性組成物塗佈於基材並使其乾燥、熱 硬化而形成。 將上述導電性組成物塗佈於上述基材之方法並無特別 限定,可自該領域中通用之方法中適宜選擇,例如可列舉: 旋塗、凹版印刷塗佈、棒塗、浸潰塗佈、淋幕式塗佈、模 塗、喷塗等塗佈方法。 又,亦可採用網版印刷、噴印 '噴墨印刷 '凸版印刷、 凹版印刷、平版印刷等印刷法來塗佈上述導電性組成物。 又,塗佈上述導電性組成物時,亦可製備將上述導電 性組成物預先以醇等稀釋之塗佈液,再塗佈該塗佈液。 28 201219514 上述導電1·生被膜之厚度並無特別限定,可根據目的而 適宜選擇。 就塗佈成本之觀點而言’較佳為加熱乾燥後之計算膜 厚為45nm以下,更佳為10〜20nm。 再者’右使塗佈液之比重與乾燥後之被膜之比重可近 似於1 ’則上述计算膜厚可根據以下之計算式而算出。 膜厚—塗佈液之濃度(%) +100X線棒之理論塗佈量 (β m)」 通系’由於線棒之塗佈量少於理論值,故而實際之膜 厚薄於計算值。 上述導電性被膜由於含有導電性聚合物故而具有導電 性’其表面電阻率較佳為104〜1ϋ11Ω/□。其原因在於:若 具有該範圍之表面電阻率,貝充分滿足作為抗靜電層之要 求特性。 上述導電性被膜係藉由對塗佈於基材之導電性組成物 加熱’並蒸發溶劑或分散介質同時使其熱硬化(乾燥、孰 硬化)而形成。 此處’加熱條件較佳為於13(TC以下(8〇t〜13(rc) 之溫度加熱1分鐘左右(3〇〜9〇秒)之條件。其原因在於: ^發明之導電性組成物可於上述條件下充分地形成導電性 被膜,且上述條件於本件技術領域中為低溫短時間之條 件’因此生產性亦優異。 ^者’於該條件下硬化不充分之情料,於輥塗後以 …之狀態於25〇C〜60。〇之乾燥機或保管庫後固化^小 g 29 201219514 時〜數週。 :了蒸發溶劑或分散介質之乾燥及熱硬化使用通常之 風乾燦機、熱風乾燥機、紅外線乾燥機等乾 :時進行乾燥及加熱,必須使用具#加熱手段之乾^ ::風乾燥機、紅外線乾燥機等)。又,作為加熱手段,陕 上述乾燥機之外,亦可接用罝据拍a & 牙' J J使用具備加熱功能之加熱加壓輥、 加壓機等。 私 如上料,本發明t導電性組成物m電性聚合 2、三聚氰胺樹脂衍生物、磺酸硬化觸媒、兩末端聚醚: 聚矽氧、導電性提升劑、及溶劑或分散介質作為必 分’並進而視需要含有水溶性抗氧化劑1濕性提升劑、 消泡劑、黏合劑樹脂、界面活性劑、矽烷偶合劑、增黏:、 微粒子材料等。 - 由該種構成所構成之組成物通常為了防止於三聚氰a 樹脂衍生物之溶液中之自我交聯,而以三聚氰胺樹脂衍: 物與酸性成分分離之狀態而供給(此處,作為顯示酸性之 成分可列舉導電性聚合物或磺酸硬化觸媒等)。 而且,將上述各成分於使用前以一定之比例混合,並 以所有成分混合之狀態而使用。再者,於以鹼等中和酸性 成分之情形時,即便將所有成分以混合之狀態而供給:可 維持保存穩定性。 通常,考慮組成物之適用期及保存穩定性,用於製傷 上述導電性組成物之塗佈液係以三聚氰胺樹脂衍生物與峻 性成分分離之2〜3液之狀態而供給。就成本之觀點 士 30 201219514 該等塗佈液之成分亦可充分濃縮。 上述導電性組成物(塗佈液)之製備方法並 掉’:各成分以機械授拌機或磁力授拌機等授 授 :鐘面混合而製備。此處’上述授掉較佳為持續約二: 或續酸硬化觸 ,故而希望預 再者’攪拌時,為了避免導電性聚合物 媒、進而二聚氰胺樹脂衍生物以高濃度混合 先添加醇等稀釋劑。 兀具疋ϋ含水溶性導電,吐聚合物之溶液盘含 有機溶劑之溶液以高濃度混合,則存在分散穩定性下降而 凝聚、且適用期減少之情形。 ,又,於直接混合三聚氰胺樹脂衍生物與酸性成分之情 形時’由於三聚氰胺之自我交聯容易於溶液中進行故而 存在導電性組成物之適用期縮短之情形。 又’導電性組成物之適關由於亦依賴於組成物之温 度,故而較佳為使液溫保持低於30t而製備。更佳之液溫 為〜5°C〜1(TC。 狐 上述導電性組成物於25t左右之常溫中穩定,但於含 有醆性成分之情形時,有時三聚氰胺樹脂衍生物之自我交 聯於溶液中進行而適用期惡化。 由於適用期依賴於塗佈液之溫度,故而藉由將溫度維 持於一20 C〜20 C進行塗佈,可提高適用期。可尤佳地維 持於一5〇C〜10。(:之溫度塗佈於基材。 將溫度保持越低適用期越提高,於水系導電性組成物S 27 201219514 Aromatic polyamide resin such as polyamide 9T; acrylic resin, polystyrene, acrylonitrile steareth copolymer, acrylonitrile butadiene copolymer, stupid ethylene copolymer, gas vinyl resin, triethyl Cellulose and the like. Further, the above substrate is preferably transparent (having a high light transmittance). Further, in the case of using the optical film as a protective film, it is preferable to use polyethylene terephthalate or triethylene terbene fiber from the viewpoint of processing and workability. Prime. The shape of the substrate is not particularly limited, and may be selected depending on the shape of the optical film. The film shape, the plate shape, and other desired shapes may be mentioned. Therefore, various substrates such as a film and a plate or a molded article can be used for the above substrate. Further, physical treatment such as corona treatment, flame treatment, or electro-hydraulic treatment may be applied to the surface of the substrate. The coating property of the conductive composition can be improved by applying such treatment. The conductive film is formed by using the conductive composition of the present invention, and is formed by applying the conductive composition to a substrate, drying it, and thermally curing the conductive composition. The method of applying the above-mentioned conductive composition to the above-mentioned substrate is not particularly limited, and can be appropriately selected from methods common in the field, and examples thereof include spin coating, gravure coating, bar coating, and dip coating. Coating methods such as curtain coating, die coating, and spray coating. Further, the conductive composition may be applied by a printing method such as screen printing or inkjet printing, letterpress printing, gravure printing or lithography. Further, when the conductive composition is applied, a coating liquid in which the conductive composition is previously diluted with an alcohol or the like may be prepared, and the coating liquid may be applied. 28 201219514 The thickness of the above-mentioned conductive film 1 is not particularly limited, and may be appropriately selected depending on the purpose. From the viewpoint of coating cost, it is preferred that the calculated film thickness after heat drying is 45 nm or less, more preferably 10 to 20 nm. Further, the right weight of the coating liquid and the specific gravity of the film after drying may be approximately 1 Å, and the calculated film thickness can be calculated according to the following calculation formula. Film thickness - concentration of coating liquid (%) + theoretical coating amount of 100X wire rod (β m) "System" Since the coating amount of the wire bar is less than the theoretical value, the actual film thickness is thinner than the calculated value. The conductive film has conductivity because it contains a conductive polymer, and its surface resistivity is preferably 104 to 1 ϋ 11 Ω/□. The reason for this is that if it has the surface resistivity in this range, the shell sufficiently satisfies the required characteristics as an antistatic layer. The conductive film is formed by heating the conductive composition applied to the substrate and evaporating the solvent or the dispersion medium while thermally hardening (drying, hardening). Here, the heating condition is preferably a condition of heating at a temperature of 13 or less (about 8 Torr to 13 (rc) for about 1 minute (3 Torr to 9 sec). The reason is: ^ The conductive composition of the invention The conductive film can be sufficiently formed under the above conditions, and the above conditions are conditions of low temperature and short time in the technical field of the present invention, so that productivity is also excellent. ^ Those who are insufficiently hardened under the conditions are coated with a roll. After the state of ... in 25 ° C ~ 60. Drying machine or storage after the curing ^ small g 29 201219514 hours ~ weeks. : Evaporation solvent or dispersion medium drying and thermal hardening using the usual air drying machine, Hot air dryer, infrared dryer, etc.: When drying and heating, it is necessary to use a dry method with a heating means: ::air dryer, infrared dryer, etc.) Also, as a heating means, in addition to the above dryers, It can also be used to take a & tooth 'JJ using a heating and pressing roller with a heating function, a press machine, etc.. As described above, the t conductive composition of the present invention is electrically polymerized 2, a melamine resin derivative, Sulfonic acid hardening catalyst, two ends : Polyoxane, conductivity enhancer, and solvent or dispersion medium as a must-- and further optionally contain water-soluble antioxidant 1 wetness enhancer, defoamer, binder resin, surfactant, decane coupling agent, Viscosity: Microparticle material, etc. - A composition composed of such a composition is usually separated from an acidic component by a melamine resin in order to prevent self-crosslinking in a solution of a melamine resin derivative. In addition, supply (herein, a component which shows an acidity may be a conductive polymer, a sulfonic acid hardening catalyst, etc.). Moreover, each component mentioned above is mix|blended at a predetermined ratio before use, and it is used by mixing all components. Further, when an acidic component is neutralized with an alkali or the like, even if all the components are supplied in a mixed state, storage stability can be maintained. Usually, the composition period and storage stability of the composition are used for the wounding. The coating liquid of the above-mentioned conductive composition is supplied in a state of 2 to 3 liquids in which the melamine resin derivative and the severe component are separated. From the viewpoint of cost 30 2012195 14 The components of the coating liquids may be sufficiently concentrated. The method for preparing the above-mentioned conductive composition (coating liquid) is omitted: each component is taught by a mechanical mixer or a magnetic mixer: clock face mixing Preparation. Here, the above-mentioned grant preferably lasts for about two: or the acid-hardening touch, so it is desirable to pre-recend the mixture to avoid the conductive polymer medium and the melamine resin derivative at a high concentration. First, a diluent such as an alcohol is added. The cookware contains a water-soluble conductive material, and the solution containing the organic solvent in the solution tray of the spun polymer is mixed at a high concentration, and the dispersion stability is lowered to agglomerate, and the pot life is reduced. In the case of directly mixing a melamine resin derivative with an acidic component, 'the self-crosslinking of melamine is easily carried out in a solution, so that the pot life of the conductive composition is shortened. Further, since the conductivity composition is also dependent on the temperature of the composition, it is preferably prepared by keeping the liquid temperature below 30t. The liquid temperature is preferably ~5°C~1 (TC. The above conductive composition of the fox is stable at room temperature of about 25t, but in the case of containing an inert component, sometimes the melamine resin derivative is self-crosslinked to the solution. The application period is deteriorated. Since the pot life depends on the temperature of the coating liquid, the application period can be improved by maintaining the temperature at a temperature of 20 C to 20 C. It can be preferably maintained at 5 〇C. ~10. (: The temperature is applied to the substrate. The lower the temperature is, the higher the pot life is, the more the water-based conductive composition

S 31 201219514 月形夺低於—2 0 c之溫度組成物有可能結冰。上述導 電性組成物較佳為自製備時起將溫度保持低於3(TC而製 備,更佳為維持於一 5°C〜10°C之溫度。 ,由^種構成所構成之光學膜作為用於液晶顯示器、偏 光,、電致發光顯示器、電漿顯示器、電子呈色顯示器、 太陽電池等之具備抗靜電層之光學膜較佳。 上述光學膜作為保遵膜尤佳,且由本發明之光學 膜構成之保護膜亦為本發明之一。 ^再者,於保護膜之情形時,就加工性及硬度或透明性 等觀點而言,其基材較佳為聚對苯二甲酸乙二酯。 [實施例] 以下,列舉實施例對本發明進行說明,但本發明不限 定於該等實施例。 (實施例1〜27及比較例1〜9 ) 將表1中所示之各成分(使用原料)一面攪拌一面逐 一 Τ加於溶劑或分散介質中。確認添加之成分溶解或均句 地分散後再添加下一成分,添加所有成分後進而攪拌5分 鐘,製備溶液或分散液狀態之熱硬化型導電性塗佈用組成 物。此後,將本組成物以80。/。乙醇稀釋至6倍(1:5,重 量比)而製備塗佈液。 製備該塗佈液後,立即以No.4之線棒(濕膜厚9 v爪) 塗佈於由聚對苯二曱酸乙二酯膜(T〇ray公司製造之 Lumirror T_60(商品名))構成之基材上,並利用熱風乾 燥機於130°C使其乾燥、熱硬化i分鐘,形成導電性被膜。 32 201219514 又’適用期之評價,製備熱硬化型導電性塗佈用組成 物後經過24小時’以相同之方式製作導電性被膜。 (實施例28) 與實施例1〜27相同地,將表2中所示之各成分(使 用原料)逐·--面攪拌一面添加,製備熱硬化型導電性塗 佈用組成物。此後’將本組成物以8 0 %乙醇稀釋至4倍(1 : 3,重量比)而製備塗佈液。 製備該塗佈液後,立即以No.4之線棒(濕膜厚9 y m ) 塗佈於由聚對苯二曱酸乙二酿膜(T〇ray公司製造之 Lumirror T—60(商品名))構成之基材上,並利用熱風乾 燥機於13 0 Τ:使其乾燥、熱硬化1分鐘,形成導電性被膜。 又,適用期之評價’製備熱硬化型導電性塗佈用組成 物後經過24小時,以相同之方式製作導電性被膜。 進而,切割製成之導電性被膜並進行ΤΕΜ觀察。將結 果示於圖1。 圖1係將實施例28中製作之導電性被膜以1 〇萬倍之 倍率拍攝之ΤΕΜ觀察影像。圖丨中,1為導電性被膜,2 為PET膜,圖中右下角出示長度115nm之比例尺。 L使用原料S 31 201219514 The composition of the temperature below -20 c may freeze. Preferably, the conductive composition is prepared by maintaining the temperature below 3 (TC) from the time of preparation, and more preferably at a temperature of from 5 ° C to 10 ° C. The optical film composed of the composition is used as the optical film. It is preferable to use an optical film having an antistatic layer for a liquid crystal display, a polarizing light, an electroluminescence display, a plasma display, an electronic color display, a solar cell, etc. The above optical film is particularly preferable as a film, and the present invention is The protective film composed of the optical film is also one of the inventions. Further, in the case of the protective film, the substrate is preferably polyethylene terephthalate in terms of workability, hardness or transparency. [Examples] Hereinafter, the present invention will be described by way of examples, but the present invention is not limited to the examples. (Examples 1 to 27 and Comparative Examples 1 to 9) The components shown in Table 1 ( The raw materials are added to the solvent or the dispersion medium one by one while stirring. It is confirmed that the added components are dissolved or uniformly dispersed, and then the next component is added, and all the components are added, followed by stirring for 5 minutes to prepare a solution or dispersion state heat. Hardened type A composition for electrical coating. Thereafter, the composition was diluted to 6 times (1:5 by weight) with 80% ethanol to prepare a coating liquid. Immediately after preparation of the coating liquid, No. 4 The wire rod (wet film thickness 9 v claw) was applied to a substrate composed of a polyethylene terephthalate film (Lumirror T_60 (trade name) manufactured by T〇ray Co., Ltd.), and a hot air dryer was used. The film was dried and thermally cured at 130 ° C for 1 minute to form a conductive film. 32 201219514 Further, in the evaluation of the pot life, conductivity was prepared in the same manner after 24 hours from preparation of the thermosetting conductive coating composition. (Example 28) In the same manner as in Examples 1 to 27, each component (using raw material) shown in Table 2 was added while stirring on the surface to prepare a thermosetting conductive coating composition. Thereafter, the composition was prepared by diluting the composition to 4 times (1:3, by weight) with 80% ethanol. Immediately after the preparation of the coating liquid, a wire rod of No. 4 (wet film thickness of 9 μm) was used. ) coated with a polyethylene terephthalate film (Lumirror T-60 (trade name) manufactured by T〇ray Co., Ltd.) On the material, the hot air dryer was used for drying at 130 ° C for 1 minute to form a conductive film. The evaluation of the pot life was carried out 24 hours after the preparation of the thermosetting conductive coating composition. A conductive film was produced in the same manner. Further, the conductive film was cut and observed, and the results are shown in Fig. 1. Fig. 1 shows the conductive film produced in Example 28 at a magnification of 10,000 times. After the filming, the image is observed. In the figure, 1 is a conductive film, 2 is a PET film, and a scale of 115 nm in length is shown in the lower right corner of the figure.

Ll導電性聚合物(a) 含有導電性材料之水分散液,使用由聚(3,4 —乙烯二氧 塞吩)與聚笨乙烯績酸之複合體構成之導電性聚合物之水分 散液即H. c. Starck公司製造之Clevios P (商品名)(1_3 重量%聚(3,4 一乙烯二氧噻吩)/聚苯乙烯磺酸(重量平均分Ll conductive polymer (a) An aqueous dispersion containing a conductive material, and an aqueous dispersion of a conductive polymer composed of a composite of poly(3,4-ethylenedioxythiophene) and polystyrene. That is, Clevios P (trade name) manufactured by H.c. Starck Co., Ltd. (1_3 wt% poly(3,4-ethylenedioxythiophene)/polystyrenesulfonic acid (weight average)

S 33 201219514 子量=150000 )之複合體分散水溶液,水98.7重量。/。)。 1.2三聚氰胺樹脂衍生物(b) 三聚氰胺樹脂衍生物,使用NIPPON CARBIDE工業公 司製造之NIKALAC MW — 390 (全醚型,式(π)中之R9 為甲基’聚合度:1.00 )、NIKALAC MS — 11 (經曱基型, 6〇重量%製品’式(II)中之R9為氫原子,聚合度:1 8〇) 及 Nippon Sytecs Industry Nihon Cytec Industries 公司製造 之Cymel 300 (全醚型,式(II)中之R9為甲基,聚合度: 1.35 )、Cymel 301(全醚型,式(η)中之R9為甲基,聚合 度:1.40 )(上述名稱均為商品名)。 1.3磺酸硬化觸媒(〇) 磺酸硬化觸媒,使用Tayca公司製造之Taycat〇xT—5〇〇 (商品名)(分子量187_2 ;化合物名:異丙苯磺酸;以下 圮作QS ) '花王公司製造之NE〇pELEX GS (商品名)(分 子量326.8 ;化合物名:十二烷基苯磺酸;以下記作dbs )。 又,比較例之一部分中,作為酸觸媒亦使用將和光純藥工 業公司製造之硝酸(分子量63 〇1 ; 6〇重量%製品)稀釋至 2重量%者。 1.4聚醚改質聚矽氧(d) 兩末知聚ϋ改質聚石夕氧,使用T〇ray . D〇w匸价以叫公司 製造之8G29 additive (商品名)、纟榮社化學工#公司製造 之Polyflow KL- 402 (商品名)、或BYK公司製造之byk 〜378 (商品名)。 較例之 σ卩刀’作為側鏈聚醚改質聚石夕氧,亦使用 34 201219514 信越化學工業公司製造之KF — 355A (商品名)、BYK公司 製造之ΒΥΚ — 348 (商品名)及ΒΥΚ — 307 (商品名)、或 Momentive Performance Materials 公司製造之 YF—3842(商 品名)。 1.5水溶性抗氧化劑(g) 水溶性抗氧化劑,使用和光純藥工業公司製造之抗壞 血酸或異抗壞血酸。 .有機/谷劑可 >谷型之抗乳化劑,亦使用Riken vitamin公 司製造之DRYMIXFS—20(商品名)(主成分:維生素E)。 L6導電性提升劑(e) 導電性提升劑,使用和光純藥工業公司製造之N —曱基 口比。各咬酮(以下記作NMP)、二甲基亞硬(以下記作DMSO)、 或乙二醇(以下記作EG)、N一甲基甲醯胺(以下記作 NMF)。 工·7有機溶劑(f) 有機'谷劑,使用和光純藥工業公司製造之1級乙醇。 Ι·8 水(f) 水K之大半係導電性聚合物之水分散體Clevios P所含之 7 ,新添加之水係使用經離子交換處理之純水。 1 2中記載之水係新添加之水。 〉需濕性提升劑(h) σ名)、〖生提升劑,使用BYK公司製造之BYK— 38〇N (商 口0 (化合物名:丙烯酸系共聚物)。 ^10消泡劑(i)S 33 201219514 sub-quant = 15000) The composite dispersion aqueous solution, water 98.7 wt. /. ). 1.2 Melamine resin derivative (b) Melamine resin derivative using NIKALAC MW-390 manufactured by NIPPON CARBIDE Industrial Co., Ltd. (per ether type, R9 in formula (π) is methyl 'degree of polymerization: 1.00), NIKALAC MS - 11 (After the sulfhydryl type, 6〇% by weight of the product 'R9 in the formula (II) is a hydrogen atom, the degree of polymerization: 18 〇) and Cymel 300 manufactured by Nippon Sytecs Industry Nihon Cytec Industries (all ether type, formula (II) R9 is a methyl group, a degree of polymerization: 1.35), Cymel 301 (a full ether type, R9 in the formula (η) is a methyl group, and a degree of polymerization: 1.40) (the above names are all trade names). 1.3 Sulfonic acid hardening catalyst (〇) Sulfonic acid hardening catalyst, Taycat® xT-5 (trade name) manufactured by Tayca Co., Ltd. (molecular weight 187_2; compound name: cumenesulfonic acid; the following Q is QS) NE〇pELEX GS (trade name) manufactured by Kao Corporation (molecular weight 326.8; compound name: dodecylbenzenesulfonic acid; hereinafter referred to as dbs). Further, in one of the comparative examples, nitric acid (molecular weight 63 〇 1 ; 6 〇 wt% product) manufactured by Wako Pure Chemical Industries Co., Ltd. was diluted to 2% by weight as an acid catalyst. 1.4 Polyether modified polyfluorene (d) Both ends of the polycondensate modified polysulfide oxygen, using T〇ray. D〇w匸 price to call the company's 8G29 additive (trade name), Yurongshe Chemicals #公司的聚流流 KL- 402 (trade name), or BYK 378 (trade name) manufactured by BYK. The σ 卩 ' 较 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 作为 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 348 2012 2012 2012 348 — 307 (trade name), or YF-3842 (trade name) manufactured by Momentive Performance Materials. 1.5 Water-Soluble Antioxidant (g) Water-soluble antioxidant, using ascorbic acid or isoascorbic acid manufactured by Wako Pure Chemical Industries, Ltd. The organic/treat agent can be used as an anti-emulsifier for cereals, and DRYMIX FS-20 (trade name) (main component: vitamin E) manufactured by Riken Vitamin Co., Ltd. is also used. L6 conductivity enhancer (e) Conductivity enhancer, using the N-曱 base ratio manufactured by Wako Pure Chemical Industries, Ltd. Each of the ketones (hereinafter referred to as NMP), dimethyl sulfite (hereinafter referred to as DMSO), or ethylene glycol (hereinafter referred to as EG), and N-methylformamide (hereinafter referred to as NMF). Industrial 7 Organic Solvent (f) Organic 'Valley, using grade 1 ethanol manufactured by Wako Pure Chemical Industries, Ltd. Ι·8 Water (f) The majority of water K is a water-dispersion of conductive polymer Clevios P. 7 . The newly added water uses pure water treated by ion exchange. The newly added water in the water system described in 1 2 . 〉Humidity enhancer (h) σ name), “Life enhancer, BYK—38〇N (commercial name: acrylic copolymer) manufactured by BYK. ^10 defoamer (i)

S 35 201219514 消泡劑,使用 Toray . Dow Corning公司製造之 ANTIFOAM 013A (商品名)(化合物名:聚二甲基矽氧烧 之乳化物,以下記作〇 1 3 A )。 I · 11其他添加劑 其他添加劑’使用作為矽烷偶合劑之Momentive ·S 35 201219514 Defoamer, using ANTIFOAM 013A (trade name) manufactured by Toray Corning Co., Ltd. (compound name: polydimethyl oxime emulsion, hereinafter referred to as 〇 13 A). I · 11 other additives Other additives 'Use Momentive as a decane coupling agent ·

Performance . Materials 公司製造之 SIRQUEST A - 189 (商 品名)(化合物名:3 — Μ基丙基三乙氧基石夕炫)、微粒子材 料之曰產化學公司製造之Snowtex 〇xs (商品名)(化合物 名:膠體二氧化石夕之水分散體)、有機緩酸之三菱瓦斯化學 公司製造之Trimellitic Acid (商品名)。 36 201219514 φ料桃:与時 22.80 1 22.30 | | 22.40 | | 23.20 1 I 18.30 I | 22.22 I 1 22.22 1 1 22.22 1 ί 22.22 | • 22.22 I :22.40 I | 22.40 | 1 22.22 I | 22.22 | | 22.20 1 1 22.52 I | 21.78 | 1 21.30 I 1 20.72 I 1 22.25 I 1 22.00 1 I 22.10 1 1 22.15 1 I 22.25 I I 22.22 I I 22.37 I 1 22.22 I 1 22.02 I I 22.12 I I 22.32 I I 22.22 I I 22.22 I I 22.72 I I 22.22 I Ι 22.22 Ι | 22.21 | 1有機溶剤1 s s s § s § § s s S 8 s 8 S S s S S s 8 s s S s g s s s 8 S S 1種類| 1乙酵| ^ 1 1乙酵1 1乙酵| 1 ^ 1 1 ^ 1 1 ^ 1 1乙酵1 1 ^ 1 —乙酵」 1乙酵」 1 ^ 1 1 ^ | 1 ^ | I乙酵ι 1 ^ 1 ϋΙ 1乙酵1 1乙酵l 1 ^ \ 1乙酵1 1 ^ 乙酵1 1乙酵1 |乙酵I ^ 1 乙醇1 乙酵」 ^ I 1乙畔1 nl 1乙酵ι —乙-醇1 乙酵1 1乙酵I 消泡劑 1 Μ 1 1 1 1 1 1 1 1 1 I I 1 1 1 1 1 I 1 1 I 1 1 1 1 1 t 0.01 1種類| 1 1 1 1 1 t 1 1 1 1 1 * 1 1 1 I 1 1 I • 1 1 1 1 1 1 1 1 1 ί 1 1 I | 013A | 濡濕性提升剤 | (Ν 〇 cs o’ rs o rs o fN O’ <N o <Ν Ο <N Ο <N 〇 <N o O’ 1 (N O’ <N O’ fN o <N 〇 <N o (N o <N d fS o rs 〇 <N O’ fN o fS 〇 cs o fS o’ fN 〇 fS o fN O’ fS o fS o CN 〇 fN 〇 <N 〇 CN Ο fN 〇 種類 | ΒΥΚ-380Ν I BYK-380N | BYK-380N | ;BYK-380N I | BYK-380N I 1 BYK-380N I 1 BYK-3S0N 1 1 BYK-380N 1 | BYK-380N I | BYK-380N I | BYK-380N I 1 | BYK-380N I | BYK-380N I | BYK-380N I 1 BYK-380N I | BYK-380N I | BYK-380N I | BYK-380N I 1 BYK-380N I | BYK-380N I | BYK-380N I | BYK-380N | | BYK-380N I 1 BYK-380N I | BYK-380N I I BYK-380N I | BYK-380N I | BYK-380N ] | BYK-380N I 1 BYK-380N I | BYK-380N I | BYK-380N I | BYK-380N I 1 BYK-380N 1 | BYK-380N I 水溶性抗氡化劑| <Ν 〇 〇 cs 6 <N 〇 n o <N 〇 rs ο rs d (N 〇 <N 〇 <N d (N o' o' fN o' tN 〇 «Ν o' ίΝ 〇 <N 〇 (N 〇 <N o' <N 〇 <N 〇 rs O <N 〇 <N 〇· o (N 〇 o' o iN o' fN d fN (N d ο rs o' 種類 | .抗壞血酸| 丨抗壊血酸I i抗壊血酸i |抗壊血酸I |抗壊血酸I |抗壊血酸I 1抗壌血酸ι 1抗壊血酸ι |抗壌血酸1 |抗壊血酸1 1 1抗壊血酸ι l抗壌血酸ι |抗壊血酸ι l抗壊血酸ι 1抗壊血酸ι 1抗壌血酸ι 1抗壞血酸ι l抗壌血酸ι l抗壊血酸ι 1抗壊血酸ι l抗壌血酸ι 1抗壌血酸ι 1抗壊血酸ι 1抗壌血酸ι l抗壊血酸ι l抗壌血酸ι 1抗壌血酸ι l抗壊血酸ι l抗壌血酸ι |抗壊血酸ι I抗壊血酸ι |抗壞血酸ι |異抗壊血酸] 1維生素E 1 1抗壊血酸ι 導電性提升劑| 〇 Ο ο 1 〇· ρ ο ρ ρ ρ p ρ ο ο ο ο ο Ο Ο ο ρ ο ρ ο ρ ρ ρ ρ ρ ρ ο ρ O’ ρ ο q 種類| ΝΜΡ I ί ΝΜΡ 1 1 ΝΜΡ 1 1 1 ΝΜΡ 1 1 ΝΜΡ 1 1 ΝΜΡ 1 1 ΝΜΡ 1 I ΝΜΡ 1 I ΝΜΡ 1 | ΝΜΡ I I ΝΜΡ 1 1 ΝΜΡ 1 I ΝΜΡ 1 1 ΝΜΡ 1 1 ΝΜΡ I I ΝΜΡ 1 1 ΝΜΡ 1 1 ΝΜΡ 1 1 ΝΜΡ 1 ι ΝΜΡ 1 1 ΝΜΡ 1 I ΝΜΡ 1 I ΝΜΡ 1 1 ΝΜΡ 1 I ΝΜΡ 1 I ΝΜΡ 1 I ΝΜΡ 1 I ΝΜΡ 1 I ΝΜΡ 1 1 DMSO 1 1 NMF ] 2 1 ΝΜΡ 1 I ΝΜΡ 1 | ΝΜΡ 1 改質聚矽氧 | ΦΙ 0.20 I 0.20 1 1 ! 0.20 1 1 0.20 1 1 0.20 1 1 0.20 1 1 0.20 1 1 0.20 1 1 0.20 1 | 0.20 I I 0.20 1 1 0.20 1 1 0.20 1 1 0.20 1 1 0.20 I 1 0.20 1 1 0.20 1 I 0.20 1 I 0.20 1 1 0.20 1 1 0.20 1 I 0.20 1 1 0.20 1 1 0.20 1 LmJ 1 0.20 1 I 0.40 1 1 0.30 1 La>°J I 0.20 1 1 0.20 1 | 0.20 I I 0.20 1 I 0.20 1 1 0.20 1 種類 | i BYK-378 I 1 BYK-378 1 1 1 BYK-378 | 1 BYK-378 1 1 ΒΥΚ-348 1 1 YF-3842 1 I KF-355A 1 I ΒΥΚ-307 1 I BYK-378 1 | BYK-378 I 1 BYK-378 1 1 BYK-378 1 ι BYK-378 1 1 BYK-378 1 1 BYK-378 1 ι BYK-378 1 1 BYK-378 1 ι BYK-378 1 I BYK-378 1 ι BYK-378 1 ι BYK-378 1 I BYK-378 1 I BYK-378 ] 1 8029 additive | 1 Polyflow-KL-402 | I Polyflow-KL-402 | I BYK-378 ] I BYK-378 1 1 BYK-378 1 1 BYK-378 I 1 BYK-378 I | BYK-378 I 1 ΒΥΚ-378 1 I BYK-378 1 1 BYK-378 I 磺酸觸媒 | o.io | 1 o.io 1 0.10 I 4.00 0.08 1 ! 0.08 1 1 0.08 1 :0.08 1 1 0.08 1 o.io 1 1 0.08 1 1 0.08 1 ο.】。1 1 0.08 I L〇j8j LmJ Lm〇J 1 0.20 1 Lml 1 0.08 1 | 0.08 I I 0.08 1 1 0.08 1 1 0.08 1 1 0.08 1 | 0.08 I | 0.08 I | 0.08 1 1 0.08 1 1 0.08 1 | 0.08 I 1種類| ί DBS 1 ί 1 DBS 1 | DBS I 1 2%硝酸1 1 DBS 1 1 DBS 1 1 DBS 1 1 DBS 1 1 DBS 1 | DBS 1 1 DBS I 1 DBS 1 1 DBS 1 1 DBS 1 1 DBS I 1 DBS I 1 DBS 1 1 DBS 1 CO 〇 1 DBS | 1 DBS 1 1 DBS | 1 DBS I 1 DBS 1 | DBS I 1 DBS 1 1 DBS | 1 DBS 1 1 DBS | | DBS I | DBS 1 | DBS I 1 DBS 1 1 DBS 1 | DBS 1 三聚氮胺樹脂衍生物| ΦΙ 1 s〇 O’ Ό Ο s〇 o s〇 〇· Ό Ο ο SO d Ό Ο SO o s〇 〇 so o' o' \〇 o SO o o p W-) o fN Ό o o' so o Ό o' Ό o' \〇 d Ό o' so o' Ό 〇 s〇 o' so o Ό d Ό o' d Ό Ο d Ό o' 種類 | 1 Cymel 300 | Cymel 300 | Cymel 300 | :Cymel 300 | ί Cymel 300 | 1 Cymel 300 | 1 Cymel 300 | 1 Cymel 300 | | Cymel 300 | | Cymel 300 | Cymel 300 | | Cymel 301 | 1 MW-390 I T ζΛ S I Cyme! 300 I | Cymel 300 | 1 Cymel 300 I | Cyme! 300 | | Cymel 300 | | Cymel 300 | | Cyme! 300 | | Cymel 300 | | Cymel 300 | | Cymel 300 | | Cymel 300 | | Cymel 300 | | Cymel 300 | | Cymel 300 | | Cymel 300 | | Cymel 300 | | Cymel 300 | | Cymel 300 | I Cymel 300 | 1 Cymel 300 | | Cymel 300 | 導電性聚合物| in vi VI w-i •n »n in •rl w-» m V)’ *r> «Π •Λ »n in in «τ» U-i u-i 種類| Clevios P I Clevios P | Clevios P | Clevios P I 1 Clevios P I Clevios Ρ 1 Clevios Ρ 1 Clevios P | 1 Clevios Ρ 1 I Clevios P I | Clevios P | | Clevios P | I Clevios P I | Clevios P | | Clevios P I Clevios P I | Clevios P | I Clevios P I | Clevios P | | Clevios P | | Clevios P | | Clevios P | | Clevios P | | Clevios P | | Clevios P | | Clevios P | | Clevios P | | Clevios P | Clevios P | Clevios P | Clevios P | Clevios P | Clevios P 1 Clevios Ρ | Clevios P | Clevios P | |比較例i | |比較例2 I |比較例3 1 |比較例4 I |比較例5 I 1比較例6 1 1比較例7 I |比較例8 I 1比較例9 1 1實施例i | 1實施例2 I 丨實施例3 1 |實施例4 I實施例5 |實施例6 |實施例7 丨實施例8 ί |實施例9 ! |實施例丨〇 1 I實施例丨1 ι 丨實施例丨2 1 |實施例丨3 1 丨實施例14 | 丨實施例15 1 丨實施例16 1 |實施例17 1 |實施例18 ! 丨實施例19 |實施例20 丨實施例21 |實施例22 丨實施例23 I實施例24 丨實施例25 丨實施例26 |實施例27 s 201219514 [表2] 單位:重i t份 實施例28 (使用原料) 種類 量 導電性聚合物 Clevios P 10.5 三聚氰胺樹脂衍生物 Cymel 300 0.6 磺酸觸媒 DBS 0.05 改質聚矽氧 BYK-378 0.30 導電性提升劑 NMP 2.0 水溶性抗氧化劑 抗壞血酸 0.1 濡濕性提升劑 BYK-380N 0.05 添加劑1 A-189 0.05 添加劑2 Snowtex OXS 0.05 添加劑3 偏苯三甲酸 0.10 有機溶劑 乙醇 60 水 26.20 II.評價 針對實施例1〜28及比較例1〜9中製備之塗佈液之液 體外觀、使用其而獲得之導電性被膜之被膜外觀、耐刮痕 性、财溶劑性、印刷性、印刷密合性,以下述3等級進行 評價。又,測定SR、Tt、Haze之值。對基材之密合性係依 據JIS K 5 400進行評價。適用期係評價自溶液製備時起經 過24小時之塗佈液及使用該塗佈液而形成之被膜。塗佈液 之適用期考慮到塗佈液之外觀、被膜之外觀、密合性、耐 到痕性、财溶劑性、印刷性、印刷密合性,與初期值相同 地進行評價。另一方面,以下述3等級評價被膜之SR ' Tt、 Haze之測定值自初期值之變動。再者,關於初期評價即便 有1個「X」評價之實施例及比較例亦未對適用期作評價。 評價結果示於下述表3及4。 38 201219514 π · 1導電性塗佈用組成物之外觀 藉由目視以3等級評價製備組成物後之溶液外觀。亦 相同地對適用期進行評價。 ◎:無沈澱物產生 〇:產生少量沈澱物 χ :凝膠化 ΙΙ.2被膜外觀 藉由目視以如下之3等級評價塗佈後之導電性被膜之 外觀(均勻性)。亦相同地對適用期進行評價。 ◎:被膜均勻地塗佈,未見塗佈不均 〇:有少許塗佈不均 χ :由於收縮而未形成被膜 ΙΙ.3表面電阻率/Sr ( Ω/〇 ) 表面電阻率係依據jIS Κ 7 194,使用三菱化學公司製造 之HirestaUP (MCP-HT450型,商品名)之ua探針並於 1 00 V之外加電壓測定,並對測定值進行評價。以如下之3 等級評價適用期相對於初期值之上升倍率。 ◎ : 1 〇倍以下 〇:超過10倍未達100倍 χ : 1 0 0倍以上 II.4總透光率(Tt : % ) 總透光率係依據JIS K 7150使用Suga Test lnstruments 公司製造之Haze Computer HGM — 2B (商品名)進行測定, 並對測定值進行評價。以如下之3等級評價適用期相對於SIRQUEST A - 189 (trade name) manufactured by Performance. Materials (Compound name: 3 - Mercaptopropyl triethoxy sulphur), Snowtex 〇xs (trade name) manufactured by 曰 化学 化工Name: Colloidal silica dioxide aqueous dispersion), Trimellitic Acid (trade name) manufactured by Mitsubishi Gas Chemical Co., Ltd., organic acid retardant. 36 201219514 φ peach: time 22.80 1 22.30 | | 22.40 | | 23.20 1 I 18.30 I | 22.22 I 1 22.22 1 1 22.22 1 ί 22.22 | • 22.22 I : 22.40 I | 22.40 | 1 22.22 I | 22.22 | 1 1 22.52 I | 21.78 | 1 21.30 I 1 20.72 I 1 22.25 I 1 22.00 1 I 22.10 1 1 22.15 1 I 22.25 II 22.22 II 22.37 I 1 22.22 I 1 22.02 II 22.12 II 22.32 II 22.22 II 22.22 II 22.72 II 22.22 I Ι 22.22 Ι | 22.21 | 1 Organic 剤 1 sss § s § § ss S 8 s 8 SS s SS s 8 ss S sgsss 8 SS 1 type | 1 Ethanol | ^ 1 1 Ethanol 1 1 Ethanol | 1 ^ 1 1 ^ 1 1 ^ 1 1 Ethanol 1 1 ^ 1 - Ethanol 1 Ethanol 1 ^ 1 1 ^ | 1 ^ | I Ethanol 1 ^ 1 ϋΙ 1 Ethanol 1 1 Ethanol l 1 ^ \ 1 Ethanol 1 1 ^ Ethanol 1 1 Ethanol 1 | Ethanol I ^ 1 Ethanol 1 Ethanol" ^ I 1 Ethyl 1 nl 1 Ethanol 1 - B-Alcohol 1 Ethanol 1 1 Ethanol I Defoamer 1 Μ 1 1 1 1 1 1 1 1 1 II 1 1 1 1 1 I 1 1 I 1 1 1 1 1 t 0.01 1 type | 1 1 1 1 1 t 1 1 1 1 1 * 1 1 1 I 1 1 I • 1 1 1 1 1 1 1 1 1 ί 1 1 I | 013A | 濡 性 剤 剤 | (Ν 〇cs o' rs o rs o fN O' <N o &l t;Ν Ο <N Ο <N 〇<N o O' 1 (N O' <N O' fN o <N 〇<N o (N o <N d fS o rs 〇<;N O' fN o fS 〇cs o fS o' fN 〇fS o fN O' fS o fS o CN 〇fN 〇<N 〇CN Ο fN 〇 kind | ΒΥΚ-380Ν I BYK-380N | BYK-380N | BYK-380N I | BYK-380N I 1 BYK-380N I 1 BYK-3S0N 1 1 BYK-380N 1 | BYK-380N I | BYK-380N I | BYK-380N I 1 | BYK-380N I | BYK-380N I | BYK-380N I 1 BYK-380N I | BYK-380N I | BYK-380N I | BYK-380N I 1 BYK-380N I | BYK-380N I | BYK-380N I | BYK-380N | | BYK-380N I BYK-380N I | BYK-380N I BYK-380N I | BYK-380N I 1 BYK-380N I 1 BYK-380N 1 | BYK-380N I Water-soluble anti-deuteration agent | <Ν 〇〇cs 6 <N 〇no <N 〇rs ο rs d (N 〇<N 〇<N d (N o' o' fN o' tN 〇«Ν o' ίΝ 〇<N 〇(N 〇<N o' <N 〇<N 〇rs O <N 〇<N 〇· o (N 〇 o' o iN o' fN d fN (N d ο rs o' species | . ascorbic acid | 丨 丨 壊 I i i | | Blood acid I | Ascorbic acid I | Ascorbic acid I 1 anti-ascorbate ι 1 anti-halophilic acid ι | Ascorbic acid 1 | Ascorbic acid 1 1 1 Anti-ascorbic acid ι l anti-blood Acid ι |Anti-Haltoic Acid ι lAnti-Haltic Acid ι 1 Anti-Haltaric Acid ι 1 Anti-Haltic Acid ι 1 Ascorbate ι l Anti-Haltaric Acid ι l Anti-Haltaric Acid ι 1 Anti-Haltic Acid ι l Anti-Aging Blood acid ι 1 anti-ascorbic acid ι 1 anti-ascorbic acid ι 1 anti-ascorbic acid ι l anti-ascorbic acid ι l anti-ascorbic acid ι 1 anti-ascorbic acid ι l anti-ascorbic acid ι l anti-ascorbic acid ι |Anti-ascorbic acid ι I anti-ascorbic acid ι | Ascorbate ι | Iso-anti-ascorbic acid] 1 Vitamin E 1 1 anti-ascorbic acid ι Conductive enhancer | 〇Ο ο 1 〇· ρ ο ρ ρ ρ p ρ ο ο ο ο ο ο ο ο ο ο ο ο ο ο ΝΜΡ 1 I ΝΜΡ 1 | ΝΜΡ II ΝΜΡ 1 1 ΝΜΡ 1 I ΝΜΡ 1 1 ΝΜΡ 1 1 ΝΜΡ II ΝΜΡ 1 1 ΝΜΡ 1 1 ΝΜΡ 1 1 ΝΜΡ 1 ι ΝΜΡ 1 1 ΝΜΡ 1 I ΝΜΡ 1 I ΝΜΡ 1 1 ΝΜΡ 1 I ΝΜΡ 1 I ΝΜΡ 1 I ΝΜΡ 1 I ΝΜΡ 1 I ΝΜΡ 1 1 DMSO 1 1 NMF ] 2 1 ΝΜΡ 1 I ΜΡ 1 | ΝΜΡ 1 Modified polyfluorene | ΦΙ 0.20 I 0.20 1 1 ! 0.20 1 1 0.20 1 1 0.20 1 1 0.20 1 1 0.20 1 1 0.20 1 1 0.20 1 | 0.20 II 0.20 1 1 0.20 1 1 0.20 1 1 0.20 1 1 0.20 I 1 0.20 1 1 0.20 1 I 0.20 1 I 0.20 1 1 0.20 1 1 0.20 1 I 0.20 1 1 0.20 1 1 0.20 1 LmJ 1 0.20 1 I 0.40 1 1 0.30 1 La>°JI 0.20 1 1 0.20 1 | 0.20 II 0.20 1 I 0.20 1 1 0.20 1 Type | i BYK-378 I 1 BYK-378 1 1 1 BYK-378 | 1 BYK-378 1 1 ΒΥΚ-348 1 1 YF-3842 1 I KF-355A 1 I ΒΥΚ-307 1 I BYK-378 1 | BYK-378 I 1 BYK-378 1 1 BYK-378 1 ι BYK-378 1 1 BYK-378 1 1 BYK-378 1 ι BYK-378 1 1 BYK-378 1 ι BYK-378 1 I BYK-378 1 ι BYK-378 1 ι BYK-378 1 I BYK-378 1 I BYK-378 ] 1 8029 additive | 1 Polyflow-KL-402 | I Polyflow-KL-402 | I BYK -378 ] I BYK-378 1 1 BYK-378 1 1 BYK-378 I 1 BYK-378 I | BYK-378 I 1 ΒΥΚ-378 1 I BYK-378 1 1 BYK-378 I Sulfonic acid catalyst | o. Io | 1 o.io 1 0.10 I 4.00 0.08 1 ! 0.08 1 1 0.08 1 : 0.08 1 1 0.08 1 o.io 1 1 0.08 1 1 0.08 1 ο.]. 1 1 0.08 IL〇j8j LmJ Lm〇J 1 0.20 1 Lml 1 0.08 1 | 0.08 II 0.08 1 1 0.08 1 1 0.08 1 1 0.08 1 | 0.08 I | 0.08 I | 0.08 1 1 0.08 1 1 0.08 1 | 0.08 I 1 Category | DB DBS 1 ί 1 DBS 1 | DBS I 1 2% nitric acid 1 1 DBS 1 1 DBS 1 1 DBS 1 1 DBS 1 1 DBS 1 | DBS 1 1 DBS I 1 DBS 1 1 DBS 1 1 DBS 1 1 DBS I 1 DBS I 1 DBS 1 1 DBS 1 CO 〇1 DBS | 1 DBS 1 1 DBS | 1 DBS I 1 DBS 1 | DBS I 1 DBS 1 1 DBS | 1 DBS 1 1 DBS | | DBS I | DBS 1 | DBS I 1 DBS 1 1 DBS 1 | DBS 1 Triazide Resin Derivative | ΦΙ 1 s〇O' Ό Ο s〇os〇〇· Ό Ο ο SO d Ό Ο SO os〇〇so o' o' \〇o SO oop W-) o fN Ό oo' so o Ό o' Ό o' \〇d Ό o' so o' Ό 〇s〇o' so o Ό d Ό o' d Ό Ο d Ό o' Category | 1 Cymel 300 | Cymel 300 | Cymel 300 | 1 Cymel 300 | 1 Cymel 300 | 1 Cymel 300 | 1 Cymel 300 | | Cymel 300 | | Cymel 300 | Cymel 300 | | Cymel 301 | 1 MW-390 IT ζΛ SI Cyme! 300 I | Cymel 300 | 1 Cymel 300 I | Cyme! 300 | | Cymel 300 | | Cymel 300 | | Cyme! 300 | | Cymel 300 | | Cymel 300 | Cymel 300 | | Cymel 300 | | Cymel 300 | | Cymel 300 | | Cymel 300 | | Cymel 300 | | Cymel 300 | | Cymel 300 | I Cymel 300 | 1 Cymel 300 | | Cymel 300 | Polymer | in vi VI wi •n »n in •rl w-» m V)' *r> «Π •Λ »n in in «τ» Ui ui kind | Clevios PI Clevios P | Clevios P | Clevios PI 1 Clevios PI Clevios Ρ 1 Clevios Ρ 1 Clevios P | 1 Clevios Ρ 1 I Clevios PI | Clevios P | | Clevios P | I Clevios PI | Clevios P | | Clevios PI Clevios PI | Clevios P | I Clevios PI | Clevios P | Clevios P | | Clevios P | | Clevios P | | Clevios P | | Clevios P | | Clevios P | | Clevios P | | Clevios P | Clevios P | Clevios P | Clevios P | Clevios P | Clevios P 1 Clevios | | Clevios P | Clevios P | | Comparative Example i | | Comparative Example 2 I | Comparative Example 3 1 | Comparative Example 4 I | Comparative Example 5 I 1 Comparative Example 6 1 1 Comparative Example 7 I | Comparative Example 8 I 1 Comparative Example 9 1 1 Example i | 1 Example 2 I 丨 Example 3 1 | Example 4 I Example 5 | Example 6 | Example 7丨Embodiment 8 ί |Example 9 ! |Example 丨〇1 I Example 丨1 ιExample 丨2 1 |Example 丨3 1 丨Example 14 | 丨Example 15 1 丨Example 16 1 | Example 17 1 | Example 18 ! 丨 Example 19 | Example 20 丨 Example 21 | Example 22 丨 Example 23 I Example 24 丨 Example 25 丨 Example 26 | Example 27 s 201219514 [Table 2 Unit: Heavy Example 28 (Use of raw materials) Type of conductive polymer Clevios P 10.5 Melamine resin derivative Cymel 300 0.6 Sulfonic acid catalyst DBS 0.05 Modified polyfluorene BYK-378 0.30 Conductivity enhancer NMP 2.0 Water Soluble Antioxidant Ascorbic Acid 0.1 Hydrating Lifting Agent BYK-380N 0.05 Additive 1 A-189 0.05 Additive 2 Snowtex OXS 0.05 Additive 3 Trimellitic Acid 0.10 Organic Solvent Ethanol 60 Water 26.20 II. Evaluation For Examples 1 to 28 and Comparative Examples The appearance of the liquid of the coating liquid prepared in 1 to 9, the appearance of the film of the conductive film obtained by using the film, the scratch resistance, the solvent property, the printability, and the printing adhesion were evaluated in the following three grades. Further, the values of SR, Tt, and Haze were measured. The adhesion to the substrate was evaluated in accordance with JIS K 5400. The pot life is a coating liquid which has been subjected to 24 hours from the preparation of the solution and a film formed using the coating liquid. The application period of the coating liquid was evaluated in the same manner as the initial value in consideration of the appearance of the coating liquid, the appearance of the coating film, the adhesion, the scratch resistance, the solvent property, the printability, and the printing adhesion. On the other hand, the change in the measured values of SR ' Tt and Haze of the film from the initial value was evaluated in the following three levels. In addition, in the initial evaluation, even if there is one "X" evaluation example and comparative example, the evaluation period is not evaluated. The evaluation results are shown in Tables 3 and 4 below. 38 201219514 Appearance of π·1 conductive coating composition The appearance of the solution after the preparation of the composition was evaluated by visual observation on a grade of 3. The applicability period is also evaluated in the same way. ◎: no precipitate was produced 〇: a small amount of precipitate was produced χ: gelation ΙΙ. 2 Appearance of the film The appearance (uniformity) of the coated conductive film was evaluated by visual observation in the following three grades. The applicability period is also evaluated in the same manner. ◎: The film was uniformly coated, and no coating unevenness was observed: a slight uneven coating was observed: the film was not formed due to shrinkage. 3 Surface resistivity / Sr (Ω/〇) Surface resistivity was based on jIS Κ 7 194. A ua probe of HirestaUP (MCP-HT450 type, trade name) manufactured by Mitsubishi Chemical Corporation was used, and a voltage was measured at a frequency of 100 V, and the measured value was evaluated. The increase rate of the pot life relative to the initial value is evaluated in the following three levels. ◎ : 1 〇 or less 〇: more than 10 times less than 100 times χ : 100 times or more II.4 total light transmittance (Tt : % ) The total light transmittance is based on JIS K 7150 using Suga Test lnstruments Haze Computer HGM — 2B (trade name) was measured and the measured value was evaluated. Evaluate the pot life relative to the following 3 levels

S 39 201219514 初期值之變化量。 ◎:大於一0.5,未達+0.5 〇:一1,0 〜一0.5 或+0.5 〜+1.〇 x*未達一 1.0或大於+ 1.0 II.5 Haze ( % )S 39 201219514 The amount of change in the initial value. ◎: greater than a 0.5, less than +0.5 〇: a 1,0 ~ a 0.5 or +0.5 ~ +1. 〇 x * not up to 1.0 or greater than + 1.0 II.5 Haze ( % )

Haze 係依據 jis K 7150 使用 Suga Test Instruments 公 司製造之Haze Computer HGM- 2B (商品名)進行測定, 並對測定值進行評價。以如下之3等級評價適用期相對於 初期值之變化量。 ◎:大於一0.5、未達+0.5 〇:一1.0 〜一0.5 或+ 0.5 〜+1.〇 x .未達一1.0或大於+ 1.〇 Η·6對基材之密合性 導電性被膜對基材之密合性係依據JIS κ 54〇〇之柵格 剝離測試進行評價,藉由—定之分數進行評價。以如下之3 等級評價適用期。 ◎:自初期值未變動 〇.自初期值以未達2分之範圍下降 χ :自初期值以2分以上之範圍下降 Π.7耐刮痕性測試 2〇〇 g之負 之形成及粉 斗對形成於基材上之導電性被膜,利用爪c 荷摩擦l〇Cm之長度,以如下之3等級評價傷 之產生。亦相同地對適用期進行評價。 ◎:未形成傷痕 40 201219514 〇:可見較輕之摩擦痕跡,但無粉產生 X :傷痕形成,產生粉 II.8耐溶劑性測試 對形成於基材上之導電性被膜,進行乙醇擦拭測試、 乙酸乙酯擦拭測試、曱基乙基酮(以下記作ΜΕκ)擦栻測 試、己烷擦拭測試。具體而言,利用滲透有各溶劑之無塵 紙(BEMCOT)以約200g之負荷摩擦10cm之長度15欠,γ 如下之3等級評價測試後之被膜外觀。亦相同地對適 進行評價》 ◎:被膜無變化 〇·可見微小之摩擦痕跡 x :被臈剥落 Π.9印刷性測試 性標記油墨 電性被膜之 印刷性測試係使用三菱鉛筆公司製造之油 (Pi:S、細字),以如下之3等級評價印刷於導 表面時之收縮情況。 ◎:所印之字完全未收縮 〇所印之字稍有收縮而不均勻 X .收縮較大,無法印刷 Π·10印刷密合性測試 之油性標記油 1分鐘後使用 視以如下之3 比閃成你…一艽抑萆么、 墨(Pl.S、細字)印刷於導電性被膜^ U約5QGg之負荷進行摩擦, 等級°平價此時之印刷狀態。、Haze was measured according to jis K 7150 using Haze Computer HGM-2B (trade name) manufactured by Suga Test Instruments, and the measured values were evaluated. The amount of change in the pot life relative to the initial value was evaluated in the following three grades. ◎: greater than a 0.5, less than +0.5 〇: a 1.0 ~ a 0.5 or + 0.5 ~ +1. 〇 x. less than a 1.0 or greater than 1. 〇Η · 6 pairs of substrate adhesion conductive film The adhesion to the substrate was evaluated in accordance with the grid peel test of JIS κ 54〇〇, and evaluated by a predetermined score. The pot life is evaluated at the following 3 levels. ◎: Since the initial value has not changed 〇. The initial value has decreased by less than 2 points χ: The initial value has decreased by 2 points or more. 7. 7 Scratch resistance test 2 〇〇g of negative formation and powder The conductive film formed on the substrate was rubbed by the length of the claw c load by 10 Cm, and the damage was evaluated in the following three grades. The applicability period is also evaluated in the same manner. ◎: No scars were formed 40 201219514 〇: Lighter friction marks were observed, but no powder was produced. X: Scar formation, powder II.8 Solvent resistance test The conductive film formed on the substrate was subjected to an ethanol wiping test. Ethyl acetate wiping test, mercaptoethyl ketone (hereinafter referred to as ΜΕκ) rub test, hexane wiping test. Specifically, the appearance of the film after the test was evaluated by using a dust-free paper (BEMCOT) infiltrated with each solvent with a load of about 200 g and a length of 15 cm under a load of 15 cm. The same applies to the evaluation. ◎: No change in the film. 微小 Visible traces of friction x: Peeling off by 臈. 9 Printability test mark The printability test of the ink film is made using oil produced by Mitsubishi Pencil Co., Ltd. ( Pi: S, fine character), the shrinkage at the time of printing on the guide surface was evaluated in the following three grades. ◎: The printed characters are completely uncontracted. The printed characters are slightly shrinked and uneven. X. The shrinkage is large, and it is impossible to print the oily marking oil of the Π10 printing adhesion test. After 1 minute, the following 3 ratios are used. Flashing you... A sigh of relief, ink (Pl.S, fine words) printed on the conductive film ^ U about 5QGg load friction, level ° parity at this time the printing state. ,

S 41 201219514 ◎:無印刷之剝落 〇:印刷留有摩擦之痕跡 X :印刷完全剝落 11.11耐空氣暴露測試 空氣暴露測試係將導電性被膜貼附於壁,以如下3等 級評價1週後之SR。亦相同地對適用期進行評價。 ◎:低於 1χ101()Ω/〇 〇:1χ1010Ω/□以上、低於 1χ10"Ω/〇 X : 1χ10ηΩ/□以上 11.12消泡測試 消泡測試係將塗佈液振盪5次,以如下之4等級評價 直至產生之較大泡沫全部消失為止之時間。亦相同地對適 用期進行評價。 ◎:於20秒以内消泡 〇:超過20秒、於20分鐘以内消泡 △:超過2 0分鐘、於1小時以内消泡 X :即便經過1小時以上亦未消泡 42 201219514 【ε <】 μ >k 〇 〇 〇 X ◎ ◎ ◎ 〇 ◎ 〇 ◎ ◎ ◎ ◎ Ο ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ 也 5 tO X X ◎ ◎ I 〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 绛 UJ 2 X X ◎ ◎ I ◎ ◎ 〇 〇 ◎ ◎ ◎ ◎ ◎ ◎ Ο ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ 鸯 〇 〇 X X 〇 ◎ I 〇 ◎ X X ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ ◎ ◎ 〇 ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ § 〇 X X 〇 ◎ I ◎ ◎ X X ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ ◎ ◎ 〇 ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ *<〇 m 基 ◎ ◎ ◎ ◎ 1 〇 ◎ 〇 〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ £- ◎ ◎ ◎ ◎ 1 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ; X X X ◎ 1 X X X X ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ t. 4μ 银 〇6 Ο Ο 〇 〇 〇 Ο Ο ο Ο ο ο ο Ο ο ο Ο ο Ο ο ο ο Ο ο ο ο ο Ο ο Ο ο ο Ο ο U 封 X ON 〇 <N On Ο <Ν 1 〇 (N O'· <N Ο <Ν Ο ΓΜ ο <Ν 〇\ (Ν σ\ Ον ο fS ο fs Ν (Ν ο is σ; ο ΓΜ ο (Ν <Ν ri ο <Ν ΟΝ O' 〇Ν· 〇Ν· S (Ν ri σ\ Η 口· ο <Ν 90 ε g〇 £ Μ £ 09 ε 1 00 £ 00 ε r- £ 0C ε 00 Μ ε βο ε 00 £ Γ- ε 00 £ 00 £ O' ε 00 £ 00 £ 〇Ν ε 〇Ν £ 00 £ 00 £ 00 £ 〇\ 00 £ Ρ» £ Μ ε 00 00 ε 00 ε r- £ βο ε ββ ν〇 £ b X r**' "ο ΓΛ ο X οΰ 1 ~°〇 X ΙΛ V0 : σ\ Η ΓΛ "ο X «Λ rS ·°ο X "ο Π’ •b 1= νο "ο -¾ «Λ ·°ο 〇\ •Λ "ο X 00 "ο σ; 00 X γ4 "ο X 00 «Λ "ο X Γ- •b 1 •b X "ο X 00 ό' ri X 3< X X pg "ο 00 "ο X κ ~k 瑤 ◎ 〇 ◎ ◎ 1 ◎ ◎ ◎ 〇 ◎ ◎ 〇 ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ 〇 〇 ◎ 〇 1 〇 ◎ 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 Ο 〇 〇 〇 〇 〇 ◎ 〇 U 女 〇 〇 Ο 〇 X ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ jj (N A} cn 耷 rr A3 m 〇 τ 耷 jj 卜 id 00 σ\ 〇J 4κ (Ν m *Κ «η 省 NO 卜 *κ 00 嫜 V © «Κ 4κ Γ*Ί V V «/ϊ Ό Γ>» V: 00 嫁 V: 〇\ *« 婼 fN <Ν V ί*1 <Ν ν «Λ <Ν 鸯 V VC ΓΊ Ρ; 00 <Ν s 201219514 〔寸<】 /* ί e 1 4 Μ m 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 * 1 1 1 1 1 1 ( 1 1 ο t ΐτ d 〇\ 00 v〇 耷 od 00 O' «Λ 00 〇 V» 〇 ΓΊ 〇 00 00 CM νο «£> 0< ή <Ν m 1 楼 4 糾 1 1 1 1 1 1 1 1 t ◎ 〇 ◎ ◎ ◎ 〇 〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ 逛 rO 1 1 1 1 1 t 1 1 1 ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ¥ 鸯 S 1 1 1 1 1 t 1 1 1 ◎ ◎ ◎ ◎ ◎ 〇 〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ 〇 瘅 错 〇 想 〇 1 1 1 1 1 1 1 1 ◎ ◎ ◎ ◎ ◎ 〇 〇 ◎ ◎ ◎ ◎ 〇 ◎ ◎ ◎ 〇 ◎ ◎ ο ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ § 〇 1 1 1 1 1 1 1 1 1 ◎ ◎ ◎ ◎ ◎ 〇 〇 〇 〇 〇 〇 〇 ◎ ◎ ◎ 〇 ◎ ◎ 〇 ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ο <0 银 S· 1 1 1 1 1 1 1 1 1 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ti £- 1 1 1 1 1 1 1 1 1 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ti 嚓 1 1 1 \ 1 1 1 1 1 ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ·<〇 银 1 1 1 1 1 1 1 I 1 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 1 X 1 1 1 1 1 1 t 1 1 ◎ ◎ ◎ 〇 〇 〇 ◎ ◎ ◎ 〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ 〇 ◎ ◎ ◎ ◎ 〇 ◎ ◎ Η 1 1 1 1 1 1 1 1 1 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 1 1 1 1 1 1 1 1 1 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 〇 〇 〇 ◎ ◎ ◎ ◎ 〇 ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ ◎ ◎ ◎ 女 薄 1 1 1 1 1 1 1 1 1 ◎ ◎ ο ◎ ◎ 〇 ◎ ◎ 〇 〇 ◎ 〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ Μ 运 Μ m 1 1 1 1 1 \ 1 1 1 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 ◎ 〇 女 1 1 1 1 t 1 1 1 1 ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ΓΊ 5 S « Jj m 5 s SO 罢 s !>· 玄 A} 00 Jj 〇\ IK ΓΊ m 鸯 Tf *n NO r- 00 <3\ % 〇 ί 'Τ •Λ NO Γ- 1«: 00 On Γ'ί fS 海 ί Μ 堤 201219514 根據比較例1〜4及實施例1〜3,报明gg 一 很明顯,若即便缺少 三聚氛胺樹脂衍生物、績酸硬化觸媒、兩末端聚驗改質聚 矽氧、導電性提升劑中之一者,則被臈外觀、導電性、總 透光率、Haze、對基材之密合性、耐到痕性、耐溶劑性、S 41 201219514 ◎: No peeling of printing 〇: traces of friction left on printing X: complete peeling of printing 11.11 Air resistance test Air exposure test system attaches conductive film to the wall, and evaluates SR after 1 week as follows: . The applicability period is also evaluated in the same manner. ◎: less than 1χ101()Ω/〇〇:1χ1010Ω/□ or more, less than 1χ10"Ω/〇X : 1χ10ηΩ/□ or more 11.12 Defoaming test Defoaming test system oscillates the coating liquid 5 times as follows The rating is evaluated until the time when the larger bubbles are all gone. The applicability period is also evaluated in the same manner. ◎: Defoaming within 20 seconds: Defoaming within 20 minutes and over 20 minutes △: Defoaming within 1 hour over 20 minutes X: Not defoaming even after 1 hour or more 42 201219514 [ε < μ & 〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ J UJ 2 XX ◎ ◎ I ◎ ◎ 〇〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ 〇 〇 I I I ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ & 基 基 ◎ ◎ ◎ ◎ 1 〇 ◎ 〇〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ t. 4μ Silver 〇 6 U Ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο ο O'· <N Ο <Ν Ο ΓΜ ο <Ν 〇\ (Ν σ\ Ον ο fS ο fs Ν (Ν ο is σ; ο ΓΜ ο (Ν <Ν ri ο <Ν ΟΝ O' 〇Ν· 〇Ν· S (Ν ri σ\ Η口· ο <Ν 90 ε g〇£ Μ £ 09 ε 1 00 £ 00 ε r- £ 0C ε 00 Μ ε βο ε 00 £ Γ- ε 00 £ 00 £ O' ε 00 £ 00 £ 〇Ν ε 〇Ν £ 00 £ 00 £ 00 £ 〇 00 £ Ρ» £ Μ ε 00 00 ε 00 ε r- £ βο ε ββ ν〇£ b X r**' "ο ΓΛ ο X οΰ 1 ~°〇X ΙΛ V0 : \ Η ΓΛ "ο X «Λ rS ·°ο X "ο Π' •b 1= νο "ο -3⁄4 «Λ ·°ο 〇\ •Λ "ο X 00 "ο σ; 00 X Γ4 "ο X 00 «Λ "ο X Γ- •b 1 •b X "ο X 00 ό' ri X 3< XX pg "ο 00 "ο X κ ~k 瑶 ◎ 〇 ◎ ◎ 1 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇〇 ◎ 〇 1 〇 ◎ 〇〇〇〇〇〇〇〇〇〇〇 〇〇〇〇〇〇〇〇〇〇〇Ο 〇〇〇〇〇 〇 〇 〇〇Ο 〇〇Ο ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ jj (NA} cn 耷rr A3 m 〇τ 耷jj id 00 σ\ 〇J 4κ (Ν m *Κ «η省NO 卜*κ 00 嫜V © «Κ 4κ Γ* Ί VV «/ϊ Ό Γ>» V: 00 Marry V: 〇\ *« 婼fN <Ν V ί*1 <Ν ν «Λ <Ν 鸯V VC ΓΊ Ρ; 00 <Ν s 201219514 〔 Inch<] /* ί e 1 4 Μ m 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 * 1 1 1 1 1 1 ( 1 1 ο t ΐτ d 〇\ 00 v〇耷od 00 O' «Λ 00 〇V» 〇ΓΊ 〇00 00 CM νο «£>0< ή <Ν m 1 Building 4 Correction 1 1 1 1 1 1 1 1 t ◎ 〇 ◎ ◎ ◎ 〇〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 鸯 1 1 1 1 1 1 1 1 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ 〇瘅 〇 〇 〇 1 1 1 1 1 1 1 1 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ § 1 1 1 1 1 1 1 1 1 1 ◎ ◎ ◎ ◎ ◎ 〇 〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ο lt lt 0 0 0 0 0 0 0 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ti 1 1 1 1 \ 1 1 1 1 1 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ · · · 〇 Silver 1 1 1 1 1 1 1 I 1 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 1 X 1 1 1 1 1 1 1 1 1 ◎ ◎ ◎ 〇〇〇 〇〇〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ Female thin 1 1 1 1 1 1 1 1 1 ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ 〇〇 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 〇 ◎ ◎ Μ Μ m 1 1 1 1 1 \ 1 1 1 〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇〇 ◎ prostitute 1 1 1 1 t 1 1 1 1 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ΓΊ 5 S « Jj m 5 s SO s s ! > · Xuan A} 00 Jj 〇\ IK ΓΊ m 鸯Tf *n NO r- 00 <3\ % 〇ί 'Τ •Λ NO Γ- 1«: 00 On Γ'ί fS Sea Μ 堤 201219514 According to Comparative Examples 1 to 4 and implementation In Examples 1 to 3, it is obvious that gg is obvious, even if it lacks one of the trimeric amine resin derivative, the acid-hardening catalyst, the two-end polymerization modified polyoxane, and the conductivity enhancer,臈 appearance, conductivity, total light transmittance, Haze, adhesion to substrates, resistance to traces, solvent resistance,

印刷性、印刷密合性無法全部同時滿足。若無導電性聚A 物及導電性提升劑’則不表現SR,若無三聚氰胺樹脂衍: 物及績酸硬化觸媒則被膜不硬化。兩末端聚鍵改質聚石夕氧 係用於使耐到痕性與印刷性、印刷密合性並存之必+成八 根據實施例i及4〜6,很明顯,三聚氰胺樹^衍生力物 為全醚型者塗佈液之穩定性優異,且24小時後之塗膜之物 性亦不下降。 根據實施例U7〜10,很明顯,存在若三聚氰胺樹脂 衍生物之含量增多則適用期惡化之傾向,若相對於導電性 聚合物固形分100重量份少於15〇重量份,則自初期起耐 溶劑性較低。 根據比較例5及實施例8,很明顯硬化觸媒較佳為確 酸’進而根據實施例U,很明顯,由於使用Qs時塗佈液之 適用期少許惡化,24小時後存在特性下降之部分,故而作 為硬化觸媒尤佳為DB S。 進而’根據實施例i及12〜15,很明顯,其含量相對 於三聚氰胺樹脂衍生物100重量份為4〇重量份以下之情況 於適用期之維持方面較佳。 ' 根據實施例1及16〜18,很明顯,為了同時滿足耐刮 痕性與印刷性及印刷密合性必須使用兩末端聚醚改質聚矽Printability and print adhesion cannot be satisfied at the same time. If there is no conductive polyA and conductivity enhancer, then SR is not exhibited. If there is no melamine resin derivative and the acid-curing catalyst, the film is not cured. The two-end poly-bonded polysulfate system is used to make the trace resistance and printability and print adhesion coexist. According to Examples i and 4 to 6, it is obvious that the melamine tree is derived. The coating liquid of the all-ether type is excellent in stability, and the physical properties of the coating film after 24 hours are not lowered. According to the examples U7 to 10, it is apparent that the application period is deteriorated if the content of the melamine resin derivative is increased, and if it is less than 15 parts by weight relative to 100 parts by weight of the conductive polymer solid content, it is resistant from the initial stage. Low solvent. According to Comparative Example 5 and Example 8, it is apparent that the hardening catalyst is preferably acid. Further, according to Example U, it is apparent that the application period of the coating liquid is slightly deteriorated due to the use of Qs, and the characteristic property is deteriorated after 24 hours. Therefore, as a hardening catalyst, it is especially good for DB S. Further, according to Examples i and 12 to 15, it is apparent that the content is preferably 4 parts by weight or less based on 100 parts by weight of the melamine resin derivative, which is preferable in terms of maintenance of the pot life. According to Examples 1 and 16 to 18, it is apparent that in order to satisfy both scratch resistance and printability and print adhesion, it is necessary to use a two-end polyether modified polyfluorene.

45 S 201219514 氧’即便如比較例6〜9般使用側鏈聚醚改質聚矽氧,亦無 法同時滿足耐刮痕性與印刷性及印刷密合性。 進而,實施例1及比較例9使用之聚醚改質聚矽氧係 均與聚二甲基矽氧烷之分子量大致相同程度、改質部位不 同結構者。而且,實施例1為兩末端聚醚改質聚矽氧,可 同時滿足耐刮痕性、耐溶劑性、印刷性及印刷密合性,相 對於此,比較例9之側鏈聚醚改質聚矽氧則無法同時滿足。 根據該結果,很明顯,藉由使用兩末端聚醚改質聚矽氧作 為聚醚改質聚矽氧’特異性地實現本發明之效果。 又’根據實施例1及19〜21,很明顯,兩末端聚醚改 質聚矽氧之含量相對於三聚氰胺樹脂衍生物丨〇〇重量份為 60重量份以下之情況於耐溶劑方面性較佳。 根據實施例1及22〜24,很明顯,藉由使用具有醢胺 基、羥基、磺基之化合物作為導電性提升劑,進一步提高 導電性被膜之導電性。 ♦若將實施例1、25與實施例2進行比較,則很明顯, 藉由添加水溶性抗氧化劑之抗壞血酸或異抗壞血酸,可抑 制暴露於空氣之SR上升。又,如實施例26般之油溶性抗 氧化劑未見該種效果。 —又’實施例3中確認少許之收縮,若與其他實施例進 行比較,則很明顯,含有濡濕性提升 進而,根據實施例27,很明顯,藉由添加消泡劑^有效 地對產生之泡洙進行消泡。 又’根據㈣例28及圖i ’报明顯’將以計算膜厚計 46 201219514 約3〇nm之被膜以TEM進行分析,結果實際測量約為 已知’於本條件下成膜之組成物之膜厚遠遠薄於計 B yia η. ' 本發明之導電性組成物由於可於低溫短時間内形成同 時滿足耐刮痕性、耐溶劑性、印刷性及印刷密合性之導電 與 故而可較佳地用於形成例如構成保護膜等各種光 子膜等之導電性被膜(抗靜電層)等。 【圖式簡單說明】 28中製作之導電 圖1係以10萬倍之倍率拍攝實施例 性被骐之ΤΕΜ觀察影像。 【主要元件符號說明】 1導電性被膜 2 ρΕΤ 膜45 S 201219514 Oxygen As the side chain polyether modified polyfluorene was used as in Comparative Examples 6 to 9, the scratch resistance, printability, and printing adhesion could not be satisfied at the same time. Further, in the first embodiment and the comparative example 9, the polyether modified polyfluorene oxide was used to have substantially the same molecular weight as that of the polydimethylsiloxane, and the modified portion had a different structure. Further, Example 1 is a polyether modified polyfluorene at both ends, which satisfies both scratch resistance, solvent resistance, printability, and printing adhesion. On the other hand, the side chain polyether of Comparative Example 9 is modified. Polyoxyl cannot be satisfied at the same time. From the results, it is apparent that the effects of the present invention are specifically achieved by using the two-end polyether modified polyfluorene as a polyether modified polyfluorene. Further, according to Examples 1 and 19 to 21, it is apparent that the content of the polyether modified polyfluorene at both ends is preferably 60 parts by weight or less relative to the melamine resin derivative by weight of 60 parts by weight or less. . According to Examples 1 and 22 to 24, it is apparent that the conductivity of the conductive film is further improved by using a compound having a mercapto group, a hydroxyl group or a sulfo group as a conductivity improving agent. ♦ Comparing Examples 1, 25 with Example 2, it is apparent that the addition of ascorbic acid or isoascorbic acid of a water-soluble antioxidant can suppress the SR rise of exposure to air. Further, such an effect was not observed in the oil-soluble antioxidant as in Example 26. - Again, a slight shrinkage was confirmed in Example 3. If compared with other examples, it is obvious that the wettability is improved. Further, according to Example 27, it is apparent that the antifoaming agent is effectively added. The bubble is defoamed. In addition, according to (4) Example 28 and Figure i 'reported', the film with a calculated film thickness of 46 201219514 and about 3 〇 nm was analyzed by TEM, and the actual measurement was about the composition known as 'film formation under these conditions. The film thickness is much thinner than that of B yia η. The conductive composition of the present invention can be formed at a low temperature for a short period of time while satisfying the scratch resistance, solvent resistance, printability, and print adhesion. It is preferably used to form, for example, a conductive film (antistatic layer) or the like which constitutes various photonic films such as a protective film. [Simple diagram of the diagram] Conductivity produced in Fig. 1 is an example of an image taken at an altitude of 100,000 times. [Main component symbol description] 1 conductive film 2 ρΕΤ film

47 S47 S

Claims (1)

201219514 七、申請專利範圍: 1. 一種熱硬化型導電性塗佈用組成物,含有: (a )導電性聚合物、 (b )三聚氰胺樹脂衍生物、 (c )磺酸硬化觸媒、 (d)兩末端聚醚改質聚矽氧、 (e )導電性提升劑、及 (f)溶劑或分散介質。 2. 如申明專利範圍第丨項之熱硬化型導電性塗佈用組 成物’其中’導電性聚合物(a)為具有下述式⑴之重複 結構之聚(3,4 —二烷氧基噻吩)或聚(3,4 —伸烷二氧基噻吩) 與摻雜物之複合體,201219514 VII. Patent application scope: 1. A thermosetting conductive coating composition comprising: (a) a conductive polymer, (b) a melamine resin derivative, (c) a sulfonic acid hardening catalyst, (d a two-end polyether modified polyfluorene oxide, (e) a conductivity enhancer, and (f) a solvent or dispersion medium. 2. The thermosetting conductive coating composition 'in which' the conductive polymer (a) is a poly(3,4-disalkoxy group having a repeating structure of the following formula (1), as claimed in the ninth aspect of the invention. a complex of thiophene) or poly(3,4-desalkyldioxythiophene) with a dopant, (式中’ R1及R2相互獨立表示氫原子或Cl-*之烷基, 或一併表示可經取代之(:卜4之伸烷基 3·如申請專利範圍第1項或第2項之熱硬化型導電性塗 佈用組成物,其中,三聚氰胺樹脂衍生物(b )之含量相對 於導電性聚合物100重量份為〜75〇重量份。 4.如申請專利範圍第1項至第3項中任一項之熱硬化型 導電性塗佈用組成物,其中,磺酸硬化觸媒(c )為芳香族 績酸, 48 201219514 其含量相對於三聚氰胺樹脂街生物⑽重量份為8〜4() 重量份。 5.如申請專利範圍第!項至第4項中任一項之熱硬化型 導電性塗佈用組成物,其中,兩末端聚越改質聚石夕氧⑷ 之含置相對於三聚氰胺樹脂衍生物1⑼重量 〇〜 量份。 重 ^6.如中請專利範圍第1項至第1項中任—項之熱硬化型 導電性塗佈用組成物,其十,導電性提升劑⑴為具有醯 胺基、磺基及羥基中之至少!種取代基的化合物。 7.如申請專利範圍第!項至第6項中任—項之熱硬化型 導電性塗佈用組成物’進而含有(g)水溶性抗氧化劑。 ^申請專利範圍帛7項之熱硬化型導電性塗佈用組 成物,其t,水溶性抗氧化劑(g)為抗壞血酸或異抗壞血 酸。 9·如申請專利範㈣丨項至“項中任—項之熱硬化型 導電性塗佈用組成物’進而含有⑴儒濕性提升劑。 1〇·如申請專利範圍帛i項至第9項中任一項之熱硬化 型導電性塗佈用組成物,進而含有(i)消泡劑。 U·如申請專利範圍第10項之熱硬化型導電性塗佈用 組成物’其中,消泡劑(i)為聚矽氧乳化液。 、I2. 一種光學膜’係由基材與積層於該基材上之導電性 被膜構成’其特徵在於: 該導電性被膜係使用申請專利範圍帛i項至第u項中 任-項之熱硬化型導電性塗佈用組成物而形成。 49 1 201219514 13. 如申請專利範圍第12項之光學膜,其中,該導電性 被膜係藉由將該熱硬化型導電性塗佈用組成物塗佈於該基 材,並於13(TC以下之溫度使其乾燥、熱硬化而形成。 14. 如申請專利範圍第12項或第13項之光學膜,其中, 該導電性被膜之計算膜厚未達45nm。 種保δ蔓膜’係由申請專利範圍第12項至第14項 中任一項之光學膜構成。 50(wherein R1 and R2 independently of each other represent a hydrogen atom or an alkyl group of Cl-*, or a combination thereof may be substituted (: a 4-alkyl group of the group 4), as in the first or second aspect of the patent application. The composition for a thermosetting conductive coating composition, wherein the content of the melamine resin derivative (b) is 〜75 重量重量份 based on 100 parts by weight of the conductive polymer. 4. The scope of claims 1 to 3 The thermosetting conductive coating composition according to any one of the preceding claims, wherein the sulfonic acid hardening catalyst (c) is an aromatic acid, 48 201219514, the content of which is 8 to 4 parts by weight relative to the melamine resin street organism (10) by weight. The heat-curable conductive coating composition according to any one of the above-mentioned items of the present invention, wherein the two ends are aggregated and modified to contain oxygen (4) The composition of the thermosetting conductive coating composition of the melamine resin derivative 1 (9) is 〇 量 重量 重量 重量 重量 重量 重量 重量 重量 重量 重量 重量 重量 重量 重量 重量 重量 重量 重量 重量 重量 重量 重量 重量 重量 重量 重量 重量 重量The enhancer (1) is a substituent having at least one of a mercapto group, a sulfo group and a hydroxyl group. 7. The thermosetting conductive coating composition 'in any one of the above-mentioned items to claim 6' further contains (g) a water-soluble antioxidant. ^ Patent Application No. 7 A composition for thermosetting conductive coating, wherein t, the water-soluble antioxidant (g) is ascorbic acid or isoascorbic acid. 9. If the patent application (4) is applied to the thermosetting conductive coating of the item The composition for the fabric of the present invention further comprises (1) a composition for the thermosetting conductive coating according to any one of the above claims, further comprising (i) a consumer. U. The thermosetting conductive coating composition of claim 10, wherein the antifoaming agent (i) is a polyoxymethylene emulsion. I2. An optical film is made of a substrate. The conductive film is formed of a conductive film laminated on the substrate. The conductive film is formed by using a thermosetting conductive coating composition according to any one of the above claims. 49 1 201219514 13. Optical film as in claim 12 In the conductive film, the thermosetting conductive coating composition is applied to the substrate, and dried at a temperature of TC or lower and thermally cured. The optical film of item 12 or 13, wherein the conductive film has a calculated film thickness of less than 45 nm. The seed δ vine film is an optical of any one of claim 12 to 14 Membrane composition. 50
TW100137819A 2010-10-29 2011-10-19 A thermosetting type conductive coating composition, an optical film, and a protective film TWI518154B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010243352A JP5776957B2 (en) 2010-10-29 2010-10-29 Thermosetting conductive coating composition, optical film and protective film

Publications (2)

Publication Number Publication Date
TW201219514A true TW201219514A (en) 2012-05-16
TWI518154B TWI518154B (en) 2016-01-21

Family

ID=45993631

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100137819A TWI518154B (en) 2010-10-29 2011-10-19 A thermosetting type conductive coating composition, an optical film, and a protective film

Country Status (5)

Country Link
JP (1) JP5776957B2 (en)
KR (1) KR101921346B1 (en)
CN (1) CN103237852B (en)
TW (1) TWI518154B (en)
WO (1) WO2012056906A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI810433B (en) * 2019-02-15 2023-08-01 日商櫻宮化學股份有限公司 Thermosetting Release Coatings and Thermosetting Release Coating Sets
TWI837233B (en) * 2018-12-05 2024-04-01 日商琳得科股份有限公司 Composite sheet for forming protective film and manufacturing method of semiconductor chip

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5919095B2 (en) * 2012-05-31 2016-05-18 信越ポリマー株式会社 Conductive polymer paint and conductive coating film
JP6050632B2 (en) * 2012-08-06 2016-12-21 リンテック株式会社 Conductive composition and electrical device
US20140065400A1 (en) * 2012-08-29 2014-03-06 Eastman Chemical Company Electrically conductive polymer compositions and films
WO2014186802A1 (en) 2013-05-17 2014-11-20 Biotectix, LLC Impregnation of a non-conductive material with an intrinsically conductive polymer
JP6325364B2 (en) * 2014-06-18 2018-05-16 マクセルホールディングス株式会社 Transparent conductive coating composition, transparent conductive sheet and method for producing the same, and transparent conductive pattern forming method
US10731041B2 (en) 2014-11-19 2020-08-04 Heraeus Medical Components Llc Conductive polymer coatings for three dimensional substrates
JP6299829B2 (en) * 2015-10-20 2018-03-28 荒川化学工業株式会社 Thermosetting release coating agent, release film and release polyethylene terephthalate film
JP7102118B2 (en) * 2017-09-29 2022-07-19 マクセル株式会社 A transparent conductive film, a coating composition for forming a transparent conductive film, and a method for producing a transparent conductive film.
JP2019069541A (en) 2017-10-06 2019-05-09 日東電工株式会社 Film with top coat layer, surface protection film, and optical component
CN111372515B (en) * 2018-01-15 2023-03-24 Nok株式会社 Bioelectrode
KR20200015881A (en) * 2018-08-03 2020-02-13 아라까와 가가꾸 고교 가부시끼가이샤 Water-based antistatic releasing coating composition and antistatic releasing film
CN109913142B (en) * 2019-03-01 2021-12-10 苏州格睿光电科技有限公司 Antistatic organic silicon pressure-sensitive adhesive product

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2785136B2 (en) 1989-06-29 1998-08-13 チッソ株式会社 Conductive resin composition
JPH04334805A (en) * 1991-05-11 1992-11-20 Kao Corp Conductive paste and conductive coating film
JP3294774B2 (en) * 1996-11-26 2002-06-24 関西ペイント株式会社 Paint composition and coated metal plate using the same
JP2004256702A (en) * 2003-02-26 2004-09-16 Toyobo Co Ltd Conductive coating
JP4672600B2 (en) * 2006-05-31 2011-04-20 大日精化工業株式会社 Antistatic film and coating material for forming antistatic layer
JP2007324142A (en) * 2007-08-15 2007-12-13 Nissan Chem Ind Ltd Conductive coating composition
JP2009107329A (en) * 2007-10-10 2009-05-21 Jsr Corp Surface protective film
JP5176162B2 (en) * 2007-12-04 2013-04-03 ナガセケムテックス株式会社 Low temperature thermosetting conductive coating composition
JP5460008B2 (en) * 2008-09-24 2014-04-02 信越ポリマー株式会社 Conductive polymer solution, conductive coating film and input device
JP5594455B2 (en) * 2008-09-30 2014-09-24 ナガセケムテックス株式会社 Low temperature thermosetting conductive coating composition
JP2010083940A (en) * 2008-09-30 2010-04-15 Nagase Chemtex Corp Method for preventing electrification of polyamide film, antistatic film and manufacturing method of the same
JP5509462B2 (en) * 2009-02-27 2014-06-04 ナガセケムテックス株式会社 Composition for conductive coating

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI837233B (en) * 2018-12-05 2024-04-01 日商琳得科股份有限公司 Composite sheet for forming protective film and manufacturing method of semiconductor chip
TWI810433B (en) * 2019-02-15 2023-08-01 日商櫻宮化學股份有限公司 Thermosetting Release Coatings and Thermosetting Release Coating Sets

Also Published As

Publication number Publication date
KR101921346B1 (en) 2018-11-22
WO2012056906A1 (en) 2012-05-03
JP2012097132A (en) 2012-05-24
JP5776957B2 (en) 2015-09-09
TWI518154B (en) 2016-01-21
KR20130132449A (en) 2013-12-04
CN103237852B (en) 2016-04-06
CN103237852A (en) 2013-08-07

Similar Documents

Publication Publication Date Title
TW201219514A (en) Composition for heat-curable conductive coatings, optical film and protective film
JP5945881B2 (en) Antistatic release agent composition and release film
TWI321578B (en) Anti-static polyester film
JP2012097132A5 (en)
US10872709B2 (en) Method for producing polyaniline complex composition and polyaniline complex composition
US20120061625A1 (en) Transparent conductive films, compositions, articles, and methods
TW201224086A (en) Electroconductive coating composition and laminate
TW201730257A (en) Composition for forming transparent conductor and transparent conductor made therefrom
WO2014038626A1 (en) Antistatic release agent and antistatic release film
KR100957694B1 (en) Biodegradable sheet having an antistatic finishing property and excellent transparency and manufacturing method thereof
JP2012172024A (en) Composition for electroconductive coating, electroconductive thin film, and electroconductive film
JP2017119841A (en) Interlayer composition for electronic printing
JP6117729B2 (en) Conductive resin composition and planar heating element
JP5984054B2 (en) Organic conductive film
JP2006282942A (en) Transparent electroconductive coating composition, transparent electroconductive film obtained by applying the same and method for producing the same
JP2014177515A (en) Transparent electroconductive coating composition, and transparent electroconductive film
JP6182815B2 (en) Conductive polymer membrane
WO2014115807A1 (en) Composition for antistatic peeling agent, and antistatic peelable film
KR20130020608A (en) Organic conductive film
CN109575760A (en) The manufacturing method of transparent and electrically conductive film, the coating composition for being used to form transparent and electrically conductive film and transparent and electrically conductive film
KR20150136451A (en) Conductive Ink composition comprising conductive polymer
KR100772926B1 (en) Conductive polymer composition, conductive polymer film prepared from the composition and organic electronic devise using the same
JP6824524B2 (en) Siloxane-based liquid antistatic agent composition
WO2024080197A1 (en) Conductive composition, conductive material, conductive film, and conductive article
JP2023091989A (en) Conductive polymer dispersion, conductive laminate and method for producing the same