TWI541304B - Conductive coating composition and laminate - Google Patents

Conductive coating composition and laminate Download PDF

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TWI541304B
TWI541304B TW100138442A TW100138442A TWI541304B TW I541304 B TWI541304 B TW I541304B TW 100138442 A TW100138442 A TW 100138442A TW 100138442 A TW100138442 A TW 100138442A TW I541304 B TWI541304 B TW I541304B
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Yasuo Chikusa
Masato Yamanishi
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Nagase Chemtex Corp
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    • C09D5/24Electrically-conducting paints
    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
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    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/044Forming conductive coatings; Forming coatings having anti-static properties
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09K3/00Materials not provided for elsewhere
    • C09K3/16Anti-static materials
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells

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Description

導電性塗佈組成物及積層體Conductive coating composition and laminate

本發明係關於一種可形成導電膜、抗靜電膜等之導電性塗佈組成物、及使用該組成物而成之積層體。The present invention relates to a conductive coating composition capable of forming a conductive film, an antistatic film, or the like, and a laminate using the composition.

若於液晶顯示器等顯示器之光學膜表面,因靜電而附著塵埃,則顯示器之辨識度降低。用以防止此情況之方法,已知有於光學膜表面設置抗靜電膜。When the surface of the optical film of a display such as a liquid crystal display is attached with dust due to static electricity, the visibility of the display is lowered. As a method for preventing this, it is known to provide an antistatic film on the surface of the optical film.

於此種抗靜電膜中調配之導電材,先前使用有氧化錫銻(ATO)、氧化銦錫(ITO)等展現導電性之無機微粒子。此種無機微粒子具有透明性或膜強度優異之優點。The conductive material formulated in such an antistatic film is previously made of an inorganic fine particle exhibiting conductivity such as tin antimony oxide (ATO) or indium tin oxide (ITO). Such inorganic fine particles have the advantage of being excellent in transparency or film strength.

然而,包含無機微粒子之抗靜電膜通常係由濺鍍或真空蒸鍍等所形成,存在如下缺點:於其形成過程中需要昂貴之設備、及例如500~600℃之高溫之設定。However, the antistatic film containing inorganic fine particles is usually formed by sputtering or vacuum evaporation, and the like, which requires expensive equipment and a high temperature setting of, for example, 500 to 600 ° C in the formation process.

又,若使包含無機微粒子之抗靜電膜成膜於玻璃基板上,則反射率會變高,結果與玻璃之折射率差會變大,進而亦存在顯示器之能見度降低之問題。進而,銦由於為稀有金屬,供給源受限而存在供給量之變動等,故較理想為避免使用。Further, when an antistatic film containing inorganic fine particles is formed on a glass substrate, the reflectance is increased, and as a result, the difference in refractive index from the glass is increased, and the visibility of the display is lowered. Further, since indium is a rare metal, the supply source is limited, and there is a variation in the amount of supply, etc., and therefore it is preferable to avoid use.

代替上述無機微粒子之導電材,揭示有將例如聚噻吩等導電性有機高分子材料用於液晶顯示器之抗靜電膜中(例如,參照專利文獻1及2)。又,為提高例如與基材之密接性或膜硬度,亦揭示有將導電性有機高分子材料與各種烷氧矽烷類併用以形成抗靜電膜(例如,參照專利文獻3、4及5)。In place of the above-mentioned conductive material of the inorganic fine particles, a conductive organic polymer material such as polythiophene is used for an antistatic film of a liquid crystal display (see, for example, Patent Documents 1 and 2). In addition, in order to improve the adhesion to the substrate or the film hardness, for example, a conductive organic polymer material and various alkoxysilanes are used to form an antistatic film (see, for example, Patent Documents 3, 4, and 5).

若利用有機系導電性材料,則無需濺鍍或真空蒸鍍,以一般的塗敷方法即可形成抗靜電膜,因此具有可由簡便且低溫之製程而成膜之優點。並且,所獲得之抗靜電膜具有導電性及穿透性較高,與基材之密接性亦優異之優點。When an organic conductive material is used, an antistatic film can be formed by a general coating method without sputtering or vacuum evaporation, and therefore, there is an advantage that a film can be formed by a simple and low-temperature process. Further, the obtained antistatic film has an advantage that the conductivity and the penetrability are high, and the adhesion to the substrate is also excellent.

然而,先前已知之有機系抗靜電膜存在膜硬度不足,表面易損傷之缺點。進而,亦存在耐化學品性不足之問題。例如,於用作液晶顯示器中之抗靜電膜時,於形成抗靜電膜後、在其表面設置偏光板前,必需進行使用丙酮等有機溶劑之清洗或鹼清洗,但抗靜電膜易因該等清洗而變質,故業界要求加以改善。However, the previously known organic antistatic film has a drawback that the film hardness is insufficient and the surface is easily damaged. Furthermore, there is also a problem of insufficient chemical resistance. For example, when used as an antistatic film in a liquid crystal display, after forming an antistatic film and before providing a polarizing plate on the surface thereof, it is necessary to perform cleaning with an organic solvent such as acetone or alkali cleaning, but the antistatic film is easily cleaned by the like. And the deterioration, so the industry requires improvement.

[專利文獻1]日本特開平10-96953號公報[Patent Document 1] Japanese Patent Laid-Open No. Hei 10-96953

[專利文獻2]日本特開2004-246080號公報[Patent Document 2] Japanese Patent Laid-Open Publication No. 2004-246080

[專利文獻3]日本特開2005-82768號公報[Patent Document 3] Japanese Laid-Open Patent Publication No. 2005-82768

[專利文獻4]日本特開2006-294532號公報[Patent Document 4] Japanese Laid-Open Patent Publication No. 2006-294532

[專利文獻5]日本特表2010-528123號公報[Patent Document 5] Japanese Patent Publication No. 2010-528123

鑒於上述現狀,本發明之課題在於提供一種可形成導電性及穿透性較高,與基材之密接性優異,且硬度較高,並且耐化學品性優異之抗靜電膜之導電性塗佈組成物。In view of the above circumstances, an object of the present invention is to provide an electroconductive coating which can form an antistatic film which is excellent in conductivity and permeability, is excellent in adhesion to a substrate, has high hardness, and is excellent in chemical resistance. Composition.

本發明人等進行了潛心研究,結果發現,藉由將導電性聚合物製成粒徑小之粒子狀,並將其與特定之水解性矽烷化合物組合使用,可解決上述課題,從而達成本發明。As a result of intensive studies, the present inventors have found that the above problem can be solved by forming a conductive polymer into particles having a small particle size and using it in combination with a specific hydrolyzable decane compound, thereby achieving the present invention. .

即,本發明係關於一種導電性塗佈組成物,包含粒徑(D50)為200nm以下之導電性聚合物粒子、及含有下述通式所表示之烷氧矽烷低聚物之黏合劑成分:That is, the present invention relates to a conductive coating composition comprising conductive polymer particles having a particle diameter (D50) of 200 nm or less and a binder component containing an alkoxydecane oligomer represented by the following formula:

[化1][Chemical 1]

式中,R1及R2相同或不同,表示碳數1~4之烷基;R3及R4相同或不同,表示H(氫原子)、羥基、或碳數1~4之烷氧基,其中複數個R3及R4中之至少1個為烷氧基;n表示2~20之整數。In the formula, R 1 and R 2 are the same or different and each represents an alkyl group having 1 to 4 carbon atoms; and R 3 and R 4 are the same or different and each represents an H (hydrogen atom), a hydroxyl group, or an alkoxy group having 1 to 4 carbon atoms; Wherein at least one of the plurality of R 3 and R 4 is an alkoxy group; and n represents an integer of from 2 to 20.

又,本發明亦關於一種積層體,係包含基材、及設置於該基材上之導電膜者,其中上述導電膜係由上述導電性塗佈組成物所形成。Furthermore, the present invention relates to a laminate comprising a substrate and a conductive film provided on the substrate, wherein the conductive film is formed of the conductive coating composition.

利用本發明之導電性塗佈組成物,可藉由利用一般塗敷方法於低溫下塗佈於基材上而形成抗靜電膜,可簡便且廉價地實施自塗佈直至成膜之製程。According to the conductive coating composition of the present invention, an antistatic film can be formed by applying it to a substrate at a low temperature by a general coating method, and the process from the coating to the film formation can be carried out simply and inexpensively.

由本發明之導電性塗佈組成物獲得之導電膜係導電性較高(即,表面電阻率較低,為1.0 E+10 Ω/□以下),並且穿透性較高,與基材之密接性亦優異。進而,膜硬度高達鉛筆硬度B以上。The conductive film obtained from the conductive coating composition of the present invention has high conductivity (that is, a surface resistivity is low, being 1.0 E+10 Ω/□ or less), and has high penetrability and is in close contact with the substrate. Excellent also. Further, the film hardness is as high as the pencil hardness B or more.

於將本發明之導電性塗佈組成物塗佈於玻璃基材上時,膜硬度進而變高為鉛筆硬度H以上,並且亦可發揮優異之耐化學品性(耐有機溶劑性、耐鹼性)。又,所形成之導電膜之穿透性極高。進而,因與玻璃之折射率差小,故可期待難以觀察到玻璃表面之缺陷(孔或小凹坑)之效果。When the conductive coating composition of the present invention is applied to a glass substrate, the film hardness is further increased to a pencil hardness of H or more, and excellent chemical resistance (organic solvent resistance and alkali resistance) can also be exhibited. ). Further, the formed conductive film has extremely high penetrability. Further, since the difference in refractive index from the glass is small, it is expected that the effect of the defects (holes or small pits) on the surface of the glass is hard to be observed.

以下,對本發明之詳細情況進行說明。Hereinafter, the details of the present invention will be described.

本發明之導電性塗佈組成物含有導電性聚合物粒子與黏合劑成分。The conductive coating composition of the present invention contains conductive polymer particles and a binder component.

(導電性聚合物粒子)(conductive polymer particles)

本發明中所使用之導電性聚合物係表現導電性之高分子材料。具體而言,可列舉:聚噻吩、聚苯胺、聚吡咯、聚對苯(polyparaphenylene)、聚對苯亞乙烯(polyparaphenylene vinylene)、該等之衍生物等π共軛系導電性聚合物。The conductive polymer used in the present invention is a polymer material exhibiting conductivity. Specific examples thereof include a π-conjugated conductive polymer such as polythiophene, polyaniline, polypyrrole, polyparaphenylene, polyparaphenylene vinylene, or the like.

其中,就高導電性與化學穩定性之觀點而言,可較佳地使用由聚噻吩與摻雜劑之複合體所構成之聚噻吩系導電性聚合物。更詳細而言,聚噻吩系導電性聚合物係由聚(3,4-二取代噻吩)與摻雜劑所構成之複合體。Among them, from the viewpoint of high conductivity and chemical stability, a polythiophene-based conductive polymer composed of a composite of polythiophene and a dopant can be preferably used. More specifically, the polythiophene-based conductive polymer is a composite of poly(3,4-disubstituted thiophene) and a dopant.

構成聚噻吩系導電性聚合物之聚(3,4-二取代噻吩)較佳為由以下之式(1):The poly(3,4-disubstituted thiophene) constituting the polythiophene-based conductive polymer is preferably represented by the following formula (1):

[化2][Chemical 2]

所示之重複結構單位所構成的陽離子形態之聚噻吩。該陽離子形態之聚噻吩係指為了與摻雜劑即聚陰離子成為複合體而藉由自聚噻吩之一部分奪走電子而一部分成為陽離子形態之聚噻吩。The polymorphic form of the cationic form consisting of the repeating structural units shown. The polythiophene in the form of a cation refers to a polythiophene which partially forms a cationic form by taking away electrons from one part of the polythiophene in order to form a complex with a polyanion as a dopant.

式(1)中,R4及R5相互獨立,表示氫原子或C1-4之烷基,或表示R4與R5鍵結而形成環狀結構的取代或無取代之C1-4之伸烷基。上述C1-4之烷基例如可列舉甲基、乙基、丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基等。R4與R5鍵結而形成環狀結構的取代或無取代之C1-4之伸烷基,例如可列舉:亞甲基、1,2-伸乙基、1,3-伸丙基、1,4-伸丁基、1-甲基-1,2-伸乙基、1-乙基-1,2-伸乙基、1-甲基-1,3-伸丙基、2-甲基-1,3-伸丙基等。可具有C1-4之伸烷基之取代基,可列舉鹵基或苯基等。較佳之C1-4之伸烷基可列舉亞甲基、1,2-伸乙基、1,3-伸丙基,尤佳為1,2-伸乙基。作為具有上述伸烷基之聚噻吩,尤佳為聚(3,4-伸乙基二氧噻吩)(poly(3,4-ethylenedioxythiophene))。Formula (1), R 4 and R 5 each independently represents a hydrogen atom or alkyl group of C 1-4, or R 4 and R 5 represents a bond to form a C 1-4 substituted or unsubstituted cyclic structure of The alkyl group. Examples of the alkyl group of the above C 1-4 include a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a second butyl group, and a third butyl group. R 4 and R 5 are bonded to form a cyclic structure of a substituted or unsubstituted C 1-4 alkylene group, and examples thereof include a methylene group, a 1,2-extended ethyl group, and a 1,3-propanyl group. , 1,4-butylene, 1-methyl-1,2-extended ethyl, 1-ethyl-1,2-extended ethyl, 1-methyl-1,3-propanyl, 2- Methyl-1,3-propanyl and the like. The substituent which may have a C 1-4 alkylene group may, for example, be a halogen group or a phenyl group. Preferred examples of the alkylene group of C 1-4 include a methylene group, a 1,2-extended ethyl group, a 1,3-propanyl group, and more preferably a 1,2-extended ethyl group. As the polythiophene having an alkylene group as described above, poly(3,4-ethylenedioxythiophene) (poly(3,4-ethylenedioxythiophene)) is preferable.

構成聚噻吩系導電性聚合物之摻雜劑較佳為藉由與上述聚噻吩成為離子對而形成複合體,可使聚噻吩穩定地分散於水中之陰離子形態之聚合物,即聚陰離子。此種摻雜劑例如可列舉:羧酸聚合物類(例如,聚丙烯酸、聚馬來酸、聚甲基丙烯酸等)、磺酸聚合物類(例如,聚苯乙烯磺酸、聚乙烯磺酸等)等。該等羧酸聚合物類及磺酸聚合物類亦可為乙烯羧酸(vinyl carboxylic acid)類及乙烯磺酸類與其他可聚合之單體類(例如,丙烯酸酯類、苯乙烯等)之共聚物。其中,尤佳為聚苯乙烯磺酸。The dopant constituting the polythiophene-based conductive polymer is preferably a polymer which forms a complex by ion pairing with the above polythiophene, and which can stably disperse polythiophene in water, that is, a polyanion. Examples of such a dopant include carboxylic acid polymers (for example, polyacrylic acid, polymaleic acid, polymethacrylic acid, etc.), and sulfonic acid polymers (for example, polystyrenesulfonic acid, polyvinylsulfonic acid). and many more. The carboxylic acid polymers and sulfonic acid polymers may also be copolymerized with vinyl carboxylic acids and vinyl sulfonic acids and other polymerizable monomers (for example, acrylates, styrene, etc.). Things. Among them, polystyrenesulfonic acid is particularly preferred.

上述聚苯乙烯磺酸較佳為重量平均分子量大於20000且為500000以下。更佳為40000~200000。若使用分子量為此範圍外之聚苯乙烯磺酸,則存在聚噻吩系導電性聚合物對於水之分散穩定性降低之情況。再者,上述聚合物之重量平均分子量係利用凝膠滲透層析法(GPC)測定之值。測定係使用Waters公司製造之ultrahydrogel 500 column。The above polystyrenesulfonic acid preferably has a weight average molecular weight of more than 20,000 and 500,000 or less. More preferably, it is 40,000 to 200,000. When polystyrenesulfonic acid having a molecular weight outside this range is used, the dispersion stability of the polythiophene-based conductive polymer with respect to water may be lowered. Further, the weight average molecular weight of the above polymer is a value measured by gel permeation chromatography (GPC). The measurement was performed using an ultrahydrogel 500 column manufactured by Waters Corporation.

聚噻吩系導電性聚合物可藉由在使用有氧化劑之水中氧化聚合而獲得。於該氧化聚合中使用2種氧化劑(第一氧化劑及第二氧化劑)。The polythiophene-based conductive polymer can be obtained by oxidative polymerization in water using an oxidizing agent. Two kinds of oxidizing agents (first oxidizing agent and second oxidizing agent) are used in the oxidative polymerization.

較佳之第一氧化劑例如可列舉:過氧二硫酸(peroxodisulfuric acid)、過氧二硫酸鈉、過氧二硫酸鉀、過氧二硫酸銨、過氧化氫、過錳酸鉀、重鉻酸鉀、過硼酸鹼鹽、銅鹽等。於該等第一氧化劑中,最佳為過氧二硫酸鈉、過氧二硫酸鉀、過氧二硫酸銨、及過氧二硫酸。上述第一氧化劑之使用量相對於所使用之噻吩類單體較佳為1.5~3.0 mol當量,進而較佳為2.0~2.6 mol當量。Preferred examples of the first oxidizing agent include peroxodisulfuric acid, sodium peroxodisulfate, potassium peroxodisulfate, ammonium peroxodisulfate, hydrogen peroxide, potassium permanganate, and potassium dichromate. Perboric acid alkali salt, copper salt, and the like. Among these first oxidizing agents, sodium peroxodisulfate, potassium peroxydisulfate, ammonium peroxodisulfate, and peroxodisulfuric acid are preferred. The amount of the first oxidizing agent used is preferably 1.5 to 3.0 mol equivalents, more preferably 2.0 to 2.6 mol equivalents, based on the thiophene monomer to be used.

適當的第二氧化劑較佳為根據觸媒量而添加金屬離子(例如,鐵、鈷、鎳、鉬、釩離子)。其中,鐵離子最有效。金屬離子之添加量相對於所使用之噻吩類單體較佳為0.005~0.1 mol當量,進而較佳為0.01~0.05 mol當量。A suitable second oxidant preferably adds metal ions (e.g., iron, cobalt, nickel, molybdenum, vanadium ions) depending on the amount of catalyst. Among them, iron ions are most effective. The amount of the metal ion to be added is preferably 0.005 to 0.1 mol equivalent, more preferably 0.01 to 0.05 mol equivalent, based on the thiophene monomer to be used.

於本氧化聚合中使用水作為反應溶劑。除水以外,亦可添加,甲醇、乙醇、2-丙醇、1-丙醇等醇,或丙酮、乙腈等水溶性溶劑。Water is used as the reaction solvent in the present oxidative polymerization. In addition to water, an alcohol such as methanol, ethanol, 2-propanol or 1-propanol or a water-soluble solvent such as acetone or acetonitrile may be added.

藉由以上之氧化聚合,可獲得導電性聚合物之水分散體。An aqueous dispersion of a conductive polymer can be obtained by the above oxidative polymerization.

本發明之導電性塗佈組成物含有粒子狀導電性聚合物。此種導電性聚合物粒子可為包含於導電性聚合物之水分散體中之導電性聚合物粒子。該水分散體可藉由上述氧化聚合而製造。又,亦可為有機溶劑(尤其是乙醇等醇)分散體中所含之導電性聚合物粒子。此種導電性聚合物之有機溶劑分散體例如可依據專利第4163867號公報中所記載之方法而製造。The conductive coating composition of the present invention contains a particulate conductive polymer. Such a conductive polymer particle may be a conductive polymer particle contained in an aqueous dispersion of a conductive polymer. The aqueous dispersion can be produced by the above oxidative polymerization. Further, it may be a conductive polymer particle contained in a dispersion of an organic solvent (especially an alcohol such as ethanol). The organic solvent dispersion of such a conductive polymer can be produced, for example, according to the method described in Japanese Patent No. 4163867.

本發明中所使用之導電性聚合物粒子之粒徑必需為200nm以下。藉由使用粒徑較小且為200nm以下之粒子,導電性聚合物與烷氧矽烷低聚物複合而形成之導電性膜之緻密性提高,膜硬度提高。具體而言,導電性聚合物粒子可分散性較佳地進入烷氧矽烷低聚物所形成之緻密的結構內部,故而膜硬度提高,並且可發揮較高之導電性。又,因相同之理由,於將本發明之導電性塗佈組成物塗佈於玻璃基材上之情形時,膜硬度進而變高且為鉛筆硬度H以上,並且耐化學品性(耐有機溶劑性、耐鹼性)得到改善。於使用粒徑超過200nm之粒子之情形時,導電性較低,並且無法達成膜硬度及耐化學品性之改善。因粒徑越小上述效果之改善程度越大,故導電性聚合物粒子之粒徑較佳為60nm以下,更佳為30nm以下。粒徑之下限無特別限定,例如為1nm以上,較佳為3nm以上。更佳為5nm以上或10nm以上。於本發明中,導電性聚合物粒子之粒徑係測定導電性粒子之個數基準之累計(累積)分佈,作為該累計分佈中之累計值50%之粒徑而算出。The conductive polymer particles used in the present invention must have a particle diameter of 200 nm or less. By using particles having a small particle diameter of 200 nm or less, the conductivity of the conductive film formed by combining the conductive polymer and the alkoxysilane oligomer is improved, and the film hardness is improved. Specifically, the dispersibility of the conductive polymer particles preferably enters the dense structure formed by the alkoxysilane oligomer, so that the film hardness is improved and the conductivity is high. Further, for the same reason, when the conductive coating composition of the present invention is applied to a glass substrate, the film hardness is further increased to a pencil hardness of H or more, and chemical resistance (organic solvent resistance) Sex, alkali resistance) improved. When a particle having a particle diameter of more than 200 nm is used, conductivity is low, and improvement in film hardness and chemical resistance cannot be achieved. The smaller the particle size, the greater the degree of improvement of the above effect. Therefore, the particle diameter of the conductive polymer particles is preferably 60 nm or less, more preferably 30 nm or less. The lower limit of the particle diameter is not particularly limited and is, for example, 1 nm or more, and preferably 3 nm or more. More preferably, it is 5 nm or more or 10 nm or more. In the present invention, the particle diameter of the conductive polymer particles is a cumulative (cumulative) distribution in which the number of conductive particles is measured, and is calculated as a particle diameter of 50% of the integrated value in the cumulative distribution.

導電性聚合物粒子之粒徑可藉由於製造上述導電性聚合物之分散體時適當地選擇分散條件而容易地調整(例如,參照專利第3966252號公報之段落[0042])。具體而言,可使用均質機等分散攪拌機(例如,參照日本專利特開2010-24304號公報之段落[0019])。The particle diameter of the conductive polymer particles can be easily adjusted by appropriately selecting the dispersion conditions when the dispersion of the above conductive polymer is produced (for example, refer to paragraph [3962] of Patent No. 3966252). Specifically, a dispersing mixer such as a homogenizer can be used (for example, refer to paragraph [0019] of JP-A-2010-24304).

(黏合劑成分)(adhesive composition)

本發明之導電性塗佈組成物於含有導電性聚合物粒子之同時亦含有黏合劑成分。黏合劑成分係導電性塗佈組成物於基材上形成膜所必需之成分。於本發明中,黏合劑成分可為僅由1種所構成者,亦可為併用2種以上者。然而,於本發明中,作為黏合劑成分,必需至少含有烷氧矽烷低聚物。The conductive coating composition of the present invention contains a binder component as well as the conductive polymer particles. The binder component is a component necessary for the conductive coating composition to form a film on the substrate. In the present invention, the binder component may be composed of only one type, or two or more types may be used in combination. However, in the present invention, it is necessary to contain at least an alkoxydecane oligomer as a binder component.

黏合劑成分之總調配量相對於上述導電性聚合物粒子100重量份較佳為150~10000重量份。若為150重量份以上,則黏合劑成分之使用比例變得充分,所形成之導電膜可獲得良好的硬度及耐化學品性。若為10000重量份以下,則含有充分量之導電性聚合物,因此可形成具有較高之導電性與良好的耐化學品性之導電膜。更佳為300~7000重量份。The total amount of the binder component is preferably 150 to 10,000 parts by weight based on 100 parts by weight of the conductive polymer particles. When it is 150 parts by weight or more, the ratio of use of the binder component becomes sufficient, and the formed conductive film can obtain good hardness and chemical resistance. When it is 10,000 parts by weight or less, a sufficient amount of the conductive polymer is contained, so that a conductive film having high conductivity and good chemical resistance can be formed. More preferably, it is 300 to 7000 parts by weight.

(烷氧矽烷低聚物)(alkoxy alkane oligomer)

於本發明之塗佈組成物中含有烷氧矽烷低聚物。可認為,由於該烷氧矽烷低聚物於塗膜中形成緻密的結構,故而本發明可獲得硬度較高之導電膜。進而,小粒徑之導電性聚合物粒子分散性佳地進入該緻密結構之內部,故而可獲得硬度及耐化學品性優異且具有較高之導電性之導電膜。The alkoxysilane oligomer is contained in the coating composition of the present invention. It is considered that since the alkoxysilane oligomer forms a dense structure in the coating film, the present invention can obtain a conductive film having a high hardness. Further, since the conductive polymer particles having a small particle diameter are excellent in dispersibility and enter the inside of the dense structure, a conductive film having excellent hardness and chemical resistance and having high conductivity can be obtained.

所謂烷氧矽烷低聚物,係藉由烷氧矽烷之單體彼此縮合而形成之經高分子量化之烷氧矽烷,係指1分子內具有1個以上之矽氧鍵(Si-O-Si)之低聚物。重量平均分子量無特別限定,但較佳為大於152且為4000以下。更佳為500~1500左右。再者,上述低聚物之重量平均分子量係藉由凝膠滲透層析法(GPC)而測定之值。測定係使用Waters公司製造之ultrahydrogel 500 column。The alkoxysilane oligomer is a polymerized alkoxysilane formed by condensing monomers of alkoxysilanes, and means having one or more oxime bonds in one molecule (Si-O-Si). ) an oligomer. The weight average molecular weight is not particularly limited, but is preferably more than 152 and 4,000 or less. More preferably, it is about 500 to 1500. Further, the weight average molecular weight of the above oligomer is a value measured by gel permeation chromatography (GPC). The measurement was performed using an ultrahydrogel 500 column manufactured by Waters Corporation.

本發明中所使用之烷氧矽烷低聚物係由下述通式表示。如由該式所明確,本發明之烷氧矽烷低聚物係與先前所使用之烷氧矽烷之單體(每1分子含有1個矽原子之化合物)、或具有環氧基之烷氧矽烷化合物、經聚醚或聚酯等改質之烷氧矽烷化合物不同之化合物。The alkoxynonane oligomer used in the present invention is represented by the following formula. As is clear from the formula, the alkoxysilane oligomer of the present invention is a monomer of the alkoxysilane previously used (a compound containing one atom per molecule) or an alkoxydecane having an epoxy group. A compound, a compound different from a modified alkoxysilane compound such as a polyether or a polyester.

[化3][Chemical 3]

式中,R1及R2相同或不同,表示碳數1~4之烷基。R3及R4相同或不同,表示H(氫原子)、羥基、或碳數1~4之烷氧基。其中,複數個R3及R4中之至少1個為烷氧基。n表示2~20之整數,更佳為表示2~14之整數。碳數1~4之烷基例如可列舉甲基、乙基、正丙基、異丙基、正丁基、異丁基、第三丁基等。碳數1~4之烷氧基,例如可列舉甲氧基、乙氧基、正丙氧基、異丙氧基、正丁氧基、異丁氧基、第三丁氧基等。本發明中所使用之烷氧矽烷低聚物可為僅由下述通式所表示之化合物1種所構成者,亦可為多種之混合物。In the formula, R 1 and R 2 are the same or different and each represents an alkyl group having 1 to 4 carbon atoms. R 3 and R 4 are the same or different and each represents H (hydrogen atom), a hydroxyl group, or an alkoxy group having 1 to 4 carbon atoms. Wherein at least one of the plurality of R 3 and R 4 is an alkoxy group. n represents an integer of 2 to 20, and more preferably represents an integer of 2 to 14. Examples of the alkyl group having 1 to 4 carbon atoms include a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, an isobutyl group, and a t-butyl group. Examples of the alkoxy group having 1 to 4 carbon atoms include a methoxy group, an ethoxy group, a n-propoxy group, an isopropoxy group, a n-butoxy group, an isobutoxy group, and a third butoxy group. The alkoxysilane oligomer used in the present invention may be one composed of only one compound represented by the following formula, or a mixture of plural kinds.

於本發明中,藉由使用預先於分子內具有矽氧鍵之烷氧矽烷低聚物作為黏合劑成分,而與無矽氧鍵之烷氧矽烷單體或環氧矽烷等相比,於導電性膜內易形成更緻密的結構,推測其結果可達成本發明之優異之效果。此效果係成膜溫度越低越顯著。又,於使用烷氧矽烷聚合物(縮合數n大於烷氧矽烷低聚物者)作為黏合劑成分之情形時,立體排斥變大,故而反應性變差而難以形成緻密的結構,藉此推測其結果膜硬度變弱。此傾向係分子量越大越顯著。In the present invention, by using an alkoxysilane oligomer having a ruthenium oxygen bond in the molecule as a binder component, it is electrically conductive as compared with an alkoxysilane monomer or an epoxy decane having no oxime bond. It is easy to form a denser structure in the film, and it is speculated that the result can be excellent in the cost of the invention. This effect is more pronounced as the film formation temperature is lower. When alkoxysilane polymer (the number of condensation n is larger than the alkoxysilane oligomer) is used as the binder component, the steric repulsion becomes large, and the reactivity is deteriorated, so that it is difficult to form a dense structure. As a result, the film hardness is weak. This tendency is more pronounced as the molecular weight is larger.

烷氧矽烷低聚物之調配量相對於導電性塗佈組成物中所含之全部黏合劑成分較佳為97~100重量%。若為97重量%以上,則利藉由調配烷氧矽烷低聚物而獲得之膜的緻密性達到充分之水準,可形成表現較高之膜硬度及優異之耐化學品性之導電膜。更佳為98.5重量%以上。The amount of the alkoxydecane oligomer is preferably from 97 to 100% by weight based on the total of the binder component contained in the conductive coating composition. When it is 97% by weight or more, the denseness of the film obtained by blending the alkoxysilane oligomer reaches a sufficient level, and a conductive film which exhibits high film hardness and excellent chemical resistance can be formed. More preferably, it is 98.5 wt% or more.

(除烷氧矽烷低聚物以外之黏合劑成分)(Binder components other than alkoxysilane oligomers)

如上所述,本發明之導電性塗佈組成物亦可含有除烷氧矽烷低聚物以外之黏合劑成分。只要含有上述烷氧矽烷低聚物,則對於其他黏合劑成分並無限定,具體而言,可將3-環氧丙氧基丙基三甲氧基矽烷、聚醚改質聚二甲基矽氧烷、聚醚改質矽氧烷等矽烷偶合劑用作黏合劑成分。又,亦可使用樹脂黏合劑,具體而言可列舉:聚酯、聚丙烯酸酯、聚甲基丙烯酸酯、聚氨酯、聚乙酸乙烯酯、聚偏二氯乙烯、聚醯胺、聚醯亞胺等均聚物;使苯乙烯、偏二氯乙烯、氯乙烯、烷基丙烯酸酯、甲基丙烯酸烷基酯等單體共聚合而獲得之共聚物等。該等黏合劑可單獨使用,亦可併用2種以上。As described above, the conductive coating composition of the present invention may contain a binder component other than the alkoxysilane oligomer. As long as the alkoxydecane oligomer is contained, it is not limited to other binder components, specifically, 3-glycidoxypropyltrimethoxydecane, polyether modified polydimethyloxime A decane coupling agent such as an alkane or a polyether modified oxirane is used as a binder component. Further, a resin binder may be used, and specific examples thereof include polyester, polyacrylate, polymethacrylate, polyurethane, polyvinyl acetate, polyvinylidene chloride, polyamine, polyimine, and the like. A homopolymer; a copolymer obtained by copolymerizing a monomer such as styrene, vinylidene chloride, vinyl chloride, alkyl acrylate or alkyl methacrylate. These binders may be used singly or in combination of two or more.

(溶劑或分散介質)(solvent or dispersion medium)

本發明之導電性塗佈組成物可為僅由導電性聚合物粒子及烷氧矽烷低聚物所構成者,但為使操作容易,通常較佳為進而含有溶劑及/或分散介質。作為溶劑或分散介質,只要為可使導電性聚合物及烷氧矽烷低聚物溶解或分散者,則無特別限定。於導電性塗佈組成物為水系之情形時,可使用水、及水與混和於水中之溶劑之混合溶劑。作為混和於水中之溶劑,並無特別限制,例如可列舉:甲醇、乙醇、2-丙醇、1-丙醇等醇類;乙二醇單甲醚、二乙二醇單甲醚、乙二醇二乙醚、二乙二醇二甲醚等乙二醇醚類;乙二醇單乙醚乙酸酯、二乙二醇單乙醚乙酸酯、二乙二醇單丁醚乙酸酯等乙二醇醚乙酸酯類;丙二醇、二丙二醇、三丙二醇等丙二醇類;丙二醇單甲醚、丙二醇單乙醚、二丙二醇單甲醚、二丙二醇單乙醚、丙二醇二甲醚、二丙二醇二甲醚、丙二醇二乙醚、二丙二醇二乙醚等丙二醇醚類;丙二醇單甲醚乙酸酯、丙二醇單乙醚乙酸酯、二丙二醇單甲醚乙酸酯、二丙二醇單乙醚乙酸酯等丙二醇醚乙酸酯類;二甲基乙醯胺、丙酮、乙腈及該等之混和物等。於導電性塗佈組成物為有機溶劑系之情形時,可使用上述所列舉之與水混和之溶劑及甲苯、二甲苯、苯、乙酸乙酯、乙酸丁酯、甲基乙基酮、甲基異丁基酮、二乙醚、二異丙醚、甲基第三丁醚、己烷、庚烷等。於上述溶劑或分散介質中,尤佳為甲醇、乙醇、2-丙醇。再者,將導電性塗佈用組成物之各成分完全溶解之情況稱為「溶劑」,將某些成分未溶解而分散之情況稱為「分散介質」。The conductive coating composition of the present invention may be composed only of conductive polymer particles and alkoxysilane oligomers. However, in order to facilitate handling, it is usually preferred to further contain a solvent and/or a dispersion medium. The solvent or the dispersion medium is not particularly limited as long as it can dissolve or disperse the conductive polymer and the alkoxysilane oligomer. When the conductive coating composition is a water system, water, a mixed solvent of water and a solvent mixed in water can be used. The solvent to be mixed in water is not particularly limited, and examples thereof include alcohols such as methanol, ethanol, 2-propanol, and 1-propanol; ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, and ethylene glycol; Glycol ethers such as alcohol diethyl ether and diethylene glycol dimethyl ether; ethylene glycol monoethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, etc. Alcohol ether acetate; propylene glycol such as propylene glycol, dipropylene glycol, tripropylene glycol; propylene glycol monomethyl ether, propylene glycol monoethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, propylene glycol dimethyl ether, dipropylene glycol dimethyl ether, propylene glycol a propylene glycol ether such as diethyl ether or dipropylene glycol diethyl ether; a propylene glycol ether acetate such as propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, dipropylene glycol monomethyl ether acetate or dipropylene glycol monoethyl ether acetate; Methylacetamide, acetone, acetonitrile, and mixtures thereof. When the conductive coating composition is an organic solvent system, the above-mentioned water-mixed solvent and toluene, xylene, benzene, ethyl acetate, butyl acetate, methyl ethyl ketone, methyl group can be used. Isobutyl ketone, diethyl ether, diisopropyl ether, methyl tert-butyl ether, hexane, heptane, and the like. Among the above solvents or dispersion media, methanol, ethanol, and 2-propanol are particularly preferred. In addition, the case where the components of the conductive coating composition are completely dissolved is referred to as a "solvent", and the case where some components are not dissolved and dispersed is referred to as a "dispersion medium".

只要導電性塗佈組成物為均勻之水分散液,則其固形物成分濃度無特別限定,於塗佈時較佳為約0.01~50重量%左右。更佳為1~20重量%。若於此範圍內,則可較容易地實施塗佈。然而,於銷售或搬運塗佈組成物時亦可為更高濃度,於此情形時,只要於使用時添加溶劑及/或分散介質適當地稀釋即可。The concentration of the solid content component is not particularly limited as long as the conductive coating composition is a uniform aqueous dispersion, and is preferably about 0.01 to 50% by weight at the time of coating. More preferably, it is 1 to 20% by weight. If it is in this range, coating can be performed relatively easily. However, a higher concentration may be used in the case of selling or transporting the coating composition, and in this case, it may be appropriately diluted by adding a solvent and/or a dispersion medium at the time of use.

(導電性提高劑)(Electrical conductivity improver)

為進一步改善導電性,亦可於本發明之塗佈組成物中進而調配導電性提高劑。作為上述導電性提高劑,並無特別限定,可視需要適當地選擇。具體而言,可列舉二甲亞碸、N-甲基吡咯啶酮、N-甲基甲醯胺、N-二甲基甲醯胺、異佛爾酮、碳酸丙烯酯、環己酮、γ-丁內酯、二乙二醇單乙醚等,於該等之中較佳為N-甲基甲醯胺、N-甲基吡咯啶酮。該等可單獨使用1種,亦可併用2種以上。導電性塗佈組成物中之導電性提高劑之含量無特別限定,但相對於導電性聚合物粒子100重量份較佳為430~13000重量份左右,更佳為430~4330重量份左右。In order to further improve the electrical conductivity, the conductivity improving agent may be further formulated in the coating composition of the present invention. The conductivity improving agent is not particularly limited, and may be appropriately selected as needed. Specific examples thereof include dimethyl hydrazine, N-methylpyrrolidone, N-methylformamide, N-dimethylformamide, isophorone, propylene carbonate, cyclohexanone, and γ. - Butyrolactone, diethylene glycol monoethyl ether, etc., among these, N-methylformamide and N-methylpyrrolidone are preferable. These may be used alone or in combination of two or more. The content of the conductivity improving agent in the conductive coating composition is not particularly limited, but is preferably about 430 to 13,000 parts by weight, more preferably about 430 to 4330 parts by weight, per 100 parts by weight of the conductive polymer particles.

(任意成分)(optional)

於本發明之導電性塗佈組成物中可進而適當地添加界面活性劑(表面調整劑)、消泡劑、流變控制劑、密接性賦予劑、抗氧化劑、氧化觸媒、粒子等。Further, a surfactant (surface conditioning agent), an antifoaming agent, a rheology controlling agent, an adhesion imparting agent, an antioxidant, an oxidation catalyst, particles, or the like can be appropriately added to the conductive coating composition of the present invention.

上述界面活性劑只要為可提高平坦性而獲得均勻之塗佈膜者,則無特別限定。此種界面活性劑可列舉如下化合物:聚醚改質聚二甲基矽氧烷、聚醚改質矽氧烷、聚醚酯改質含羥基之聚二甲基矽氧烷、聚醚改質含丙烯基之聚二甲基矽氧烷、聚酯改質含丙烯基之聚二甲基矽氧烷、全氟聚二甲基矽氧烷、全氟聚醚改質聚二甲基矽氧烷、全氟聚酯改質聚二甲基矽氧烷等矽氧烷化合物;全氟烷基羧酸、全氟烷基聚氧乙烯乙醇等含氟有機化合物;聚氧乙烯烷基苯醚、環氧丙烷聚合物、環氧乙烷聚合物等聚醚系化合物;椰子油脂肪酸胺鹽、松脂膠(gum rosin)等羧酸;蓖麻油硫酸酯類、磷酸酯、烷基醚硫酸鹽、山梨糖醇酐脂肪酸酯、磺酸酯、磷酸酯、琥珀酸酯等酯系化合物;烷基芳基磺酸胺鹽、磺基琥珀酸二辛基鈉等磺酸鹽化合物;十二烷基磷酸鈉等磷酸鹽化合物;椰子油脂肪酸乙醇醯胺等醯胺化合物;進而丙烯酸系共聚物等。於該等之中,就流平(leveling)性之方面而言,較佳為矽氧烷系化合物及含氟化合物,尤佳為聚醚改質聚二甲基矽氧烷。The surfactant is not particularly limited as long as it is a coating film which can improve uniformity and obtain a uniform coating film. Such a surfactant may be exemplified by a polyether modified polydimethyl siloxane, a polyether modified oxirane, a polyether ester modified with a hydroxyl group-containing polydimethyl siloxane, and a polyether modified product. Polypropylene oxyalkylene containing propylene group, polyester modified polydimethyl methoxy oxane containing propylene group, perfluoropolydimethyl siloxane, perfluoropolyether modified polydimethyl oxime Alkane, perfluoropolyester modified polyoxyalkylene compound such as polydimethyloxane; fluorine-containing organic compound such as perfluoroalkyl carboxylic acid, perfluoroalkyl polyoxyethylene ethanol; polyoxyethylene alkyl phenyl ether; a polyether compound such as a propylene oxide polymer or an ethylene oxide polymer; a carboxylic acid such as a coconut oil fatty acid amine salt or a gum rosin; a castor oil sulfate, a phosphate, an alkyl ether sulfate, and a sorbent An ester compound such as a sugar anhydride fatty acid ester, a sulfonate, a phosphate or a succinate; a sulfonate compound such as an alkylarylsulfonate amine salt or a dioctyl sodium sulfosuccinate; a dodecylphosphoric acid; a phosphate compound such as sodium; a guanamine compound such as coconut oil fatty acid ethanol decylamine; and an acrylic copolymer. Among these, from the viewpoint of leveling, a naphthenic compound and a fluorine-containing compound are preferable, and a polyether-modified polydimethylsiloxane is particularly preferable.

為使黏度提高,亦可添加增黏劑。此種增黏劑可列舉:精胺酸衍生物、三仙膠衍生物、卡拉膠或纖維素等糖類化合物等水溶性高分子等。In order to increase the viscosity, a tackifier may also be added. Examples of such a tackifier include water-soluble polymers such as arginine derivatives, santillac derivatives, carbohydrates, and saccharides such as cellulose.

上述抗氧化劑並無特別限定,可列舉還原性或非還原性之水溶性抗氧化劑。具有還原性之水溶性抗氧化劑例如可列舉:L-抗壞血酸、L-抗壞血酸鈉、L-抗壞血酸鉀、異抗壞血酸、異抗壞血酸鈉、異抗壞血酸鉀等具有經2個羥基取代之內酯環之化合物;麥芽糖、乳糖、纖維雙糖、木糖、阿拉伯糖、葡萄糖、果糖、半乳糖、甘露糖等單糖類及二糖類;兒茶素、芸香苷、楊梅黃酮、槲皮素、山奈酚等類黃酮;薑黃素、迷迭香酸、漂木酸、對苯二酚、3,4,5-三羥基苯甲酸等具有2個以上酚性羥基之化合物;半胱胺酸、麩胱甘肽、新戊四醇四(3-巰基丁酸酯)等具有硫醇基之化合物等。非還原性水溶性抗氧化劑例如可列舉:苯咪唑磺酸、苯基三唑磺酸、2-羥基嘧啶、水楊酸苯酯、2-羥基-4-甲氧基二苯基酮-5-磺酸鈉等吸收成為氧化劣化之原因之紫外線之化合物。該等可單獨使用,亦可併用2種以上。The antioxidant is not particularly limited, and examples thereof include a reducing or non-reducing water-soluble antioxidant. Examples of the water-soluble antioxidant having a reducing property include a compound having a lactone ring substituted with two hydroxyl groups, such as L-ascorbic acid, sodium L-ascorbate, potassium L-ascorbate, erythorbic acid, sodium erythorbate or potassium erythorbate; Monosaccharides and disaccharides such as maltose, lactose, cellobiose, xylose, arabinose, glucose, fructose, galactose, mannose; flavonoids such as catechin, rutin, myricetin, quercetin and kaempferol; Curcumin, rosmarinic acid, bleaching acid, hydroquinone, 3,4,5-trihydroxybenzoic acid and other compounds having two or more phenolic hydroxyl groups; cysteine, glutathione, neopentyl A compound having a thiol group such as tetraol tetrakis(3-mercaptobutyrate). Examples of the non-reducing water-soluble antioxidant include benzzimidazolesulfonic acid, phenyltriazolesulfonic acid, 2-hydroxypyrimidine, phenyl salicylate, and 2-hydroxy-4-methoxydiphenylketone-5- A compound which absorbs ultraviolet rays which is a cause of oxidative degradation, such as sodium sulfonate. These may be used alone or in combination of two or more.

又,本發明之導電性塗佈組成物可包含賦予耐磨性或滑動性之粒子。粒子可列舉無機粒子,無機粒子可列舉:矽石、氧化鋁、氧化鋅、氧化鉀、氧化鈣、氧化鉻、氧化鍶、氧化鎢、氧化鎂、氧化鈦、氧化鉍、氧化鈰、氧化鈷、氧化鐵、氧化鈥、氧化錳、氧化錫、氧化釔、氧化鋯、氧化銻、碳酸鈣、碳酸鎂、碳酸鋇、矽酸鈣、鈦酸鈣、硫酸鈣、硫酸鋇等金屬氧化物;或硫化鉬、硫化銻、硫化鎢、氮化硼、碘化鎳等中之一種或複數種合成物及其含水物;或高嶺土、黏土、滑石、雲母、膨潤土、水滑石、沸石、葉蠟石、碳黑、石墨等天然或合成礦物粒子。Further, the conductive coating composition of the present invention may contain particles which impart abrasion resistance or slidability. Examples of the particles include inorganic particles, and examples of the inorganic particles include vermiculite, alumina, zinc oxide, potassium oxide, calcium oxide, chromium oxide, cerium oxide, tungsten oxide, magnesium oxide, titanium oxide, cerium oxide, cerium oxide, and cobalt oxide. Metal oxides such as iron oxide, cerium oxide, manganese oxide, tin oxide, cerium oxide, zirconium oxide, cerium oxide, calcium carbonate, magnesium carbonate, barium carbonate, calcium citrate, calcium titanate, calcium sulfate, barium sulfate; or vulcanization One or a plurality of compositions of molybdenum, strontium sulfide, tungsten sulfide, boron nitride, nickel iodide, and the like thereof; or kaolin, clay, talc, mica, bentonite, hydrotalcite, zeolite, pyrophyllite, carbon Natural or synthetic mineral particles such as black and graphite.

(塗佈組成物之製造方法)(Manufacturing method of coating composition)

製造本發明之導電性塗佈組成物之方法並無特別限制,只要利用機械攪拌器或磁力攪拌器等攪拌機將上述各組成物一面攪拌一面混合且攪拌混合約1~60分鐘即可。具體而言,只要首先以導電性聚合物粒子具有特定之粒徑之方式製造導電性聚合物之分散體,繼而對各成分進行混合、攪拌即可。The method for producing the conductive coating composition of the present invention is not particularly limited, and the respective components may be mixed while stirring with a stirrer such as a mechanical stirrer or a magnetic stirrer, and stirred and mixed for about 1 to 60 minutes. Specifically, the dispersion of the conductive polymer is first produced so that the conductive polymer particles have a specific particle diameter, and then the components are mixed and stirred.

(積層體)(layered body)

本發明之導電性塗佈組成物可藉由塗佈於被塗佈基材後進行乾燥而形成導電性塗膜。構成塗佈導電性塗佈組成物之被塗佈基材之材料並無特別限定,例如可列舉:聚乙烯、聚丙烯、乙烯-乙酸乙烯酯共聚物、乙烯-丙烯酸酯共聚物、離子聚合物共聚物、環烯烴系樹脂等聚烯烴樹脂;聚對苯二甲酸乙二醇酯、聚對苯二甲酸丁二醇酯、聚碳酸酯、聚氧乙烯、改質聚苯(polyphenylene)、聚苯硫醚等聚酯樹脂;尼龍6、尼龍6,6、尼龍9、半芳香族聚醯胺6T6、半芳香族聚醯胺6T66、半芳香族聚醯胺9T等聚醯胺樹脂;除此以外亦可列舉:丙烯酸樹脂、聚苯乙烯、丙烯腈苯乙烯、丙烯腈丁二烯苯乙烯、氯乙烯樹脂等有機材料;玻璃等無機材料。尤其是本發明之導電性塗佈組成物藉由塗佈於玻璃基板上,而膜硬度變得極高且以鉛筆硬度計為H以上,並且可發揮優異之耐化學品性(耐有機溶劑性、耐鹼性),因此尤其較佳。The conductive coating composition of the present invention can be applied to a substrate to be coated and then dried to form a conductive coating film. The material constituting the substrate to be coated to which the conductive coating composition is applied is not particularly limited, and examples thereof include polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-acrylate copolymer, and ionic polymer. Polyolefin resin such as copolymer or cycloolefin resin; polyethylene terephthalate, polybutylene terephthalate, polycarbonate, polyoxyethylene, modified polyphenylene, polyphenylene Polyester resin such as thioether; nylon 6, nylon 6,6, nylon 9, semi-aromatic polyamide 6T6, semi-aromatic polyamide 6T66, semi-aromatic polyamide 9T, etc.; Examples thereof include organic materials such as acrylic resin, polystyrene, acrylonitrile styrene, acrylonitrile butadiene styrene, and vinyl chloride resin; and inorganic materials such as glass. In particular, the conductive coating composition of the present invention is applied to a glass substrate, and the film hardness is extremely high, and the pencil hardness is H or more, and excellent chemical resistance (organic solvent resistance) can be exhibited. It is alkali resistant, so it is especially preferred.

導電性塗佈組成物之塗佈法並無特別限制,可自公知之方法中適當地選擇。例如可列舉:旋塗法、凹版印刷塗佈法、棒塗法、浸塗法、簾塗法、模塗法、噴塗法等。又,亦可應用網版印刷、噴霧印刷、噴墨印刷、凸版印刷、凹版印刷、平版印刷等印刷法。The coating method of the conductive coating composition is not particularly limited, and can be appropriately selected from known methods. For example, a spin coating method, a gravure coating method, a bar coating method, a dip coating method, a curtain coating method, a die coating method, a spray coating method, and the like can be mentioned. Further, a printing method such as screen printing, spray printing, inkjet printing, letterpress printing, gravure printing, or lithography may be applied.

上述導電性塗佈組成物之塗膜之乾燥係使用通常之通風乾燥機、熱風乾燥機、紅外線乾燥機等乾燥機等。於該等中若使用具有加熱機構之乾燥機(熱風乾燥機、紅外線乾燥機等),則可同時進行乾燥及加熱。加熱機構除上述乾燥機以外,亦可使用具備加熱功能之加熱、加壓輥、加壓機等。The drying of the coating film of the above-mentioned conductive coating composition is a dryer such as a general air dryer, a hot air dryer, or an infrared dryer. When such a dryer (hot air dryer, infrared dryer, etc.) having a heating mechanism is used in these, drying and heating can be simultaneously performed. The heating means may be a heating, a pressure roller, a press machine or the like having a heating function in addition to the above-described dryer.

塗膜之乾燥條件並無特別限定,例如於25℃~200℃下進行10秒~2小時左右,較佳為於80℃~150℃下進行5~30分鐘左右。The drying conditions of the coating film are not particularly limited, and are, for example, about 25 seconds to 2 hours at 25 to 200 ° C, preferably about 8 to 30 minutes at 80 to 150 ° C.

由本發明之導電性塗佈組成物形成之塗膜之乾燥膜厚可視需要適當地選擇。然而,為提高導電性及硬度、耐化學品性,較佳為25~380 nm。更佳為30~350 nm。The dry film thickness of the coating film formed from the conductive coating composition of the present invention can be appropriately selected as needed. However, in order to improve conductivity, hardness, and chemical resistance, it is preferably 25 to 380 nm. More preferably, it is 30 to 350 nm.

藉由將導電性塗佈組成物塗佈於基材表面並使之乾燥,可製造包含形成於基材表面之導電膜之積層體。上述積層體如下述般可應用於各種用途,尤其是於基材為玻璃基板之情形時,可較佳地用作液晶顯示裝置中所含之積層體。By coating the conductive coating composition on the surface of the substrate and drying it, a laminate including the conductive film formed on the surface of the substrate can be produced. The laminate can be applied to various applications as described below, and particularly when the substrate is a glass substrate, it can be preferably used as a laminate contained in a liquid crystal display device.

圖1係表示通常之液晶顯示裝置之積層結構之示意圖。符號1係液晶顯示裝置中之彩色濾光片,於彩色濾光片1表面積層有玻璃基板2。進而,依序積層有抗靜電膜(導電膜)3及偏光板4。本發明之積層體可為僅由玻璃基板2與抗靜電膜3所構成者,亦可為上述液晶顯示裝置之積層結構中所含者。又,亦可為完成液晶顯示裝置之前的由彩色濾光片1、玻璃基板2及抗靜電膜3所構成之積層體中所含者。Fig. 1 is a schematic view showing a laminated structure of a general liquid crystal display device. The symbol 1 is a color filter in a liquid crystal display device, and the glass substrate 2 is provided on the surface layer of the color filter 1. Further, an antistatic film (conductive film) 3 and a polarizing plate 4 are laminated in this order. The laminate of the present invention may be composed only of the glass substrate 2 and the antistatic film 3, or may be included in the laminated structure of the liquid crystal display device. Further, it may be included in the laminate including the color filter 1, the glass substrate 2, and the antistatic film 3 before the liquid crystal display device is completed.

液晶顯示裝置之驅動方式目前廣泛地應用TN(Twisted Nematic,扭轉向列)方式、VA(Vertical alignment,垂直排列)方式、橫電場驅動方式3種。本發明之積層體可應用於任一種方式之液晶顯示層。其中,於橫電場驅動方式中,為防止塵埃附著並且提高液晶驅動性,必需設置抗靜電膜,本發明之積層體亦可較佳地應用於該橫電場驅動方式之液晶顯示裝置中。於此情形時,抗靜電膜可達成改善由靜電所導致之液晶混亂之效果,並且因高透明性或與玻璃之折射率差而亦具有提高顯示器之能見度之效果。In the driving method of the liquid crystal display device, three types of TN (Twisted Nematic), VA (Vertical Alignment), and Horizontal Electric Field are widely used. The laminate of the present invention can be applied to a liquid crystal display layer of any of the modes. Among them, in the horizontal electric field driving method, in order to prevent dust from adhering and to improve liquid crystal driving properties, it is necessary to provide an antistatic film, and the laminated body of the present invention can be preferably applied to the liquid crystal display device of the horizontal electric field driving method. In this case, the antistatic film can achieve an effect of improving the liquid crystal disorder caused by static electricity, and also has an effect of improving the visibility of the display due to high transparency or a difference in refractive index from the glass.

[實施例][Examples]

以下列舉實施例更詳細地說明本發明,但本發明並不限定於該等實施例。以下,「份」只要未特別說明,則表示「重量份」。The invention is illustrated in more detail below by way of examples, but the invention is not limited to the examples. Hereinafter, "parts" means "parts by weight" unless otherwise specified.

粒徑(D50)係針對各水分散液測定個數基準之累計(累積)分佈,並算出作為該累計分佈中之累計值50%之粒徑。具體而言,使用以純水稀釋各水分散液並調整為0.1%之水溶液之樣品,使用Sysmex公司製造之粒度分佈計ZETASIZER Nano-ZS,進行利用電動勢之粒徑測定。The particle diameter (D50) is a cumulative (cumulative) distribution of the number basis of each aqueous dispersion, and the particle diameter which is 50% of the integrated value in the cumulative distribution is calculated. Specifically, a sample having an electrohydraulic particle size was measured using a particle size distribution meter ZETASIZER Nano-ZS manufactured by Sysmex Corporation using a sample in which each aqueous dispersion was diluted with pure water and adjusted to 0.1%.

(實施例1)(Example 1)

使用包含粒徑(D50)為20nm之導電性聚合物(聚3,4伸乙基二氧噻吩/聚苯乙烯磺酸)之水分散液Baytron PH500(H.C.Starck公司製造)100份(其中包含上述導電性聚合物1.1份、離子交換水98.9份。於將上述導電性聚合物設為100份時,離子交換水為8991份)、為黏合劑之烷氧矽烷低聚物MS-51(三菱化學公司製造)24份(於將上述導電性聚合物設為100份時,為2165份)、為導電性提高劑之N-甲基甲醯胺(Nacalai Tesque公司製造,試劑)19份(於將導電性聚合物設為100份時,為1730份)、乙醇(Nacalai Tesque公司製造,試劑)514份(於將導電性聚合物設為100份時,為46727份)、離子交換水48份(於將導電性聚合物設為100份時,為4364份)製備均勻之水分散液。100 parts of an aqueous dispersion of Baytron PH500 (manufactured by HC Starck Co., Ltd.) containing a conductive polymer (poly(3,4-extended ethylenedioxythiophene/polystyrenesulfonic acid) having a particle diameter (D50) of 20 nm (including the above) 1.1 parts of a conductive polymer and 98.9 parts of ion-exchanged water. When the conductive polymer is 100 parts, the ion-exchanged water is 8991 parts), and the alkoxysilane oligomer MS-51 which is a binder (Mitsubishi Chemical) 24 parts (manufactured by the company, 2165 parts when the conductive polymer is 100 parts), N-methylformamide (manufactured by Nacalai Tesque Co., Ltd.), which is a conductivity improver, 19 parts When the amount of the conductive polymer was 100 parts, it was 1,730 parts), 514 parts of ethanol (manufactured by Nacalai Tesque Co., Ltd.) (46,627 parts when the conductive polymer was 100 parts), and 48 parts of ion-exchanged water ( A uniform aqueous dispersion was prepared by using 4364 parts of the conductive polymer as 100 parts.

繼而,於無鹼玻璃板上塗佈上述分散液,利用烘箱於130℃下加熱30分鐘進行成膜,而獲得表面具有抗靜電膜之試片。再者,試片中之乾燥膜厚係根據水分散液之塗佈量進行計算並調整。Then, the dispersion liquid was applied onto an alkali-free glass plate, and the film was formed by heating at 130 ° C for 30 minutes in an oven to obtain a test piece having an antistatic film on its surface. Further, the dry film thickness in the test piece was calculated and adjusted according to the amount of the aqueous dispersion applied.

MS-51:於表示烷氧矽烷低聚物之上述通式中,R1=R2=甲基,R3=R4=甲氧基,重量平均分子量為500~700(給定值),n=4~7(根據重量平均分子量進行計算)MS-51: In the above formula representing alkoxydecane oligomer, R 1 = R 2 = methyl group, R 3 = R 4 = methoxy group, and the weight average molecular weight is 500 to 700 (given value), n=4 to 7 (calculated based on weight average molecular weight)

(實施例2)(Example 2)

使用Baytron PH1000(H.C.Starck公司製造,D50為52 nm,包含1.1份上述導電性聚合物)代替實施例1之Baytron PH500(H.C.Starck公司製造),以與實施例1相同之方式獲得試片。A test piece was obtained in the same manner as in Example 1 except that Baytron PH1000 (manufactured by H. C. Starck Co., Ltd., D50 was 52 nm, containing 1.1 parts of the above-mentioned conductive polymer) was used instead of Baytron PH500 (manufactured by H. C. Starck Co., Ltd.) of Example 1.

(實施例3)(Example 3)

使用Baytron P(H.C.Starck公司製造,D50為140 nm,包含1.1份上述導電性聚合物)代替實施例1之Baytron PH500(H.C.Starck公司製造),以與實施例1相同之方式獲得試片。A test piece was obtained in the same manner as in Example 1 except that Baytron P (manufactured by H. C. Starck Co., Ltd., D50 was 140 nm, containing 1.1 parts of the above-mentioned conductive polymer) was used instead of Baytron PH500 (manufactured by H. C. Starck Co., Ltd.) of Example 1.

(比較例1)(Comparative Example 1)

使用Baytron HC V4(H.C.Starck公司製造,D50為570 nm,包含1.1份上述導電性聚合物)代替實施例1之Baytron PH500(H.C.Starck公司製造),以與實施例1相同之方式獲得試片。A test piece was obtained in the same manner as in Example 1 except that Baytron HC V4 (manufactured by H. C. Starck Co., Ltd., D50 was 570 nm, containing 1.1 parts of the above-mentioned conductive polymer) was used instead of Baytron PH500 (manufactured by H. C. Starck Co., Ltd.) of Example 1.

(實施例4~7)(Examples 4 to 7)

除根據表2所記載而變更作為黏合劑之烷氧矽烷低聚物MS-51之使用量以外,以與實施例1相同之方式獲得試片。A test piece was obtained in the same manner as in Example 1 except that the amount of the alkoxydecane oligomer MS-51 used as the binder was changed as described in Table 2.

(實施例8及9)(Examples 8 and 9)

除實施例1之各成分以外,進而以表3所記載之量使用作為2-(3,4-環氧基環己基)乙基三甲氧基矽烷之Z-6043(Dow Corning Toray公司製造),以與實施例1相同之方式獲得試片。In addition to the components of Example 1, Z-6043 (manufactured by Dow Corning Toray Co., Ltd.) as 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane was used in the amounts described in Table 3, A test piece was obtained in the same manner as in Example 1.

(實施例10)(Embodiment 10)

除實施例1之各成分以外,進而以表4所記載之量使用作為3-環氧丙氧基丙基三甲氧基矽烷之Z-6040(Dow Corning Toray公司製造),以與實施例1相同之方式獲得試片。In the amount described in Table 4, Z-6040 (manufactured by Dow Corning Toray Co., Ltd.) as 3-glycidoxypropyltrimethoxydecane was used in the same manner as in Example 1, except that the components of Example 1 were used. The way to get the test piece.

(實施例11)(Example 11)

除實施例1之各成分以外,進而以表4所記載之量使用作為聚醚改質聚二甲基矽氧烷之BYK-301(BYK-Chemie公司製造),以與實施例1相同之方式獲得試片。In the same manner as in Example 1, except that each component of Example 1 was used, BYK-301 (manufactured by BYK-Chemie Co., Ltd.) which is a polyether-modified polydimethyl siloxane was used in the amount shown in Table 4 in the same manner as in Example 1. Get the test piece.

(實施例12)(Embodiment 12)

除使用MS-56(三菱化學公司製造)24份代替實施例1之烷氧矽烷低聚物MS-51(三菱化學公司製造)24份以外,以與實施例1相同之方式獲得試片。MS-56:於表示烷氧矽烷低聚物之上述通式中,R1=R2=甲基,R3=R4=甲氧基,重量平均分子量為1100~1300(給定值),n=10~12(根據重量平均分子量進行計算)A test piece was obtained in the same manner as in Example 1 except that 24 parts of MS-56 (manufactured by Mitsubishi Chemical Corporation) was used instead of 24 parts of the alkoxydecane oligomer MS-51 (manufactured by Mitsubishi Chemical Corporation) of Example 1. MS-56: In the above formula representing alkoxydecane oligomer, R 1 = R 2 = methyl group, R 3 = R 4 = methoxy group, and the weight average molecular weight is from 1100 to 1300 (given value), n=10~12 (calculated based on weight average molecular weight)

(比較例2~4)(Comparative examples 2 to 4)

除分別使用下述黏合劑24份代替實施例1之烷氧矽烷低聚物MS-51(三菱化學公司製造)24份以外,以與實施例1相同之方式獲得試片。A test piece was obtained in the same manner as in Example 1 except that 24 parts of the following adhesive were used instead of 24 parts of the alkoxydecane oligomer MS-51 (manufactured by Mitsubishi Chemical Corporation) of Example 1.

比較例2:單體(烷氧矽烷之單體(不含矽氧鍵)、甲基三甲氧基矽烷):Z-6366(Dow Corning Toray公司製造)Comparative Example 2: Monomer (alkoxysilane monomer (excluding oxime bond), methyltrimethoxy decane): Z-6366 (manufactured by Dow Corning Toray Co., Ltd.)

比較例3:聚酯樹脂:PlascoatRZ-105(互應化學公司製造)Comparative Example 3: Polyester resin: Plascoat RZ-105 (manufactured by Mutual Chemical Co., Ltd.)

比較例4:環氧系矽烷化合物:Z-6040(Dow Corning Toray公司製造)Comparative Example 4: epoxy decane compound: Z-6040 (manufactured by Dow Corning Toray Co., Ltd.)

(實施例13)(Example 13)

除使用N-甲基吡咯烷酮(Nacalai Tesque公司製造,試劑)19份代替實施例1之N-甲基甲醯胺(Nacalai Tesque公司製造,試劑)19份以外,以與實施例1相同之方式獲得試片。It was obtained in the same manner as in Example 1 except that 19 parts of N-methylpyrrolidone (available from Nacalai Tesque Co., Ltd.) was used instead of 19 parts of N-methylformamide (manufactured by Nacalai Tesque Co., Ltd.) of Example 1. Audition.

(實施例14~17)(Examples 14 to 17)

除藉由調整實施例1之水分散液之塗佈量而按照表7所記載變更乾燥膜厚以外,以與實施例1相同之方式獲得試片。A test piece was obtained in the same manner as in Example 1 except that the dry film thickness was changed as described in Table 7 by adjusting the coating amount of the aqueous dispersion of Example 1.

(實施例18)(Embodiment 18)

將實施例1之水分散液塗佈於PET膜(LumirrorT-60,Toray公司製造)上而非玻璃板上,利用烘箱於130℃下加熱30分鐘進行成膜而獲得表面具有抗靜電膜之試片。The aqueous dispersion of Example 1 was applied onto a PET film (Lumirror T-60, manufactured by Toray Co., Ltd.) instead of a glass plate, and heated at 130 ° C for 30 minutes in an oven to form a film to obtain an antistatic film on the surface. sheet.

(比較例5)(Comparative Example 5)

於本比較例中,對專利文獻1(日本專利特開平10-96953號)之第1實施形態進行驗證。即,根據[0051]之記載,於無鹼玻璃上塗佈3,4-伸乙基二氧噻吩1g與對甲苯磺酸鐵5g之乙醇溶液,利用烘箱進行加熱乾燥,形成有機導電膜而製作試片。In the present comparative example, the first embodiment of Patent Document 1 (Japanese Patent Laid-Open No. Hei 10-96953) was verified. Specifically, according to the description of [0051], an ethanol solution of 1 g of 3-, 4-ethylenedioxythiophene and 5 g of iron p-toluenesulfonate was applied to an alkali-free glass, and dried by an oven to form an organic conductive film. Audition.

(比較例6)(Comparative Example 6)

於本比較例中,對專利文獻1(日本專利特開平10-96953號)之第5實施形態進行驗證。即,根據[0070]之記載,於無鹼玻璃上塗佈將3,4-伸乙基二氧噻吩1g、對甲苯磺酸鐵2g、聚乙酸乙烯酯5g溶解於異丙醇-丙酮(1:1)混合物中而成之溶液後,對經塗佈之基板進行加熱乾燥。進而,以水流清洗,進行乾燥而製作試片。In the present comparative example, the fifth embodiment of Patent Document 1 (Japanese Patent Laid-Open No. Hei 10-96953) was verified. That is, according to the description of [0070], 1 g of 3,4-extended ethyldioxythiophene, 2 g of iron p-toluenesulfonate, and 5 g of polyvinyl acetate were dissolved in isopropanol-acetone (1) on the alkali-free glass. :1) After the solution obtained in the mixture, the coated substrate is dried by heating. Further, it was washed with a water stream and dried to prepare a test piece.

(比較例7)(Comparative Example 7)

於本比較例中,對利用無機物ITO之先前之抗靜電膜進行驗證。即,藉由濺鍍法於玻璃基板上使ITO膜成膜而製作試片。In the present comparative example, the previous antistatic film using the inorganic ITO was verified. That is, a test piece was produced by forming an ITO film on a glass substrate by a sputtering method.

利用以下方法對藉由以上實施例及比較例所獲得之試片之物性進行評價。The physical properties of the test pieces obtained by the above Examples and Comparative Examples were evaluated by the following methods.

(1)膜強度(1) Film strength

各試片之抗靜電膜之膜強度(鉛筆硬度)係依據JIS-K5600-5-4之試驗法,使用安田精機製作所公司製造之鉛筆刮痕硬度試驗機而進行測定。The film strength (pencil hardness) of the antistatic film of each test piece was measured by a pencil scratch hardness tester manufactured by Yasuda Seiki Co., Ltd. according to the test method of JIS-K5600-5-4.

(2)密接性(2) Adhesion

各試片之抗靜電膜與基材之密接性係根據JIS K5400之柵格剝離試驗進行評價。評價係以如下3個階段進行。The adhesion between the antistatic film of each test piece and the substrate was evaluated in accordance with the grid peeling test of JIS K5400. The evaluation was carried out in the following three stages.

◎:10分◎: 10 points

○:8分○: 8 points

×:6分以下×: 6 points or less

(3)總光線穿透率(%)、霧度(%)(3) Total light transmittance (%), haze (%)

各試片之總光線穿透率及霧度係根據JIS K7150,使用Suga試驗機公司製造之霧度計HGM-2B(商品名)而進行測定。The total light transmittance and haze of each test piece were measured in accordance with JIS K7150 using a haze meter HGM-2B (trade name) manufactured by Suga Test Instruments Co., Ltd.

(4)表面電阻率(Ω/□)(4) Surface resistivity (Ω/□)

各試片之抗靜電膜之表面電阻率係根據JIS K7194,使用三菱化學公司製造之Hiresta UP(MCP-HT-450,商品名),利用探針UA(Probe UA)於10V~500V之施加電壓下進行測定。The surface resistivity of the antistatic film of each test piece was based on JIS K7194, using Hiresta UP (MCP-HT-450, trade name) manufactured by Mitsubishi Chemical Corporation, and applying voltage of 10 V to 500 V using probe UA (Probe UA). The measurement was carried out.

(5)折射率(5) Refractive index

各試片之折射率係利用池尻光學工業所公司製造之Ellipsometer DHA-XA2/S6(商品名),於632.8 nm之波長下進行測定。The refractive index of each test piece was measured at a wavelength of 632.8 nm using an Ellipsometer DHA-XA2/S6 (trade name) manufactured by Ikebukuro Optical Industry Co., Ltd.

(6)耐化學品性(6) Chemical resistance

將各試片浸漬於溶劑(氫氧化鈉水溶液或丙酮溶液)中後,以如上所述之方式測定表面電阻率及膜強度,根據下述基準以3個階段評價其結果。於氫氧化鈉水溶液中之浸漬條件係設為於室溫下浸漬2分鐘。於丙酮中之浸漬條件係設為於室溫下浸漬1小時。After immersing each test piece in a solvent (aqueous sodium hydroxide solution or acetone solution), the surface resistivity and the film strength were measured as described above, and the results were evaluated in three stages according to the following criteria. The immersion conditions in the aqueous sodium hydroxide solution were set to be immersed at room temperature for 2 minutes. The immersion conditions in acetone were set to be immersed at room temperature for 1 hour.

○:表面電阻率為10乘方以下,且膜強度為鉛筆硬度B以上○: The surface resistivity is 10 or less, and the film strength is pencil hardness B or more.

△:表面電阻率為10乘方以下,或膜強度為鉛筆硬度B以上△: The surface resistivity is 10 or less, or the film strength is pencil hardness B or more.

×:表面電阻率為10乘方以上,且膜強度為鉛筆硬度B以下×: The surface resistivity is 10 or more, and the film strength is equal to or less than the pencil hardness B.

將以上所獲得之結果示於以下之表1~表8中。The results obtained above are shown in Tables 1 to 8 below.

再者,於表8中之比較例5及6中,成膜之抗靜電膜之塗膜表面較粗糙,因此無法測定折射率。Further, in Comparative Examples 5 and 6 in Table 8, the surface of the film formed by the antistatic film formed was rough, and thus the refractive index could not be measured.

根據表1之實施例1~3及比較例1可知,導電性聚合物粒子之粒徑必需為200 nm以下,若粒徑超過200 nm,則表面電阻率上升(即導電性較低),耐化學品性較差。According to Examples 1 to 3 and Comparative Example 1 of Table 1, the particle diameter of the conductive polymer particles must be 200 nm or less. When the particle diameter exceeds 200 nm, the surface resistivity increases (that is, the conductivity is low). Poor chemical properties.

根據表5之實施例1、12及比較例2~4可知,若使用烷氧矽烷之低聚物作為黏合劑成分,則耐化學品性優異且膜硬度較高,但若使用烷氧矽烷之單體,則耐化學品性大幅度降低,若使用聚酯系矽烷化合物或環氧系矽烷化合物,則除耐化學品性以外膜硬度亦降低。According to Examples 1 and 12 and Comparative Examples 2 to 4 of Table 5, when an oligomer of alkoxysilane is used as a binder component, chemical resistance is excellent and film hardness is high, but if alkoxysilane is used, When the monomer is used, the chemical resistance is greatly lowered. When a polyester decane compound or an epoxy decane compound is used, the film hardness is lowered in addition to the chemical resistance.

根據表2之實施例1及4~7可知,若烷氧矽烷低聚物之使用量相對於導電性聚合物粒子100重量份於150~10000重量份之範圍內,則可達成本發明之優異之效果。According to the examples 1 and 4 to 7 of Table 2, when the amount of the alkoxysilane oligomer used is in the range of 150 to 10,000 parts by weight based on 100 parts by weight of the conductive polymer particles, the invention can be excellent. The effect.

根據表3之實施例1、8及9及表4之實施例10及11可知,即便於本發明之組成物含有除烷氧矽烷低聚物以外之黏合劑成分之情形時,只要黏合劑成分中之烷氧矽烷低聚物之比例於97~100重量%之範圍內,則可達成本發明之優異之效果。According to Examples 10, 8 and 9 of Table 3 and Examples 10 and 11 of Table 4, it is understood that as long as the composition of the present invention contains a binder component other than the alkoxysilane oligomer, as long as the binder component The ratio of the alkoxysilane oligomer in the range of 97 to 100% by weight can achieve the excellent effect of the invention.

根據表7之實施例1及實施例14~17可知,若抗靜電膜之乾燥膜厚於25~380 nm之範圍內,則可達成本發明之優異之效果。According to Example 1 and Examples 14 to 17 of Table 7, it is understood that if the dried film thickness of the antistatic film is in the range of 25 to 380 nm, the excellent effect of the invention can be obtained.

根據表8之實施例18可知,即便塗佈於無鹼玻璃以外之PET基材上,亦可達成本發明之優異之效果。According to Example 18 of Table 8, it is understood that the excellent effects of the present invention can be achieved even when applied to a PET substrate other than alkali-free glass.

[產業上之可利用性][Industrial availability]

本發明之導電性塗佈組成物可於液晶顯示器(LCD)、電致發光顯示器、電漿顯示器、電子呈色顯示器、太陽電池、電池、電容器、化學感測器、顯示元件、半導體材料、電磁波遮罩材等中,藉由塗佈基材而用以於該基材上形成導電膜或抗靜電膜。又,亦可用作塗佈於眼鏡或汽車等之玻璃上之導電性塗料或防銹塗料。The conductive coating composition of the present invention can be used in liquid crystal displays (LCDs), electroluminescent displays, plasma displays, electronic color display, solar cells, batteries, capacitors, chemical sensors, display elements, semiconductor materials, electromagnetic waves. In a mask or the like, a conductive film or an antistatic film is formed on the substrate by coating a substrate. Moreover, it can also be used as a conductive coating or rust-proof coating applied to the glass of glasses, an automobile, etc..

1...彩色濾光片1. . . Color filter

2...玻璃基板2. . . glass substrate

3...抗靜電層3. . . Antistatic layer

4...偏光板4. . . Polarizer

圖1為表示通常之液晶顯示裝置之積層結構之示意圖。Fig. 1 is a view showing a laminated structure of a general liquid crystal display device.

Claims (11)

一種導電性塗佈組成物,包含粒徑(D50)為200nm以下之導電性聚合物粒子、及含有下述通式所表示之烷氧矽烷低聚物之黏合劑成分;該黏合劑成分之總調配量相對於該導電性聚合物粒子100重量份為150~10000重量份;該黏合劑成分中之該烷氧矽烷低聚物之調配量為97~100重量%: 式中,R1及R2相同或不同,表示碳數1~4之烷基;R3及R4相同或不同,表示H(氫原子)、羥基、或碳數1~4之烷氧基,其中複數個R3及R4中之至少1個為烷氧基;n表示2~20之整數。 A conductive coating composition comprising conductive polymer particles having a particle diameter (D50) of 200 nm or less and a binder component containing an alkoxynonane oligomer represented by the following formula; The blending amount is 150 to 10000 parts by weight based on 100 parts by weight of the conductive polymer particles; and the alkoxydecane oligomer in the binder component is formulated in an amount of 97 to 100% by weight: Formula, R 1 is and R 2 are the same or different and each represents an alkyl group having 1 to 4 carbon atoms, the; same or different, R 3 and R 4, represents H (a hydrogen atom), a hydroxyl group, or an alkoxy having 1 to 4 carbon atoms of the group Wherein at least one of the plurality of R 3 and R 4 is an alkoxy group; and n represents an integer of from 2 to 20. 如申請專利範圍第1項之導電性塗佈組成物,其中,該導電性聚合物粒子之粒徑為60nm以下。 The conductive coating composition according to claim 1, wherein the conductive polymer particles have a particle diameter of 60 nm or less. 如申請專利範圍第1項之導電性塗佈組成物,其中,該導電性聚合物粒子之粒徑為30nm以下。 The conductive coating composition according to claim 1, wherein the conductive polymer particles have a particle diameter of 30 nm or less. 如申請專利範圍第1項至第3項中任一項之導電性塗佈組成物,其中,該導電性聚合物為聚(3,4-二取代噻吩)與聚陰離子之複合體。 The conductive coating composition according to any one of claims 1 to 3, wherein the conductive polymer is a composite of poly(3,4-disubstituted thiophene) and a polyanion. 如申請專利範圍第1項至第3項中任一項之導電性塗佈組成物,進而包含導電性提高劑。 The conductive coating composition according to any one of claims 1 to 3, further comprising a conductivity improving agent. 如申請專利範圍第5項之導電性塗佈組成物,其中,該導電性提高劑係選自由N-甲基甲醯胺及N-甲基吡咯烷酮構成之群中之至少1種。 The conductive coating composition according to claim 5, wherein the conductivity improving agent is at least one selected from the group consisting of N-methylformamide and N-methylpyrrolidone. 如申請專利範圍第1項至第3項中任一項之導電性塗佈組成物,係用以形成液晶顯示裝置所含之抗靜電層。 The conductive coating composition according to any one of claims 1 to 3 is for forming an antistatic layer contained in a liquid crystal display device. 一種積層體,係包含基材、及設置於該基材上之導電膜,其中,該導電膜係由申請專利範圍第1項至第7項中任一項之導電性塗佈組成物所形成。 A laminated body comprising a substrate and a conductive film provided on the substrate, wherein the conductive film is formed by the conductive coating composition according to any one of claims 1 to 7. . 如申請專利範圍第8項之積層體,其中,該導電膜之乾燥膜厚為25~380nm。 The laminate of claim 8 wherein the conductive film has a dry film thickness of 25 to 380 nm. 如申請專利範圍第8項或第9項之積層體,其中,該基材為玻璃基板。 The laminate of claim 8 or 9, wherein the substrate is a glass substrate. 如申請專利範圍第10項之積層體,係包含於液晶顯示裝置中。 The laminate according to claim 10 of the patent application is included in a liquid crystal display device.
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