TWI513302B - 半導體裝置 - Google Patents
半導體裝置 Download PDFInfo
- Publication number
- TWI513302B TWI513302B TW100107560A TW100107560A TWI513302B TW I513302 B TWI513302 B TW I513302B TW 100107560 A TW100107560 A TW 100107560A TW 100107560 A TW100107560 A TW 100107560A TW I513302 B TWI513302 B TW I513302B
- Authority
- TW
- Taiwan
- Prior art keywords
- transistor
- sensor
- photo sensor
- pixel
- data
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/042—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8033—Photosensitive area
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04166—Details of scanning methods, e.g. sampling time, grouping of sub areas or time sharing with display driving
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/70—Circuitry for compensating brightness variation in the scene
- H04N23/73—Circuitry for compensating brightness variation in the scene by influencing the exposure time
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/51—Control of the gain
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/016—Manufacture or treatment of image sensors covered by group H10F39/12 of thin-film-based image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/182—Colour image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Thin Film Transistor (AREA)
- Studio Devices (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Nanotechnology (AREA)
- Position Input By Displaying (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Indication In Cameras, And Counting Of Exposures (AREA)
- Liquid Crystal (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010054006 | 2010-03-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201206186A TW201206186A (en) | 2012-02-01 |
| TWI513302B true TWI513302B (zh) | 2015-12-11 |
Family
ID=44559632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100107560A TWI513302B (zh) | 2010-03-11 | 2011-03-07 | 半導體裝置 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US8502902B2 (enExample) |
| JP (3) | JP5890608B2 (enExample) |
| KR (2) | KR101706291B1 (enExample) |
| TW (1) | TWI513302B (enExample) |
| WO (1) | WO2011111530A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10884552B2 (en) | 2019-04-15 | 2021-01-05 | Au Optronics Corporation | Touch panel with sensor elements |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5848586B2 (ja) | 2010-11-12 | 2016-01-27 | 株式会社半導体エネルギー研究所 | 入出力装置 |
| JP5774974B2 (ja) | 2010-12-22 | 2015-09-09 | 株式会社半導体エネルギー研究所 | 半導体装置の駆動方法 |
| KR102021908B1 (ko) * | 2011-05-03 | 2019-09-18 | 삼성전자주식회사 | 광터치 스크린 장치 및 그 구동 방법 |
| KR101854187B1 (ko) * | 2011-07-28 | 2018-05-08 | 삼성전자주식회사 | 광센싱 장치 및 그 구동 방법, 광센싱 장치를 포함하는 광터치 스크린 장치 |
| JP5270790B1 (ja) | 2012-05-30 | 2013-08-21 | 富士フイルム株式会社 | 放射線画像撮影装置、放射線画像撮影システム、放射線画像撮影装置の制御プログラム、及び放射線画像撮影装置の制御方法 |
| CN103855182A (zh) * | 2012-11-28 | 2014-06-11 | 瀚宇彩晶股份有限公司 | 有机发光二极管触控显示面板及其电磁式触控显示装置 |
| US10222911B2 (en) * | 2013-04-12 | 2019-03-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and driving method of the same |
| US9817520B2 (en) | 2013-05-20 | 2017-11-14 | Semiconductor Energy Laboratory Co., Ltd. | Imaging panel and imaging device |
| KR102085274B1 (ko) * | 2013-06-21 | 2020-03-06 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| CN104867964B (zh) * | 2015-05-18 | 2019-02-22 | 京东方科技集团股份有限公司 | 阵列基板、其制造方法以及有机发光二极管显示装置 |
| KR102453950B1 (ko) * | 2015-09-30 | 2022-10-17 | 엘지디스플레이 주식회사 | 표시장치와 그 구동 방법 |
| US20170170218A1 (en) * | 2015-12-09 | 2017-06-15 | Dpix, Llc | Top gate metal oxide thin film transistor switching device for imaging applications |
| CN106529463B (zh) * | 2016-10-28 | 2019-04-23 | 京东方科技集团股份有限公司 | 一种指纹识别显示面板、显示装置和指纹识别方法 |
| JP6892577B2 (ja) * | 2017-04-28 | 2021-06-23 | 天馬微電子有限公司 | イメージセンサ及びセンサ装置 |
| KR102430318B1 (ko) * | 2017-06-21 | 2022-08-10 | 삼성디스플레이 주식회사 | 표시 장치 및 그의 동작 방법 |
| US10777122B2 (en) * | 2017-12-27 | 2020-09-15 | Lg Display Co., Ltd. | Electroluminescence display device and driving method thereof |
| CN108304803B (zh) * | 2018-01-31 | 2021-04-23 | 京东方科技集团股份有限公司 | 光检测电路、光检测方法和显示装置 |
| KR102532091B1 (ko) * | 2018-11-16 | 2023-05-15 | 엘지디스플레이 주식회사 | 표시 장치 |
| JP7530898B2 (ja) * | 2019-07-17 | 2024-08-08 | 株式会社半導体エネルギー研究所 | 表示装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200631171A (en) * | 2005-02-18 | 2006-09-01 | Semiconductor Energy Lab Co Ltd | Photoelectric conversion device and manufacturing method of the same, and a semiconductor device |
| TW200844560A (en) * | 2006-12-27 | 2008-11-16 | Semiconductor Energy Lab | Liquid crystal display device and driving method thereof, and electronic device with the liquid crystal display device |
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| JPS634777A (ja) | 1986-06-24 | 1988-01-09 | Nippon Denso Co Ltd | 固体撮像装置 |
| JPH0612512B2 (ja) | 1989-03-16 | 1994-02-16 | ミナトエレクトロニクス株式会社 | 光学式タッチパネルの受光素子の感度調整方法 |
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| JP4112184B2 (ja) | 2000-01-31 | 2008-07-02 | 株式会社半導体エネルギー研究所 | エリアセンサ及び表示装置 |
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| KR101102370B1 (ko) | 2003-03-26 | 2012-01-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 다방향으로부터의 빛을 검출하는 광센서, 휴대용 통신기기및 표시 방법 |
| JP4257221B2 (ja) | 2003-03-31 | 2009-04-22 | 東芝松下ディスプレイテクノロジー株式会社 | 表示装置および情報端末装置 |
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| JP2006243927A (ja) | 2005-03-01 | 2006-09-14 | Toshiba Matsushita Display Technology Co Ltd | 表示装置 |
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| JP4338140B2 (ja) | 2005-05-12 | 2009-10-07 | 株式会社 日立ディスプレイズ | タッチパネル一体表示装置 |
| JP2007129564A (ja) | 2005-11-04 | 2007-05-24 | Olympus Imaging Corp | デジタルカメラ |
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| JP2008102418A (ja) | 2006-10-20 | 2008-05-01 | Toshiba Matsushita Display Technology Co Ltd | 表示装置 |
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| JP2008053583A (ja) | 2006-08-28 | 2008-03-06 | Nec Corp | 半導体受光素子及び半導体光集積素子 |
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| US7924273B2 (en) | 2006-11-06 | 2011-04-12 | Toshiba Matsushita Display Technology Co., Ltd. | Display apparatus with optical input function |
| JP4826512B2 (ja) | 2007-03-12 | 2011-11-30 | セイコーエプソン株式会社 | 表示装置及び電子機器 |
| CN101627350A (zh) | 2007-03-26 | 2010-01-13 | 夏普株式会社 | 定位设备和使用它的显示装置 |
| WO2008123119A1 (en) | 2007-03-26 | 2008-10-16 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and electronic device provided with the photoelectric conversion device |
| WO2008126768A1 (ja) | 2007-04-09 | 2008-10-23 | Sharp Kabushiki Kaisha | 表示装置 |
| DE102007021036A1 (de) * | 2007-05-04 | 2008-11-06 | Carl Zeiss Ag | Anzeigevorrichtung und Anzeigeverfahren zur binokularen Darstellung eines mehrfarbigen Bildes |
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| JP5567770B2 (ja) | 2007-09-21 | 2014-08-06 | 株式会社ジャパンディスプレイ | 表示装置及び表示装置の製造方法 |
| JP5660755B2 (ja) * | 2007-11-02 | 2015-01-28 | 株式会社ジャパンディスプレイ | 表示装置および表示制御方法ならびに電子機器 |
| JP4978453B2 (ja) | 2007-12-14 | 2012-07-18 | セイコーエプソン株式会社 | センシング装置、表示装置および電子機器 |
| US8411117B2 (en) | 2007-12-20 | 2013-04-02 | Sharp Kabushiki Kaisha | Display device having optical sensors |
| TWI360644B (en) * | 2008-02-19 | 2012-03-21 | Wintek Corp | Photo sensor for a display device |
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| JP5311299B2 (ja) * | 2008-06-03 | 2013-10-09 | 株式会社ジャパンディスプレイ | 液晶表示装置 |
| US8736587B2 (en) | 2008-07-10 | 2014-05-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP5501583B2 (ja) * | 2008-08-08 | 2014-05-21 | 株式会社半導体エネルギー研究所 | 光電変換装置、及び当該光電変換装置を具備する電子機器 |
| JP4796104B2 (ja) * | 2008-08-29 | 2011-10-19 | シャープ株式会社 | 撮像装置、画像解析装置、外光強度算出方法、画像解析方法、撮像プログラム、画像解析プログラムおよび記録媒体 |
| KR20100038046A (ko) | 2008-10-02 | 2010-04-12 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 터치 패널 및 터치 패널의 구동방법 |
| US8154532B2 (en) * | 2008-10-15 | 2012-04-10 | Au Optronics Corporation | LCD display with photo sensor touch function |
| KR100975871B1 (ko) * | 2008-10-17 | 2010-08-13 | 삼성모바일디스플레이주식회사 | 광 센싱 회로, 이를 포함하는 터치 패널, 및 광 센싱 회로의 구동 방법 |
| US8675962B2 (en) * | 2008-12-22 | 2014-03-18 | Rohm Co., Ltd. | Image correction processing circuit, semiconductor device, and image correction processing device |
| WO2010073892A1 (en) | 2008-12-24 | 2010-07-01 | Semiconductor Energy Laboratory Co., Ltd. | Touch panel and driving method thereof |
| JP5313853B2 (ja) | 2008-12-24 | 2013-10-09 | 株式会社半導体エネルギー研究所 | センサを有する装置、及び表示装置 |
| JP4699536B2 (ja) | 2009-03-06 | 2011-06-15 | シャープ株式会社 | 位置検出装置、制御方法、制御プログラムおよび記録媒体 |
| JP5740132B2 (ja) | 2009-10-26 | 2015-06-24 | 株式会社半導体エネルギー研究所 | 表示装置及び半導体装置 |
| JP5866089B2 (ja) | 2009-11-20 | 2016-02-17 | 株式会社半導体エネルギー研究所 | 電子機器 |
| TWI507934B (zh) | 2009-11-20 | 2015-11-11 | Semiconductor Energy Lab | 顯示裝置 |
| CN105786268B (zh) | 2010-02-19 | 2019-03-12 | 株式会社半导体能源研究所 | 显示设备及其驱动方法 |
-
2011
- 2011-02-17 KR KR1020127026016A patent/KR101706291B1/ko not_active Expired - Fee Related
- 2011-02-17 WO PCT/JP2011/054058 patent/WO2011111530A1/en not_active Ceased
- 2011-02-17 KR KR1020177003173A patent/KR101754382B1/ko not_active Expired - Fee Related
- 2011-03-03 US US13/039,672 patent/US8502902B2/en not_active Expired - Fee Related
- 2011-03-07 JP JP2011049287A patent/JP5890608B2/ja not_active Expired - Fee Related
- 2011-03-07 TW TW100107560A patent/TWI513302B/zh not_active IP Right Cessation
-
2013
- 2013-08-02 US US13/957,559 patent/US10031622B2/en active Active
-
2015
- 2015-02-13 JP JP2015026341A patent/JP5970095B2/ja not_active Expired - Fee Related
-
2016
- 2016-07-08 JP JP2016135864A patent/JP6204539B2/ja not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200631171A (en) * | 2005-02-18 | 2006-09-01 | Semiconductor Energy Lab Co Ltd | Photoelectric conversion device and manufacturing method of the same, and a semiconductor device |
| TW200844560A (en) * | 2006-12-27 | 2008-11-16 | Semiconductor Energy Lab | Liquid crystal display device and driving method thereof, and electronic device with the liquid crystal display device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10884552B2 (en) | 2019-04-15 | 2021-01-05 | Au Optronics Corporation | Touch panel with sensor elements |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011210248A (ja) | 2011-10-20 |
| TW201206186A (en) | 2012-02-01 |
| WO2011111530A1 (en) | 2011-09-15 |
| US10031622B2 (en) | 2018-07-24 |
| JP5890608B2 (ja) | 2016-03-22 |
| JP2016208527A (ja) | 2016-12-08 |
| US8502902B2 (en) | 2013-08-06 |
| US20130313412A1 (en) | 2013-11-28 |
| US20110221945A1 (en) | 2011-09-15 |
| JP2015149071A (ja) | 2015-08-20 |
| KR101754382B1 (ko) | 2017-07-05 |
| KR101706291B1 (ko) | 2017-02-14 |
| KR20170016036A (ko) | 2017-02-10 |
| KR20130028076A (ko) | 2013-03-18 |
| JP5970095B2 (ja) | 2016-08-17 |
| JP6204539B2 (ja) | 2017-09-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |