TWI512047B - 可固化有機聚矽氧烷組合物及光學半導體裝置 - Google Patents

可固化有機聚矽氧烷組合物及光學半導體裝置 Download PDF

Info

Publication number
TWI512047B
TWI512047B TW100121707A TW100121707A TWI512047B TW I512047 B TWI512047 B TW I512047B TW 100121707 A TW100121707 A TW 100121707A TW 100121707 A TW100121707 A TW 100121707A TW I512047 B TWI512047 B TW I512047B
Authority
TW
Taiwan
Prior art keywords
sio
component
weight
group
composition
Prior art date
Application number
TW100121707A
Other languages
English (en)
Chinese (zh)
Other versions
TW201209101A (en
Inventor
吉武誠
山川美江子
Original Assignee
道康寧東麗股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 道康寧東麗股份有限公司 filed Critical 道康寧東麗股份有限公司
Publication of TW201209101A publication Critical patent/TW201209101A/zh
Application granted granted Critical
Publication of TWI512047B publication Critical patent/TWI512047B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Led Device Packages (AREA)
TW100121707A 2010-06-29 2011-06-21 可固化有機聚矽氧烷組合物及光學半導體裝置 TWI512047B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010147689A JP5680889B2 (ja) 2010-06-29 2010-06-29 硬化性オルガノポリシロキサン組成物および光半導体装置

Publications (2)

Publication Number Publication Date
TW201209101A TW201209101A (en) 2012-03-01
TWI512047B true TWI512047B (zh) 2015-12-11

Family

ID=44475009

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100121707A TWI512047B (zh) 2010-06-29 2011-06-21 可固化有機聚矽氧烷組合物及光學半導體裝置

Country Status (7)

Country Link
US (1) US9012586B2 (enExample)
EP (1) EP2588539B1 (enExample)
JP (1) JP5680889B2 (enExample)
KR (1) KR101722123B1 (enExample)
CN (1) CN102959015B (enExample)
TW (1) TWI512047B (enExample)
WO (1) WO2012002561A1 (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5534977B2 (ja) 2010-06-29 2014-07-02 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および光半導体装置
JP5693063B2 (ja) * 2010-07-01 2015-04-01 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置
JP5817377B2 (ja) * 2011-09-20 2015-11-18 住友ベークライト株式会社 シリコーンゴム系硬化性組成物、シリコーンゴムの製造方法、シリコーンゴム、成形体および医療用チューブ
JP6057503B2 (ja) * 2011-09-21 2017-01-11 東レ・ダウコーニング株式会社 光半導体素子封止用硬化性シリコーン組成物、樹脂封止光半導体素子の製造方法、および樹脂封止光半導体素子
JP5706357B2 (ja) * 2012-02-24 2015-04-22 富士フイルム株式会社 基板モジュールおよびその製造方法
JP5922463B2 (ja) * 2012-03-30 2016-05-24 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
US9902811B2 (en) * 2013-02-22 2018-02-27 Dow Corning Toray Co. Ltd. Curable silicone composition, cured product thereof, and optical semiconductor device
JP6467125B2 (ja) * 2013-06-27 2019-02-06 株式会社カネカ 硬化性樹脂組成物、該組成物を硬化させてなる硬化物
EP3041897B1 (en) * 2013-09-03 2017-05-24 Dow Corning Corporation Additive for a silicone encapsulant
WO2017028008A1 (zh) * 2015-08-14 2017-02-23 烟台德邦先进硅材料有限公司 一种高折射率高韧性的耐硫化led封装硅胶
WO2017068762A1 (en) * 2015-10-19 2017-04-27 Dow Corning Toray Co., Ltd. Active energy ray curable hot melt silicone composition, cured product thereof, and method of producing film
WO2017085612A1 (en) * 2015-11-18 2017-05-26 Sabic Global Technologies B.V. An iccp grid anode system that mitigates the failure of positive feeder connections
US20200239687A1 (en) * 2015-11-18 2020-07-30 Dow Silicones Corporation Curable silicone composition
US10461232B2 (en) 2016-01-15 2019-10-29 Citizen Watch Co., Ltd. Condensation reaction-type die bonding agent, LED light emitting device and method for manufacturing same
EP3409209B1 (en) * 2016-01-28 2025-04-30 FUJIFILM Corporation Composition for acoustic wave probe, silicone resin for acoustic wave probe using same, acoustic wave probe, and ultrasonic probe, and acoustic wave measurement device, ultrasonic diagnostic device, photoacoustic wave measurement device, and ultrasonic endoscope
WO2017163936A1 (ja) * 2016-03-25 2017-09-28 富士フイルム株式会社 音響波プローブ用組成物、これを用いた音響波プローブ用シリコーン樹脂、音響波プローブおよび超音波プローブ、ならびに、音響波測定装置、超音波診断装置、光音響波測定装置および超音波内視鏡
JP6519531B2 (ja) * 2016-06-03 2019-05-29 信越化学工業株式会社 付加硬化性シリコーン樹脂組成物及び光半導体装置用ダイアタッチ材
KR102550879B1 (ko) * 2016-12-13 2023-07-03 미쯔비시 케미컬 주식회사 폴리오르가노실록산, 폴리오르가노실록산 조성물, 및 그 경화물, 그리고 폴리오르가노실록산을 포함하는 전해 콘덴서용 전해액 및 그것을 사용한 전해 콘덴서
EP3562889A4 (en) * 2016-12-30 2020-12-09 Elkem Silicones Shanghai Co., Ltd. CURING SILICONE COMPOSITIONS
KR102518155B1 (ko) * 2017-01-16 2023-04-06 니치아 카가쿠 고교 가부시키가이샤 경화성 수지 조성물, 그의 경화물 및 반도체 장치
CN110382625B (zh) * 2017-02-27 2022-02-18 杜邦东丽特殊材料株式会社 可固化的有机聚硅氧烷组合物和半导体器件
TWI762649B (zh) * 2017-06-26 2022-05-01 日商杜邦東麗特殊材料股份有限公司 黏晶用固化性矽組合物
RU2696897C1 (ru) 2018-12-18 2019-08-07 Открытое акционерное общество "Хлебпром" Чипсы цельнозерновые и способ их производства
TWI869483B (zh) * 2019-12-11 2025-01-11 美商陶氏全球科技公司 快速矽氫化固化組合物
CN116134093B (zh) 2020-06-30 2024-12-27 陶氏东丽株式会社 固化性有机硅组合物及其固化物
JP2023132309A (ja) 2022-03-10 2023-09-22 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物
CN120380086A (zh) * 2022-12-23 2025-07-25 陶氏东丽株式会社 热熔性固化性有机硅组合物、使用该组合物的层叠体以及半导体装置的制造方法
JP7904782B2 (ja) 2022-12-28 2026-08-13 Ｄｕｒｏｐｔｉｘマテリアル株式会社 硬化性シリコーン組成物
CN118085575A (zh) * 2023-11-28 2024-05-28 东莞市贝特利新材料有限公司 有机聚硅氧烷组合物、密封材料和半导体器件

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200849508A (en) * 2007-03-19 2008-12-16 Sanyu Rec Co Ltd Silicone resin composition for encapsulating luminescent element and process for producing optical-semiconductor electronic part with the same through potting
TW200916530A (en) * 2007-07-31 2009-04-16 Dow Corning Toray Co Ltd Curable silicone composition for providing highly transparent silicone cured material

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5696210A (en) * 1996-10-09 1997-12-09 Dow Corning Corporation Flowable adhesive
US6124407A (en) 1998-10-28 2000-09-26 Dow Corning Corporation Silicone composition, method for the preparation thereof, and silicone elastomer
JP4648099B2 (ja) 2005-06-07 2011-03-09 信越化学工業株式会社 ダイボンディング用シリコーン樹脂組成物
JP2007063538A (ja) 2005-08-03 2007-03-15 Shin Etsu Chem Co Ltd 発光ダイオード用付加硬化型シリコーン樹脂組成物
JP4965111B2 (ja) 2005-11-09 2012-07-04 東レ・ダウコーニング株式会社 硬化性シリコーン組成物
JP2008120843A (ja) 2006-11-08 2008-05-29 Momentive Performance Materials Japan Kk 光透過性シリコーンレジンと光透過性シリコーンレジン組成物および光半導体装置
JP5233645B2 (ja) 2008-12-17 2013-07-10 株式会社ニコン 撮像装置および画像処理プログラム
JP5534977B2 (ja) 2010-06-29 2014-07-02 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および光半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200849508A (en) * 2007-03-19 2008-12-16 Sanyu Rec Co Ltd Silicone resin composition for encapsulating luminescent element and process for producing optical-semiconductor electronic part with the same through potting
TW200916530A (en) * 2007-07-31 2009-04-16 Dow Corning Toray Co Ltd Curable silicone composition for providing highly transparent silicone cured material

Also Published As

Publication number Publication date
EP2588539A1 (en) 2013-05-08
TW201209101A (en) 2012-03-01
JP2012012433A (ja) 2012-01-19
CN102959015A (zh) 2013-03-06
JP5680889B2 (ja) 2015-03-04
US9012586B2 (en) 2015-04-21
KR20130112713A (ko) 2013-10-14
KR101722123B1 (ko) 2017-03-31
CN102959015B (zh) 2015-02-18
WO2012002561A1 (en) 2012-01-05
EP2588539B1 (en) 2014-05-14
US20130161686A1 (en) 2013-06-27

Similar Documents

Publication Publication Date Title
TWI512044B (zh) 可固化有機聚矽氧烷組合物及光學半導體裝置
US9012586B2 (en) Curable organopolysiloxane composition and optical semiconductor device
TWI495688B (zh) 可固化有機聚矽氧烷組合物、光學半導體元件密封劑及光學半導體裝置
TWI480337B (zh) 可固化有機聚矽氧烷組合物、光學半導體元件密封劑及光學半導體裝置
KR101580955B1 (ko) 경화성 실리콘 수지 조성물, 그 경화물 및 광반도체 디바이스
EP3662006B1 (en) Curable organopolysiloxane composition and optical semiconductor device
TWI567112B (zh) 可硬化性聚矽氧組合物、其硬化產品及光半導體裝置
KR20130105429A (ko) 경화성 실리콘 수지 조성물, 그의 경화물 및 광반도체 디바이스
JP6463663B2 (ja) 接着促進剤、付加硬化型オルガノポリシロキサン樹脂組成物及び半導体装置
EP3587498B1 (en) Curable organopolysiloxane composition and semiconductor device
TWI829640B (zh) 可固化聚矽氧組合物及光學半導體裝置