TWI512047B - 可固化有機聚矽氧烷組合物及光學半導體裝置 - Google Patents

可固化有機聚矽氧烷組合物及光學半導體裝置 Download PDF

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Publication number
TWI512047B
TWI512047B TW100121707A TW100121707A TWI512047B TW I512047 B TWI512047 B TW I512047B TW 100121707 A TW100121707 A TW 100121707A TW 100121707 A TW100121707 A TW 100121707A TW I512047 B TWI512047 B TW I512047B
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Taiwan
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component
weight
group
composition
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TW100121707A
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Chinese (zh)
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TW201209101A (en
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吉武誠
山川美江子
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道康寧東麗股份有限公司
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H10W72/30—
    • H10W74/40—
    • H10W74/476—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H10W72/884—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
TW100121707A 2010-06-29 2011-06-21 可固化有機聚矽氧烷組合物及光學半導體裝置 TWI512047B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010147689A JP5680889B2 (ja) 2010-06-29 2010-06-29 硬化性オルガノポリシロキサン組成物および光半導体装置

Publications (2)

Publication Number Publication Date
TW201209101A TW201209101A (en) 2012-03-01
TWI512047B true TWI512047B (zh) 2015-12-11

Family

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Family Applications (1)

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TW100121707A TWI512047B (zh) 2010-06-29 2011-06-21 可固化有機聚矽氧烷組合物及光學半導體裝置

Country Status (7)

Country Link
US (1) US9012586B2 (enExample)
EP (1) EP2588539B1 (enExample)
JP (1) JP5680889B2 (enExample)
KR (1) KR101722123B1 (enExample)
CN (1) CN102959015B (enExample)
TW (1) TWI512047B (enExample)
WO (1) WO2012002561A1 (enExample)

Families Citing this family (28)

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JP5534977B2 (ja) 2010-06-29 2014-07-02 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および光半導体装置
JP5693063B2 (ja) * 2010-07-01 2015-04-01 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置
JP5817377B2 (ja) * 2011-09-20 2015-11-18 住友ベークライト株式会社 シリコーンゴム系硬化性組成物、シリコーンゴムの製造方法、シリコーンゴム、成形体および医療用チューブ
JP6057503B2 (ja) * 2011-09-21 2017-01-11 東レ・ダウコーニング株式会社 光半導体素子封止用硬化性シリコーン組成物、樹脂封止光半導体素子の製造方法、および樹脂封止光半導体素子
JP5706357B2 (ja) * 2012-02-24 2015-04-22 富士フイルム株式会社 基板モジュールおよびその製造方法
JP5922463B2 (ja) * 2012-03-30 2016-05-24 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
KR101747160B1 (ko) * 2013-02-22 2017-06-14 다우 코닝 도레이 캄파니 리미티드 경화성 실리콘 조성물, 이의 경화물, 및 광반도체 디바이스
JP6467125B2 (ja) * 2013-06-27 2019-02-06 株式会社カネカ 硬化性樹脂組成物、該組成物を硬化させてなる硬化物
EP3041897B1 (en) * 2013-09-03 2017-05-24 Dow Corning Corporation Additive for a silicone encapsulant
WO2017028008A1 (zh) * 2015-08-14 2017-02-23 烟台德邦先进硅材料有限公司 一种高折射率高韧性的耐硫化led封装硅胶
JP6347902B1 (ja) * 2015-10-19 2018-06-27 東レ・ダウコーニング株式会社 活性エネルギー線硬化型ホットメルトシリコーン組成物、その硬化物、およびフィルムの製造方法
WO2017085612A1 (en) * 2015-11-18 2017-05-26 Sabic Global Technologies B.V. An iccp grid anode system that mitigates the failure of positive feeder connections
WO2017087351A1 (en) * 2015-11-18 2017-05-26 Dow Corning Corporation Curable silicone composition
DE112017000390T5 (de) * 2016-01-15 2018-09-27 Citizen Electronics Co., Ltd. Chip-Bindemittel vom Typ Kondensationsreaktion, LED-Licht emittierende Vorrichtung und Verfahren zu deren Herstellung
WO2017130890A1 (ja) * 2016-01-28 2017-08-03 富士フイルム株式会社 音響波プローブ用組成物、これを用いた音響波プローブ用シリコーン樹脂、音響波プローブおよび超音波プローブ、ならびに、音響波測定装置、超音波診断装置、光音響波測定装置および超音波内視鏡
WO2017163936A1 (ja) * 2016-03-25 2017-09-28 富士フイルム株式会社 音響波プローブ用組成物、これを用いた音響波プローブ用シリコーン樹脂、音響波プローブおよび超音波プローブ、ならびに、音響波測定装置、超音波診断装置、光音響波測定装置および超音波内視鏡
JP6519531B2 (ja) * 2016-06-03 2019-05-29 信越化学工業株式会社 付加硬化性シリコーン樹脂組成物及び光半導体装置用ダイアタッチ材
WO2018110613A1 (ja) * 2016-12-13 2018-06-21 三菱ケミカル株式会社 ポリオルガノシロキサン、ポリオルガノシロキサン組成物、及びその硬化物、並びにポリオルガノシロキサンを含む電解コンデンサ用電解液及びそれを用いた電解コンデンサ
WO2018121706A1 (en) * 2016-12-30 2018-07-05 Elkem Silicones Shanghai Co., Ltd. Curable silicone compositions
JP6985613B2 (ja) * 2017-01-16 2021-12-22 日亜化学工業株式会社 硬化性樹脂組成物、その硬化物、及び半導体装置
EP3587498B1 (en) * 2017-02-27 2022-02-16 DuPont Toray Specialty Materials Kabushiki Kaisha Curable organopolysiloxane composition and semiconductor device
TWI762649B (zh) * 2017-06-26 2022-05-01 日商杜邦東麗特殊材料股份有限公司 黏晶用固化性矽組合物
RU2696897C1 (ru) 2018-12-18 2019-08-07 Открытое акционерное общество "Хлебпром" Чипсы цельнозерновые и способ их производства
TWI869483B (zh) * 2019-12-11 2025-01-11 美商陶氏全球科技公司 快速矽氫化固化組合物
KR20230030637A (ko) 2020-06-30 2023-03-06 다우 도레이 캄파니 리미티드 경화성 실리콘 조성물 및 그의 경화물
JP2023132309A (ja) 2022-03-10 2023-09-22 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物
KR20250126734A (ko) * 2022-12-23 2025-08-25 다우 도레이 캄파니 리미티드 핫 멜트성 경화성 실리콘 조성물, 당해 조성물을 사용하는 적층체 및 반도체 장치의 제조 방법
JP2024095181A (ja) 2022-12-28 2024-07-10 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物

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TW200849508A (en) * 2007-03-19 2008-12-16 Sanyu Rec Co Ltd Silicone resin composition for encapsulating luminescent element and process for producing optical-semiconductor electronic part with the same through potting
TW200916530A (en) * 2007-07-31 2009-04-16 Dow Corning Toray Co Ltd Curable silicone composition for providing highly transparent silicone cured material

Also Published As

Publication number Publication date
WO2012002561A1 (en) 2012-01-05
US20130161686A1 (en) 2013-06-27
KR20130112713A (ko) 2013-10-14
JP2012012433A (ja) 2012-01-19
CN102959015A (zh) 2013-03-06
EP2588539B1 (en) 2014-05-14
TW201209101A (en) 2012-03-01
CN102959015B (zh) 2015-02-18
US9012586B2 (en) 2015-04-21
KR101722123B1 (ko) 2017-03-31
EP2588539A1 (en) 2013-05-08
JP5680889B2 (ja) 2015-03-04

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