JP5680889B2 - 硬化性オルガノポリシロキサン組成物および光半導体装置 - Google Patents

硬化性オルガノポリシロキサン組成物および光半導体装置 Download PDF

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JP5680889B2
JP5680889B2 JP2010147689A JP2010147689A JP5680889B2 JP 5680889 B2 JP5680889 B2 JP 5680889B2 JP 2010147689 A JP2010147689 A JP 2010147689A JP 2010147689 A JP2010147689 A JP 2010147689A JP 5680889 B2 JP5680889 B2 JP 5680889B2
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component
group
formula
methyl group
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JP2012012433A (ja
JP2012012433A5 (enExample
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吉武　誠
誠 吉武
美江子 山川
美江子 山川
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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Priority to JP2010147689A priority Critical patent/JP5680889B2/ja
Priority to TW100121707A priority patent/TWI512047B/zh
Priority to US13/806,871 priority patent/US9012586B2/en
Priority to PCT/JP2011/065248 priority patent/WO2012002561A1/en
Priority to CN201180028772.0A priority patent/CN102959015B/zh
Priority to KR1020127032665A priority patent/KR101722123B1/ko
Priority to EP20110738059 priority patent/EP2588539B1/en
Publication of JP2012012433A publication Critical patent/JP2012012433A/ja
Publication of JP2012012433A5 publication Critical patent/JP2012012433A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Led Device Packages (AREA)
JP2010147689A 2010-06-29 2010-06-29 硬化性オルガノポリシロキサン組成物および光半導体装置 Active JP5680889B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2010147689A JP5680889B2 (ja) 2010-06-29 2010-06-29 硬化性オルガノポリシロキサン組成物および光半導体装置
TW100121707A TWI512047B (zh) 2010-06-29 2011-06-21 可固化有機聚矽氧烷組合物及光學半導體裝置
PCT/JP2011/065248 WO2012002561A1 (en) 2010-06-29 2011-06-28 Curable organopolysiloxane composition and optical semiconductor device
CN201180028772.0A CN102959015B (zh) 2010-06-29 2011-06-28 可固化的有机聚硅氧烷组合物及光学半导体器件
US13/806,871 US9012586B2 (en) 2010-06-29 2011-06-28 Curable organopolysiloxane composition and optical semiconductor device
KR1020127032665A KR101722123B1 (ko) 2010-06-29 2011-06-28 경화성 오가노폴리실록산 조성물 및 광반도체 장치
EP20110738059 EP2588539B1 (en) 2010-06-29 2011-06-28 Curable organopolysiloxane composition and optical semiconductor device

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Application Number Priority Date Filing Date Title
JP2010147689A JP5680889B2 (ja) 2010-06-29 2010-06-29 硬化性オルガノポリシロキサン組成物および光半導体装置

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JP2012012433A JP2012012433A (ja) 2012-01-19
JP2012012433A5 JP2012012433A5 (enExample) 2013-08-01
JP5680889B2 true JP5680889B2 (ja) 2015-03-04

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US (1) US9012586B2 (enExample)
EP (1) EP2588539B1 (enExample)
JP (1) JP5680889B2 (enExample)
KR (1) KR101722123B1 (enExample)
CN (1) CN102959015B (enExample)
TW (1) TWI512047B (enExample)
WO (1) WO2012002561A1 (enExample)

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JP5534977B2 (ja) 2010-06-29 2014-07-02 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および光半導体装置
JP5693063B2 (ja) * 2010-07-01 2015-04-01 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置
JP5817377B2 (ja) * 2011-09-20 2015-11-18 住友ベークライト株式会社 シリコーンゴム系硬化性組成物、シリコーンゴムの製造方法、シリコーンゴム、成形体および医療用チューブ
JP6057503B2 (ja) * 2011-09-21 2017-01-11 東レ・ダウコーニング株式会社 光半導体素子封止用硬化性シリコーン組成物、樹脂封止光半導体素子の製造方法、および樹脂封止光半導体素子
JP5706357B2 (ja) * 2012-02-24 2015-04-22 富士フイルム株式会社 基板モジュールおよびその製造方法
JP5922463B2 (ja) * 2012-03-30 2016-05-24 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
US9902811B2 (en) * 2013-02-22 2018-02-27 Dow Corning Toray Co. Ltd. Curable silicone composition, cured product thereof, and optical semiconductor device
JP6467125B2 (ja) * 2013-06-27 2019-02-06 株式会社カネカ 硬化性樹脂組成物、該組成物を硬化させてなる硬化物
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WO2017163936A1 (ja) * 2016-03-25 2017-09-28 富士フイルム株式会社 音響波プローブ用組成物、これを用いた音響波プローブ用シリコーン樹脂、音響波プローブおよび超音波プローブ、ならびに、音響波測定装置、超音波診断装置、光音響波測定装置および超音波内視鏡
JP6519531B2 (ja) * 2016-06-03 2019-05-29 信越化学工業株式会社 付加硬化性シリコーン樹脂組成物及び光半導体装置用ダイアタッチ材
KR102550879B1 (ko) * 2016-12-13 2023-07-03 미쯔비시 케미컬 주식회사 폴리오르가노실록산, 폴리오르가노실록산 조성물, 및 그 경화물, 그리고 폴리오르가노실록산을 포함하는 전해 콘덴서용 전해액 및 그것을 사용한 전해 콘덴서
EP3562889A4 (en) * 2016-12-30 2020-12-09 Elkem Silicones Shanghai Co., Ltd. CURING SILICONE COMPOSITIONS
KR102518155B1 (ko) * 2017-01-16 2023-04-06 니치아 카가쿠 고교 가부시키가이샤 경화성 수지 조성물, 그의 경화물 및 반도체 장치
CN110382625B (zh) * 2017-02-27 2022-02-18 杜邦东丽特殊材料株式会社 可固化的有机聚硅氧烷组合物和半导体器件
TWI762649B (zh) * 2017-06-26 2022-05-01 日商杜邦東麗特殊材料股份有限公司 黏晶用固化性矽組合物
RU2696897C1 (ru) 2018-12-18 2019-08-07 Открытое акционерное общество "Хлебпром" Чипсы цельнозерновые и способ их производства
TWI869483B (zh) * 2019-12-11 2025-01-11 美商陶氏全球科技公司 快速矽氫化固化組合物
CN116134093B (zh) 2020-06-30 2024-12-27 陶氏东丽株式会社 固化性有机硅组合物及其固化物
JP2023132309A (ja) 2022-03-10 2023-09-22 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物
CN120380086A (zh) * 2022-12-23 2025-07-25 陶氏东丽株式会社 热熔性固化性有机硅组合物、使用该组合物的层叠体以及半导体装置的制造方法
JP7904782B2 (ja) 2022-12-28 2026-08-13 Ｄｕｒｏｐｔｉｘマテリアル株式会社 硬化性シリコーン組成物
CN118085575A (zh) * 2023-11-28 2024-05-28 东莞市贝特利新材料有限公司 有机聚硅氧烷组合物、密封材料和半导体器件

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EP2588539A1 (en) 2013-05-08
TW201209101A (en) 2012-03-01
JP2012012433A (ja) 2012-01-19
CN102959015A (zh) 2013-03-06
US9012586B2 (en) 2015-04-21
KR20130112713A (ko) 2013-10-14
TWI512047B (zh) 2015-12-11
KR101722123B1 (ko) 2017-03-31
CN102959015B (zh) 2015-02-18
WO2012002561A1 (en) 2012-01-05
EP2588539B1 (en) 2014-05-14
US20130161686A1 (en) 2013-06-27

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