TWI510673B - 2-layer flexible substrate and manufacturing method thereof - Google Patents

2-layer flexible substrate and manufacturing method thereof Download PDF

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Publication number
TWI510673B
TWI510673B TW100108894A TW100108894A TWI510673B TW I510673 B TWI510673 B TW I510673B TW 100108894 A TW100108894 A TW 100108894A TW 100108894 A TW100108894 A TW 100108894A TW I510673 B TWI510673 B TW I510673B
Authority
TW
Taiwan
Prior art keywords
layer
film
flexible substrate
copper
metal layer
Prior art date
Application number
TW100108894A
Other languages
English (en)
Chinese (zh)
Other versions
TW201139730A (en
Inventor
Eiichiro Nisimura
Yoshiyuki Asakawa
Original Assignee
Sumitomo Metal Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co filed Critical Sumitomo Metal Mining Co
Publication of TW201139730A publication Critical patent/TW201139730A/zh
Application granted granted Critical
Publication of TWI510673B publication Critical patent/TWI510673B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
TW100108894A 2010-03-16 2011-03-16 2-layer flexible substrate and manufacturing method thereof TWI510673B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010059903 2010-03-16
PCT/JP2011/055686 WO2011114997A1 (ja) 2010-03-16 2011-03-10 ２層フレキシブル基板およびその製造方法

Publications (2)

Publication Number Publication Date
TW201139730A TW201139730A (en) 2011-11-16
TWI510673B true TWI510673B (zh) 2015-12-01

Family

ID=44649092

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100108894A TWI510673B (zh) 2010-03-16 2011-03-16 2-layer flexible substrate and manufacturing method thereof

Country Status (5)

Country Link
JP (1) JP5672299B2 (ja)
KR (1) KR101363771B1 (ja)
CN (1) CN102792786B (ja)
TW (1) TWI510673B (ja)
WO (1) WO2011114997A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150008703A (ko) * 2013-07-15 2015-01-23 (주)이엔에이치 정전용량 방식의 터치스크린 패널 및 그 제조방법
JP6409267B2 (ja) * 2013-10-15 2018-10-24 セイコーエプソン株式会社 量子干渉装置、原子発振器、電子機器および移動体
TWI568865B (zh) * 2013-10-23 2017-02-01 Sumitomo Metal Mining Co Layer 2 flexible wiring substrate and manufacturing method thereof, and two-layer flexible wiring board and manufacturing method thereof
JP6484922B2 (ja) * 2014-03-20 2019-03-20 セイコーエプソン株式会社 原子セル、量子干渉装置、原子発振器および電子機器
JP6834592B2 (ja) * 2016-04-01 2021-02-24 住友金属鉱山株式会社 ポリイミド樹脂中のオリゴマ量の評価方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000216534A (ja) * 1999-01-26 2000-08-04 Matsushita Electric Works Ltd 配線基板の製造方法
JP2008078276A (ja) * 2006-09-20 2008-04-03 Sumitomo Metal Mining Co Ltd 高耐熱密着力を有する銅被覆ポリイミド基板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05136547A (ja) * 1991-11-11 1993-06-01 Shin Etsu Chem Co Ltd フレキシブル印刷配線用基板の製造方法
JP2001089590A (ja) * 1999-09-27 2001-04-03 Toray Ind Inc ポリエステルフィルムの製造方法
JP2004087909A (ja) * 2002-08-28 2004-03-18 Toppan Printing Co Ltd 多層回路配線板の製造方法
CN100566505C (zh) * 2004-09-01 2009-12-02 住友金属矿山株式会社 2层挠性基板及其制造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000216534A (ja) * 1999-01-26 2000-08-04 Matsushita Electric Works Ltd 配線基板の製造方法
JP2008078276A (ja) * 2006-09-20 2008-04-03 Sumitomo Metal Mining Co Ltd 高耐熱密着力を有する銅被覆ポリイミド基板

Also Published As

Publication number Publication date
TW201139730A (en) 2011-11-16
KR20120127743A (ko) 2012-11-23
WO2011114997A1 (ja) 2011-09-22
KR101363771B1 (ko) 2014-02-14
CN102792786B (zh) 2015-11-25
CN102792786A (zh) 2012-11-21
JP5672299B2 (ja) 2015-02-18
JPWO2011114997A1 (ja) 2013-06-27

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