CN102792786B - 2层挠性基板及其制造方法 - Google Patents
2层挠性基板及其制造方法 Download PDFInfo
- Publication number
- CN102792786B CN102792786B CN201180013870.7A CN201180013870A CN102792786B CN 102792786 B CN102792786 B CN 102792786B CN 201180013870 A CN201180013870 A CN 201180013870A CN 102792786 B CN102792786 B CN 102792786B
- Authority
- CN
- China
- Prior art keywords
- film
- layers
- flexible substrate
- mentioned
- surface treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010059903 | 2010-03-16 | ||
JP2010-059903 | 2010-03-16 | ||
PCT/JP2011/055686 WO2011114997A1 (ja) | 2010-03-16 | 2011-03-10 | 2層フレキシブル基板およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102792786A CN102792786A (zh) | 2012-11-21 |
CN102792786B true CN102792786B (zh) | 2015-11-25 |
Family
ID=44649092
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201180013870.7A Active CN102792786B (zh) | 2010-03-16 | 2011-03-10 | 2层挠性基板及其制造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5672299B2 (ja) |
KR (1) | KR101363771B1 (ja) |
CN (1) | CN102792786B (ja) |
TW (1) | TWI510673B (ja) |
WO (1) | WO2011114997A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150008703A (ko) * | 2013-07-15 | 2015-01-23 | (주)이엔에이치 | 정전용량 방식의 터치스크린 패널 및 그 제조방법 |
JP6409267B2 (ja) * | 2013-10-15 | 2018-10-24 | セイコーエプソン株式会社 | 量子干渉装置、原子発振器、電子機器および移動体 |
TWI568865B (zh) * | 2013-10-23 | 2017-02-01 | Sumitomo Metal Mining Co | Layer 2 flexible wiring substrate and manufacturing method thereof, and two-layer flexible wiring board and manufacturing method thereof |
JP6484922B2 (ja) * | 2014-03-20 | 2019-03-20 | セイコーエプソン株式会社 | 原子セル、量子干渉装置、原子発振器および電子機器 |
JP6834592B2 (ja) * | 2016-04-01 | 2021-02-24 | 住友金属鉱山株式会社 | ポリイミド樹脂中のオリゴマ量の評価方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100566505C (zh) * | 2004-09-01 | 2009-12-02 | 住友金属矿山株式会社 | 2层挠性基板及其制造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05136547A (ja) * | 1991-11-11 | 1993-06-01 | Shin Etsu Chem Co Ltd | フレキシブル印刷配線用基板の製造方法 |
JP2000216534A (ja) * | 1999-01-26 | 2000-08-04 | Matsushita Electric Works Ltd | 配線基板の製造方法 |
JP2001089590A (ja) * | 1999-09-27 | 2001-04-03 | Toray Ind Inc | ポリエステルフィルムの製造方法 |
JP2004087909A (ja) * | 2002-08-28 | 2004-03-18 | Toppan Printing Co Ltd | 多層回路配線板の製造方法 |
JP4923903B2 (ja) * | 2006-09-20 | 2012-04-25 | 住友金属鉱山株式会社 | 高耐熱密着力を有する銅被覆ポリイミド基板 |
-
2011
- 2011-03-10 WO PCT/JP2011/055686 patent/WO2011114997A1/ja active Application Filing
- 2011-03-10 CN CN201180013870.7A patent/CN102792786B/zh active Active
- 2011-03-10 JP JP2012505641A patent/JP5672299B2/ja active Active
- 2011-03-10 KR KR1020127026124A patent/KR101363771B1/ko active IP Right Grant
- 2011-03-16 TW TW100108894A patent/TWI510673B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100566505C (zh) * | 2004-09-01 | 2009-12-02 | 住友金属矿山株式会社 | 2层挠性基板及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI510673B (zh) | 2015-12-01 |
CN102792786A (zh) | 2012-11-21 |
KR101363771B1 (ko) | 2014-02-14 |
JP5672299B2 (ja) | 2015-02-18 |
KR20120127743A (ko) | 2012-11-23 |
WO2011114997A1 (ja) | 2011-09-22 |
TW201139730A (en) | 2011-11-16 |
JPWO2011114997A1 (ja) | 2013-06-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102792786B (zh) | 2层挠性基板及其制造方法 | |
US20120205146A1 (en) | Heat-resistant copper foil and method of producing the same, circuit board, and copper-clad laminate and method of producing the same | |
US6248401B1 (en) | Process for treating a metallic body with vapor-deposited treatment layer(s) and adhesion-promoting layer | |
CN100566505C (zh) | 2层挠性基板及其制造方法 | |
CN1805653B (zh) | 配线电路基板及其制造方法 | |
KR100727716B1 (ko) | 연성금속 적층판 및 그 제조방법 | |
JP3888587B2 (ja) | フレキシブル基板のエッチング方法 | |
JP2008162245A (ja) | メッキ法2層銅ポリイミド積層フィルムおよびその製造方法 | |
CN102548195A (zh) | 高精度柔性电路板及其制备方法 | |
CN100542374C (zh) | 2层挠性基板及其制造方法 | |
CN1376308A (zh) | 溅射方法 | |
CN113421697A (zh) | 一种柔性覆铜膜及其制造方法 | |
KR100701645B1 (ko) | 연성회로기판용 적층구조체의 제조방법 | |
KR20120053195A (ko) | 내열접착력을 개선한 연성회로기판용 동박 적층 구조체 및 그의 제조방법 | |
CN113667952B (zh) | 一种磁控溅射柔性覆铜基板及其制备方法 | |
CN103643085B (zh) | 埋入式薄膜电阻材料及其制备方法 | |
JP2004009357A (ja) | 金属蒸着/金属メッキ積層フィルム及びこれを用いた電子部品 | |
KR101681663B1 (ko) | 전도성 패턴 적층체 및 이의 제조방법 | |
Noh et al. | Effects of different kinds of seed layers and heat treatment on adhesion characteristics of Cu/(Cr or Ni–Cr)/PI interfaces in flexible printed circuits | |
KR101012919B1 (ko) | 접착제가 없는 연성금속 적층판 및 그 제조방법 | |
KR20210106811A (ko) | 연성회로기판 적층구조체의 제조방법 및 제조장치 | |
JP2006159632A (ja) | 銅メタライズド積層板及びその製造方法 | |
JPH04267597A (ja) | フレキシブルプリント配線板の製造方法 | |
JP4776217B2 (ja) | 銅メタライズド積層板及びその製造方法 | |
KR20110072767A (ko) | 전자파 차폐 필름의 제조 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |