KR101363771B1 - 2층 플렉시블 기판 및 그 제조 방법 - Google Patents

2층 플렉시블 기판 및 그 제조 방법 Download PDF

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Publication number
KR101363771B1
KR101363771B1 KR1020127026124A KR20127026124A KR101363771B1 KR 101363771 B1 KR101363771 B1 KR 101363771B1 KR 1020127026124 A KR1020127026124 A KR 1020127026124A KR 20127026124 A KR20127026124 A KR 20127026124A KR 101363771 B1 KR101363771 B1 KR 101363771B1
Authority
KR
South Korea
Prior art keywords
layer
film
base metal
flexible substrate
metal layer
Prior art date
Application number
KR1020127026124A
Other languages
English (en)
Korean (ko)
Other versions
KR20120127743A (ko
Inventor
에이이치로 니시무라
요시유키 아사카와
Original Assignee
스미토모 긴조쿠 고잔 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미토모 긴조쿠 고잔 가부시키가이샤 filed Critical 스미토모 긴조쿠 고잔 가부시키가이샤
Publication of KR20120127743A publication Critical patent/KR20120127743A/ko
Application granted granted Critical
Publication of KR101363771B1 publication Critical patent/KR101363771B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
KR1020127026124A 2010-03-16 2011-03-10 2층 플렉시블 기판 및 그 제조 방법 KR101363771B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2010-059903 2010-03-16
JP2010059903 2010-03-16
PCT/JP2011/055686 WO2011114997A1 (ja) 2010-03-16 2011-03-10 ２層フレキシブル基板およびその製造方法

Publications (2)

Publication Number Publication Date
KR20120127743A KR20120127743A (ko) 2012-11-23
KR101363771B1 true KR101363771B1 (ko) 2014-02-14

Family

ID=44649092

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127026124A KR101363771B1 (ko) 2010-03-16 2011-03-10 2층 플렉시블 기판 및 그 제조 방법

Country Status (5)

Country Link
JP (1) JP5672299B2 (ja)
KR (1) KR101363771B1 (ja)
CN (1) CN102792786B (ja)
TW (1) TWI510673B (ja)
WO (1) WO2011114997A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150008703A (ko) * 2013-07-15 2015-01-23 (주)이엔에이치 정전용량 방식의 터치스크린 패널 및 그 제조방법
JP6409267B2 (ja) * 2013-10-15 2018-10-24 セイコーエプソン株式会社 量子干渉装置、原子発振器、電子機器および移動体
TWI568865B (zh) * 2013-10-23 2017-02-01 Sumitomo Metal Mining Co Layer 2 flexible wiring substrate and manufacturing method thereof, and two-layer flexible wiring board and manufacturing method thereof
JP6484922B2 (ja) * 2014-03-20 2019-03-20 セイコーエプソン株式会社 原子セル、量子干渉装置、原子発振器および電子機器
JP6834592B2 (ja) * 2016-04-01 2021-02-24 住友金属鉱山株式会社 ポリイミド樹脂中のオリゴマ量の評価方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05136547A (ja) * 1991-11-11 1993-06-01 Shin Etsu Chem Co Ltd フレキシブル印刷配線用基板の製造方法
JP2001089590A (ja) * 1999-09-27 2001-04-03 Toray Ind Inc ポリエステルフィルムの製造方法
JP2008078276A (ja) * 2006-09-20 2008-04-03 Sumitomo Metal Mining Co Ltd 高耐熱密着力を有する銅被覆ポリイミド基板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000216534A (ja) * 1999-01-26 2000-08-04 Matsushita Electric Works Ltd 配線基板の製造方法
JP2004087909A (ja) * 2002-08-28 2004-03-18 Toppan Printing Co Ltd 多層回路配線板の製造方法
JP4605511B2 (ja) * 2004-09-01 2011-01-05 住友金属鉱山株式会社 ２層フレキシブル基板及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05136547A (ja) * 1991-11-11 1993-06-01 Shin Etsu Chem Co Ltd フレキシブル印刷配線用基板の製造方法
JP2001089590A (ja) * 1999-09-27 2001-04-03 Toray Ind Inc ポリエステルフィルムの製造方法
JP2008078276A (ja) * 2006-09-20 2008-04-03 Sumitomo Metal Mining Co Ltd 高耐熱密着力を有する銅被覆ポリイミド基板

Also Published As

Publication number Publication date
TWI510673B (zh) 2015-12-01
CN102792786B (zh) 2015-11-25
CN102792786A (zh) 2012-11-21
JP5672299B2 (ja) 2015-02-18
KR20120127743A (ko) 2012-11-23
WO2011114997A1 (ja) 2011-09-22
TW201139730A (en) 2011-11-16
JPWO2011114997A1 (ja) 2013-06-27

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