TWI506669B - 顆粒污染物之移除方法 - Google Patents

顆粒污染物之移除方法 Download PDF

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Publication number
TWI506669B
TWI506669B TW099119545A TW99119545A TWI506669B TW I506669 B TWI506669 B TW I506669B TW 099119545 A TW099119545 A TW 099119545A TW 99119545 A TW99119545 A TW 99119545A TW I506669 B TWI506669 B TW I506669B
Authority
TW
Taiwan
Prior art keywords
viscoelastic material
semiconductor wafer
liquid
particulate contaminants
wafer
Prior art date
Application number
TW099119545A
Other languages
English (en)
Chinese (zh)
Other versions
TW201110193A (en
Inventor
直志 川口
世禮 梅
馬克 威爾克遜
Original Assignee
蘭姆研究公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 蘭姆研究公司 filed Critical 蘭姆研究公司
Publication of TW201110193A publication Critical patent/TW201110193A/zh
Application granted granted Critical
Publication of TWI506669B publication Critical patent/TWI506669B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0014—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by incorporation in a layer which is removed with the contaminants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D17/00—Detergent materials or soaps characterised by their shape or physical properties
    • C11D17/04—Detergent materials or soaps characterised by their shape or physical properties combined with or containing other objects
    • C11D17/049—Cleaning or scouring pads; Wipes
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/40—Specific cleaning or washing processes
    • C11D2111/42—Application of foam or a temporary coating on the surface to be cleaned

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW099119545A 2009-06-16 2010-06-15 顆粒污染物之移除方法 TWI506669B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/485,733 US9159593B2 (en) 2008-06-02 2009-06-16 Method of particle contaminant removal

Publications (2)

Publication Number Publication Date
TW201110193A TW201110193A (en) 2011-03-16
TWI506669B true TWI506669B (zh) 2015-11-01

Family

ID=43305323

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099119545A TWI506669B (zh) 2009-06-16 2010-06-15 顆粒污染物之移除方法

Country Status (7)

Country Link
US (1) US9159593B2 (https=)
JP (1) JP5730298B2 (https=)
KR (1) KR101660075B1 (https=)
CN (1) CN102458697B (https=)
SG (2) SG176793A1 (https=)
TW (1) TWI506669B (https=)
WO (1) WO2010147752A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI877241B (zh) * 2019-10-22 2025-03-21 荷蘭商Ａｓｍｌ荷蘭公司 薄膜清潔裝置

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JP5762925B2 (ja) * 2010-12-28 2015-08-12 東京エレクトロン株式会社 液処理装置および液処理方法
US11643946B2 (en) * 2013-10-02 2023-05-09 Aerocore Technologies Llc Cleaning method for jet engine
CN107075411A (zh) * 2014-09-18 2017-08-18 应用材料公司 使用经设计的黏性流体的高效率后cmp清洗的方法与设备
US10276469B2 (en) * 2015-04-17 2019-04-30 Taiwan Semiconductor Manufacturing Co., Ltd Method for forming semiconductor device structure
TWI621171B (zh) * 2015-10-13 2018-04-11 Usun Technology Co Ltd Sheet surface treatment method and structure
JP6715019B2 (ja) * 2016-02-09 2020-07-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR102093641B1 (ko) * 2018-06-22 2020-04-23 주식회사 로보스타 파티클제거팁 및 그것을 이용한 인덱스형 파티클 제거장치
KR102139605B1 (ko) * 2018-11-06 2020-08-12 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
TWI673789B (zh) * 2018-11-19 2019-10-01 弘塑科技股份有限公司 清洗裝置及方法
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers

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US5372652A (en) * 1993-06-14 1994-12-13 International Business Machines Corporation Aerosol cleaning method
US7479205B2 (en) * 2000-09-22 2009-01-20 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI877241B (zh) * 2019-10-22 2025-03-21 荷蘭商Ａｓｍｌ荷蘭公司 薄膜清潔裝置

Also Published As

Publication number Publication date
CN102458697A (zh) 2012-05-16
CN102458697B (zh) 2015-11-25
KR20120036864A (ko) 2012-04-18
KR101660075B1 (ko) 2016-09-26
TW201110193A (en) 2011-03-16
US20100313917A1 (en) 2010-12-16
WO2010147752A1 (en) 2010-12-23
US9159593B2 (en) 2015-10-13
SG176793A1 (en) 2012-01-30
JP2012530379A (ja) 2012-11-29
SG10201403214PA (en) 2014-10-30
JP5730298B2 (ja) 2015-06-10

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