KR101660075B1 - 파티클 오염 제거 방법 - Google Patents

파티클 오염 제거 방법 Download PDF

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Publication number
KR101660075B1
KR101660075B1 KR1020117030247A KR20117030247A KR101660075B1 KR 101660075 B1 KR101660075 B1 KR 101660075B1 KR 1020117030247 A KR1020117030247 A KR 1020117030247A KR 20117030247 A KR20117030247 A KR 20117030247A KR 101660075 B1 KR101660075 B1 KR 101660075B1
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KR
South Korea
Prior art keywords
viscoelastic material
liquid
semiconductor wafer
wafer
carrier gas
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KR1020117030247A
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English (en)
Korean (ko)
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KR20120036864A (ko
Inventor
마크 가와구치
데이비드 무이
마크 윌콕슨
Original Assignee
램 리써치 코포레이션
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Publication of KR20120036864A publication Critical patent/KR20120036864A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0014—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by incorporation in a layer which is removed with the contaminants
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D17/00—Detergent materials or soaps characterised by their shape or physical properties
    • C11D17/04—Detergent materials or soaps characterised by their shape or physical properties combined with or containing other objects
    • C11D17/049—Cleaning or scouring pads; Wipes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/40—Specific cleaning or washing processes
    • C11D2111/42—Application of foam or a temporary coating on the surface to be cleaned

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020117030247A 2009-06-16 2010-05-28 파티클 오염 제거 방법 Active KR101660075B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/485,733 2009-06-16
US12/485,733 US9159593B2 (en) 2008-06-02 2009-06-16 Method of particle contaminant removal
PCT/US2010/036754 WO2010147752A1 (en) 2009-06-16 2010-05-28 Method of particle contaminant removal

Publications (2)

Publication Number Publication Date
KR20120036864A KR20120036864A (ko) 2012-04-18
KR101660075B1 true KR101660075B1 (ko) 2016-09-26

Family

ID=43305323

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117030247A Active KR101660075B1 (ko) 2009-06-16 2010-05-28 파티클 오염 제거 방법

Country Status (7)

Country Link
US (1) US9159593B2 (https=)
JP (1) JP5730298B2 (https=)
KR (1) KR101660075B1 (https=)
CN (1) CN102458697B (https=)
SG (2) SG176793A1 (https=)
TW (1) TWI506669B (https=)
WO (1) WO2010147752A1 (https=)

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JP5762925B2 (ja) * 2010-12-28 2015-08-12 東京エレクトロン株式会社 液処理装置および液処理方法
US11643946B2 (en) * 2013-10-02 2023-05-09 Aerocore Technologies Llc Cleaning method for jet engine
CN107075411A (zh) * 2014-09-18 2017-08-18 应用材料公司 使用经设计的黏性流体的高效率后cmp清洗的方法与设备
US10276469B2 (en) * 2015-04-17 2019-04-30 Taiwan Semiconductor Manufacturing Co., Ltd Method for forming semiconductor device structure
TWI621171B (zh) * 2015-10-13 2018-04-11 Usun Technology Co Ltd Sheet surface treatment method and structure
JP6715019B2 (ja) * 2016-02-09 2020-07-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR102093641B1 (ko) * 2018-06-22 2020-04-23 주식회사 로보스타 파티클제거팁 및 그것을 이용한 인덱스형 파티클 제거장치
KR102139605B1 (ko) * 2018-11-06 2020-08-12 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
TWI673789B (zh) * 2018-11-19 2019-10-01 弘塑科技股份有限公司 清洗裝置及方法
NL2026646B1 (en) * 2019-10-22 2021-08-02 Asml Netherlands Bv Membrane cleaning apparatus
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers

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JP2007150375A (ja) 2007-03-19 2007-06-14 Dainippon Screen Mfg Co Ltd 基板処理装置

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JPH01135574A (ja) * 1987-11-24 1989-05-29 Osaka Shinku Kogyo Kk 蒸着薄膜形成用基板の清浄方法
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JP3315611B2 (ja) * 1996-12-02 2002-08-19 三菱電機株式会社 洗浄用２流体ジェットノズル及び洗浄装置ならびに半導体装置
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Also Published As

Publication number Publication date
CN102458697A (zh) 2012-05-16
TWI506669B (zh) 2015-11-01
CN102458697B (zh) 2015-11-25
KR20120036864A (ko) 2012-04-18
TW201110193A (en) 2011-03-16
US20100313917A1 (en) 2010-12-16
WO2010147752A1 (en) 2010-12-23
US9159593B2 (en) 2015-10-13
SG176793A1 (en) 2012-01-30
JP2012530379A (ja) 2012-11-29
SG10201403214PA (en) 2014-10-30
JP5730298B2 (ja) 2015-06-10

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